JPH0820671A - Resin composition for electronic parts - Google Patents

Abstract

PURPOSE:To obtain the subject composition having a low relative dielectric constant, low dielectric loss tangent, high heat resistance and high mechanical strength at the same time and useful as circuit base material for high-frequency by compounding a synthetic resin with a whisker having a specific composition in a specific amount. CONSTITUTION:This composition is obtained by compounding (A) a thermoplastic resin (preferably, a polyphenylene ether resin, syndiotactic polystyrene resin, etc.) or a heat-hardening resin (preferably, a triazine resin, epoxy resin, etc.) with (B) a whisker having a composition of the formula [(a) and (b) are each 1-9; A is a divalent or trivalent element; x=y=1 or x=2 and y=3] (preferably, an aluminum borate whisker of the formula 9Al2O3.2B2O3 or a magnesium borate whisker of the formula 2MgO.B2O3, etc.) in an amount of 5-60% based on the total weight of components A and B. Further, fiber diameter and fiber length of component B are preferably 0.1-2mum and 10-50mum, respectively.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a resin composition for electronic parts. More specifically, the present invention has a low relative permittivity, low dielectric loss tangent, high heat resistance and high mechanical strength, and is a resin composition suitable as a circuit board material for electric and electronic devices, particularly as a circuit board material for high frequencies. Regarding things.

[0002]

2. Description of the Related Art Circuit board materials for electronic and electrical equipment are required to have low dielectric properties such as relative permittivity and dielectric loss tangent and excellent physical properties such as heat resistance and mechanical strength. .

The relative permittivity (ε) is a parameter indicating the degree of polarization in the dielectric, and the higher the relative permittivity, the larger the propagation delay of the electric signal (Td = 3.33√ε, Td:
Propagation delay time of electrical signal). Therefore, in order to increase the propagation speed of the electric signal and enable high-speed calculation, it is preferable that the relative permittivity is low. The dielectric loss tangent (tan δ) is a parameter that represents the amount of the electrical signal propagating in the dielectric body that is converted into heat and lost, and the lower the dielectric loss tangent, the less the electrical signal loss and the higher the signal transfer rate.

As a conventional circuit board material, a so-called glass epoxy substrate, which is made by impregnating glass cloth with a thermosetting resin such as epoxy resin and curing it, has been generally used. For example, at 1 MHz and 25 ° C. The relative permittivity of the substrate is as high as 4.5 to 5.5, and the dielectric loss tangent is 0.020 to
Since it is as large as 0.035, the signal transmission speed and transmission rate are not satisfactory, particularly in the high frequency region above the MHz band.

Recently, attention has been paid to the easy moldability of synthetic resin, and it has been studied to use it as a material for electric / electronic parts.
Some synthetic resins have a relative permittivity and dielectric loss tangent suitable for high-frequency circuit board materials, but their heat resistance and mechanical strength are generally insufficient and they cannot withstand actual use. I don't get it.

[0006] For the purpose of improving heat resistance, mechanical strength, etc., it is generally practiced to add reinforcing fibers such as whiskers and fibrous substances to synthetic resins for electric / electronic parts. For example, JP-A-3-35585 proposes reinforcing fibers such as glass fibers and potassium titanate whiskers.

However, when glass fiber is added to the synthetic resin, the increase in the relative dielectric constant can be suppressed to a relatively small value, but the dielectric loss tangent increases remarkably. Further, since the glass fiber has a large fiber diameter of 5 to 15 μm and a long fiber length of 100 μm or more, the surface smoothness of the molded product is impaired, and it becomes difficult to plate a fine circuit on the surface of the molded product. When connecting the gold wire with the bonder, there is a problem such as damage to the tip of the wire bonder.

On the other hand, potassium titanate whiskers are microfibers having a fiber diameter of 0.05 to 2 μm and a fiber length of 2 to 50 μm, and are effective for improving heat resistance and mechanical strength and lowering the coefficient of linear expansion. However, the relative permittivity and the dielectric loss tangent are remarkably increased, which causes a delay in the signal transmission speed and a reduction in the transmission coefficient particularly in a high frequency range. Moreover, the alkaline component such as potassium contained in the whiskers corrodes the electrodes and wirings of the electronic parts, and causes disconnection and leakage of current.

Furthermore, aluminum borate whiskers and magnesium borate whiskers are also known as reinforcing fibers (JP-A-2-166134 and JP-A-3-2).
03961 publication). However, there is no report that when these whiskers are mixed with a synthetic resin, the dielectric properties and thermal conductivity of the resin are improved.

