JPH08234035A - Manufacture of conductive structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a conductive structure at a low cost in particular by providing a conductive layer covering the surface of a daughter structure on the plane exceeding the size of a cut section on the lower face of the daughter structure. SOLUTION: A hardenable liquid material or a plastically deformable material is provided on a parent structure 10, and it is continuously hardened in a first process. The hardened material or the plastically deformable material is separated from the parent structure 10, and a daughter structure 20 having at least one excision section 19 is formed on the lower face. A conductive layer 25 covering the surface of the daughter structure 20 at the excision section 19 is provided on the plane exceeding the size of the excision section 19 on the lower face of the daughter structure 20 in a second process. The conductive layer 25 is removed from the surface of the lower face of the daughter structure 20, and a conductive structure 18 is formed in the excision section 19 in a third process. The parent structure 10 is made of a particularly stable material, preferably a material capable of being deposited by plating, e.g. a metal.

Description

Detailed Description of the Invention

[0001]

The invention starts from a method for manufacturing a conductive structure according to the preamble of claim 1.

[0002]

2. Description of the Related Art German Patent Application Publication No. 4232608
From the specification, a method for manufacturing a cover for an optical integrated circuit (IC) is known. The optical structure element is then inserted into the positive mold and the polymeric plastic is injected. After the plastic has hardened, the positive mold is removed and the resulting cover is placed on the substrate. Instead of an optical component, a thermally integrated actuator is provided and used to change the temperature of the optical waveguide below the thermal actuator. It is customary to manufacture thermal actuators by coating the carrier material with a conductive material by means of mask technology.

[0003]

On the other hand, the method according to the invention with the features of the characterizing part of claim 1 has the advantage that the conductive structure is manufactured in a particularly inexpensive and inexpensive manner.

Advantageous constructions and improvements of the method according to claim 1 are possible by means of the measures stated in claim 2 and thereafter.

It is particularly advantageous to use a metal as the material of the parent structure. This is because metals are particularly stable to heat and have a high degree of reusability.

Another advantage is that the removal of the conductive layer is mechanical, which is likewise an inexpensive and less expensive method of removing the conductive layer only in the plane of the cutout. This is because it is particularly suitable for

The increase of the layer thickness of the conductive layer has the advantage that good conductivity is achieved. Furthermore, the conductive layer can be made very thin before the increase of the layer thickness, which on the one hand achieves a very short coating process and on the other hand a time and material saving removal of the conductive layer. To be done.

It has been found advantageous to provide the conductive layer by vapor deposition, since this method is particularly inexpensive.

Furthermore, at the same time that the cutout is formed, the daughter structure is provided with a groove which is used for adjusting a positive mold two-daughter structure with additionally projecting waveguide-forming elements, which groove is subsequently liquefied. When forming a waveguide in a substrate that results when coated with plastic, the advantage arises that the electrically conductive structure can be adjusted in its relative position with respect to the resulting waveguide without an effective adjustment device.

If there are still protruding fiber conditioning elements on the positive mold, then a suitable fiber conditioning groove is formed in the substrate for use in accommodating the glass fibers to be bonded.

When a pushing element is provided which projects above the positive mould, and in which the substrate in which it is produced forms a wire groove used for containing a conductive material, it guides the current flow of the conductive structure. This results in good availability.

Placing a substrate on a circuit board component with the use of a curable polymer adhesive involves mechanically and firmly joining the substrate and the circuit board component in one common working step, while at the same time providing a waveguide. Is filled with a polymer adhesive, which has the advantage of being used as a waveguide.

When the conductive structure is configured as a heat conductive structure,
A particularly suitable field of application arises for conducting structures in the field of integrated optics. The arrangement of duct-like structures has the advantage that it can compensate for the shrinkage that occurs during the bonding process.

One embodiment of the present invention is illustrated and described in detail below.

