JPH0821775B2 - Printed circuit board transfer method and apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for carrying a printed circuit board, in which the carrying speed of the printed circuit board can be arbitrarily changed.

[0002]

2. Description of the Related Art FIG. 4 is a plan view showing the outline of a conventional soldering apparatus, 1 is a printed circuit board, 2 is a soldering apparatus,
3 is a pair of transport chains whose opposing parts run in parallel, 4 is a fluxer, 5 is a preheater, 6 is a solder bath, 7
Is a cooler, 8 is a cleaner, 9 is a free-flow chain on the loading side of the printed circuit board 1, and 10 is the printed circuit board 1.
Is a sprocket of the carrying chain 3, 12 is a holding claw formed on the carrying chain 3, and 13 is a claw cleaning device for the holding claw 12.

Next, the operation will be described. When the printed circuit board 1 is placed on the traveling free flow chain 9,
The printed circuit board 1 is transported in the direction of arrow A, and is transferred to and engaged with the holding claws 12 of the transport chain 3, and the soldering process is performed. Next, the printed circuit board 1 is transferred to the transport chain 3
Is transferred to and transported from the free flow chain 10 on the unloading side that travels from.

[0004]

By the way, in the conventional transporting apparatus for the printed circuit board 1, when the traveling speed of the transport chain 3 for transporting the printed circuit board 1 is based on, for example, the preheater 5, the solder bath 6 is used. Becomes slower and the printed circuit board 1 and electronic components (not shown) mounted on the printed circuit board 1 become overheated.
However, there is a problem in that they are warped and deformed, or electronic components are damaged by heat.

For this reason, the carrier chain 3 was divided to provide another carrier chain (not shown) that travels at a high speed in the solder bath 6, but in this case, the structure of the soldering device 2 is configured. Becomes complicated. Further, when the traveling speed of the transport chain 3 shown in FIG. 4 is increased, the heating time is shortened at the preheater 5 and the length of the preheater 5 must be increased. There is a problem in that the entire apparatus 2 becomes large in size and the cost increases, and the installation area becomes large, resulting in cost.

Further, in recent years, soldering is often carried out in an inert gas atmosphere. For this reason, a soldering apparatus for sealing and soldering a soldering portion is used. In this case, soldering is performed. A shutter for preventing the outflow of the inert gas is provided at the insertion port or the delivery port of the device, and the shutter is opened when the printed circuit board 1 is inserted or delivered, so that the traveling speed of the printed circuit board 1 is slow. There is a problem in that the shutter opening time becomes long and the outflow amount of the inert gas in the soldering apparatus increases.

The present invention has been made to solve the above-mentioned problems, and by moving the printed circuit board held by the holding claws of the carrier chain which travels at a constant speed, a speed different from the traveling speed of the carrier chain. It is an object of the present invention to provide a method of transferring a printed circuit board and a device for the same, the method of transferring the printed circuit board.

[0008]

According to the present invention, there is provided a printed circuit board carrying method, wherein a printed circuit board carrying method comprises a ring-shaped ring formed at a lower end of a board holder made of a rotating body fitted rotatably around a rod forming a chain body. The printed circuit board is placed on and held by the holding claws, and then the printed circuit board held by the holding claws is moved in the same or opposite direction to the traveling direction of the transport chain while rotating the substrate holder to Is transported at a required location at a speed different from the traveling speed of the transport chain.

Further, in the printed board carrying device according to the present invention, a board holder made of a rotating body is rotatably fitted around a rod forming a chain body, and the board holder is attached to a lower end portion of the board holder. An annular holding claw for mounting and holding the printed circuit board is formed, and its longitudinal direction is the same as the traveling direction of the carrier chain on the outer peripheral surface of the side surface of the substrate holder, and abuts on the side surface of the substrate holder. Thus, a pressing piece for rotating the substrate holder to move the printed circuit board held by the holding claw is provided by cooperating with the traveling of the transport chain.

The side surface of the substrate holder is formed on the outer peripheral surface having different radii.

Further, there is provided means for changing the position of the pressing piece in order to change the moving speed of the printed circuit board held by the holding claw.

[0012]

According to the method and apparatus for carrying a printed circuit board of the present invention, an annular holding claw is formed on a board holder that is rotatably attached to a rod of a carrying chain, and the printed board is placed on the holding claw. The printed circuit board in the same traveling direction as the carrier chain by rotating the substrate holder in cooperation with the traveling of the transport chain by bringing the pressing piece into contact with the outer peripheral surface formed on the substrate holder. By moving in the opposite direction, it is conveyed at a speed different from the traveling speed of the conveyor chain.

Further, by bringing the pressing pieces into contact with the outer peripheral surfaces having different radii and further changing the position of the pressing pieces, it is possible to variously change the conveying speed of the printed circuit board.

