JPH08195474A - Semiconductor device, electric components, and electric devices for multiple mounting - Google Patents

Abstract

PURPOSE: To dispense with various kinds of packages and lead frames by mounting a semiconductor device or electronic components having specified intermediate leads, on a mounting substrate, and mounting other semiconductor devices or electronic components on the semiconductor device or the electronic components mounted on the substrate. CONSTITUTION: This device is provided with an intermediate lead 7 where one end is electrically connected with a lead and the other end is exposed on the surface of a sealing body. Semiconductor devices 21 and 23 or electronic components 22 and 24 having these relays are mounted on a mounting substrate 1. And, other semiconductor devices 31 and 32 or electronic components 33 are mounted on the semiconductor devices 21 and 23 or the electronic components 22 and 24 mounted on the board 1. Furthermore, the semiconductor device 13 or the electronic components 33 is given heat conductive members 9 and 16, which absorbs and radiates the heat of the semiconductor device whose heat radiation is not performed enough, being surrounded by other semiconductor devices 11, 12, 21, 23, 31 and 32, the electronic components 22 and 24, or the substrate 1. The density of mounting of electronic components can be improved, by mounting such devices, etc., in multilayers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for multiple mounting, a semiconductor device and an electronic device using the same, and more particularly to a technique effective when applied to high-density mounting on a mounting substrate. is there.

[0002]

2. Description of the Related Art In an electronic device using a semiconductor device, various semiconductor devices and various electronic components such as a resistor capacitor are attached to a mounting substrate on which wiring such as a printed circuit board is formed and fixed by a method such as a soldering flow. Makes electrical connections.

[0003]

In recent years, electronic devices have been required to be further miniaturized and speeded up, and this has been dealt with by improving the performance of the semiconductor device or the mounting substrate. There are limits to what can be done, and as a result, prices will rise.

Further, when many semiconductor devices are mounted, the size of the mounting substrate is limited due to problems such as strength, and as a result, all semiconductor devices cannot be mounted on one substrate, In some cases, semiconductor devices are mounted on a plurality of mounting boards, connectors are provided on the boards, and the boards are connected by cables.

In such a case, the price of the product increases due to the connector and the cable, the reliability decreases due to the contact failure of the connector or the cable, etc., and the operating speed decreases due to the increase in the wiring length or the cable is removed from the cable. The noise may be increased due to the mixing.

In order to solve such a problem, it is considered to mount multiple semiconductor devices on a mounting substrate as in Japanese Patent Application No. 2-98301 or Japanese Patent Application No. 5-122726. However, these inventions require special packages or lead frames, are not compatible with ordinary products, and increase costs. Alternatively, there is a problem that the degree of freedom in applying the technology is low.

An object of the present invention is to provide a technique capable of increasing the mounting density of electronic devices and solving the above-mentioned problems.

It is another object of the present invention to provide a technique capable of improving heat dissipation and stably operating when multiple electronic devices are mounted.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

A semiconductor device or electronic component having a relay function is mounted on a mounting substrate, and another semiconductor device or electronic component is mounted on the semiconductor device or electronic component mounted on the substrate. Further, the semiconductor device or the electronic component is provided with a heat transfer function to absorb and radiate the heat of the semiconductor device surrounded by other semiconductor devices, electronic components or the substrate, which does not sufficiently radiate heat.

[0012]

According to the above-mentioned means, the mounting density of the electronic devices can be improved by mounting the semiconductor devices or the electronic parts in multiple layers. In addition, by imparting a heat transfer function to the semiconductor device or the electronic component, heat dissipation is improved and performance is stabilized.

The structure of the present invention will be described below together with embodiments.

In all the drawings for explaining the embodiments, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0015]

【Example】

(Embodiment 1) FIG. 1 is a vertical sectional view showing an electronic device according to an embodiment of the present invention. In this embodiment, a plurality of semiconductor devices and electronic components are laminated in three layers and connected to form an electronic device.

