JPH08199041A - Structure having solder layer and conductive composition used to make same - Google Patents

Abstract

PURPOSE: To obtain a structure having a solder layer on the surface layer of a conductive composition and improved in wettability between the solder layer and the conductive composition and deflection strength by using a specified composition as the conductive composition. CONSTITUTION: This structure is composed of a conductive composition mainly consisting of desirably 3-40wt.% binder component 2 comprising a resol phenolic resin having dimethylene ether bonds and a linear polymer resin (e.g. polyamide resin) and desirably 60-97wt.% metallic particle component 1 having a mean particle diameter of 0.1-50μm and a solder layer 4 which comes in direct contact with the metallic particle component 1. It is desirable that the metallic particle used is one in which the core is made of an Ni component and the surface of the core is coated with at least one noble metal selected from among Au, Ag, Pd and Pt.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder-bonded structure used as a wiring material, an electrode material, a conductive bonding material for electronic parts and circuits, and a conductive composition used for the structure.

[0002]

2. Description of the Related Art In recent electronic parts and circuits, polymer type conductive compositions have been used as wiring materials, electrode materials and conductive bonding materials in various forms mainly for the purpose of cost reduction of conductive materials. However, polymer-type conductive compositions have a limit in increasing conductivity, and electronic components and circuits are not ready for solder mounting in the end, so polymer-type conductive compositions can get wet with solder. Functions are required.
In addition, since the mainstream of substrate materials is resin substrates such as epoxy resin-impregnated glass fiber sheet (hereinafter referred to as glass epoxy substrate) and polyimide substrate, the conductive composition is a high-strength material that does not break even when the substrate flexes. Is being requested.

Usually, the polymer-type conductive composition is in the form of a paste and solidifies by drying or baking to become a conductive material. After solidification, the metal particles 21 which are conductors are covered with the binder resin 22 and dispersed as shown in FIG. In most polymer conductive conductive compositions, the binder resin 22 is a thermosetting resin. In this case, the binder resin film covering the metal particles 21 is strong and does not break and repels the solder, so that the solder does not get wet. There is a problem. On the other hand, when the binder resin is made of a thermoplastic resin, there is a problem that the binder is melted by the heat of solder and the dispersed metal particles fall off or settle. Further, the metal particles in the conductive composition have a high surface area, and the surface of the particle body is oxidized even in a normal environment, so that the solder is not wet.

In order to improve such problems, the use of organic metal (JP-A-1-34597) and the use of Ag-coated Cu particles (JP-A-63-81706) prevent oxidation of metal particles. Proposals have been made to improve solder wetting. In these known examples, a resol type phenol resin, which is one of thermosetting resins, is used as a binder. In this resin, part of the molecular bond (dimethylene ether bond) is decomposed and detached by the action of the flux and the heat of the solder, so the resin film covering the metal particles is broken and the metal particles that are not oxidized are exposed and the solder is soldered. It gets wet (FIGS. 4A to 4C). In FIG. 4A, 31
Is a metal particle, and 32 is a binder resin. Figure 4 (a)
When the flux and heat are applied in this state, the portion of the binder resin on the surface layer is thermally decomposed to become an altered binder resin layer 33 (FIG. 4B), which has low strength. Next, when solder 34 is applied on the altered binder resin layer 33, as shown in FIG.
As shown in (3), since the strength of the portion of the altered binder resin layer 33 is low, it is easily broken.

[0005]

As described above, in all of the conventional examples proposed in JP-A-1-34597 and JP-A-63-81706, the binder of the conductive composition is hard and brittle. Since the phenolic resin that forms the film is used, the flexural strength of the film is low and the application is limited. Further, since the phenol resin secures the wetting of the solder by decomposing and releasing a part of the molecular bond, there is a problem that the strength is remarkably lowered after the solder is wet as shown in FIG. there were. Furthermore, in the conventional example, as metal particles
Since Cu or Ag is the main component, when wetting the solder in a high temperature range, there is a problem that Cu or Ag will dissolve into the solder (solder erosion) and the solder will not ride on the conductive composition. It was In addition, the conductive composition mainly composed of a resin binder and metal particles has a large specific gravity difference between the resin and the metal, and therefore, if the paste composition before curing is stored for a long period of time, the metal particles will precipitate and become unusable. There was a problem.