[0010]

Means for Solving the Problems As a result of intensive studies to solve the problems of the prior art, the present inventors have found that when a specific amount of whiskers having a specific composition is added to a synthetic resin, it is used in a high frequency range. The dielectric loss tangent can be reduced to a range suitable for use in the high frequency range (around 0.001 or less) without increasing the relative permittivity to the extent that it causes a problem in the high frequency range. It has been found that it becomes more remarkable and that the thermal conductivity, heat resistance and mechanical strength can be improved, and it is extremely desirable as a material for electric / electronic parts, particularly as a circuit board material for high frequencies in the MHz band or higher. The composition was successfully obtained, and the present invention was completed here.

That is, according to the present invention, a thermoplastic resin or a thermosetting resin is represented by the general formula aA _x O _y · bB ₂ O ₃ (where 1 ≦
a ≦ 9, 1 ≦ b ≦ 9, A is an element of II valence or III valence, x =
y = 1 or x = 2, y = 3) whiskers having a composition represented by a composition of 5 to 60% based on the total weight of the resin and the whiskers. The present invention relates to a resin composition.

The thermoplastic resin used in the present invention includes:

[0013]

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A polyphenylene ether having a structural unit of and a small amount of polystyrene or a styrene-butadiene type elastomer is added to obtain a polyphenylene ether type resin having improved impact resistance and moldability, and the structure is controlled by using a metallocene catalyst. Syndiotactic polystyrene,

[0015]

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5-methylpentene resin having a structural unit of

[0017]

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A cyclic polyolefin containing a cyclic olefin such as a polynorbornene resin having a structural unit as a component, a heat-resistant ABS resin having an increased heat distortion temperature by copolymerizing maleimide, and 1,4-diaminobutane / adipic acid. Polyamide-4,6 obtained by condensation polymerization, hexamethylenediamine and polyamide-6T obtained from terephthalic acid, modified polyamide-6T, ε-caprolactam and hexamethylene in which a part of terephthalic acid is replaced with isophthalic acid or adipic acid Heat-resistant polyamide resin such as polyamide-6 / 6T obtained by copolymerizing diamine and terephthalic acid, polyamide-6 / 6T obtained by copolymerizing hexamethylenediamine, adipic acid and terephthalic acid,

[0019]

[Chemical 4]

A polyphenylene sulfide resin containing as a structural unit,

[0021]

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An aromatic polysulfone-based resin having a structural unit of

[0023]

[Chemical 6]

A polyetherimide resin having a structural unit of

[0025]

[Chemical 7]

A polyetherketone resin having as a structural unit,

[0027]

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A polyether nitrile resin having a structural unit of

[0029]

[Chemical 9]

Thermotropic liquid crystal polyester resin containing as a structural unit, heat-fusible fluororesin such as ethylene / tetrafluoroethylene copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, tetrafluoroethylene / perfluoroalkoxy vinyl ether copolymer, thermoplastic polyimide. Resin etc. can be illustrated. Among these, polyphenylene ether resin,
Syndiotactic polystyrene, 5-methylpentene resin, cyclic polyolefin resin, polyphenylene sulfide resin, polyetherimide resin, polyetherketone resin, thermotropic liquid crystal polyester resin,
A heat-meltable fluororesin and a thermoplastic polyimide resin can be particularly preferably used. In the present invention, one of these may be used alone or two or more of them may be mixed and used.

As the thermosetting resin, for example, triazine resin such as triazine resin, bismaleimide triazine (BT) resin, thermosetting polyphenylene ether resin subjected to thermosetting modification, phenol resin, epoxy resin, Saturated polyester resin etc. can be mentioned. Among these, triazine-based resins, thermosetting polyphenylene ether-based resins, epoxy resins and the like are preferable.
In the composition of the present invention, it is particularly preferable to use a resin composition which has a glycidyl ether-type heat-resistant polyfunctional epoxy resin as a curing agent and which has a low elasticity at the time of heating due to modification of a phenol resin and selection of a catalyst.

The general formula used in the present invention is as follows: aA _x O _y · b
Examples of the whiskers represented by B ₂ O ₃ (in the formula, a, b, x and y are the same as above) are aluminum borate whiskers in which A is Al, magnesium borate whiskers in which A is Mg, A And nickel borate whiskers in which Ni is Ni.