[0014]

FIG. 1 is a schematic plan view showing an embodiment of the present invention,
2 is a partially cutaway front view showing the main part of FIG. 1, and FIG. 3 is a sectional view taken along the line I-I of FIG. In these figures, the same symbols as those in FIG. 4 indicate the same parts, and 21 indicates the whole of the soldering apparatus. Reference numeral 22 is a carrier chain of the printed circuit board 1, 23 is a chain body of the carrier chain 22, 24 is a guide rail of the carrier chain 22, and a chain guide 25 and a steady rest 26 are formed. 27 is a rod loosely fitted to the chain body 23, 28 is a collar, 29
Is a substrate holder of the printed circuit board 1 rotatably fitted to the rod 27, 30 is an annular holding claw formed on the lower end of the substrate holder 29 for mounting and holding the printed circuit board 1, 31 is A tapered surface formed on the outer peripheral surface of the upper side surface of the substrate holder 29, 32 is a bearing, 33 is a one-way clutch, and the substrate holder 29 is freely rotated in the direction of arrow B in FIG. However, it does not rotate due to the engagement in the direction opposite to the arrow B direction. 34 is a bottom lid for sealing the lower surface of the substrate holder 29,
Reference numeral 35 denotes a long pressing piece, which is the tapered surface 3 of the substrate holder 29.
The contact with 1 causes the carrier chain 22 to move in the direction of arrow A in FIG. 3 to rotate the substrate holder 29 in the direction of arrow B. Reference numeral 36 designates the pressing piece 35 on the tapered surface 31.
It is a pressing part that is pressed against.

The pressing piece 35 is moved by a moving means (not shown) so that the pressing portion 36 is brought into contact with the tapered surface 31 by an arrow C.
Can be moved in any direction. Therefore, the pressing piece 35
The radius of the tapered surface 31 where the pressing portion 36 abuts at the position L indicated by the solid line is r1. Further, the radius of the taper surface 31 by which the pressing piece 35 is in contact with the position M indicated by the two-dot chain line is r2, and the taper surface 31 by which the pressing piece 35 is in contact with the position H indicated by the two-dot chain line. Has a radius of r3. The radius of the holding claw 30 holding the printed circuit board 1 is r0.

Although not shown, the substrate holder 29
The outer peripheral surface of the side surface may have stepped portions with different radii instead of forming the tapered surface 31 or may have a cylindrical shape having the same radius. In these cases, the pressing piece 35 is It moves in the direction of coming into contact with or leaving the outer peripheral surface.

Next, the operation will be described. The printed circuit board 1 mounted on the free flow chain 9 is indicated by an arrow A.
In the direction indicated by arrow A, then is transferred to the carrier chain 22 and placed and held on the holding claws 30 of the substrate holder 29, and further conveyed in the direction of arrow A for soldering processing,
Next, after transferring to the free flow chain 10, it is carried out and taken out. At this time, when the printed circuit board 1 is placed on the holding claw 30 from the free flow chain 9,
If the pressing piece 35 is not in contact with the tapered surface 31 of the substrate holder 29, the speed of the printed circuit board 1 is the same as the traveling speed v0 of the transport chain 22. That is, the transport chain 2
Since the traveling speed v0 of 2 is set in accordance with the time of passing over the preheater 5, it becomes slow when the printed circuit board 1 is transferred to the transport chain 22.

Therefore, in order to increase the transfer speed of the printed circuit board 1, the pressing piece 35 is brought into contact with the taper surface 31, for example, the position L, and the substrate pressing tool 29 is rotated.
The printed circuit board 1 has a traveling speed v0 of the transport chain 22.
The radius r1 of the substrate holder 29 and the radius r0 of the holding claw 30.
The speed obtained by adding the speed obtained by multiplying the ratio of the above by the speed of the transport chain 22 becomes v1 = (r0 / r1) .times.v0 + v0.

In the solder bath 6, the pressing piece 35 is brought into contact with the portion having the smallest radius r3 at the position indicated by the chain double-dashed line H in order to further increase the conveying speed of the printed circuit board 1. Velocity v3 = (r0 / r3) ×
It becomes v0 + v0.

When the cleaning of the printed circuit board 1 is completed and the user moves to the free flow chain 10, the pressing piece 35 is used.
By contacting with the position of the chain double-dashed line M, the intermediate velocity v2 = (r0 / r2) .times.v0 + v0.

Also, at the claw cleaning device 13, the substrate holder 29 is rotated by bringing the pressing piece 35 into contact with the tapered surface 31, so that the entire circumference of the retaining claw 30 can be cleaned.