In order to solve the above-mentioned conventional problems, the present invention provides a highly reliable polymer type solder attachment structure which has high flexural strength and wets solder in a wide temperature range, and a conductive composition used for the same. The purpose is to

[0007]

In order to achieve the above object, the solder-adhered structure of the present invention is a solder-adhesive structure having a solder layer on the surface layer of a conductive composition, wherein the conductive composition is A resol type phenol resin having a dimethylene ether bond, a binder component made of a linear polymer resin, and a metal particle component having an average particle diameter of 0.1 μm or more and 50 μm or less as main components, and the metal particle component and the above It is characterized in that it has a portion in direct contact with the solder layer.

The conductive composition of the present invention comprises a resol-type phenol resin having a dimethylene ether bond, a binder of a linear polymer resin composition, and an average particle size of 0.1 μm.
It is characterized in that the main component is metal particles of m or more and 50 μm or less.

In the above structure, the binder component is 3
It is preferable that the content is ˜40% by weight and the content of metal particles is 60 to 97% by weight. Further, in the above structure, the linear polymer resin is polyvinyl formal resin, polyvinyl butyral resin, polyester resin, polyamide resin, polyurethane resin, polyurea resin, polyphenoxy resin, polyimide resin, poly (meth) acrylic ester resin, poly ( (Meth) acrylamide resin, poly (meth) acrylonitrile resin, alkyd resin, silicone resin, or copolymer resin thereof, acrylic rubber, nitrile rubber,
It is preferably at least one selected from chloroprene rubber and copolymer rubbers thereof.

In the above structure, the metal particles are Ni
It is preferable that the component is a core and the surface layer is coated with at least one noble metal selected from Au, Ag, Pd and Pt. Further, in the above configuration, the metal particles are Ni, Cu, Al, T
i, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd, Pt is the alloy component consisting of at least two selected from the core, the surface layer is Au, Ag,
It is preferably coated with at least one noble metal selected from Pd and Pt.

In the above structure, the metal particles are Ni
Metal particles having a component as a core and a surface layer coated with at least one noble metal selected from Au, Ag, Pd and Pt, and Ni, Cu, Al, T
i, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd, Pt is the alloy component consisting of at least two selected from the core, the surface layer is Au, Ag,
It is preferably a mixture with metal particles coated with at least one noble metal selected from Pd and Pt.

Further, in the above structure, metal particles having a Ni component as a core and a surface layer coated with at least one noble metal selected from Au, Ag, Pd and Pt, and / or Ni, Cu, A
l, Ti, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd, Pt, with at least two alloying elements selected from the core, and the surface layer of A
A mixture of metal particles coated with at least one noble metal selected from u, Ag, Pd and Pt and at least one particle selected from the metals of any of the following groups a to c is preferable. Group a: Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd and Pt
At least one metal particle selected from b group: at least one metal particle selected from Cu, Al, Ti, Cr, Pb, Sn, Zn, In and Bi as a nucleus, and any one of Au, Ag, Pd and Pt Metal particles coated with noble metal selected from group c: Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd and Pt
At least two kinds of alloy particles selected from the following: In the above-mentioned constitution, the resol type phenol resin having a dimethylene ether bond is 50% by weight or more and 97% by weight, and the binder component composed of the linear polymer resin is 3% by weight or more and 50% by weight or more. It is preferably in the range of% by weight.

[0013]

According to the above-described solder-adhered structure of the present invention, the conductive composition has a resol-type phenol resin having a dimethylene ether bond, a binder component made of a linear polymer resin, and an average particle size of 0. High reliability in which the bending strength is high and the solder wets in a wide temperature range by having a metal particle component of 1 μm or more and 50 μm or less as a main component and having a portion where the metal particle component and the solder layer are in direct contact with each other. It is possible to realize a polymer type solder attachment structure. That is, the present invention, by using a resol type phenolic resin having a dimethylene ether bond as a binder of the conductive composition, and a linear polymer resin composition, the solder can be wetted without solder erosion and bending. It is intended to obtain a conductive composition having high strength, a small decrease in strength even after wetting with solder, and an improved preservability in a paste state before curing. In other words, when the conductive composition is subjected to flux and heat, the binder resin (linear polymer) portion of the surface layer is melted and the resol-type phenol resin is decomposed to expose the metal particles. Therefore, the metal particle component and the solder layer are in direct contact with each other.

Here, the resin composition of the resol type phenol resin and the linear polymer resin may be a modified product obtained by partially reaction-bonding or a simple mixture. In addition, one type of resol-type phenol resin and one type of linear polymer resin are used.
Mixtures of more than one species can also be used. The resol type phenol resin of the present invention has a dimethylene ether bond. More specifically, between the benzene ring containing a phenol group and the benzene ring, dimethylene ether [CH ₂ OCH ₂ ]
They are connected by a bond.