Aluminum borate whiskers are white needle-shaped crystals, and for example, "Bull. Soc. Fr. M".
internal. Cristalgr. (1977),
100, 28-32 "," Zeitschrift f
ur anorganische und allge
maine Chemie, Band 284.192
No. (1955), pp. 47-51, JP-A-63-31
It is described in many documents such as 9299, JP-A-63-319298 and the like.

The aluminum borate whiskers are, for example, at least one selected from aluminum hydroxide and aluminum inorganic salt, and at least one selected from boron oxide, oxyacid and alkali metal salt. 600 to 120 in the presence of at least one melting agent selected from alkali metal sulfates, chlorides and carbonates.
It is easily produced by heating to a firing temperature in the range of 0 ° C. to cause reaction and growth.

Taking into consideration the effect of lowering the dielectric loss tangent, concrete examples of preferable aluminum borate whiskers are as follows.
Aluminum borate whiskers of the formula _{9Al 2 O 3 · 2B 2 O} 3, aluminum borate whisker represented by the formula _{2Al 2 O 3 · B 2 O} 3 can be exemplified.

The aluminum borate whiskers of the formula _{9Al 2 O 3 · 2B 2 O} 3 is a true specific gravity 2.93～
2.95, whiskers with a melting point of 1420 to 1460 ° C.,
Those produced at a firing temperature of 900 to 1200 ° C. are particularly preferable. The aluminum borate whisker represented by _{2Al 2 O 3 · B 2 O} 3 is a true specific gravity from 2.92 to 2.9
4, whiskers having a melting point of 1030 to 1070 ° C., and those manufactured at a firing temperature of 600 to 1000 ° C. are particularly preferable.

Examples of commercially available aluminum borate whiskers are represented by the formula 9Al ₂ O ₃ .2B ₂ O.
There is one shown by ₃ (Arborex G, manufactured by Shikoku Chemicals Co., Ltd.), and the average fiber diameter of this is 0.5 to 1
μm, and the average fiber length is 10 to 30 μm.

Magnesium borate whiskers are also white needle-like crystals, for example, a magnesium supplying component selected from oxides, hydroxides and inorganic acid salts of magnesium, and oxides of boron, oxyacids and alkali metal salts thereof. Easily produced by heating the boron-supplying component selected from the above to a temperature of 600 to 1000 ° C. in the presence of at least one melting agent selected from sodium halide and potassium halide. To be done.

Specific examples of preferable magnesium borate whiskers include those represented by the formula 2MgO.B ₂ O ₃ . Among the whiskers having the composition, whiskers having a true specific gravity of 2.90 to 2.92 and a melting point of 1320 to 1360 ° C. are particularly preferable.

In the present invention, the whiskers may be used alone or in combination of two or more.

The fiber diameter and the fiber length of the whisker used in the present invention are not particularly limited, and the application of the obtained composition of the present invention, the balance between physical properties and dielectric properties, the ease of manufacturing the whisker itself, etc. The fiber diameter can be appropriately selected from a wide range, but the fiber diameter is usually about 0.05 to 5 μm, preferably about 0.1 to 2 μm, and the fiber length is usually about 2 to 100 μm, preferably about 10 to 50 μm. .

The whiskers used in the present invention may be added to the synthetic resin as they are or in the form of granules having an appropriate size. Water or a suitable binder may be used to granulate the whiskers.

The whiskers used in the present invention are for the purpose of further improving the wettability with the matrix resin, the bondability, etc., and further the mechanical strength of the composition of the present invention.
You may give a coupling agent process. The coupling agent used here is not particularly limited and widely known ones can be widely used, and examples thereof include a silane coupling agent such as epoxysilane, aminosilane and acrylsilane, and a titanate coupling agent. . Among these, silane coupling agents such as epoxysilane and aminosilane can be preferably used. The amount of the coupling agent used is not particularly limited and may be appropriately selected depending on the use of the resulting composition, etc., but is usually 0.3 to 5 of the whisker amount.
It may be weight%.

The blending ratio of whiskers to the thermoplastic resin or thermosetting resin is 5 to 60 whiskers based on the total weight of the resin and whiskers (resin composition).
% Is required. When the whiskers are less than 5%, the effect of lowering the dielectric loss tangent, the effect of improving the mechanical properties, the effect of improving the heat distortion resistance, etc. are not sufficient. Dispersion in the curable resin solution becomes difficult, and viscosity is increased during the kneading / dispersion operation, resulting in a drawback that molding becomes extremely difficult. In the present invention, it is desirable to add the above whiskers in a proportion of 10 to 50%.

