JPH08236954A - Housing for electronic equipment - Google Patents

Abstract

PURPOSE: To reduce the height of a housing for electronic equipment, such as the display, etc., installed to a control panel in a factory, etc., so as to reduce the size of the housing by effecting insulating the heat from a power source. CONSTITUTION: A housing 1 for housing heat generating components, such as a power source, etc., and other electronic circuits has heat radiating openings 5 formed at appropriate intervals through the peripheral wall of the housing 1 and the inside of the housing 1 is divided into a heat generating components arranging section for arranging heat generating components and electronic circuit arranging section for arranging other electronic circuits by partition wall 10 erected on the bottom plate 2 of the housing 1. Since the wall 10 has a U-shaped cross section and heat radiating holes 15 are formed at appropriate intervals through one side wall 11 of the U-shape on the heat radiating components arranging section side and the heat radiated from the heat radiating components arranging section through the holes 14 is insulated by the other side wall of the U-shape on the electronic circuit arranging section, the heat from the power source is not transmitted to the electronic circuit arranging section.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for electronic equipment equipped with a power source, electronic circuit parts and the like, and more particularly to a housing structure for thinning the outer shape of the housing for electronic equipment to reduce the size thereof. It is a thing.

[0002]

2. Description of the Related Art Conventionally, a display installed on an electronic device, such as a control panel of a factory, has a top opening portion of a casing 31 as shown in a schematic sectional perspective view of FIG. 4 and a schematic transverse sectional view of FIG. A display panel 32 made of liquid crystal or EL is installed in
A circuit board 33 having an electronic circuit for driving and controlling the display of the display panel 32 installed therein and a power supply 34 are provided.

In the display having such a structure, the display elements constituting the display panel 32 and the circuit components of the circuit board 33 are weak to the temperature, and the heat of the circuit board 33 is applied to the display panel 32.
In addition, the heat from the power source 34 is generated by the circuit board 33 and the display panel 3.
In order not to be transmitted to the display panel 32, the housings 31 are arranged at predetermined intervals in the thickness direction of the housing 31 so as to be parallel to and overlap the display panel 32. In particular, since the power source 34 emits the most heat, the power source 34 is arranged on the side of the circuit board 33 remote from the display panel 2 opposite to the side where the display panel 32 is located.

Therefore, the casing 31 is formed with a step between a deep bottom surface 35 for arranging the power source 34 on the bottom surface and a shallow bottom surface 36 on which the power source 34 is not disposed, and the side wall peripheral surface and the power source 34 are disposed. The deep bottom surface 35 has a heat dissipation opening 37 (in FIG. 4, only the side wall peripheral surface on which the power source is located is shown.
Others are omitted. ) Has been formed.

[0005]

As described above, in the conventional display, the circuit board 33, which is parallel to the display panel 32, is provided at a predetermined interval in the thickness direction of the housing 31 (the bottom surface side direction of the housing 31). The power supplies 34 are arranged so that they overlap,
The bottom surface of the casing 31 in which the power source 34 is arranged projects outward in the outer shape, and the outer thickness of the casing 31 is correspondingly thicker. However, the display etc. installed on the control panel of the factory etc.
There is a restriction on the space for installation, and it is desired to make electronic devices installed on the control panel as thin as possible in outer shape and downsized.

However, if the display panel 32, the circuit board 33, and the power source 34 are arranged as they are, and the distances between the display panel 32 and the circuit board 33 and between the circuit board 33 and the power source 34 are reduced, the power source 34 The heat and noise of the display panel 32 are easily transmitted to the display element of the display panel 32 and the display drive circuit of the circuit board 33, causing a problem of malfunction or damage, and it is not possible to reduce the outer thickness of the display.

In view of the above problems, the present invention effectively shields heat generated from a power source, and thins the outer shape of an electronic equipment casing such as a display installed in a control panel of a factory or the like to reduce the size. The purpose is to plan.

[0008]

The above objects of the present invention can be achieved by the following items (1) and (2). (1) A case having a peripheral wall that stands up along the periphery of a flat plate, in which heat dissipation openings are formed at appropriate intervals on the peripheral wall of the case, and partition walls that stand upright from the flat plate are provided inside, and by the partition wall A housing for an electronic device, characterized in that the inside of the housing is partitioned.

(2) A housing having a peripheral wall standing upright along the periphery of a flat plate, wherein heat dissipation openings are formed at appropriate intervals on the peripheral wall of the housing, and partition walls standing upright from the flat plate are provided inside the housing. An electronic device characterized in that the inside of the housing is partitioned by a partition wall, the partition wall has a U-shaped cross section, and heat dissipation openings are formed at appropriate intervals on at least one of the U-shaped standing walls. Equipment housing.

[0010]

According to the above configuration of the present invention, the heat-generating component such as the power source and the other electronic circuit components arranged in the housing are separated by the partition wall, and the heat generated from the heat-generating component such as the power source is separated by the partition wall. Of the electronic circuit is prevented from entering the arrangement side.
Therefore, even if another electronic circuit is arranged in parallel with a heat-generating component such as a power supply, the influence of the heat of the power source of the other electronic circuit is suppressed to a small extent. It is possible to make the outer thickness of the housing thinner by eliminating the predetermined gap in the thickness direction that is required.

Further, since the partition wall has an inverted U-shape in cross section and the heat dissipation openings are formed at appropriate intervals on the side wall located on the side where the heat-generating components such as the power source are arranged, the heat-generating components such as the power source are formed through the openings. The heat generated from the heat is radiated to the outside through the U-shaped opening, the heat radiation effect of the heat generated from the heat generating component such as the power source is further improved, and the heat shielding effect of the partition wall is also improved. Another electronic circuit can be arranged in parallel with the heat-generating component such as a power source, thereby eliminating the predetermined gap in the thickness direction, which is required between the other electronic circuit and the heat-generating component such as the power source. The outer thickness of the housing can be reduced.

