JPH08209004A - Electrical/electronic part with contact point and thermoplastic resin composition therefor - Google Patents

Abstract

PURPOSE: To obtain the subject composition capable of suppressing the generation of an organic gas contributing to contact failures of the subject parts even without performing degassing treatment by vacuum baking, and capable of markedly improving the contact reliability and mechanical service life of the parts through generating necessary and sufficient amount of an aliphatic polyol gas acting as a contact-protective component, and also of generating no sticking simultaneously. CONSTITUTION: This composition is obtained by blending 100 pts.wt. of a thermoplastic resin such as polybutylene terephthalate generating 1,4-butylene glycol gas at >=0.5ppm when heated at 150 deg.C for 2h with 0.2-10 (pref. 0.5-5) pts.wt. of a polyol such as 1,4-butylene glycol, 1,5-pentanediol or polyethylene glycol. The characteristic of the objective electrical/electronic part such as a relay or switch is to contain a molded structural body made form this composition and an electric contact point, as constituents.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding material for the above-mentioned resin-molded structure in a contact electric / electronic component including electric contacts and a resin-molded structure as constituent elements, as represented by, for example, switches and relays. The present invention relates to a thermoplastic resin composition for electric contact / electrical parts used, and an electric contact / electrical part provided with a molded structure made of the thermoplastic resin composition. More specifically, a thermoplastic resin composition for contact electric / electronic parts, which is effective for preventing contact failure of electric contacts of contact electric / electronic parts such as relays and switches, and a structure formed from the thermoplastic resin composition. The present invention relates to a contact electric / electronic component having a body.

[0002]

2. Description of the Related Art Generally, contact electrical and electronic parts such as switches and relays are
Not only is high flame retardancy required, but because of the implication of achieving the miniaturization and weight reduction that the contact electric / electronic parts are always aiming for, the resin molded structure that is a part of the component is A complex molded structure is required, and in addition to electrical and mechanical life, it is also required to prevent sticking (a general term for welding between contacts, locking, adhesion, etc.).

As resin molding materials that meet such various requirements, thermoplastic resins called engineering plastics such as polyester resins, polyamide resins and polycarbonate resins, which are generally excellent in mechanical properties and electrical properties, have hitherto been used. , A thermoplastic resin containing various additives such as an epoxy resin containing a brominated bisphenol compound, pentabromobenzyl polyacrylate (PBBPA), a brominated polycarbonate oligomer, and other organic halogen-based or phosphorus-based flame retardants. The composition has been used.

However, a conventional general thermoplastic resin composition containing various additives as described above is used as a molding material for a resin molding structure in a contact electric / electronic component having electric contacts such as a relay and a switch. In that case, during and / or after the molding of the resin molded structure, the organic gas generated by the thermal decomposition of the resin or the additive undergoes a mechanochemical reaction with the metal (eg, Ag) surface of the electrical contact to form brown powder. In addition, the contact surface is likely to cause black powder by reacting with the contact surface through an arc to increase contact resistance and cause contact failure. Is a big problem. In addition, there is a problem that the organic gas directly reacts with a molding die in a high temperature state and causes corrosion of the die.

Among the contact electric / electronic parts, in particular, in the sealed type electric / electronic parts such as a relay for a communication device and a seal switch, which are sealed with a resin material for downsizing and improvement of reliability, Since the organic gas generated from the resin molded structure does not escape to the outside and accumulates inside the component, it reacts with the electrical contacts, the joints, and the joints, and the contact failure increases due to the increase in contact resistance.

In order to solve the above-mentioned problems such as poor contact due to the generation of organic gas, in general, in order to eliminate the influence of the organic gas component generated from the resin molding structure on the electrical contact portion and the like. In addition, a resin molded structure that has been degassed by vacuum baking has been used as a component of a contact electric / electronic component.

However, in the case of the degassing treatment method by vacuum baking, not only there is a problem of low productivity and cost increase, but also the molded structure loses luster and its toughness decreases and becomes brittle. Molding powder tends to come out, and this mixes in and causes contact failure. Further, if the degassing process becomes excessive, there is a problem that sticking occurs, and in order to prevent this sticking, a contact electric / electronic component including a molded structure molded by a degassing process method by vacuum baking. Method of further adhering a lubricant to the surfaces of the electric contacts and sliding parts (Japanese Patent Publication No. 63-5434) or a method of incorporating a felt impregnated with a lubricant into a contact electric / electronic component (special Japanese Patent Publication No. 62-195090) and the like have been proposed, but if such a method is adopted, new problems such as an increase in the number of steps and the number of parts at the time of manufacturing electric / electronic parts will occur.