In the present invention, talc for improving plating properties, fine particle fillers such as calcium pyrophosphate, glass fibers, milled glass fibers, and reinforcing fibers such as potassium titanate whiskers are used within a range not impairing the object of the present invention. , Antioxidants, heat stabilizers, ultraviolet absorbers, coloring agents such as dyes and pigments, lubricity imparting agents such as fluororesins, release modifiers, antistatic agents, flame retardants, flame retarding aids, etc. Additives can be appropriately mixed.

The flame retardant is not particularly limited and known ones can be used, and examples thereof include a halogen flame retardant and a phosphorus flame retardant. Specific examples of the halogen-based flame retardant include decabromobiphenyl ether, hexabromobiphenyl, brominated polystyrene, tetrabromobisphenol A and its oligomer, halogenated polycarbonate such as brominated polycarbonate oligomer, halogenated epoxy resin, and the like. You can Examples of phosphorus-based flame retardants include ammonium phosphate, tricresyl phosphate, triphenylphosphine oxide, and the like. Such a flame retardant may be appropriately selected and used depending on whether the resin matrix used is a thermoplastic resin or a thermosetting resin.
As the flame retardant aid, known ones can be used, and for example, antimony compounds represented by antimony trioxide, zinc borate, barium metaborate, zirconium oxide and the like are preferable.

In producing the resin composition of the present invention, conventionally known methods can be widely adopted. For example, in the case of a thermoplastic resin, the above additives are mixed with the resin as needed using a tumbler, a ribbon mixer, or the like, and then a predetermined amount of whiskers is added while being melt-kneaded using a twin-screw extruder. It is optimal to feed knead and pelletize.
In the case of a thermosetting resin, put an uncured resin in a super mixer or a kneader, mix whiskers and additives as necessary, and finally put a curing agent and a catalyst and take out in a paste form. Is common.

The composition of the present invention can be molded into a desired shape by a known method such as injection molding, extrusion molding, compression molding or cast molding.

A known method can be used for producing a circuit board, for example, using the composition of the present invention. For example, a molded product of the composition of the present invention may be subjected to etching if necessary and / or a metal foil such as copper may be attached or plated, and then a circuit may be formed on the surface thereof. The circuit is formed by, for example, plating, sputtering, ion plating,
It can be performed according to a known method such as vacuum deposition or printing.

[0050]

According to the present invention, it has low relative permittivity, low dielectric loss tangent, high heat resistance and high mechanical strength, and is suitable as a circuit board material for electric / electronic equipment, particularly as a circuit board material for high frequencies. There is provided a resin composition for electronic parts that can be used for.
Further, the resin composition of the present invention has good thermal conductivity, in other words, excellent heat dissipation, and is also useful as a material for electric / electronic devices in that respect. Furthermore, the resin composition of the present invention is used as a material for semiconductor packages such as chip carriers and pin grid arrays, base parts such as resistors, switches, capacitors, and photosensors, and electric / electronic device members such as IC sockets and connectors. Is also expected to be applied.

[0051]

EXAMPLES The present invention will be described in detail below with reference to examples and comparative examples. The relative permittivity and dielectric loss tangent shown here are
The measurement was performed by the cavity resonance method using JIS K-6911 and a network analyzer (8510C, manufactured by Hewlett Packard). The tensile strength is JIS
K-7113, flexural strength and flexural modulus are JIS K-7
203, JIS Izod impact strength (with notch)
It was measured by K-7110.

Examples 1-5 and Comparative Examples 1-2 As a polyphenylene ether resin, 18.6 kgf
Using Zylon PXL-2502 (manufactured by Asahi Kasei Co., Ltd.) having a heat distortion temperature of 150 ° C. under a load of / cm ² ,
As a whisker-like reinforcing material, 9Al ₂ O.2B ₂ O ₃
With a composition of, fiber diameter 0.5-1.0 μm, fiber length 10
~ 30μm Arbolex G (Shikoku Chemicals Co., Ltd.)
Made: Aluminum borate whiskers) and 2MgO.B
Suwanite having a composition of ₂ O ₃ , a fiber diameter of 0.5 to 2.0 μm, and a fiber length of 20 to 40 μm (Otsuka Chemical Co., Ltd .: magnesium borate whiskers) and K _{2 for} comparison.
O.8TiO ₂ composition, average fiber diameter 0.4 μm,
Tismo-D with an average fiber length of 15 μm (Otsuka Chemical Co., Ltd.)
Made: potassium titanate whiskers) 15% by weight or 3
Pellets containing 0% by weight were mixed at a cylinder temperature of 30 using a twin-screw extruder (PCM45 manufactured by Ikegai Tekko KK).
After the PXL2502 was melted at 0 ° C., each whisker was subjected to strand cutting by a method of adding (side-feeding) in the middle to make a prototype. These pellets were injection molded at a cylinder temperature of 320 ° C., a mold temperature of 100 ° C. and an injection pressure of 800 kg / cm ² G using an injection molding machine (FS-150, manufactured by Nissei Plastic Industry Co., Ltd.). The physical properties of the resin composition were measured.

