JPH08208359A - Metal-ceramic laminated substrate - Google Patents

Abstract

PURPOSE: To obtain a metal-ceramic laminated substrate for an electrical motorcar having such performance as resistance to heat cycles repeated >=3,000 times by directly solidifying molten Al on a ceramic substrate. CONSTITUTION: When a metal part for ensuring electric conduction and mounting electronic parts is formed on at least one principal face of a ceramic substrate to obtain a metal-ceramic laminated substrate, molten Al is directly solidified on the ceramic substrate and joined to the substrate. A prescribed circuit is formed by etching a metallic sheet on the resultant laminated substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-ceramic composite substrate suitable for mounting high-power electronic components such as power modules, and more particularly to an automobile electronic component which requires particularly excellent heat cycle resistance. It is an object to provide a composite substrate suitable for mounting.

[0002]

2. Description of the Related Art Conventionally, a copper-clad ceramics composite substrate manufactured by bonding a copper plate to a surface of a ceramics substrate has been used as a substrate used for mounting a high power electronic component such as a power module. Depending on the type of ceramic substrate used and its manufacturing method, this composite substrate
It is divided into a copper / alumina direct bonding substrate, a copper / aluminum nitride direct bonding substrate, a copper / alumina brazing substrate, and a copper / aluminum nitride brazing substrate.

Of these, the copper / alumina direct bonding substrate is
As disclosed in Japanese Patent Application Laid-Open No. 52-37914, a copper plate containing oxygen is used, or an oxygen-free copper plate is used for heating in an oxidizing atmosphere so that the surface of the oxygen-free copper plate is exposed to copper oxide. After being generated, the copper plate and the alumina substrate are overlapped and heated in an inert atmosphere to form a composite oxide of copper and aluminum at the interface between the copper plate and the alumina substrate to bond the copper plate and the alumina substrate. .

On the other hand, in the case of a copper / aluminum nitride direct bonding substrate, it is necessary to previously form an oxide on the surface of the aluminum nitride substrate. For example, as disclosed in JP-A-3-93687, about 100
The aluminum nitride substrate is treated at a temperature of 0 ° C. to generate an oxide on the surface, and then the copper plate and the aluminum nitride substrate are bonded via the oxide layer by the above method.

The copper / alumina brazing substrate and the copper / aluminum nitride brazing substrate are joined together by using a brazing material having a low contact point between the copper plate and the ceramic substrate.
In addition to copper, an alloying element for lowering the melting point and an alloying element for improving wetting with ceramics are added to the brazing material used. For example, an active metal brazing material such as Ag-Cu-Ti system is often used. Has been done.

Although the copper / ceramic composite substrate is widely used as described above, there are some problems during manufacturing and practical use. The most serious problem among them is a failure due to the formation of cracks inside the ceramic substrate during the mounting and use of electronic components, and electrical conduction between the front and back of the substrate.

This is because the coefficient of thermal expansion of copper is larger than that of ceramics by about an order of magnitude. In the case of bonding, the ceramics substrate and copper are heated to near 1000 ° C., and when cooling from the bonding temperature to room temperature, a large thermal stress is generated inside the composite substrate due to the difference in thermal expansion coefficient.

Further, when mounting an electronic component such as a power module, since the copper / ceramics composite substrate is heated to nearly 400 ° C., the temperature of the composite substrate is constantly changed due to the use environment and heat generated during use. Then, a varying thermal stress is applied to the composite substrate. These thermal stresses cause cracks in the ceramic substrate.

Heat cycle resistance is one of the important evaluation items of the composite substrate. This is indicated by the number of cycles until the substrate is cracked due to thermal stress during heating / cooling by repeating the substrate from -40 ° C to 125 ° C. The copper / ceramic composite substrate produced by the direct bonding method is About 50 times, the characteristic value of the composite substrate produced by the brazing method is 50 times or less.

Further, in order to obtain such characteristics, there is a restriction condition that the thickness of the ceramic substrate is made thicker by the total thickness of the copper plates joined to both main surfaces. There has been a problem that the thickness must be more than double the thickness required to maintain electrical insulation. On the contrary, the thermal conductivity, which is another important characteristic for the composite substrate, is currently sacrificed.

In recent years, due to the development of power modules for electric vehicles, the demand for composite substrates having excellent heat cycle resistance has been particularly increased. For example, in the case of use conditions such as electric vehicles where the temperature change is severe and vibration is large. Although it is said that the heat resistance of the composite substrate must be 3000 times or more, the copper / ceramic composite substrate currently used cannot meet such a demand.

The concept of using aluminum as a conductive circuit material, which has excellent electric and thermal conductivity similar to that of copper, has been used for a long time. For example, such a concept is described in Japanese Patent Laid-Open No. 59-121890. A brazing method is used for joining aluminum and ceramics, and is disclosed in JP-A-3-1254.
No. 63, JP-A-4-12554 and JP-A-4-187
No. 46 discloses an aluminum-ceramic substrate manufactured by a brazing method. According to this, the heat cycle resistance of the produced aluminum-ceramic substrate was about 200 times, and it was still not sufficiently applicable to the applications requiring high heat cycle resistance as described above.