On the other hand, in the case of the degassing treatment method by vacuum baking, if the degassing treatment is insufficient, the problem of contact failure due to the remaining organic gas cannot be avoided. Therefore, when a conventional general thermoplastic resin composition is used as a molding material,
In order to prevent poor contact and sticking, it is necessary to optimize the degassing treatment conditions by vacuum baking depending on the purpose and application of the molded structure, which is time and It is labor intensive and not easy.

On the other hand, since it is thought that the main cause of the generation of the organic gas is the volatile component, a resin composition in which the volatile component is reduced in order to shorten the vacuum baking treatment time is disclosed in JP-A-6-9858. Japanese Patent Publication No. 6-15788
It is proposed in Japanese Patent Publication No. 1 and the like.

That is, in Japanese Unexamined Patent Publication No. 6-9858, it is estimated that the decomposition gas generated at the time of molding and using the molded structure is composed mainly of tetrahydrofuran (THF) to reduce the generation of THF. Therefore, it has been proposed to use polybutylene terephthalate having a low concentration of terminal hydroxyl groups, and in JP-A-6-157881, the drying time of the resin composition before molding under a hot air flow is extended to evaporate volatile components. However, even with these methods, it was not possible to prevent the occurrence of contact failure and sticking.

The present invention has been earnestly studied in view of the above-mentioned circumstances, and it is possible to prevent contact failure and sticking and to significantly improve contact reliability without performing degassing treatment by vacuum baking. Can be realized,
Reed contact electric / electronic component resin composition capable of maintaining stable contact performance even at low frequency switching and contact reed electric having a structure molded from the thermoplastic resin composition
The purpose is to provide electronic components.

[0012]

As a result of intensive studies to achieve the above-mentioned object, the present inventors have found that it is a specific organic gas different from the above-mentioned volatile components that adversely affects the electrical contacts. On the other hand, when a certain amount of an aliphatic polyol gas having a boiling point of 180 ° C. or higher is present, the gas acts as a contact protection component and suppresses contact failure, and a resin molding material that produces only such a useful gas. As a result of studying the above, the present invention has been achieved.

That is, the present invention is based on the thermoplastic resin 100.
The gist is a thermoplastic resin composition characterized by being blended with 0.2 to 10 parts by weight of a polyol, preferably 0.5 to 5 parts by weight with respect to parts by weight. Also, the present invention
A contact electric / electronic component including a molded structure made of the above-mentioned thermoplastic resin composition and an electric contact as constituent elements is also a gist.

The present invention will be described in detail below. The thermoplastic resin used in the thermoplastic resin composition for contact electric / electronic parts according to the present invention is not particularly limited, and examples thereof include polyester resin, polycarbonate resin, polyamide resin, polyacetal resin, polyphenylene sulfide resin and the like. The polymer alloy which makes it a main component is mentioned. Examples of the polyester resin include polyalkylene terephthalates such as polyethylene terephthalate and polybutylene terephthalate, and liquid crystal polyesters having a melt anisotropy represented by a copolymer of polyethylene terephthalate and oxybenzoic acid.
Of these, more preferred are polyalkylene terephthalates such as polyethylene terephthalate and polybutylene terephthalate, and most preferred are polybutylene terephthalate resins.

The polybutylene terephthalate resin used as the most preferable thermoplastic resin in the present invention is
It is a polymer obtained by polycondensing 1,4-butylene glycol and terephthalic acid or its ester, and may be a copolymer containing 70% by weight or more of butylene terephthalate units. As the monomer to be copolymerized,
As a dibasic acid component other than terephthalic acid or its ester, when isophthalic, naphthalenedicarboxylic acid, adipic acid, sebacic acid, trimellitic acid, succinic acid and the like aliphatic, aromatic polybasic acid, or an ester-forming derivative thereof, Examples thereof include hydroxycarboxylic acids such as hydroxybenzoic acid and ester-forming derivatives thereof.

As glycol components other than 1,4-butylene glycol, alkylene glycols such as ethylene glycol, diethylene glycol, propylene glycol, trimethylene glycol, hexamethylene glycol, neopentyl glycol, cyclohexanedimethanol, bisphenol A, 4 , 4'-dihydroxybiphenyl and other aromatic diols, bisphenol A
Ethylene oxide 2mol adduct, bisphenol A
Alkylene oxide adduct alcohol such as propylene oxide 2 mol adduct.