The results are shown in Table 1.

[0054]

[Table 1]

From Table 1, the polyphenylene ether resin is originally very small in dielectric constant and dielectric loss tangent, and is very suitable as a matrix resin for a circuit board (Comparative Example 1), but it has heat resistance and mechanical properties. It can be seen from Examples 1 to 5 and Comparative Example 2 that it is effective to fill the reinforcing agent (whisker) in order to improve the temperature.

However, when 30 wt% of potassium titanate whiskers, which have been often used as conventional ceramic whiskers, are filled, the dielectric constant is 4.6 and the dielectric loss tangent is 0.085.
3 shows a considerably large value, whereas aluminum borate whiskers and magnesium borate whiskers have dielectric constants of 3.2 and 2.9, respectively, and dielectric loss tangents are both 0.0001 or less, which are both low dielectric constants. It can be seen that the mechanical properties and the heat distortion temperature can be improved while maintaining the refractive index and the low dielectric loss tangent.

Examples 6-11 and Comparative Examples 3-5 Ultem # 1010-1 as a polyetherimide resin
000 (sold by Japan GE Plastics Co., Ltd.) was used, and the extruder cylinder temperature was 34 as in Examples 1-5.
Vectra C950 (sold by Polyplastics Co., Ltd.) as a thermotropic liquid crystal polyester at 0 ° C
Using, the resin composition (pellet) was trial-produced at an extruder cylinder temperature of 310 ° C. The polyetherimide resin composition has a cylinder temperature of 370 ° C., a mold temperature of 120 ° C., an injection pressure of 700 kgf / cm ² G, and the thermotropic liquid crystal polyester resin composition has a cylinder temperature of 330 ° C. and a mold temperature of 120 ° C. Injection pressure 8
Injection molding was carried out at 00 kgf / cm ² G to measure the physical properties of each resin composition. The results are summarized in Table 2 for the polyetherimide resin composition and Table 3 for the thermotropic liquid crystal polyester resin. Here, as potassium titanate whiskers, neutral Tismo N (for the purpose of preventing an increase in viscosity at the time of melting with respect to the polyetherimide resin and with respect to thermotropic liquid crystal polyester for preventing alkali decomposition). K ₂ O · 6TiO ₂ manufactured by Otsuka Chemical Co., Ltd. was used.

[0058]

[Table 2]

[0059]

[Table 3]

From Table 2, it is noted that the reinforcement effect of these whiskers is relatively small with respect to the polyetherimide resin because it is an amorphous resin, but among them, the reinforcement performance of aluminum borate whiskers is large. Also noteworthy is the dielectric properties, where potassium titanate whiskers significantly increase the dielectric constant with fill, whereas aluminum borate whiskers and magnesium borate whiskers do. However, the dielectric loss tangent did not substantially increase, and as the filling amount increased, the dielectric loss tangent decreased more than that of the resin alone (Comparative Example 3).
It can be seen that, when the weight percent is filled, the performance is lowered by one digit, which is a very desirable performance as a circuit board.

Further, from Table 3, since the thermotropic liquid crystal polyester resin is a crystalline resin, the whisker reinforcing effect is larger than that of the amorphous polyetherimide resin. Also in this case, when the potassium titanate whiskers are filled, the dielectric constant is considerably increased, and the dielectric loss tangent is also increased by one digit, whereas when the aluminum borate whiskers are filled, the dielectric constant is only slightly increased. Is smaller as the filling amount is larger than that of the resin alone. The calcium pyrophosphate powder (average particle size of about 10 μm, manufactured by Ohira Chemical Industry Co., Ltd.) is
It is added as an etching aid of thermotropic liquid crystal polyester resin, and it can slightly improve the dielectric properties for potassium titanate whiskers, but tends to lower the dielectric properties for aluminum borate whiskers. .