The engagement direction of the one-way clutch 33 attached to the substrate holder 29 is reversed so that the rotation direction of the substrate holder 29 is set in the direction opposite to the arrow B direction in FIG. By providing the piece 35 on the side where the printed circuit board 1 is held, that is, at a symmetrical position about the rod 27, the pressing piece 35 that abuts the tapered surface 31 is the same as the traveling direction of the transport chain 22 (direction of arrow A). If the printed circuit board 1 moves in the opposite direction with respect to the traveling transport chain 22 when moved in a direction and at a speed higher than the traveling speed of the transport chain 22, the transport chain 22 moves in the direction of arrow A. The speed obtained by the difference between the traveling speed of the printed circuit board 1 and the moving speed of the printed circuit board 1 in the opposite direction with respect to the transport chain 22 is the arrow of the printed circuit board 1. Since the speed of the direction A, the printed circuit board 1 is conveyed in the arrow A direction at a speed slower than the traveling speed of the conveyor chain 22. Therefore, set the transport chain 22 as the reference speed at the highest speed required,
By moving the pressing piece 35 at a required speed, the printed circuit board 1 can be transported at a speed lower than the traveling speed of the transport chain 22. Therefore, as the speed of the pressing piece 35 is increased, the conveyance speed of the printed board 1 in the arrow A direction becomes slower.

Further, the rotation means of the substrate holder 29 is not limited to the above, and other means may be used.

[0024]

As described above, according to the method of transporting a printed circuit board of the present invention, the printed circuit board is formed at the lower end portion of the substrate holder which is a rotating body that is rotatably fitted around a rod forming a chain body as an axis. The printed circuit board is placed and held on the ring-shaped holding claw, and then the printed circuit board held by the holding claw is moved in the same direction or in the opposite direction as the traveling direction of the transport chain while rotating the substrate holder to print. Since the board is transported at the required location at a speed different from the traveling speed of the transport chain, even if the traveling speed of the transport chain is constant, the transportation speed of the printed circuit board can be adjusted to the required speed at the required location depending on the soldering conditions. It has the advantage that it can be easily changed.

Further, in the printed board carrying device of the present invention, a board holder made of a rotating body is rotatably fitted around a rod forming a chain body as an axis, and a printed material is printed on a lower end portion of the board holder. Forming an annular holding claw for mounting and holding the substrate, the longitudinal direction is the same as the traveling direction of the transport chain on the outer peripheral surface of the side surface of the substrate holder, and by contacting the side surface of the substrate holder, Since a pressing piece that rotates the substrate holder to move the printed circuit board held by the holding claws in cooperation with the traveling of the transport chain is provided, the transport chain is divided to change the transport speed of the printed circuit board. Since it is not necessary to provide a high-speed transport chain, the structure of the soldering device can be simplified and the cost can be reduced.

Further, since the side surface of the substrate holder is formed on the outer peripheral surface having a different radius, and the means for changing the position of the pressing piece for changing the moving speed of the printed circuit board held by the holding claw is provided. There is an advantage that the conveying speed of the printed circuit board can be variously changed.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of the present invention.

FIG. 2 is a partially cutaway front view showing a main part of FIG.

3 is a cross-sectional view taken along the line I-I of FIG.

FIG. 4 is a plan view showing the outline of a conventional soldering device.

[Explanation of symbols]

 1 Printed Circuit Board 21 Soldering Device 22 Transport Chain 23 Chain Body 24 Guide Rail 27 Rod 29 Board Holding Tool 30 Holding Claw 31 Tapered Surface 35 Pressing Piece

Claims (4)

[Claims] 1. A method of conveying a printed circuit board, wherein a soldering process is performed while the printed circuit board is held and conveyed by a plurality of holding claws attached to chain bodies of a pair of conveying chains that travel along guide rails. The printed circuit board is placed and held on an annular holding claw formed at the lower end of a substrate holder that is rotatably fitted around a rod that forms a chain body, and then the substrate is held. Moving the printed circuit board held by the holding claws in the same direction as the traveling direction of the transport chain or in the opposite direction while rotating the tool, and transporting the printed circuit board at a speed different from the traveling speed of the transport chain. A method of transporting a printed circuit board, comprising: 2. A printed board carrying device for carrying out a soldering process while holding a printed board by a plurality of holding claws attached to a chain body of a pair of carrying chains running along a guide rail and running the printed board. A board holder made of a rotating body is rotatably fitted around a rod forming a chain body, and an annular holding claw for mounting and holding the printed board is formed at a lower end portion of the board holder. , The longitudinal direction of the outer peripheral surface of the substrate holder is the same as the traveling direction of the transport chain, and the abutment of the substrate holder on the side surface cooperates with the traveling of the transport chain. A printed circuit board transport device comprising a pressing piece for rotating the circuit board holder to move the printed circuit board held by the holding claw. 3. The printed board carrying device according to claim 2, wherein the side surface of the substrate holder is formed on outer peripheral surfaces having different radii. 4. The printed board carrying device according to claim 3, further comprising means for changing the position of the pressing piece to change the moving speed of the printed board held by the holding claws.