The linear polymer resin may be of any kind as long as it is compatible with the resol type phenol resin.
Preferred examples include polyvinyl formal resin, polyvinyl butyral resin, polyester resin, polyamide resin, polyurethane resin, polyurea resin, polyphenoxy resin, polyimide resin, poly (meth) acrylic ester resin, poly (meth) acrylamide resin, poly (meth). Examples thereof include acrylonitrile resin, alkyd resin, silicone resin, acrylic rubber, nitrile rubber, and chloroprene rubber. The above-mentioned polymers can also be used as copolymers or modified products. For example, it is a polyether ester resin, a polyester urethane resin, a polyamide-imide resin or the like.

As the binder of the conductive composition, in addition to the above essential components, a third resin component is required for the purpose of improving coating film strength, adhesion strength, conductivity, viscosity adjustment, rheology adjustment of viscosity and the like. You may add according to.

As the metal particles of the conductive composition, particles having an average particle size of 0.1 μm or more and 50 μm or less can be used, but as a preferred example, it is selected from any of (a) Au, Ag, Pd and Pt. Ni particles coated with noble metal, and / or
(B) Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, coated with the precious metal,
It is desirable that the main component is an alloy particle composed of at least two kinds selected from In, Bi, Au, Ag, Pd and Pt. In particular, it is preferable in terms of cost to use Ni or alloy particles containing a base metal component as at least one component as a core metal. Here, the metal particles may be the above (ii) or (ii) alone or a mixture thereof, or may be the above (ii) and / or (ii) and Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In. , Bi, Au, Ag, Pd, Pt
Any of the above or a mixture of two or more kinds of mixed metal particles may be used. In addition, Cu, Al, Ti, Cr, Pb, Sn, Zn, I
n, Bi, or a metal particle coated with a noble metal selected from any of Au, Ag, Pd, and Pt having a mixed metal particle of any combination of two or more kinds as a nucleus, and (a) and / or It may be a mixture with (b). Furthermore, Ni, Cu, Al, Ti, C
Alloy particles of any combination of two or more of r, Pb, Sn, Zn, In, Bi, Au, Ag, Pd, Pt and the above (a) and / or (b)
It is also possible to use mixed particles with. By using these metal particles, excellent solder wetting and solder erosion,
It is possible to realize a conductive composition in which the strength is not significantly reduced even after the solder is wet.

As the constituent components of the conductive composition, a rheology modifier such as a solvent, a dispersant and a leveling agent, and an adhesion improver such as a coupling agent may be used, if necessary. In the present invention, since the hard and brittle resol-type phenol resin is reinforced with the tough polymer component of the linear polymer as the binder of the conductive composition, the conductive composition having high flexural strength can be obtained.

[0019]

The present invention will be described in more detail with reference to the following examples. The conductive composition of the present invention exposes metal particles and wets the solder by decomposing a part (dimethylene ether bond) of the resol-type phenol resin in the binder and melting the linear polymer (thermoplastic) component. It has a feature. After the solder gets wet, when the solder cools and returns to room temperature, the linear polymer has the original high strength, so that the strength of the binder is not significantly reduced due to the wetness of the solder. FIG. 1 (a)
(C) shows the process of one Example which forms the solder attachment structure of this invention. In FIG. 1A, 1 is metal particles, and 2 is a binder resin. When the flux and heat are applied in the state of FIG. 1A, the binder resin (linear polymer) portion of the surface layer is melted and the resol-type phenol resin is decomposed to expose the metal particles (FIG. 1).
(B)). When the solder 4 is applied to the exposed metal particles 3, a structure having high solder wettability and free from solder erosion is obtained (FIG. 1 (c)). As described above, a resol type phenol resin having a dimethylene ether bond, a binder resin 2 composed of a polymer having a molecular weight of 1000 or more and having compatibility with the resin, and a coating of a conductive composition containing metal particles 1 as main components. A film is formed on a substrate, which is dipped in a solder solution to form a solder layer 4 on the conductive composition coating film, in which case the binder surface layer of the coating film is decomposed or melted by the heat of the solder to enclose metal particles. Is exposed and 3 solder gets wet. When the solder cools, the molten binder also solidifies, whereby the conductive composition coating film is firmly bonded to the solder layer.

