JPH08213083A - Live wire inserting-extracting system - Google Patents

Abstract

PURPOSE: To provide a live wire inserting-extracting system which can cope with operation stabilization at live wire inserting-extracting time of a large electric current system with a small and inexpensive structure. CONSTITUTION: Ordinary electric power supply wiring 301 and live wire inserting-extracting electric power supply wiring 302 are arranged on a back plane 30, and both of these are connected to each other by a large capacity coil 303 to restrain a rush current. Connectors 201 having a structure capable of connecting GND, the live wire inserting-extracting electric power supply wiring 302 and the ordinary electric power supply wiring 301 in this order when these the connected to the back plane 30, are arranged in packages 20-1 and 20-2. When the package 20-2 is inserted, in the stage when the GND and the live wire inserting-extracting power supply wiring 302 are connected to each other by the connector 201, the rush current is restrained by the coil 303, and when the ordinary electric power supply wiring 301 is connected, a counterflow of an electric current is restrained by diodes 203, and stable operation can be maintained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system which realizes a predetermined service function by accommodating a plurality of circuit boards in a mother board, if the circuit boards can be inserted and removed without stopping the operation of the system. The present invention relates to a hot-swap method for tightening.

[0002]

2. Description of the Related Art For example, in a system such as an electronic exchange, a circuit board (hereinafter,
In general, a package (abbreviated as a package) is inserted into a mother board (hereinafter referred to as a backplane) to realize a functional operation related to a replacement service or the like.

Since this type of system is basically operated continuously at all times, even if a package needs to be added or replaced due to a package failure, the system is stopped in consideration of the influence on the operation. Can not do it.

For this reason, it is sometimes necessary to insert and remove the package during operation. In such a case, in order to prevent malfunction due to voltage drop of the power supply of the system due to inrush current to the capacitive component of the package. Measures are required.

Such an inrush current is generated because when the power source is applied to the package, the frequency component of the voltage immediately after the application has a wide range, so that the capacitor inside the package initially has a very small impedance. This is to have.

When an inrush current occurs, the voltage-current characteristic of the power supply changes. For example, when the load current of the power source increases due to the inrush current and the normal output voltage decreases as shown in FIG. 5, the operating range of the parts used (in a digital IC, normally ± 5% of the rated voltage is used). Since it falls outside the fluctuation range), malfunction occurs on the system.

As a countermeasure against this malfunction, it is indispensable to consider the voltage change as described above when hot-plugging the package.

As conventional methods for suppressing the change in the power supply voltage during hot-plugging and unplugging, the following three methods A, B, and C have been typical.

A: The package is provided with a circuit configuration as shown in FIG.
In this method, the power source drawn from 0 is supplied to the circuit components inside the package 20 after passing through the coil 210.

In this system, when a voltage is applied by mounting the package 20a on the backplane 30, the resistance value increases due to the characteristics of the coil 210, and the inrush current is suppressed. After that, the capacitor 211
When the voltage becomes stable after charging to the coil 21,
The resistance value of 0 becomes almost "0".

B: The package is provided with the circuit configuration as shown in FIG. 7, the power source is divided in the same manner as in the method A, and the separately divided power sources are connected by the resistor 221.
1, a relay 222 is provided in parallel with the relay control circuit 223.
It is a method of controlling by.

In this method, the package 20b is mounted on the backplane 30, and the resistor 221 is provided between the time when the power source 10 is turned on and the time when the contact K of the relay 222 operates.
Since the capacitor 220 is charged through the rush current, the inrush current can be reduced to the ratio of the voltage and resistance in the steady state, and the voltage fluctuation can be reduced. After that, the relay control circuit 2
23, the contact K of the relay 222 is driven by the resistor 221.
Short circuit.

C: As shown in FIG. 8, a connector 230 for supplying electric power, which is different from the connector 200, is provided on the front surface of the package, and an independent power supply 40 for hot-swap is prepared separately from the normal power supply 10. In this system, the power supply 40 for hot-swap and the normal power supply 10 are turned on in this order.