Moreover, in the case of this method, the joining must be carried out in a vacuum, and in the case of non-oxide ceramics, pretreatment must be carried out in advance to form an oxide on the surface of the ceramics. Also, there were some points that were not satisfactory in terms of thermal conductivity.

[0014]

The copper / ceramics direct substrate and the aluminum brazing substrate which are conventionally manufactured as described above are not suitable for electric vehicles in terms of heat cycle resistance. An object of the present invention is to provide a novel substrate having heat cycle resistance of 3000 times or more for electric vehicles.

[0015]

The present inventors have noticed that the brazing material used for brazing is harder than the metal to be joined. The use of the hard brazing filler metal impairs the stress relaxation function of the metal itself, relatively large thermal stress is generated in the substrate, and the heat cycle resistance is deteriorated. In order to develop a substrate having low heat stress and excellent heat cycle resistance, the present inventors further improved the previous invention (Japanese Patent Application No. 4-355211) of one of the inventors, and
A ceramic direct bonding substrate was produced. When evaluating these substrates, excellent heat cycle resistance was confirmed,
The present invention could be submitted.

That is, in the present invention, the first invention is
In a metal-ceramics composite substrate in which a metal portion for electrical conduction and electronic component mounting is formed on at least one main surface of the ceramics substrate, a metal characterized in that molten aluminum is directly solidified and joined onto the ceramics substrate. A second aspect of the present invention is a ceramic composite substrate.
In a metal-ceramic composite substrate in which at least one main surface of the ceramic substrate is provided with a metal portion for electrical conduction and electronic component mounting, a metal plate on the composite substrate obtained by directly solidifying and joining molten aluminum on the ceramic substrate is used. The present invention relates to a metal-ceramic composite substrate characterized in that a predetermined circuit is formed by etching.

[0017]

The substrate used in the present invention is a ceramic substrate made of alumina, aluminum nitride, silicon carbide, zirconia or the like, glass or the like. In this case, a material having high strength is even more preferable.

Further, the metal used in the present invention is a pure metal of aluminum, which improves conductivity and obtains softness. In this case, the higher the purity, the higher the conductivity, but on the contrary, the price becomes higher. Therefore, in the present invention, 99.9% (3N) of pure aluminum was used.

The metal and the ceramics substrate are joined by the melt joining method, whereby a composite substrate having high joining strength and few non-contact defects can be obtained. In addition, since the bonding atmosphere can be performed in a nitrogen atmosphere, it is not necessary to perform it in a vacuum as in the conventional method, and the manufacturing cost is low. Further, it is directly bonded to an aluminum nitride substrate without surface modification. be able to.

Regarding the relationship between the thickness of the ceramic substrate and the thickness of the aluminum metal, the thickness of the metal should be further increased, while the thickness of the ceramic substrate should be reduced, as compared with the conventional copper-clad ceramic composite substrate. Therefore, the thickness ratio of metal / ceramics can be further increased as compared with the conventional product. As a result, it is easily conceivable that the heat dissipation of the composite substrate of the present invention and the amount of flowing current increase.

The composite substrate of the present invention (hereinafter referred to as an aluminum-ceramics direct bonding substrate) will be described in detail below with reference to the drawings.

[0022]

【Example】

(Example 1)

FIG. 7 is a principle view of equipment for manufacturing the aluminum-ceramics direct bonding substrate of the present invention.
Aluminum having a purity of 99.9% is set in the crucible 10, the lid 13 is closed, and the inside of the case 12 is filled with nitrogen gas. After heating to 750 ° C. with the heater 11 to melt aluminum, an alumina substrate of 36 mm × 52 mm × 0.635 mm was sequentially inserted as the ceramic substrate 1 from the left inlet of the guide-integrated die 14 provided in the crucible 10. . A molten aluminum was brought into contact with the alumina substrate contained in the crucible 10 and then solidified on the outlet side to obtain an aluminum-alumina direct bonding substrate having aluminum plates of 0.5 mm thickness bonded on both sides.

Then, on the aluminum portion on the composite substrate,
The etching resist was heat-pressed, light-shielded and developed to form a desired pattern, and then etched with a ferric chloride solution to form a circuit. Further, the circuit surface was replaced with Zn and subjected to Ni plating treatment to obtain an aluminum-ceramics direct bonding substrate having a shape as shown in FIG.

When the various properties of the composite substrate were measured, the following results were obtained.