In addition, in this embodiment, as a binder, a polymer component of a linear polymer having a number average molecular weight of 1000 or more and a solvent are contained. The solvent dissolves or swells the linear polymer that is the binder component, and adjusts the viscosity of the paste. Paste viscosity is 1 Pa · s
Even in a smaller range, it can be used up to about 0.2 Pa · s, but the preferable viscosity is 1 to 2000 Pa · s, and more preferably 2 to 100 Pa · s. With such a viscosity, it is possible to improve the handling property, to suppress the precipitation of metal particles, and to enable long-term storage.

Further, a noble metal that is hard to oxidize into metal particles and has high solder wettability is arranged on the surface, so that the core is not easily eaten by the solder.
Ni particles, and / or Ni, Cu, Al, T coated with said noble metal
Since it uses alloy particles consisting of at least two kinds selected from i, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd, Pt, it has high solder wettability from low temperature to high temperature. The conductive composition does not suffer from solder erosion.

Specific examples will be described below. In the following examples, the resol type phenolic resin is "PL4348" manufactured by Gunei Chemical Co., the polyimide resin is "U Varnish" manufactured by Ube Industries, the polyamide resin is "Dyamide 170" manufactured by Daicel, and the epoxy resin is oil. "Epicote 807" manufactured by Kabushiki Kaisha, its curing agent dicyandiamide, and polyurethane resin are "Crisbon 8" manufactured by Dainippon Ink and Chemicals, Inc.
566 ", polyvinyl formal resin is"# 200 "manufactured by Denki Kagaku Kogyo KK, polysilicone imide resin is" KJR651 "manufactured by Shin-Etsu Chemical, and nitrile rubber is" Hiker 1072 "manufactured by BF Goodrich. Using.

(Examples 1 to 4, Comparative Examples 1 to 3) Tables 1 and 2
Each composition blend shown in FIG.
11, the conductive compositions of Comparative Examples 1 to 3 were prepared.

[0024]

[Table 1]

[0025]

[Table 2]

A coating film of these conductive compositions was formed on a glass epoxy substrate to a film thickness of 30 μm and baked at 170 ° C. for 20 minutes. These conductive composition coating films were evaluated for solder wettability and solder erosion by the evaluation methods shown below. The results are shown in Tables 3-4.

[0027]

[Table 3]

[0028]

[Table 4]

(Remarks) Evaluation scale in Tables 3 to 4 Solder wetting number 100: ○ 99 to 95: △ 95 or less: × Solder erosion occurrence temperature 300 ° C or more: ○ 300 to 270 ° C: △ 270 ° C or less: × Deflection Adhesion strength unit [kgf / cm ² ] Paste storability unit [elapsed days] The solder wettability evaluation method is shown in FIGS. 2 (a) to 2 (e).
In FIG. 2A, 11 is a glass epoxy substrate, 12 is a baked conductive composition coating film, and 13 is an intermediate body 13 in which the glass epoxy substrate 11 and the conductive composition coating film 12 are integrated. . The intermediate body 13 has, for example, a conductive composition coating film 1 formed in a pattern of 1 × 1 mm ^2.
100 are created. Next, as shown in FIG. 2B, the intermediate 13 was immersed in a bath of the Sn—Pb eutectic solder solution 14 at 220 ° C. for 10 seconds. The obtained solder-attached structure (see FIG. 2
(C)). Next, the number of wet solders 15 was measured. 2 (d) shows that the solder wettability is good, FIG. 2 (e)
Indicates that the solder wettability is poor. Reference numeral 16 is a portion having poor solder wettability.

The solder erosion evaluation method is basically the same as the solder wettability evaluation. 100 conductive composition films formed in a pattern of 1 × 1 mm ² were prepared (see FIG. 2).
(A)) It was immersed in solder for 10 seconds (FIG. 2B), and the temperature at which even one solder erosion occurred was measured. Figure 2 (f)
Indicates a solder-eated portion 17.

The bending adhesion strength was evaluated according to JIS-K6856. As a method for evaluating paste storability, the conductive composition paste that had been kneaded was put in a 100 cc plastic container and allowed to stand in an environment of 25 ° C. ± 3 ° C. The number of days elapsed until the metal particles in the paste were precipitated and a supernatant was produced was measured.

As a result of the above evaluation, in Examples 1 to 11, there was no problem in solder wettability and solder erosion was about 300 ° C.
Didn't happen until. Moreover, the bending strength was several tens of kg / cm ^2, and the strength was sufficient to withstand the warpage and bending of the resin substrate. No precipitation occurred for more than 3 months.