Among the polybutylene terephthalate resins, particularly preferable is 0.5 when heated at 150 ° C. for 2 hours.
It produces ppm, preferably 1 ppm or more of 1,4-butylene glycol gas. This is because 1,4-butylene glycol gas has a function as an electrical contact protection component, and therefore, when heated at 150 ° C. for 2 hours, the amount of 1,4-butylene glycol gas produced is 0.5 p.
If it is less than pm, the effect of improving contact failure of the obtained contact electric / electronic component may be insufficient. In addition, 1,4
-As a specific detection method for butylene glycol gas, first, pelletized resin is put in a 26 ml vial bottle.
After being charged and sealed, the bottle is heated at 150 ° C. for 2 hours, and the generated gas is measured.

The polybutylene terephthalate resin capable of generating a certain amount of gas or more as described above has an intrinsic viscosity of 0.7 to 0.7 obtained by a melt polymerization method or a solid phase polymerization method, preferably a melt polymerization method having a low reaction rate. It is preferably in the range of 1.4 dl / g, more preferably 0.7 to 1.1 dl.
/ G range, particularly preferably 0.7 to 0.75
It is in the range of dl / g. The intrinsic viscosity here is a value measured at 30 ° C. using a mixed solution of phenol and tetrachloroethane in a weight ratio of 1: 1 as a solvent.

As the polyol used in the present invention,
Ethylene glycol, 1,2-propylene glycol,
1,3-propylene glycol, 1,2-butylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, 2,3-butylene glycol, 1,5-
Pentanediol, hexylene glycol, octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, glycerin, polyethylene glycol, polypropylene glycol, polybutylene glycol, and polyglycerin may be mentioned. Of these, a polyol having a molecular weight of 5000 or less is particularly preferable. If the molecular weight is too high, the amount of glycol-based gas having a contact protection effect is insufficiently produced, which is not preferable. For example, when polyethylene glycol is used, it preferably has a molecular weight of 5000 or less. When polytetramethylene glycol is used, the molecular weight is 100
Those of 0 or less are preferable.

The amount of the above-mentioned polyol compounded is 0.2 to 1 with respect to 100 parts by weight of the polybutylene terephthalate resin.
0 parts by weight. If the amount is less than 0.2 part by weight, the glycol-based gas is not sufficiently generated, which is not preferable. Further, if the blending amount exceeds 10 parts by weight, mechanical properties are deteriorated, which is not preferable. The lower limit of this blending amount is preferably 0.5 parts by weight, more preferably 1 part by weight, considering the amount of glycol-based gas produced. Further, the upper limit of the blending amount is preferably 5 parts by weight in consideration of mechanical properties. Further, in the present invention, when the polyol is kneaded with the above-mentioned polybutylene terephthalate resin which produces a certain amount of 1,4-butylene glycol gas, the terminal hydroxyl group of the polyol reacts with the molecular chain of the polybutylene terephthalate resin, and further 1 It is particularly preferable because it produces 1,4-butylene glycol gas and acts as a contact protection component.

The resin composition for electric contact parts of the present invention, when heated at 150 ° C. for 2 hours, contains an aliphatic polyol gas having a boiling point of 180 ° C. or higher at 0.5 ppm to 5000 p.
Those that produce pm are preferred. Such gas acts as a contact protection component on the electrical contacts, and has the effect of suppressing an increase in contact resistance. Here, as the aliphatic polyol gas having a boiling point of 180 ° C. or higher, specifically, ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,2-butylene glycol, 1,
3-butylene glycol, 1,4-butylene glycol, 2,3-butylene glycol, 1,5-pentanediol, hexylene glycol, octylene glycol, diethylene glycol, dipropylene glycol,
Examples include triethylene glycol, glycerin, polyethylene glycol, polypropylene glycol, polybutylene glycol, and polyglycerin. 180 ° C boiling point
When the production amount of the above aliphatic polyol gas is less than 0.5 ppm, when opening and closing electrical contacts such as relays and connectors,
The contact resistance between the contacts is increased, and poor contact is likely to occur. However, when the resin composition is heated at 150 ° C. for 2 hours, a gas containing an organic compound having an aromatic ring in the molecule and / or a carbon-carbon double bond or a carbon-carbon in the molecule.
It is desirable that the gas containing an organic compound having a carbon triple bond and having 5 or more carbon atoms has a production amount less than a certain amount. Specific examples thereof include benzene, toluene, butylhydroxytoluene, xylene, styrene, phenol, 2,6-di-tert-butylphenol and cresol.