[0015]

EXAMPLES Uniform numbering was used in all figures. FIG. 1 shows a parent structure 10 having the shape of a rectangular parallelepiped disk. On the upper surface of the parent structure 10, a ridgeline extends in parallel to a lateral line on the surface of the parent structure 10, and the ridgeline forms a first ridgelike projection 11 on the upper surface of the parent structure 10. The second ridge-shaped projection 12 extending substantially parallel to the protrusion on the side facing each other, and the ridge-line is the first ridge-shaped projection 1
A third ridge 15 extending substantially perpendicular to the first ridgeline and the ridgeline of the second ridge 12 is arranged. At this time, the third ridge 15 joins one end of the first ridge 11 with one end of the second ridge 12. Thus, the three ridges 11, 12, 15 form a "U" shape located on the upper surface of the parent structure 10. Between the first ridge-shaped projection 11 and the second ridge-shaped projection 12, the first vertically elongated rectangular parallelepiped-shaped projection 1 is formed.
3 and a second elongated rectangular parallelepiped projection 14 are arranged, the longitudinal axes of both elongated rectangular parallelepiped projections 13 and 14 extending substantially parallel to the ridgeline of the first ridge-like projection 11.
A meander-shaped protrusion 16 having a rectangular cross section extends between the vertically elongated ridge-shaped protrusions 13 and 14, and the protrusion is joined at one end thereof to one end of the first vertically-oriented rectangular parallelepiped protrusion 13 and the other end thereof. Is connected to one end of the second vertically elongated rectangular parallelepiped protrusion 14. The heights of the ridge-shaped projections 11, 12, 15 are higher than the heights of the vertically long rectangular parallelepiped projections 13, 14 and the meander-shaped projections 16 of both. The cross section of the meander-shaped projection 16 is smaller than the cross section of the vertically long rectangular parallelepiped projections 13 and 14.
The parent structure 10 is composed of a particularly stable, preferably depositable material such as a metal. This is because it is often used for the production of daughter structures to be molded on the surface of the parent structure 10. Furthermore, the material of the parent structure 10 should be resistant to the materials used for molding and the environmental conditions (temperature, light incidence, etc.) that occur during molding. On the other hand, the material of the parent structure has projections 11, 12, 13, 14, 15, 1 on it.
It should be suitable for producing 6 in a particularly accurate and durable manner.

A side view of the described parent structure 10 is shown in FIG. 2a). In addition, the daughter structure 2 is shown in FIG.
0 side view is shown, the daughter structure having a first inverted ridged groove 21 as well as a second inverted ridged groove 22 on its underside. For the sake of detailed description, reference is made to FIG. 2 b) in which a plan view of the underside of the daughter structure 20 is shown. The ridgelines of the first inverted ridged groove 21 and the second inverted ridged groove 22 extend substantially parallel to each other and to the lateral lines of the daughter structure 20 having the shape of a flat rectangular parallelepiped disc. The ridge line of the third reverse ridge groove 45 extends perpendicularly to the ridge lines of the first reverse ridge groove 21 and the second reverse ridge groove 22.
5 has one end of the first reverse ridge groove 21 and the second reverse ridge groove 2
Combine with one end of 2. Within this "U" -shaped arrangement of the inverted ridges 21, 22, 45, a vertically elongated rectangular parallelepiped recess 23 and a second vertically elongated rectangular parallelepiped recess 2 substantially parallel thereto.
4 is extended. Both vertically elongated rectangular parallelepiped recesses 23, 24
Is substantially parallel to the ridgeline of the first inverted ridged groove 21 and faces the third inverted ridged groove 45, the ends of the two vertically elongated rectangular parallelepiped recesses 23, 24 being It is connected to the meander-shaped recess 17. The elongated rectangular parallelepiped recesses 23 and 24 and the meander-shaped recess 17 together form a cutout 19.