On the other hand, in Comparative Example 1, the solder wettability was sufficient, but solder erosion was severe and it could not be used in the soldering process at 270 ° C. or higher. In addition, the flexural strength was low (particularly the flexural strength after solder wetting was much lower), and the resin board could not withstand the flexure. Precipitation also occurred after 70 days had passed. The reason why solder erosion is severe is that only Cu particles are used as cores in the conductor, and in Examples 1 to 8 according to the present invention, conductors mainly containing Ni particles as cores are used. Because there was no problem. It is considered that the reason why the flexural strength is low is due to the brittleness of the phenol resin as the binder. In addition, as shown in FIG. 4 described above, the phenol resin is decomposed by the heat of the solder, so that the flexural strength after the solder is wet is further reduced.

In Comparative Examples 2 and 3, the bending strength was high, but the solder did not get wet. In Comparative Example 2, precipitation occurred around 55 days later. When the compositions of Example 1 and Comparative Example 2 are compared, both have the same metal particles (Pd-coated Ni particles) but different binder components. In Comparative Example 2, a brittle phenol resin as a binder is modified with a tough epoxy resin in order to increase the flexural strength. Certainly, in Comparative Example 2, the flexural strength was high, but the solder did not get wet. This is because there is no phenomenon such as decomposition or melting even when the binder of Comparative Example 2 wets the solder at a high temperature, and the Ni particles contained therein are wrapped in the binder and are not exposed. On the other hand, in Example 1, since the resol-type phenol resin that decomposes by solder heat and the polyamide resin that melts and softens are used as binders, as shown in FIG. 1, when wet well with solder, and after returning to room temperature after getting wet with solder Since the polyamide resin retains the original strong binding force, the flexural strength can be maintained.

The same applies to the comparison between Example 2 and Comparative Example 3, and the compositions of the two differ only in the binder component. Comparative Example 3
Is an example often applied as a binder of a conductive composition having high heat resistance. Although it is shown that the flexural strength is high in Comparative Example 3 even after the solder gets wet, the solder does not get wet. The reason for this is that the binder of Comparative Example 3 is neither decomposed nor melted by the heat of the solder. On the other hand, in Example 2, as in Example 1, the heat of the solder broke the binder in the outermost layer.
Since the Ni particles were exposed, they were well wetted with solder and had high bending strength.

The compositions of Example 2 and Examples 5, 6, 7, and 8 differ only in the binder component, especially in the polymer component. It is shown that the conductive composition of this example has no problem in solder wettability and solder erosion even when the kind of the polymer component is changed, and there is no problem in flexural strength and storability as a paste.

The binder compositions of Examples 3 and 4 were the same as those of Examples 1 and 2, respectively, but the metal particles were different. In Example 3, Ni particles were used in addition to the noble metal (Ag) -coated Ni particles, and in Example 4, Ag particles were used in addition to the noble metal (Pd) -coated Ni particles.
Cu particles are used. However, the evaluation results of Examples 3 and 4 are not inferior to those of Examples 1 and 2. This indicates that if the noble metal-coated Ni particles are contained as the metal particles, the object of the present invention can be achieved even with a composite with other metal particles.

Furthermore, in Examples 9 and 10, the binder composition is the same as that of Example 1 and Example 11 is the same as that of Example 5, but the metal particles are different. In Examples 9, 10 and 11, Ag-coated Ni
-Metal particles mainly composed of Cu alloy particles are used. However, the evaluation results of Examples 9, 10 and 11 are not inferior to those of Examples 1 and 5. This indicates that if the noble metal-coated base metal alloy particles are contained as the metal powder, the object of the present invention can be achieved even with a composite with other metal particles.

[0039]

According to the present invention, a tough conductive composition having a high flexural strength and a small decrease in strength even after solder wetting can be obtained. Therefore, the application of the resin composition to be mounted on a resin substrate where warpage, flexure or the like is likely to occur is expanded. Further, since a conductive composition having a wide temperature range where the solder is wet without being eaten can be obtained, it can be used for various solder mounting. Further, distortion due to a difference in thermal expansion often occurs between the board and the mounted component, which causes destruction of the component, dropout, destruction of the conductive joint, or the like, but the conductive composition of the present invention is Since it also has an effect of relieving the strain, it is possible to prevent the components from being broken or dropped and the conductive joint from being broken by thermal strain.

In addition, as the conductive metal particles that form the core of the present invention, Ni particles that are inexpensive and have excellent supply stability, and /
Alternatively, when alloy particles containing a base metal component as at least one component are used, the cost becomes low and it is excellent.