The amount of gas produced from these organic compounds is preferably less than 0.1 ppm, more preferably 0.1.
It is less than 01 ppm. If this amount is too large, the contact resistance of the electrical contact increases, causing poor contact, which is not preferable. The specific gas detection method is described in 1,4-
This is the same as the method for detecting butylene glycol gas.

In the resin composition of the present invention, if necessary, other thermoplastic resins such as polyamide, polycarbonate, polyethylene terephthalate, liquid crystal polyester, etc. may be added to the entire resin composition as long as the effects of the present invention are not impaired. A polymer alloy can be prepared by blending it in the range of 50% by weight or less. Further, in order to impart desired properties depending on its purpose, known substances generally added to thermoplastic resins, for example, flame retardants, flame retardant aids, inorganic fillers, lubricants, antioxidants, various stabilizers, Impact modifiers, plasticizers, release agents, colorants, crystallization accelerators and the like can be added.

Examples of the flame retardant include halogen flame retardants, phosphorus flame retardants, and the like, preferably halogen flame retardants, and particularly halogenated aromatic compounds.
Specific examples thereof include brominated phenoxy resin and brominated epoxy resin, and brominated epoxy resin is particularly preferable. As the flame retardant aid, antimony compounds, preferably antimony oxide such as antimony trioxide and antimony pentoxide are used. Here, a double salt of antimony pentoxide and an alkali metal oxide is more preferable because it has an action of suppressing the generation of halogen gas that increases electrical contact resistance, and among them, a double salt of γ-butyrolactone that induces contact failure is preferable. Small amount (Na ₂ O) _1.0 (Sb
₂ 0 ₅₎ is preferably used an antimony compound represented by _1.0. The blending amount of the flame retardant is 1 to 50 parts by weight with respect to 100 parts by weight of the polybutylene terephthalate resin,
The amount is preferably 10 to 30 parts by weight, and the amount of the flame retardant auxiliary compounded is 10% by weight of polybutylene terephthalate resin.
0.1 to 30 parts by weight, preferably 0.
5 to 20 parts by weight.

Examples of the inorganic filler include fibrous fillers such as glass fiber, carbon fiber, silica fiber, silica-alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, potassium titanate fiber and gypsum fiber, carbon black. , Silica, quartz powder, glass beads, glass powder, calcium silicate, kaolin, talc, clay, mica, and the like. Among them, it is preferable to use glass fiber, but a sizing agent for the glass fiber to be used, etc. Since a gas component that adversely affects the electrical contacts is generated from the above, it is desirable to select a gas component that generates less such gas component.

As an embodiment of the thermoplastic resin composition according to the present invention, for example, as shown in FIG. 1, a movable block 3 is rotatably mounted at the center of the upper surface of an electromagnet block 2 housed in a box-shaped base 1. There is a sealed electromagnetic relay 5 which is supported and in which the case 4 is fitted into the base 1 in a sealed state.
In this sealed electromagnetic relay 5, the main body 1a of the base 1, the spool 2a of the electromagnet block 2, the central connecting portion 3a of the movable block 3 and the case 4 are formed from the thermoplastic resin composition of the present invention. However, it is not necessary to mold all of these structures from the thermoplastic resin composition of the present invention, and the molding material for other structures may be appropriately selected.

As another embodiment, as shown in FIG. 2, a molded structure such as a PB substrate 8 having a contact mechanism 6 and a joint portion 7 and a case cover 9 is formed from the thermoplastic resin composition of the present invention. Molded closed relay 10 for communication equipment
Alternatively, as shown in FIG. 3, a microswitch 14 formed by molding a molded structure such as a housing 12 having a contact mechanism 11 and a push button 13 from the thermoplastic resin composition of the present invention, or as shown in FIG. In addition, a connector socket 17 formed by molding a housing 16 in which a large number of terminal groups 15 are integrally implanted by insert molding from the thermoplastic resin composition of the present invention, or a pin-shaped terminal 18 is inserted as shown in FIG. A connector 22 formed by molding a thermoplastic resin composition of the present invention into a socket body 19 which is integrally penetrated and fixed by molding and a plug body 21 which internally houses a contact 20 which is electrically conducted by engagement of the pin-shaped terminal 18. Or
As shown in FIG. 6, there is a photoelectric sensor 24 formed by molding the tip portion 23 of the thermoplastic resin composition of the present invention.