Thus, the daughter structure 20 has, on its underside, exactly the opposite view of the upper surface of the parent structure 10. In this case, the daughter structure 20 is produced by providing a curable liquid material, in particular plastic, preferably on the parent structure 10 preferably by injection molding and, after curing, removing the plastic from the parent structure again. At that time, the ridge-shaped projections 11, 12,
The 15 elongated rectangular parallelepiped projections 13, 14 and the meander-shaped projections 16 are reproduced in the corresponding recesses 23, 24, 17 and notches 21, 22, 45. Suitable materials or plastics are, for example, injection-moldable plastics, for example polycarbonate. The material is provided by casting or injection molding or other suitable method. Similarly, a plastically deformable material is pressed against the parent structure 10 and this causes the protrusions 11, 12, 13, 14, 15, 15.
6 is stamped on the surface of the material. Next, the plastically deformable material is removed from the parent structure 10 as the daughter structure 20.

A side view of the daughter structure 20 is shown in FIG. A conductive layer 25 is provided on the lower surface of the daughter structure 20, which is now facing upward. In this case, the conductive layer 25 covers the entire surface of the lower surface above the daughter structure 20, and the first reverse ridge groove 21, the second reverse ridge groove 22, both longitudinally elongated rectangular parallelepiped recesses 23, 24 and It also covers the third inverted ridge groove 45 and the meander-shaped recess 17, which are not shown in FIG.

On the lower surface of the daughter structure 20 having the inverted ridge-shaped grooves 21, 22, 45 and the cut portion 19, the conductive layer 25 was provided in the second step after being separated from the parent structure 10. This was done, for example, by depositing a metal. At this time, the conductive layer 25 is deposited on the entire lower surface wall of the daughter structure 20 with a substantially constant layer thickness.

4a) and 4b) show a side view and a plan view, respectively, of the daughter structure 20 after the third step. Here, the daughter structure 20 includes the first conductive coating 2 in the first inverted ridge-shaped notch 21.
6. Correspondingly, the second vertically elongated rectangular parallelepiped recess 24 has a second conductive coating 27, and the first vertically elongated rectangular parallelepiped recess 23 is formed.
Has a third conductive coating 28 and has a second inverted ridged notch 22
Has a fourth conductive coating 29 and the meander-shaped recess 17 has a fifth conductive coating 58,
5 has a sixth conductive coating 59. The second conductive coating 27, the third conductive coating and the fifth conductive coating 58 together form the conductive structure 18 within the cutout 19.

The daughter structure 20 having the conductive layer 25 is formed in the third step following the overall covering of the lower surface of the daughter structure 20 with the conductive layer 25.
The conductive layer 25 was removed parallel to the surface of the lower surface of the daughter structure 20 from the surface of the arrangement shown in FIG. In this case, since the processing direction extends at a right angle to the surface of the daughter structure 20, the reverse ridge-shaped projections 21, 22, 45 and the cut portion 19 are formed.
Only the portion of the conductive layer 25 protruding from is removed from the surface of the daughter structure 20. The conductive layer portion above for another function of the daughter structure 20 is not important and is considered a side effect, but the third step is above all used to form the conductive structure 18 in the cutout 19. It The resulting conductive structure 18 is used, for example, to generate heat from an electric current flowing through the conductive structure 18 and is thus used as a thermal actuator. A particular application of such thermal actuators is integrated optics, where the optical waveguide is exposed to different temperatures to adjust its waveguide properties.