[0012]

Embodiments of the present invention will be described below with reference to FIGS. 1 is a schematic cross-sectional perspective view of an electronic device housing according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional perspective view of a display using the electronic device housing shown in FIG. 1, and FIG. 3 is the display of FIG. 2 is a schematic cross-sectional view of the same, and the same reference numerals are given to the same portions in FIGS.

The housing 1 in this embodiment is, for example, a housing which constitutes the outer wall of a display, and is formed in a tray shape as a whole, and a peripheral wall 3 which stands up is formed on the peripheral edge of a flat plate 2. Although not shown in the drawing, openings 5 for heat dissipation are formed at appropriate intervals on the entire circumference of the peripheral wall 3.
A flange 4 for mounting a frame 7 having a display panel 6 made of liquid crystal, EL, plasma or the like is formed on the peripheral edge of the peripheral wall 3 opposite to the flat plate 2, that is, the peripheral edge of the opening of the housing 1.

Inside the casing 1, a circuit board 9 is provided with a portion where a power source 8 is arranged by a partition wall 10 standing upright from the flat plate 2 and an electronic circuit which constitutes a display drive circuit such as a CPU and a memory.
The flat plate 2 in the portion in which the power source 8 is arranged is divided into the portions in which the power sources 8 are arranged, and the openings 15 for heat dissipation are formed at appropriate intervals.

The partition wall 10 faces the side wall 11 facing the side where the power source 8 is arranged, and the side wall 12 and the side wall 11 facing the side wall 11 and facing the side where the circuit board 9 is arranged with an appropriate interval. It has an end edge and a top face plate 13 formed over the end edge of the side wall 12, and has an appropriate height and length (in this embodiment, formed over the peripheral walls 3 of the housing 1 facing each other). The housing 1 is formed in a U-shaped cross section.

Further, on the side wall 11 of the partition wall 10 facing the side where the power source 8 is arranged, heat dissipation openings 14 are formed at appropriate intervals, and a space (U) formed by the side wall 11 and the side wall 12 is formed. The letter-shaped opening) communicates with the outside. In addition,
Reference numeral 16 in the figure denotes a support column that supports and fixes the circuit board 9.

In the case 1 thus constructed, the heat generated from the power source 8 is radiated to the outside through the openings 5 and 15 formed in the peripheral wall 3 and the flat plate 2 of the case 1, and the power source of the partition wall 10 is further increased. Heat is radiated to the outside from the opening 14 formed in the side wall 11 facing the arrangement side of 8 through the U-shaped opening. At this time, the side wall 12 of the partition wall 10 facing the side where the circuit board 9 is arranged prevents heat from the power source 8 from entering the side where the circuit board 9 is arranged.

Therefore, even if the circuit board 9 is arranged in parallel with the power supply 8, the influence of the heat of the power supply 8 on the circuit board 9, that is, the circuit elements and components mounted on the circuit board 9, is suppressed to a small extent. Further, since the circuit board 9 can be arranged in parallel with the power supply 8, a predetermined space in the thickness direction, which is required between the circuit board 9 and the power supply 8, is unnecessary, and the thickness of the outer shape of the housing 1 is correspondingly increased. Can be thinned. Further, the partition wall 10 can also serve as a reinforcing function of the housing 1.

The housing 1 may be integrally formed with the partition wall 10 by using a synthetic resin or the like. Further, although one circuit board is arranged in the portion of the housing 1 where the circuit board 9 is arranged, a plurality of circuit boards can be arranged. Further, when heat dissipation from the circuit board 9 side is also required, a heat dissipation opening may be provided in the side wall 12 of the partition wall 10 facing the side where the circuit board 9 is arranged.

Further, in this embodiment, the display panel 6 is mounted in the opening of the housing 1. However, instead of the display device, a heat generating component such as a power source or an electronic circuit component is mounted, such as a chassis. Of course, the invention is not limited to displays. Further, although the means for attaching the display panel or the like to the housing is appropriate, a projection having a claw at the tip is formed at an appropriate position on the flange portion of the housing, and the projection is provided with a claw on the mounting side. You may make it attach by the engaging groove etc. which match.

[0021]

As described in detail above, according to the present invention,
The circuit board can be arranged side by side with the power supply, and the predetermined space required between the circuit board and the power supply in the thickness direction of the housing is unnecessary, and the outer thickness of the housing is reduced accordingly. be able to.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional perspective view of an electronic device housing according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional perspective view of a display using the electronic device casing shown in FIG.

3 is a schematic cross-sectional view of the display of FIG.

FIG. 4 is a schematic sectional perspective view of a conventional display.

5 is a schematic cross-sectional view of the display of FIG.

[Explanation of symbols]

 1 case 2 bottom plate 3 peripheral wall 4 flanges 5, 14, 15, opening 6 display panel 7 frame 8 power supply 9 circuit board 10 partition wall 11, 12 partition wall standing wall 13 partition wall top plate

Claims (2)

[Claims] 1. A housing having a peripheral wall standing upright along the periphery of a flat plate, wherein heat dissipation openings are formed at appropriate intervals on the peripheral wall of the housing, and partition walls standing upright from the flat plate are provided inside the housing.
An electronic device casing, wherein the partition wall divides the inside of the casing. 2. A housing having a peripheral wall standing upright along the periphery of a flat plate, wherein heat dissipation openings are formed at appropriate intervals on the peripheral wall of the housing, and a partition wall standing upright from the flat plate is provided therein.
The partition wall defines the interior of the housing, the partition wall has a U-shaped cross section, and heat dissipation openings are formed at appropriate intervals on at least one of the U-shaped standing walls. Electronic device housing.