In addition to the above, although not shown, the present invention can be applied to various electric / electronic parts including electric contacts such as actuators, microsensors, microactuators and the like, and molded structures as components, In any of the embodiments, there is little generation of organic gas that causes poor contact of electrical contacts, and an aliphatic polyol gas having a boiling point of 180 ° C. or higher, which has a contact protection function, is generated for a long period of time to suppress an increase in electrical resistance. Have a function to do. In particular, it is effective when used for electric / electronic parts such as relays for communication devices, closed switches, etc., in which electric contacts are placed in an atmosphere in which the polyol gas is not easily dissipated.

The relay, switch, and
Metals used for electrical contacts such as connectors and sensors include Au, Au-Ag, Pt-Au-Ag, Ag, Ag.
-C, Ag-CdO, Ag-Ni, Ag-NiO, Ag
_{-In 2 O 2, Ag-SnO} 2, Ag-In 2 O 2 -S
nO ₂ , Ag-Pd, Pd, Pd-Ru, Pd-Ni,
Rh, Ni, Sn-Ni, Sn-Pd, etc. can be mentioned.

[0030]

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples without departing from the gist thereof. <Example 1> Polybutylene terephthalate resin having an intrinsic viscosity of 0.7 dl / g measured at 30 ° C using a mixed solution of phenol and tetrachloroethane in a weight ratio of 1: 1 obtained by melt polymerization (150 1.4-butylene glycol gas amount generated when heated at 2 ° C. for 2 hours is 1.4 ppm): 100 parts by weight, brominated epoxy resin having a structure represented by the following chemical formula (molecular weight: 400)
00, epoxy equivalent 20000): 22 parts by weight, polyethylene glycol (molecular weight 200): 1 part by weight, (Na
₂ O) _1.0 (Sb ₂ O ₅ ) _1.0 Pellets composed of a resin composition obtained by mixing 11 parts by weight of a double salt of an alkali metal oxide and antimony pentoxide, and 24 parts by weight of glass fiber. , Manufactured by a predetermined method. That is, first, additives other than glass fiber and polybutylene terephthalate resin were blended and uniformly blended, and then the obtained mixture was side-fed with a predetermined amount of glass fiber using a twin screw extruder with a screw diameter of 37 mm and L / D33. I pushed it out. The cylinder temperature was 245 ° C., and the pressure was reduced from the vent port located in the middle of the glass fiber feed port and the die to perform melt mixing while removing volatile components. The strand extruded from the die was cooled with water and then cut to obtain a pellet-shaped sample of the resin composition.

[0031]

Embedded image

<Comparative Example 1> A pellet-shaped sample made of a resin composition was produced in the same manner as in <Example 1> except that polyethylene glycol was not added. <Comparative Example 2> As a polybutylene terephthalate resin,
Using polybutylene terephthalate resin having an intrinsic viscosity of 0.85 dl / g obtained by solid phase polymerization (the amount of 1,4-butylene glycol gas generated when heated at 150 ° C. for 2 hours is 0.6 ppm), A pellet-shaped sample made of the resin composition was produced in the same manner as in <Example 1> except that polyethylene glycol was not added.

For each of the pellet-shaped samples shown in the above <Example 1>, <Comparative Example 1> and <Comparative Example 2>, 1, 4
-The amount of heated gas containing butylene glycol gas, the flame retardancy, and the resistance value between contacts of the relay were measured to evaluate various physical properties and the life of the relay. The results are shown as a chart in FIGS. 7 and 8.

The method for measuring the amount of heating gas containing 1,4-butylene glycol gas and the flame retardancy, which were used for the evaluation of the above physical properties, were carried out as follows. 1. Qualitative Analysis of Organic Gas Components GC / MS (Gas Chromatograph / Mass Spectrometer, Perkin Elmer, HS-101 / GC-8700 / S
Outgas was evaluated by measuring the value of the amount of outgas with respect to the retention time using PB-1 / ITD). Using a vial having a volume of 26 ml, the sample collection amount is 1.00 g, the outgas generation condition is 120 ° C.,
Column oven temperature for 9 hours is 35 ° C., 3 min (holding) → 10 ° C./min (heating) → 200 ° C. → 30 ° C./m
in (temperature rise) → 250 ° C., 5 min (holding). 2. Measurement of gas generation amount of organic gas component 5 g of a sample (pellet of resin composition) was sealed in a vial having a volume of 26 ml and heated at 150 ° C. for 2 hours. The evolved gas was analyzed by gas chromatography. The weight of the generated gas was shown in ppm with respect to the weight of the sample. The measurement conditions are shown below. Equipment: Shimadzu Gas Chromatograph GC-14
A type column: Capillary column OV-17 type Column temperature = 50 ° C. (1 min) 50 to 280 ° C. (5 ° C./min) Carrier gas: Nitrogen detector: FID data processing device: Shimadzu Chromatopack CR7A type 3. Flame-retardant In accordance with the method of UL94 standard of Underwriters Laboratory, evaluation was performed using 5 sample pieces having a thickness of 1/32 inch.