In the figure, reference numeral 1 denotes a mounting board, and the mounting board 1
Is an insulator 1a such as glass epoxy resin or ceramic
Then, a conductor 1b such as copper or aluminum is formed by patterning.

The semiconductor device 1 of the first layer is provided on the surface of the mounting substrate 1.
1, 12, 13 are surface-mounted, and semiconductor devices 11, 12,
13, the second-layer semiconductor devices 21 and 23 and the electronic component 2
2, 24 are connected, and the semiconductor devices 31, 32 and the electronic component 33 of the third layer are connected to the semiconductor devices 21, 23 and the electronic components 22, 24.

Semiconductor devices 11, 12, 13, 21, 2
3, 31, 32 are SOP (Small Outline Package)
Type semiconductor device, a semiconductor chip 2 having a predetermined circuit formed thereon is mounted on a tab 3, and an inner lead 4a of a lead 4 (hereinafter simply referred to as a lead) used in a conventional semiconductor device and a semiconductor chip 2 are connected to each other. The semiconductor chip 2, the inner leads 4a, and the bonding wires 5 are connected by the bonding wires 5, and are sealed by a sealing body 6 made of epoxy resin or the like. The inner lead 4a is integrated with the outer lead 4b which is an external terminal of the semiconductor device,
The outer leads 4b are connected to the mounting substrate 1 or other semiconductor devices 11, 12, 13, 21, 23.

The electronic components 22, 24 and 33 have substantially the same shape as the semiconductor device, but do not have a semiconductor chip mounted thereon, have a sealing body 6 and leads 4, and the inner leads 4a of the leads 4 are sealed. The outer lead 4b is housed inside the stopper 6.
Extend to the outside of the sealing body 6.

For manufacturing the electronic components 22, 24 and 33, it is possible to use a normal manufacturing technique of a semiconductor device. Predetermined wiring is provided on a lead frame for manufacturing a semiconductor device, and the lead frame is sealed in the same manner as the semiconductor device, and the leads are molded to manufacture the semiconductor device.

Since no semiconductor chip is housed in the electronic parts 22, 24, 33, the wiring within the sealing body 6 has a high degree of freedom in routing and a complicated wiring can be constructed.

The semiconductor devices 11, 12, 13 of this embodiment are
21,23,31,32 and electronic parts 22,24,33
In addition to the normal lead 4 described above, a relay lead 7 including a vertical wiring 7a extending vertically from the inner lead 4a and a surface wiring 7b extending on the upper surface of the sealing body 6 is attached.

The electrical connection of this electronic device will be described below.

A line is formed by the lead 4 and the relay lead 7 connected to the mounting substrate 1, and each semiconductor chip 2 is connected to this line. Wirings common to each semiconductor device such as a power source are connected in parallel, and the semiconductor chip 2 and the inner lead 4a are the same line by the bonding wire 5 like the semiconductor device 12 right side, the semiconductor device 23 left side, and the semiconductor device 32 right side. Connected to.

For example, the semiconductor device 3 is not connected in parallel by the wiring unique to each semiconductor device, such as individual data input / output.
As shown on the right side of FIG. 1, only the predetermined semiconductor chip 2 is connected to the line by the inner lead 4a and the bonding wire 5, and the other semiconductor chips are not connected.

When the semiconductor devices are connected to each other but not to the mounting board, the semiconductor device 2 is connected, for example, the right side of the semiconductor device 21 and the left side of the semiconductor device 31.
1, 31 are only connected to each other, the corresponding vertical wiring is eliminated in the semiconductor device 11, and the connection with the mounting substrate 1 is blocked.

In this way, the respective semiconductor devices are electrically connected to the mounting board or the semiconductor devices are electrically connected to other semiconductor devices.

It is possible to use the ordinary semiconductor device 32 without the relay lead 7 as the uppermost third layer semiconductor device, but the relay lead 7 is provided like the semiconductor device 31. Electronic components such as resistors and capacitors 8
It is also possible to connect with and to set the time constant, for example.