In this system, first, the package 20c to be inserted is connected by the cable 50 using the connectors 401 and 501 while the power supply 40 for hot-swap is kept in the off state, and then switched on to turn the package 20 on.
Power is supplied to the c from the hot-swap power supply 40. This time,
Since a rush current is generated in the hot-swap power supply 40, the voltage drops for a short time, but since the power supply independent of the normal power supply 10 is used, it does not affect the operation of the system.

Thereafter, the package 20c is attached to the connector 20.
0 is connected to the backplane 30, but at this time, the package 20c has already been supplied with power from the hot-swap power supply 40 and has been charged with the capacity, so that no rush current is generated during insertion and voltage fluctuation Can be suppressed. This does not affect the operation of other packages which are already connected to the backplane 30 and are in operation.

Of the conventional hot-swap methods, the method A is used for the coil 21 in the case of a package with large power consumption.
A large size is required as 0, and when it is mounted on the package 20a, the size cannot be allowed in terms of area. Further, in the method B, in the case of a package with high power consumption, there is no choice but to use a plurality of relays in parallel because of the allowable current per contact of the relay, but in this case, the contact time of each relay contact There is a possibility that a large current may momentarily flow into a single relay and be damaged due to a slight error in the voltage, occurrence of chattering, or the like.

On the other hand, in the method C, since no coil or relay is used, it is possible to deal with a package with large power consumption without causing the problems of the methods A and B. However, this system requires a power supply 40 for hot-plugging and unplugging in addition to the normal power supply 10, resulting in cost increase, and the effect could not be expected unless the order of cable connection and the like was observed.

[0018]

As described above, the above-mentioned conventional hot-swap method is a method of absorbing a power supply fluctuation at the time of hot-swap by providing a coil or a relay between one common power source. It can be roughly divided into a method of absorbing power fluctuations by using two independent power supplies and changing the supply timing of these power supplies.

However, in the former method, considering the order of the coil or the relay, the package that requires a large-capacity power source has a large structure and is not feasible. Further, although the latter method can cope with the increase in capacity, there is a problem in that an independent power source is required, resulting in an increase in cost and an operational limitation on the connection procedure.

It is an object of the present invention to eliminate the above problems and provide a hot-swap system capable of maintaining stable operation during hot-swap of a large current package by using a compact and inexpensive structure. To do.

[0021]

According to the present invention, during operation of a system comprising a mother board and a circuit board that can be inserted into and removed from the mother board, the circuit board can be inserted or removed without hindering the operation. In the hot-swap method, a normal power supply wiring and a power-supply wiring for hot-swap which is branched and connected to the power supply wiring via a coil are provided on the mother board, and the circuit board has the mother board. To the wiring of the circuit board to be inserted into the mother board, grounding wiring, power supply wiring for hot-swap, and normal power supply wiring are connected in this order when connecting to the wiring board. It is characterized in that the connection is made at different timings.

[0022]

In the present invention, the normal power supply wiring and the power supply wiring for hot-swap are provided on the mother board, and these are mounted through the coil, and each circuit board has a power supply for the mother board. As the connecting means, a connector having a terminal structure that is connected to the power supply wiring in a predetermined order when the hot wire is inserted is adopted.

According to this structure, a large-capacity coil, which causes the largest increase in the size of the circuit structure in increasing the capacity, can be arranged on the mother board, that is, outside the circuit board. It is possible to minimize the size increase of the substrate. Further, the above-mentioned terminal structure of each circuit board makes it possible to maintain a desired order of connection without special consciousness in connection operation, and to stably obtain the effect of suppressing voltage fluctuation.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a conceptual diagram showing an example of a schematic structure of a backplane based on a hot-swap system according to an embodiment of the present invention.