On the other hand, as a method of evaluating the life of the relay, the one obtained by cutting the top plate of the relay shown in FIG. 1 and 60 g of the sample are sealed in a glass container having an internal volume of 110 ml, and the glass container is heated at 85 ° C. in an oven. Set to the inside, apply the drive voltage of 5V5Hz of the relay coil from the drive circuit, and 0V, 10V-10mA, 28V between the contacts of the relay.
A direct current voltage of -100 mA was applied from the power supply device. The relay was stopped and the resistance value between the contacts of the relay was measured with an ohmmeter every predetermined number of times of operation. A contact having a resistance value between contacts of 100 mΩ or more during 2.5 million operations was determined to be a defective contact, and the ratio to the total number of contacts used in the test was defined as the defective rate. In addition, even when this test was carried out without inserting the sample, it was measured as a blank.

As is apparent from the table of FIG. 7 showing the measurement results of the heated gas generation amount and flame retardance, <Example 1>.
Acts on the electrical contact as a contact protection component and suppresses the increase in contact resistance, and the generation amounts of 1,4-butylene glycol and other polyol gases are <Comparative Example 1> and <Comparative Example 2>.
It is much more than>. Therefore, it can be seen that the contact resistance of the contact is stable.

Further, as is clear from the result of evaluating the life of the relay shown in FIG. 8, in the case of <Example 1>, irrespective of the magnitude of the applied voltage between the contacts, the contacts were contacted during 2.5 million operations. It was found that the rate of occurrence of defective contacts having a resistance value of 100 mΩ or more was 0%, and the life was longer than that in <Comparative Example 1> and <Comparative Example 2>.

Further, the present inventor, in connection with the evaluation of the above-mentioned relay life, has examined the mechanical life characteristics of the contacts of the relay including the structure molded from the thermoplastic resin composition of the present invention as a constituent element. Evaluation was performed by measuring the contact resistance (CR) between the contacts as a function of the number of times the contacts were opened and closed. The contact used for this measurement is of Au-Ag system. For relays placed in an atmosphere of 85 ° C, (1) voltage 50V, 100mA, (2) voltage 28
V, 100mA, (3) Voltage 10V, 10mA, (4)
The contact resistance of the contact was measured under a load of 0 V and 0 mA at a contact opening / closing frequency of 5 Hz until the number of contact opening / closing reached 2.5 million times. The number of measurement samples is 10,
The sample used is the sealed electromagnetic relay shown in FIG. 1 molded from the thermoplastic resin composition of <Example 1>, and this electromagnetic relay has not been degassed by vacuum baking.

The measurement results of the mechanical contact life characteristics are shown in FIG. 9 for (1), FIG. 10 for (2), and FIG. 11 for (3).
(4) was as shown in FIG. 9 to 1
2 is shown as an average value of the contact resistance under each load condition obtained from 10 samples, and here, when the contact resistance exceeds 100 mΩ, the mechanical contact life is defined.

As is clear from the above-mentioned measurement results of mechanical contact life characteristics, the electromagnetic relay of the present invention shows almost no increase in the contact resistance value of the contact under any load condition. Even if the number of contacts is 2.5 million times, the contact resistance is at the threshold hold.
It does not exceed 0 mΩ. It was therefore found to have a very long mechanical contact life.

Furthermore, the present inventor has the presence of (5) 1,4-butanediol at the contact of the sealed electromagnetic relay shown in FIG. 1 which includes the structure molded from the thermoplastic resin composition of the present invention as a constituent element. Below, (6) In the presence of polyethylene glycol and (7) In the presence of 1,5-pentanediol, the electrical life characteristics were evaluated by measuring the contact resistance (CR) between contacts as a function of the number of times of contact opening and closing. Was done. The contact used for this measurement is Au-Ag.
System.

The measurement results of the above electrical contact life characteristics are
(5) is as shown in FIG. 13, (6) is as shown in FIG. 14, and (7) is as shown in FIG. 15, and any one of the above 1,4-butanediol, polyethylene glycol, and 1,5-pentanediol is used as the polyol. Even when used, the number of contact switching operations is 2
Even if it reaches 500,000 times, the contact resistance does not exceed 100 mΩ, which is the threshold value.
When 4-butanediol is used, the number of contact closures is 3
It was found that the contact resistance did not exceed the threshold value of 100 mΩ even after exceeding, 000,000 times, and the electrical contact life was excellent.