FIG. 5 shows a perspective view of the daughter structure 20 on the positive mold 30. In this case, the positive mold 30 has an outer dimension larger than that of the daughter structure and likewise has the shape of a rectangular disk. On the upper surface of the positive mold 30, a first vertically elongated rectangular parallelepiped waveguide forming element 32 extending at one end to the first ridge-shaped fiber adjusting element 37 extends. A second elongated rectangular parallelepiped waveguide forming element 33 extends substantially parallel to the first elongated rectangular parallelepiped waveguide forming element 32, with a second end at the end facing the first fiber tuning element 37. Ridge-shaped fiber adjusting element 38.
In this, the opposite ends of the second vertically elongated rectangular parallelepiped waveguide shaping element 33 are transferred to the third ridge-shaped fiber adjusting element 41. Similarly, the first vertically elongated rectangular parallelepiped waveguide forming element 3
In No. 2, the end facing the third ridge-shaped fiber adjusting element 41 is transferred to the fourth ridge-shaped fiber adjusting element 42. Each of the ridged fiber adjustment elements 37, 38, 41, 42 directly contacts the opposite edges of the positive mold 30.
A first ridge-shaped adjusting element 34 is provided on the surface of the second vertically long rectangular parallelepiped waveguide forming element 33 opposite to the first vertically long rectangular parallelepiped waveguide forming element 32. The line extends substantially parallel to the longitudinal axis of the second vertically elongated rectangular parallelepiped waveguide forming element 33. Further, on the same side of the second vertically long rectangular parallelepiped waveguide forming element 33, a second corner roof-like adjusting element 35 is arranged, one leg of which is the ridge of the first ridge-like adjusting element 34. Aligned with the line, its second leg extends substantially at a right angle to this ridgeline. Longitudinal rectangular parallelepiped waveguide forming element 3
A third ridge-like adjusting element 31 and a fourth corner roof-like adjusting element 36 are mounted on the positive mold 30 on the surface of the positive mold 30 in mirror symmetry with respect to the center line between the two and 33. ing. Adjusting elements 31, 34, 35, 3
The six interconnecting ridgelines form a "U" shape. Furthermore, the L-shaped projection 39, which has a rectangular parallelepiped cross section, is mounted on the side of the third ridge-shaped adjustment element 31 opposite the fourth corner roof-shaped adjustment element 36, in which case the L-shaped projection 39 One leg extends substantially at right angles to the elongated rectangular parallelepiped waveguide forming elements 32 and 33, and the other leg extends substantially in parallel. The leg of the L-shaped projection 39 that is substantially parallel to the elongated rectangular parallelepiped waveguide forming elements 32 and 33 is provided between the third ridge-shaped adjustment element 31 and the first elongated rectangular parallelepiped waveguide forming element 32. Has a first rectangular parallelepiped projection 43 at its free end, the height of which is greater than the height of the first vertically elongated rectangular parallelepiped waveguide forming element 32. This L having a first rectangular parallelepiped projection 43
Also for the V-shaped projection 39, there is a second L-shaped projection having a second rectangular parallelepiped projection 44, which is arranged in a mirror image with respect to the center line between both the longitudinal rectangular parallelepiped waveguide forming elements 3233. There is a protrusion 40. In the daughter structure 20, the lower surface on which the conductive structure 18 and the inverted ridge grooves 21, 22, 45 are present is directed downward, the upper surface of the positive mold 30.

The daughter structure 20 is mounted on the positive mold described above, the inverted ridges 21, 22, 45 being present on the adjusting elements 31, 34, 35, 36. Adjusting element 31,
Due to the substantially corresponding shapes of 34, 35, 36 and the inverted ridges 21, 22, 45, the daughter structure 20 is adjusted in its position with respect to the elongated rectangular parallelepiped waveguide forming elements 32, 33.