In addition to the relay function described above, the semiconductor device 13 and the electronic component 33 have a heat dissipation function. That is, the semiconductor device 13 is provided with the heat transfer member 9 exposed to the outside of the sealing body 6, and the semiconductor chip 2 is thermally connected to the heat transfer member 9.

The electronic component 33 is provided with a heat receiving member 15 and a heat transfer member 16 which are exposed on the surface of the sealing body 6, and the heat receiving member 15 and the heat transfer member 16 are thermally connected.

The heat generated by the electric current flowing through the semiconductor chip 2 is transferred from the heat transfer portion 9 exposed to the outside of the sealing body 6 to the heat receiving portion 15, and is thermally connected to the heat receiving portion 15 and is provided on the upper surface of the sealing body 6. The heat is transferred from the exposed heat transfer member 16 to the air. The heat transfer members 9 and 16 and the heat receiving member 15 are made of a metal such as aluminum and copper having a high heat transfer coefficient, but other heat transfer elements such as a heat pipe may be used.

(Embodiment 2) FIG. 2 is a vertical sectional view showing an electronic device according to another embodiment of the present invention. In this embodiment, a plurality of DRAMs (Dynamic Random Access Memo) are used.
ry) is connected and laminated.

In the figure, reference numeral 1 denotes a mounting board, and semiconductor devices 41, 42, 43 are stacked on the mounting board 1 and mounted in multiple layers.

The mounting board 1 is formed by patterning a conductor 1b of copper, aluminum or the like on an insulator 1a of glass epoxy resin, ceramic or the like.

The semiconductor devices 41, 42 and 43 are SOJ
(Small Outline J type lead) type DRAM,
The semiconductor chip 2 is placed on the tab 3, the semiconductor chip 2 and the inner lead 4a are connected by a bonding wire 5, and the semiconductor chip 2, the inner lead 4a and the bonding wire 5 are sealed by a sealing body 6 such as an epoxy resin. I am doing it. The inner lead 4a is integrated with the outer lead 4b which is an external terminal of the semiconductor device, and the outer lead 4b is used to mount the mounting substrate 1 or another semiconductor device 4
1, 42, 43.

In the semiconductor devices of this embodiment, other than the uppermost semiconductor device 43, other semiconductor devices 41 and 42 are provided with relay leads 7 in addition to the leads 4 which are normally provided. The relay lead 7 includes a tape-shaped conductor 7c and an adhesive layer 7b.
Is bonded to the outer peripheral surface of the semiconductor device 41, 42, 43 via the outer lead 4 and one end of the conductor 7c of the relay lead 7
It is electrically connected to b and the other end extends to the upper surface of the sealing body 6. Outer leads 4b of the upper semiconductor devices 43, 42
Is connected to the relay lead 7 formed on the upper surfaces of the semiconductor devices 42 and 41 immediately below, and the outer lead 4b of the semiconductor device 41 in the lowermost layer is connected to the mounting substrate 1.

Regarding the electrical connection of this electronic device, the leads common to each semiconductor device, such as a power source, are connected in parallel as shown on the right side in FIG. 2, and the semiconductor chip 2 and the inner lead 4a of each semiconductor device are connected. Bonded and connected.

The wiring unique to each semiconductor device, such as individual data input / output of the semiconductor device 2, is not connected in parallel, and in this embodiment, is called an empty pin which is not normally connected to the semiconductor chip in the lead. These leads are used to connect these unique wirings to the mounting board. For example, when only the semiconductor device 22 is connected, as shown on the left side in FIG. 2, in the semiconductor device 42, the inner lead 4a which is an empty pin and is not normally wire-bonded.
In the other semiconductor devices 41 and 43, the lead 4 is used as an empty pin and bonding is not performed. As a result, the relay lead 7 of another semiconductor device 41
Also, the semiconductor device 42 and the mounting substrate 1 are connected using the leads 4.