Furthermore, the inventor of the present invention includes as a constituent element a structure molded from the thermoplastic resin composition shown in <Example 1>, <Comparative Example 1> and <Comparative Example 2> described above. The number of sticking times of each contact was measured using five sealed electromagnetic relays shown in Fig. 6 as samples, and the data shown in Fig. 16 were obtained. Here, 1a is 1a contact, 2a is 2a contact, 1b is 1b contact, 2b is 2
The b contact is shown, a is a normally open contact, and b is a normally closed contact.

The sticking measurement conditions were a voltage of 96 V and 140 mA for a relay placed in an atmosphere of 50 ° C.
Under a load of 3 times with a contact opening / closing frequency of 3 Hz
The number of sticking times up to 0,000 was measured. here,
A delay of 20 msec or more in contact opening and closing time was regarded as sticking. As is clear from the sticking data shown in FIG. 16, in the case of the sealed electromagnetic relay including the structure molded from the thermoplastic resin composition of <Example 1> as a constituent element, any of 1a to 2b The number of sticking occurrences was 0 even with the number of contact opening / closing, the number of passing products was (20/20), and the passing rate was 100%, whereas in the case of <Comparative Example 1>, the number of sticking occurrences was 99. With the above, the number of passed products (0/20),
The pass rate is 0%, and in the case of <Comparative Example 2>, the number of occurrences of sticking is 0 to 99 or more, the number of passes as a product is (1/20), and the pass rate is 0.05%. It was
From this, it has been found that the electromagnetic relay of the present invention can solve the above-mentioned contact failure as well as the occurrence of sticking. The sticking measuring device used can measure the number of occurrences of sticking up to 99 times, and 99 in FIG. 16 represents 99 times or more.

Although the above description has been made on the case where the thermoplastic resin and the polyol are kneaded, the same effect can be obtained when the polyol is applied to the thermoplastic resin pellets at a predetermined weight ratio. It plays.

[0046]

As described above, the thermoplastic resin composition for electric contact electronic parts according to the present invention generates an aliphatic polyol gas having a boiling point of 180 ° C. or higher which acts on the thermoplastic resin as a contact protection component. In that case, by blending a specific amount of the polyol, a sufficient amount of the polyol gas for exhibiting the contact protection effect is generated without deteriorating the mechanical properties, and thus 1. Even if the degassing treatment by vacuum baking, which requires time and labor, is not performed, the increase in the contact resistance due to the organic gas is suppressed, the occurrence of poor contact is prevented, and the gloss and toughness due to the degassing treatment are reduced. It is also possible to prevent the occurrence of contact failure due to the mixing of molding powder which is generated. 2. At the same time, the occurrence of sticking can be eliminated, and the contact reliability and electrical / mechanical life of the contacts of the contact electric / electronic parts can be significantly improved. 3. Further, it is possible to improve the metal corrosiveness, and it is possible to extend the life of the molding die as well as the contact. 4. The contact resistance is stable, and the present invention can be suitably applied to electric / electronic parts having low-frequency switching contacts. 5. The degree of freedom in selecting the contact material can be expanded. It came to have many technical effects such as.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an electromagnetic relay that is an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of a sealed communication device relay according to an embodiment of the present invention.

FIG. 3 is a front view showing the internal structure of the microswitch according to the embodiment of the present invention.

FIG. 4 is a perspective view of a connector socket which is an embodiment of the present invention.

FIG. 5 is a vertical sectional view of a connector according to an embodiment of the present invention.

FIG. 6 is a perspective view of a photoelectric sensor according to an embodiment of the present invention.

FIG. 7 is a chart showing the results of various measurement tests carried out to evaluate the physical properties of Examples and Comparative Examples of the present invention.

FIG. 8 is a chart showing the evaluation results of relay life according to the examples and comparative examples of the present invention.

FIG. 9 shows an electromagnetic relay that is an embodiment of the present invention.
It is a figure which shows the measurement result of the mechanical life characteristic in case of 50V-100mA.

FIG. 10 is a diagram showing measurement results of mechanical life characteristics of an electromagnetic relay according to an embodiment of the present invention in the case of 28 V-100 mA.

FIG. 11 is a diagram showing measurement results of mechanical life characteristics of the electromagnetic relay according to the embodiment of the present invention in the case of 10 V-100 mA.