FIG. 6a) shows a cross-sectional view of the positive mold 30 on which the daughter structure 20 is mounted. The third ridge-shaped adjusting element 31 projects at its ridge into the second inverted ridge-shaped groove 22, whereupon it contacts the fourth conductive coating 29. Similarly, the first ridged adjusting element 34 projects at its top into the first inverted ridged groove 21, in which case it makes contact with the electrically conductive coating 26.
Further, the lower surface of the daughter structure 20 rests on the rectangular parallelepiped projections 43 and 44. This entire arrangement on the positive mold 30 is coated with another curable liquid material, for example plastic, the plastic filling the respective gaps of the arrangement. The cured material forms a substrate 50 with the daughter structure 20. Therefore, FIG. 6 b) shows a plan view of the lower surface of the substrate 50. When the substrate 50 is separated from the upper surface of the positive mold 30, the first inverted ridge-shaped recess 55 is formed. Similarly, the first ridge-shaped adjusting element 34 has a second ridge-shaped recess 56 in the substrate 50. The fourth corner roof-shaped adjustment element 36 causes a third inverted roof-shaped recess 72 in the substrate 50, and the second corner roof-shaped adjustment element 35 forms a fourth inverted roof-shaped recess 73 in the substrate 50. Occurs. The second rectangular parallelepiped projection 44 is formed on the substrate 5
A first hole 53 is formed in the substrate 0, and similarly, the first rectangular parallelepiped protrusion 43 forms a second hole 54 in the substrate 50. The first waveguide parallel to the second waveguide 52 formed by the second vertical rectangular parallelepiped waveguide forming element 33 in the substrate 50 by the first vertical rectangular parallelepiped waveguide forming element 32. A conduit 51 is created. Furthermore, the fiber adjustment elements 37, 38, 41, 42
Is the corresponding fiber adjustment groove 5 in the substrate 50.
7, 70, 71 are formed.

Positive mold 30 with daughter structure 20
Substrate 50 is manufactured by reflowing a curable liquid material onto the arrangement consisting of, re-injecting or otherwise applying by suitable method, followed by curing, and separating the resulting substrate 50 from positive mold 30. Has a conductive structure 18 inside and two waveguides 51 on its underside,
52. In this case, the conductive structure 18 is the waveguide 5
It exists in the immediate vicinity of 1,52. Positive mold 30
Are manufactured, for example, from metal, in particular nickel, which at the same time allows for high durability for many applications and good manufacturability of the structure present on its upper surface.

FIG. 7 shows the substrate 50 on the circuit board component (60). The hole 53 is filled with a conductive material 65.
The second ridge-shaped recess 56 is filled with a filler 64 made of a polymer adhesive. Similarly, the first ridge 55 is filled with a polymer adhesive, which is not explicitly shown in FIG. The first waveguide 51 is also filled with a polymer adhesive, which allows the first waveguide 62 to
Exists in the first waveguide 51. Similarly, the second waveguide 52 is filled with a polymer adhesive, which results in a second waveguide 63. By the second L-shaped projection 40, the second
Lead groove 49 is formed, which is also filled with a conductive material to form a second lead 67.
The second lead wire 67 is conductively coupled to the conductive material 65 in the first hole 53. Similarly, the conductive material 65 in the second hole 54 is also conductively coupled to the first lead wire 66 created by filling the first lead groove 48 with another conductive material. The first lead groove 48 was also created by the first L-shaped projection 39 during the manufacture of the cover 50. The substrate 50 is provided on the extension of the vertical axis of the first waveguide 51.
Is a fiber adjustment element 37 in the manufacturing process of the substrate 50.
The fiber adjustment groove 57 produced by Board 50
In a mirror symmetry with respect to the seam between the circuit board part 60 and the circuit board part 60, the circuit board part 60 has a second fiber adjustment groove 61. Both fiber adjustment grooves 57, 61 together form an adjustment hole 68. Another not shown in the figure
One such adjustment hole 68 is present at the remaining end of the waveguide 62, 63 where the other adjustment grooves 69, 70, 71 are already present in the substrate 50. Further, the circuit board component 60 has a guiding groove-like structure 75 that communicates with the second waveguide 63 from the lower surface of the circuit board component 60.

Conductors 66, 67 are used to conduct current to the conductive structures 18 in the substrate 50. For this reason, the L-shaped projections 39, 40 and the inverse structure to the projections in the substrate caused by the associated rectangular parallelepiped projections were filled with metal, for example. In order to fill these structures with metal, it is possible to deposit metal layers in a similar manner and to cut away the metal layer portions protruding from the reverse structure, similar to the method of manufacturing the conductive structure 18. Substrate 50 is adhered to the circuit board component with a curable liquid polymer adhesive in between.