[Brief description of drawings]

1A to 1C are schematic cross-sectional views showing the steps of an embodiment for forming a solder attachment structure of the present invention.

2A to 2E are process diagrams showing a solder wettability evaluation method according to an embodiment of the present invention. (F) is a figure which shows the same solder erosion evaluation method.

FIG. 3 is a schematic cross-sectional view of a conventional conductive composition.

FIG. 4 is a schematic cross-sectional view showing a solder wetting mechanism of a conventional conductive composition.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal particles 2 Binder resin 3 Exposed metal particles 4 Solder 11 Glass epoxy substrate 12 Conductive composition coating film 13 Intermediate 14 Solder liquid 15 Solder 16 Bad solder wettability part 17 Solder eaten part 21 Metal particle 22 Binder resin 31 metal particles 32 binder resin 33 altered binder resin layer 34 solder

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location // H05K 3/24 B 7511-4E (72) Inventor Wataru Sakurai 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Goji Hinomori 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (9)

[Claims] 1. A solder attachment structure having a solder layer on a surface layer of a conductive composition, wherein the conductive composition comprises a resol-type phenol resin having a dimethylene ether bond,
A binder component made of a linear polymer resin and a metal particle component having an average particle diameter of 0.1 μm or more and 50 μm or less as main components, and the metal particle component and the solder layer have a portion in direct contact with each other. A solder attachment structure characterized by the above. 2. A resol-type phenol resin having a dimethylene ether bond, a binder of a linear polymer resin composition, and metal particles having an average particle size of 0.1 μm or more and 50 μm or less as main components. Conductive composition. 3. The solder adhering structure according to claim 1, wherein the binder component is 3 to 40% by weight and the metal particles are 60 to 97% by weight, and the conductive composition used therefor. 4. The linear polymer resin is a polyvinyl formal resin, polyvinyl butyral resin, polyester resin, polyamide resin, polyurethane resin, polyurea resin, polyphenoxy resin, polyimide resin, poly (meth) acrylic ester resin, poly (meth). ) Acrylamide resin, poly (meth) acrylonitrile resin, alkyd resin, silicone resin, or copolymer resin thereof, acrylic rubber, nitrile rubber, chloroprene rubber,
Alternatively, the solder-attached structure according to claim 1 or 2, which is at least one selected from these copolymer rubbers, and the conductive composition used therefor. 5. The metal particles have a Ni component as a nucleus and have a surface layer of A.
The solder-attached structure according to claim 1 or 2, which is coated with at least one noble metal selected from u, Ag, Pd and Pt, and a conductive composition used for the same. 6. The metal particles are Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn,
The alloy is composed of at least two alloy components selected from In, Bi, Au, Ag, Pd and Pt as a core, and the surface layer is coated with at least one noble metal selected from Au, Ag, Pd and Pt. The electrically conductive composition as described in 1 or 2. 7. The metal particles have a Ni component as a nucleus and have a surface layer of A.
u, Ag, Pd and metal particles coated with at least one noble metal selected from Pt, Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi,
A mixture of metal particles having an alloy component consisting of at least two kinds selected from Au, Ag, Pd and Pt as a core and having a surface layer coated with at least one noble metal selected from Au, Ag, Pd and Pt. The solder-attached structure according to 1 or 2, and a conductive composition used for the same. 8. A surface layer comprising a Ni component as a core, Au, Ag, Pd and Pt.
Metal particles coated with at least one noble metal selected from the group consisting of Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi, Au and A
g, Pd, Pt, and at least one noble metal selected from Au, Ag, Pd and Pt as a core, and metal particles having a core of an alloy component consisting of at least two selected from the following a to c.
The solder-attached structure according to claim 1 or 2, which is a mixture with at least one particle selected from the group of metals, and the conductive composition used for the same. Group a: Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd and Pt
At least one metal particle selected from b group: at least one metal particle selected from Cu, Al, Ti, Cr, Pb, Sn, Zn, In and Bi as a nucleus, and any one of Au, Ag, Pd and Pt Metal particles coated with noble metal selected from group c: Ni, Cu, Al, Ti, Cr, Pb, Sn, Zn, In, Bi, Au, Ag, Pd and Pt
At least two types of alloy particles selected from 9. A resol type phenolic resin having a dimethylene ether bond is 50% by weight or more and 97% by weight, and a binder component consisting of a linear polymer resin is 3% by weight or more 50%.
The solder-attached structure according to claim 1 or 2, and the conductive composition used for the same are in the range of weight%.