Peel characteristics> 30 kg / cm (aluminum is cut)

Heat cycle> 3000 times (no crack)

Bending strength: 69 kg / mm ²

Deflection: 286 μm (see FIG. 5)

(Comparative Example 1)

A copper plate 7 having a thickness of 0.3 mm is set to 36 mm × 52
Directly bonded to the upper and lower surfaces of the alumina substrate 6 of mm × 0.635 mm to obtain a copper-alumina direct bonded substrate having the shape shown in FIG. In addition, 3 is an oxide (Al-Cu-Si-O).

When various characteristics shown in Example 1 were similarly obtained,

Peel characteristics> 10 kg / cm (cut at the interface between alumina and Cu)

Heat cycle: cracks occur after 50 cycles, and copper plates peel after 600 cycles

Bending strength: 49 kg / mm ²

The deflection was 172 μm.

(Example 2)

An aluminum nitride plate (36 mm × 52 mm × 0.63) was used as the ceramic substrate 1 instead of alumina.
5 mm) was used, and an aluminum-aluminum nitride direct bonding substrate was obtained by the same means as in Example 1.

The characteristics of this composite substrate are as follows:

Peel characteristics> 20 kg / cm

Heat cycle> 3000 times

Bending strength: 53 kg / mm ²

Deflection: 230 μm

As described above, the heat cycle resistance was preferable for automobiles.

(Comparative Example 2)

As shown in FIG. 4, the metal plate 9 has a thickness of 0.
3mm copper plate with active metal brazing material (Ag-Cu-Ti) 5
When the characteristics were measured in the same manner as in Example 2 using a copper-aluminum nitride brazing substrate obtained by bonding to the aluminum nitride plate 8 via

Peel characteristics> 30 kg / cm

Heat cycle: cracks occur after 40 cycles and peeling of copper plate after 500 cycles

Bending strength: 42 kg / mm ²

Deflection: 140 μm

Although the peel characteristics were excellent, the desired heat cycle resistance characteristics were far from the requirements.

(Example 3)

The amount of warp of the aluminum substrate having a thickness of 0.535 mm formed on one surface of the alumina substrate having a thickness of 0.635 mm used in Example 1 and passed through a continuous heating furnace heated to 360 ° C. is shown in FIG. 5, the same operation was repeated, and the warpage amount of the substrate was summarized for each number of times and shown in FIG. The atmosphere in the heating furnace was H ₂ : N ₂ = 1: 4.

(Comparative Example 3)

Except for the copper-clad alumina substrate directly bonded using a copper plate having a thickness of 0.3 mm instead of aluminum,
The amount of warpage was measured by the means shown in Example 3, and the result is shown in FIG.
Are also shown.

As a result, the amount of warpage of the aluminum / alumina substrate according to the present invention was about 1/3 of that of the copper-clad alumina substrate of Comparative Example 3. It was found that the amount of warp increases as the stress inside the substrate increases, so the stress inside the aluminum / alumina substrate is much smaller than that in the copper-clad alumina substrate.

[0058]

As described above, the aluminum / ceramics direct bonding substrate according to the present invention is excellent in heat cycle resistance which cannot be obtained by the conventional composite substrate, and is preferable as a power module substrate for electric vehicles.

[Brief description of drawings]

FIG. 1 is a schematic view of an aluminum / ceramics direct bonding substrate according to the present invention.

FIG. 2 is a schematic view of a conventional copper / alumina direct bonding substrate.

FIG. 3 is a schematic view of a conventional copper / aluminum nitride direct bonding substrate.

FIG. 4 is a schematic view of a conventional metal / ceramics brazing substrate.

FIG. 5 is a schematic diagram of measuring the amount of warpage in Example 3.

FIG. 6 is a diagram in which a warp amount with respect to the number of times of passing a furnace is obtained in Example 3 and Comparative example 3.

FIG. 7 is a principle view of an apparatus for manufacturing a composite substrate of the present invention.

[Explanation of symbols]

 1 Ceramics Substrate 2 Aluminum 3 Oxide (Al-Cu-Si-O) 4 Oxide of Aluminum Nitride Surface 5 Metal Brazing Material 6 Alumina Substrate 7 Copper Plate 8 Aluminum Nitride Plate 9 Metal Plate 10 Crucible 11 Heater 12 Case 13 Lid 14 Guide Integrated die

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[Procedure amendment]

[Submission date] June 15, 1995

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

Front page continued (72) Inventor Nagatoshi Nagata 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd.

Claims (2)

[Claims] 1. In a metal-ceramic composite substrate in which a metal portion for electrical conduction and electronic component mounting is formed on at least one main surface of the ceramic substrate, molten aluminum is directly solidified on the ceramic substrate and joined. A characteristic metal-ceramic composite substrate. 2. A metal-ceramic composite substrate in which a metal portion for electrical conduction and electronic component mounting is formed on at least one main surface of the ceramic substrate, and the composite substrate is obtained by directly solidifying and joining molten aluminum on the ceramic substrate. A metal-ceramic composite substrate, characterized in that a predetermined circuit is formed by etching the upper metal plate.