In this case, the circuit board component 60 simultaneously supplements the first fiber adjusting groove 57 with the second fiber adjusting groove in the adjusting hole 68 and, accordingly, in the other adjusting holes, and mechanically integrates the optical integrated circuit which results in this case. Or help protect against other environmental impacts. Further, the substrate 5
0 and the circuit board component are adhered, the polymer adhesive is pushed into the gap between the cover 50 and the circuit board component 60, so that the waveguide 6 is particularly provided in the waveguides 51 and 52.
2,63 occur. Thus, the polymer adhesive is simultaneously used to mechanically bond between the substrate 50 and the circuit board component 60 as well as to form the waveguides 62,63. An optical fiber can be inserted into the adjusting hole 68, and the fiber introduces an optical signal into the waveguides 62 and 63, and the signal is transmitted to the substrate 50.
Again, on opposite sides of the, couple into the optical fiber inserted there. Due to the duct-like structure 75, consideration is given to compensating for the shrinkage which then occurs during the bonding process with the polymer adhesive by externally guiding another polymer adhesive to the second waveguide 63 by means of the duct-like structure 75. ing. So,
No voids occur during the bonding process. In order to be able to post-fill polymer adhesive in several places,
It is also considered to arrange several such duct-like structures 75.

By supplying an electric current through the lead wires 66 and 67 to the conductive structure 18, which is used here as a heat conductive structure, the temperature near the waveguides 62 and 63 changes. Therefore, by intentionally controlling the thermal change, the waveguide 6
It is possible to change 2, 63 waveguide characteristics. Such an arrangement applies especially to digital optical switches or tunable filters.

Another field of application is the use as electrodes for generating electric fields, for example to take advantage of electro-optical effects. To this end, if the counter electrode is otherwise attached, only one lead 66,
The conductive structure 18 with 67 is already sufficient. The structure shown and described represents one example in particular insofar as its shape and cross section can also be implemented in other shapes, for example in semicircular cross-sections or rounded corners. In addition, the method described allows the conductive structure 18 and other integrated optical structures to be simultaneously formed on the common substrate 50.
For example, it is suitable for use for integrating Bragg structures or optical sensors. Depending on the coating method, the conductive layer 25 does not adhere to the vertical walls, but the resulting function of the conductive structure 18 is not changed thereby.

The conductors 66 of the conductive structure 18 illustrated here,
Instead of the contact connection by 67, the conductive structure 18 itself is
It is likewise possible to dimension it at the edge of the substrate 50, of which a part occurs, to be used for direct current supply.

The shapes of the waveguides 62 and 63 are not limited to the example shown here. This can vary significantly in cross-section and course depending on the field of application.

[Brief description of drawings]

FIG. 1 is a perspective view of a parent structure.

FIG. 2 (a) is a side view of the formed daughter structure and parent structure,
(B) is a plan view of the formed daughter structure

FIG. 3 is a side view of a daughter structure having a conductive layer.

FIG. 4A is a side view of the daughter structure after removing the conductive layer, and FIG. 4B is a plan view of the daughter structure after partially removing the conductive layer.

FIG. 5 is a perspective view of a daughter structure and a positive mold.

6A is a cross-sectional view of a positive mold having a substrate, and FIG. 6B is a plan view of the lower surface of the substrate.

FIG. 7 is a partially exploded side view of a board on a circuit board component.

[Explanation of symbols]

 10 Parent structure 11, 12, 15 Building-like projections 13, 14 Vertically long rectangular parallelepiped projections 16, 17 Meander-like projections 20 Daughter structure 21, 22, 45 Reverse building-like groove 23, 24 Vertically long rectangular parallelepiped recess 25 Conductive layer 26, 27, 28,58,59 Conductive coating 30 Positive mold 31,34,35,36 Adjusting element 32,33 Waveguide forming element 37,38,41,42 Fiber adjusting element 43,44 Rectangular parallelepiped projection 39,40 L-shaped projection 48,49 Lead wire groove 50 Substrate 51,52 Waveguide path 56 Building recess 53,54 Hole 57,61 Fiber adjustment groove 60 Circuit board component 62,63 Waveguide 66,67 Lead wire 66,68 Adjustment hole 69 , 70, 71 Adjusting groove 75 Duct structure