Examples 12 to 14 and Comparative Examples 9 to 10 Aurum PD400 (sold by Mitsui Toatsu Chemicals, Inc.) was used as the thermoplastic polyimide resin, and the extruder cylinder was at 400 ° C. as in Examples 1 to 5. Each resin composition (pellet) was manufactured as a trial. The thermoplastic polyimide resin composition was injection-molded at a cylinder temperature of 410 ° C., a mold temperature of 180 ° C. and an injection pressure of 1000 kgf / cm ² G to measure the physical properties. The results are summarized in Table 4.

[0063]

[Table 4]

Example 15 and Comparative Examples 11 to 13 Phenol type epoxy resin (EPC) as thermosetting resin
LON850, manufactured by Dainippon Ink and Chemicals, Inc., using E glass short fiber (made by Nippon Electric Glass Fiber Co., Ltd.) having a diameter of 13 μm and a length of 1.5 mm as a filler, potassium titanate fiber (Otsuka Chemical ( Co., Ltd., Tismo-D) or aluminum borate whiskers (Shikoku Chemicals Co., Ltd.,
After mixing 50% by weight of Arbolex G) and thoroughly stirring and dispersing, 15 phR (15 parts by weight based on 100 parts by weight of epoxy resin) of metaxylline diamine was added as a curing agent, and further stirred. After vacuum degassing, a spacer with a thickness of 3 mm was cast on a Teflon sheet in the surroundings, allowed to stand at room temperature for 3 hours, and then at 130 ° C. for 3 hours.
It is heat-cured for a time, and the bending strength and the deflection temperature under load (18.
5 kgf / cm ² load) is shown by JIS K-6911 and surface roughness is shown by center line average roughness Ra using Surfcom 300B (manufactured by Tokyo Seimitsu Co., Ltd.), and the results are summarized in Table 5. It was

[0065]

[Table 5]

From Table 5, also regarding the thermosetting resin, the aluminum borate whiskers have superior dielectric properties to the conventionally used glass fibers (of course, to potassium titanate whiskers) and to other reinforcing materials. , The dielectric constant and the dielectric loss tangent are inferior to those of unfilled, whereas aluminum borate whiskers have the same or slightly smaller dielectric constant and a dielectric constant of 1
It can be seen that the dielectric property becomes extremely small and extremely desirable as a circuit board material.

As for the surface roughness, it was also revealed that the submicron surface property that is a characteristic of whiskers was obtained, which was very advantageous in terms of the adhesion of the copper foil and the circuit printability.

Claims (4)

[Claims] 1. A thermoplastic resin or thermosetting resin having the general formula aA _x O _y .bB ₂ O ₃ (where 1 ≦ a ≦ 9, 1 ≦ b
≦ 9, A is an element of II valence or III valence, x = y = 1 or x =
2, 60% of the whisker having the composition represented by y = 3) based on the total weight of the resin and the whisker.
The resin composition for electronic parts, characterized in that 2. The thermoplastic resin is polyphenylene ether resin, syndiotactic polystyrene, 5-methylpentene resin, cyclic polyolefin resin, heat resistant ABS.
Resin, heat resistant polyamide resin, polyphenylene sulfide resin, aromatic polysulfone resin, polyetherimide resin, polyetherketone resin, polyether nitrile resin, thermotropic liquid crystal polyester resin,
The resin composition for electronic parts according to claim 1, which is at least one kind selected from a heat-meltable fluororesin and a thermoplastic polyimide resin. 3. The resin composition for electronic parts according to claim 1, wherein the thermosetting resin is at least one selected from a triazine resin, a thermosetting polyphenylene ether, a phenol resin, an Epokin resin and an unsaturated polyester resin. . 4. A general formula aA _x O _y · bB whiskers represented by ₂ O ₃ has the formula 9Al ₂ O ₃ · 2B ₂ O ₃ or 2
Aluminum borate represented by Al ₂ O ₃ · B ₂ O ₃ or magnesium borate represented by the formula 2MgO · B ₂ O ₃ , and a fiber diameter of 0.05 to 5 μm in a whisker shape.
The resin composition for electronic parts according to claims 1 to 3, wherein one having m and a fiber length of 2 to 100 µm is used alone or in combination of two kinds.