According to this embodiment, the backplane 30
As the power supply wiring for supplying electric power to each package 20, two wirings, that is, a normal power supply wiring 301 and a power supply wiring 302 for hot-plugging / unplugging are provided above.

The wiring structure of the power supply wirings 301 and 302 may be a printed wiring pattern, or may be a wiring or harness (cable) structure.

The two power supply wires 301 and 302 are applied with the same voltage by a structure branched from a single power supply 10, but the hot-swap power supply wire 302 is a coil 303.
It is connected to the normal power supply wiring 301 through.

It is desirable that the coil 303 has a large capacity so that it can handle the operation of the package 20 which consumes a large amount of power. In this case, the mounting area of the coil 303 inevitably becomes large, but in the present invention, the coil 303 can be mounted on the backplane 30 as shown in FIG. 1 and commonly used instead of being mounted on each package. With such a structure,
It is possible to realize the mounting adaptable to the large capacity without affecting the mounting area of the package 20 and the like.

On the other hand, the package 20 corresponding to the structure of the back plane 30 can be realized by a structure as shown in FIG. 2, for example. That is, the package 20 first has the connector 201 for connecting the power source, and the connector 201
In addition to the above-described normal power supply wiring 301 and hot-swap power supply wiring 302, a wiring section for connecting to GND (ground wiring) is provided in the.

Inside the package 20, a functional circuit 202 for realizing a desired function is connected between the normal power supply wiring 301 and GND, and a capacitor 204 for charging is connected in parallel with the functional circuit 202.

The normal power supply wiring 301 and the hot-swap power supply wiring 302 are connected via a diode 203. This diode 203 is package 20
Is a circuit means for preventing current from flowing backward from a package already mounted on the backplane 30 to the package 20 to be inserted when the is inserted into the backplane 30.

Further, in the package 20 of the present embodiment, the connector 201 is structurally improved to define the connection order to the power supply wirings and the like.

FIG. 3 shows a cross-sectional structure in the vicinity of the connector 201 of the package 20 of this embodiment, in which the GND pin 2010, the hot-swap power supply pin 2011 and the normal power supply pin 2012 which constitute the connector 201 are the same. As shown in the figure, the GND, the normal power supply wiring 301, and the hot-swap power supply wiring 302, which are the connected sides, are formed to have different lengths.

Here, these pins 2010 and 201
The length of 1, 2011 is GN with respect to the connected side.
It is designed to have a sequence structure in which D, the hot-swap power supply wiring 302, and the normal power supply wiring 301 are connected in this order.

Next, an operation procedure for hot-plugging and unplugging using the package 20 and the backplane 30 having the above-mentioned structure will be described.

FIG. 4 is a conceptual diagram showing an example of the mounting state of the package 20 according to the present invention on the backplane 30. In the figure, 20-1 indicates a package already mounted, and 20-2 indicates a package to be hot-plugged.

When the package 20-2 is inserted, the GN is first set by the structure of each pin of the connector 201 shown in FIG.
D, connection with the hot-swap power supply wiring 302 is made, and the hot-swap power supply is turned on. At that time, the coil 3 provided between the hot-swap power supply wiring 302 and the normal power supply wiring 301
The action of 03 suppresses the rush current into the package 20-2.

Further, after the capacitor 204 in the package 20-2 is sufficiently charged from the hot-swap power supply, the normal power supply wiring 301 is connected. As a result, the voltage difference between the package 20 and the backplane 30 can be reduced, and the power supply fluctuation during hot insertion can be suppressed.

When the hot wire is inserted, the power supply wiring 30 for hot wire insertion / removal is added to the package 20-2 to be inserted from the already mounted package 20-1.
Package 20-1 so that current does not flow back through 2
The diode 203 therein acts.

By the above-described series of sequences, it is possible to suppress the voltage fluctuation and stabilize the operation even when the package 20 is inserted and removed during the system operation.