Claims (11)

[Claims] 1. A method of manufacturing a conductive structure, comprising the steps of: a) in the first step, a liquid curable material or a plastically deformable material is provided on the parent structure (10) and subsequently cured, and the cured material is removed from the parent structure. Separating or separating the plastically deformable material to produce a daughter structure (20) having at least one cutout (19) on the lower surface, b) in a second step, on the lower surface of the daughter structure (20) A conductive layer (25) covering the surface of the daughter structure (20) in the cut portion (19) is provided on a surface exceeding the size of the cut portion (19), and c) in the third step, the conductive layer (25) is formed. Daughter structure (2
0) from the lower surface of the lower surface of the cut portion (1)
9) A conductive structure (18) is formed in the conductive structure (18). 2. The method for producing a conductive structure according to claim 1, wherein a metal is used as a material of the parent structure (10). 3. The method for manufacturing a conductive structure for an optical integrated circuit according to claim 1, wherein the conductive layer (25) is mechanically removed. 4. The layer thickness of the conductive structure (18) remaining in the cutout (19) after the removal of the conductive material (25) is increased by plating. The method for manufacturing a conductive structure according to item 1. 5. The method for producing a conductive structure according to claim 1, wherein the conductive layer (25) is provided by vapor deposition. 6. At least one groove (21, 22, 45) corresponding to this is formed in the daughter structure (20) by at least one projection (11, 12, 15) present on the parent structure (10). A) In a fourth step, the daughter structure (20) is placed on the positive mold (30), the positive mold (30) including at least one protruding adjusting element (31, 34, 3).
5, 36) in which the element engages at least one groove (21, 22, 45) on the underside of the daughter structure (20) and the positive mold (30) comprises at least one protruding waveguide. A tube-forming element (32, 33), which element is then in the vicinity of the conducting structure (18), and b) in a fifth step the daughter structure (20) present on the positive mold (30), A substrate (50) coated with another curable liquid material and formed of a cured material having a daughter structure (20) therein is separated from the positive mold (30), at least one waveguide formation. Element (3
2. The method of manufacturing a conductive structure according to claim 1, characterized in that 2, 33) form at least one waveguide (51, 52) on the substrate (50). 7. At least one protruding fiber tuning element (37, 38, 41) provided integrally with at least one of the waveguide forming elements (32, 33) on the positive mold (30). , 42) forming at least one fiber adjustment groove (57, 69, 70, 71) in the substrate (50) during the production of the substrate (50). Method. 8. At least one protruding pushing element (46) provided on the positive mold (30) for contacting the conductive structure (18) when the daughter structure (20) is placed on the positive mold (30). , 47), the substrate (5
0) at least one lead groove (48,
49) is formed on the substrate (50), and the positive mold (3
After separating the substrate (50) from (0), the lead wire groove (4
8. A method of manufacturing a conductive structure according to claim 6, wherein a conductive material (65) is introduced into the conductive material (8, 49) to thereby form a conductive wire (66, 67). 9. In the sixth step, the substrate (50) is placed on the circuit board component (60), wherein a curable liquid polymer adhesive is introduced between the substrate (50) and the circuit board component (60). The adhesive is applied to the board (50) and the circuit board component (6
0) and at least one waveguide (5
1, 52), whereby at least one waveguide (62, 63) is formed, the method for producing a conductive structure according to any one of claims 6 to 8. 10. The electrically conductive structure (18) is produced as a heat conducting structure, the heat conducting structure comprising two recesses (23, 24).
And a third recess (17) which joins both recesses together.
A method of manufacturing a conductive structure according to item. 11. A substrate (50) and / or a circuit board component (60) is provided with at least one duct-like structure (75) prior to the introduction of the polymer adhesive, which further cures the adhesive when cured. 10. Method according to claim 9, characterized in that it is filled between the substrate (50) and the circuit board component (60).