FIG. 12 is a diagram showing measurement results of mechanical life characteristics of an electromagnetic relay according to an embodiment of the present invention in the case of 0 V-0 mA.

FIG. 13 is a diagram showing measurement results of electrical life characteristics of contacts of a sealed electromagnetic relay according to an embodiment of the present invention in the presence of 1,4-butanediol.

FIG. 14 is a diagram showing the results of measuring the electrical life characteristics of the contacts of the sealed electromagnetic relay according to the embodiment of the present invention in the presence of polyethylene glycol.

FIG. 15 is a diagram showing measurement results of electrical life characteristics of contacts of a sealed electromagnetic relay according to an embodiment of the present invention in the presence of 1,5-pentanediol.

FIG. 16 is a chart showing sticking data in the case of a sealed electromagnetic relay including a structure molded from a thermoplastic resin composition of Examples and Comparative Examples of the present invention as a constituent element.

[Explanation of symbols]

 5 Electromagnetic relay 10 Communication device relay 14 Micro switch 17 Connector socket 22 Connector 24 Photoelectric sensor

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical display location C08L 77/00 LQR 81/02 LRG (72) Inventor Kenji Funaki Hanazono Tadodo-cho, Ukyo-ku, Kyoto Prefecture 10 Omron Co., Ltd. (72) Inventor Toshiyuki Furuya 370 Enzo, Chigasaki-shi, Kanagawa Mitsubishi Engineering Plastics Co., Ltd. Technology Center Chigasaki (72) Inventor Shigeru Muramatsu 370 Enzo, Chigasaki, Kanagawa Mitsubishi Engineering Ring Plastics Co., Ltd. Technical Center Chigasakiuchi (72) Inventor Yoshitaka Kanazawa 370 Enzo, Chigasaki City, Kanagawa Prefecture Mitsubishi Engineering Ring Plastics Co., Ltd. Technical Center Chigasakinai (72) Inventor, Rin Kimura 370 Enzo, Chigasaki City, Kanagawa Prefecture Mitsubishi Engineering Plastics Co., Ltd. Technical Center Chigasaki

Claims (27)

[Claims] 1. A heat for electrical and electronic parts of a contact, comprising 0.2 to 10 parts by weight of a polyol, preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of a thermoplastic resin. Plastic resin composition. 2. The thermoplastic composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is polyester. 3. The contact electric / electronic device according to claim 2, wherein the polyester is a polybutylene terephthalate resin which produces 0.5 ppm or more of 1,4-butylene glycol gas when heated at 150 ° C. for 2 hours. Thermoplastic resin composition for parts. 4. The thermoplastic resin for contact electric / electronic parts according to claim 3, wherein the polybutylene terephthalate resin has an intrinsic viscosity of 0.75 dl / g or less obtained by a melt polymerization method or a solid phase polymerization method. Composition. 5. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is polyamide. 6. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is polycarbonate. 7. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is liquid crystal polyester. 8. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is polyacetal. 9. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the thermoplastic resin is polyphenylene sulfide. 10. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is polyethylene glycol. 11. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is polypropylene glycol. 12. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is polybutylene glycol. 13. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is glycerin. 14. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is polyglycerin. 15. The thermoplastic resin composition for contact electric / electronic parts according to claim 1, wherein the polyol is 1,5-pentanediol. 16. The average molecular weight of the polyol is 50.
The thermoplastic resin composition for contact electric / electronic parts according to any one of claims 1 to 15, which is 00 or less. 17. The contact electric / electronic device according to claim 1, which produces 0.5 ppm or more of an aliphatic polyol gas having a boiling point of 180 ° C. or higher when heated at 150 ° C. for 2 hours. Thermoplastic resin composition for parts. 18. A gas comprising an organic compound having an aromatic ring in the molecule and / or an organic compound having 5 or more carbon atoms having a carbon-carbon double bond or a carbon-carbon triple bond when heated at 150 ° C. for 2 hours. The thermoplastic resin composition for contact electric / electronic parts according to any one of claims 1 to 17, wherein the production amount of the compound gas is less than 0.1 ppm. 19. A contact electric / electronic component comprising a molded structure made of the thermoplastic resin composition for a contact electric / electronic component according to claim 1 and an electric contact as constituent elements. 20. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a hermetically sealed type. 21. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a relay. 22. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a switch. 23. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a connector. 24. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a sensor. 25. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is an actuator. 26. The contact electric / electronic component according to claim 19, wherein the contact electric / electronic component is a microsensor. 27. The contact electric / electrical component according to claim 19, wherein the contact electric / electronic component is a microactuator.
Electronic components.