[0041]

As described above, according to the present invention,
Mount normal power supply wiring and power supply wiring for hot-swap on the backplane through coils, and use a connector structure that can be connected in a predetermined sequence to the package when inserting into the backplane. Therefore, the structure in which the coil is provided outside the package allows the package to be kept compact without being affected by the large coil for increasing the capacity, and requires an independent power source by using a single power source. It is possible to realize a system configuration that is more cost effective than the case of performing.

Furthermore, the combined use of the connector structure having the above connection sequence eliminates the operational restriction for protecting the mounting order and contributes to the stabilization of the voltage fluctuation suppressing effect at the time of hot-plugging and unplugging the system using a large current. Has excellent advantages.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing an embodiment of a backplane based on a hot-swap system of the present invention.

FIG. 2 is a conceptual diagram showing an embodiment of a package based on the hot-swap system of the present invention.

3 is a conceptual diagram showing an example of a sectional structure of a connector of the package in FIG.

FIG. 4 is a conceptual diagram showing an example of a package insertion / extraction mode for / from a backplane based on the hot-swap system of the present invention.

FIG. 5 is a diagram showing an example of power output characteristics when hot-plugging and unplugging.

FIG. 6 is a circuit diagram showing an example of a package based on a conventional hot-swap system.

FIG. 7 is a circuit diagram showing another example of a package based on a conventional hot-swap system.

FIG. 8 is a circuit diagram showing still another example of a package based on a conventional hot-swap system.

[Explanation of symbols]

 10 Power Supply 20, 20-1, 20-2 Package 201 Connector 2010 GND Pin 2011 Power Supply Pin for Hot Swap 2012 Normal Power Supply Pin 202 Circuit 203 Backflow Prevention Diode 204 Capacitor 30 Backplane 301 Normal Power Supply Wiring 302 For Hot Swap Power wiring 303 coil

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shunroku Ogino 1-3-1, Asahigaoka, Hino City, Tokyo 1 Toshiba Toshiba Communication Systems Engineering Co., Ltd.

Claims (4)

[Claims] 1. A hot-swap method for realizing insertion or removal of the circuit board during operation of a system including a mother board and a circuit board that can be inserted into and removed from the mother board without disturbing the operation. On the board, a normal power supply wire and a power supply wire for hot-swap that is branched and connected to the power supply wire via a coil are provided, and the circuit board has a ground wire and a live wire when connecting to the mother board. Each wiring of the circuit board to be inserted into the mother board is equipped with a connecting means having a structure in which a power supply wiring for inserting / removing a wire, a normal power supply wiring, and a signal wire necessary for the system operation are connected in order The hot-swap method is characterized in that connection to the connection is made at different timings. 2. A hot-line insertion / removal method that realizes insertion or removal of the circuit board during operation of a system including the mother board and a circuit board that can be inserted into and removed from the mother board during operation. On the board, a normal power supply wire and a power supply wire for hot-swap that is branched and connected to the power supply wire via a coil are provided, and the circuit board has a ground wire and a live wire when connecting to the mother board. Power supply wiring for wire insertion / removal and normal power supply wiring are connected in this order, and a connecting means is provided so that the circuit board to be inserted into the mother board is connected to the respective wiring at different timings. The hot-swap method, which is characterized by 3. The circuit board according to claim 2, further comprising circuit means for preventing backflow of current from the circuit board already inserted in the mother board to the circuit board about to be hot-inserted. Hot-plugging and unplugging method. 4. A hot-swap method for realizing insertion or removal of the circuit board during operation of a system including a mother board and a circuit board that can be inserted into and removed from the mother board during operation. Two power supply wirings, a first power supply wiring and a second power supply wiring branched from one power supply, are provided on the board, and the second power supply wiring is connected to the first power supply wiring via a coil. Connection means having connection terminals of different lengths are provided, and when the circuit board is inserted into the mother board by the connection means, the connection timings to the first and second power supply wirings are made different from each other. A hot-swap method that is characterized by