In this embodiment, the relay lead is adhered and the empty pin is used to maintain the compatibility with the conventional product.

Further, in the present embodiment, three layers are stacked, but if more layers are stacked and the number of vacant pins is insufficient, another lead frame with an increased number of leads is used to improve the stacking. Multiple layers can be stacked.

As described above, the inventions made by the present inventor are
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0042]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) According to the present invention, since the semiconductor device is provided with the relay function, there is an effect that multiple mounting of the semiconductor device becomes possible.

(2) According to the present invention, by mounting the semiconductor devices in multiple layers, it is possible to achieve high-density mounting on the mounting substrate.

(3) According to the present invention, due to the effect (2), the device can be downsized.

(4) According to the present invention, due to the effect (2), there is an effect that the connector and the cable become unnecessary.

(5) According to the present invention, due to the effect (4), the price is reduced and the reliability is improved.

(6) According to the present invention, since the wiring length is reduced by the effect (4), there is an effect that the circuit is speeded up and resistant to noise.

(7) According to the present invention, since the semiconductor device and the electronic component are provided with the heat radiation function, there is an effect that the heat radiation is performed well even when the multiple mounting is performed.

(8) According to the present invention, due to the effect (7), the performance of the electronic device is stabilized.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an electronic device according to an embodiment of the present invention.

FIG. 2 is a vertical sectional view showing an electronic device according to another embodiment of the present invention.

[Explanation of reference numerals] 1 ... Mounting substrate, 1a ... Insulator, 1b ... Conductor, 2 ... Semiconductor chip, 3 ... Tab, 4 ... Lead, 4a ... Inner lead, 4b ... Outer lead, 5 ... Bonding wire,
6 ... Sealing body, 7 ... Relay lead, 7a ... Vertical wiring, 7b ...
Surface wiring, 7c ... conductor, 7d ... adhesive layer, 8 ... electronic component,
9, 16 ... Heat transfer member, 11, 12, 13, 21, 23,
31, 32, 41, 42, 43 ... Semiconductor device, 15 ... Heat receiving member, 22, 24, 33 ... Electronic parts.

Claims (11)

[Claims] 1. A semiconductor device comprising a lead in which a semiconductor chip is sealed in a sealing body, one end is housed inside the sealing body, and the other end is extended outside the sealing body, wherein one end is the lead. A semiconductor device for multiple mounting, which is provided with a relay lead electrically connected to the other end of which is exposed on the surface of the sealing body. 2. The semiconductor device for multiple mounting according to claim 1, wherein a lead electrically connected to the relay lead is also electrically connected to the semiconductor chip. 3. The semiconductor device for multiple mounting according to claim 1, wherein the lead electrically connected to the relay lead is not electrically connected to the semiconductor chip. 4. The heat transfer member that is exposed to the outside of the sealing body, and the semiconductor chip is thermally connected to the heat transfer member. A semiconductor device for multiple mounting according to claim 1. 5. A sealing body, a lead, and a relay lead,
One end of the lead is housed inside the sealing body and the other end is extended to the outside of the sealing body, one end of the relay lead is electrically connected to the lead and the other end is exposed on the surface of the sealing body. An electronic component characterized by. 6. The electronic device according to claim 5, wherein a heat transfer member and a heat receiving member which are respectively exposed on the surface of the sealing body are provided, and the heat transfer member and the heat receiving member are thermally connected to each other. parts. 7. A semiconductor chip is sealed in a sealing body, and one end is housed inside the sealing body and the other end is extended to the outside of the sealing body, and the lead is electrically connected to the lead. An electronic device comprising a plurality of semiconductor devices, each having a relay lead, the other end of which is exposed on the surface of the sealing body. 8. A semiconductor chip is sealed in a sealing body, and one end is housed inside the sealing body and the other end is extended to the outside of the sealing body, and a lead is provided, and one end is electrically connected to the lead. A semiconductor device having a relay lead whose other end is exposed on the surface of the sealing body; and a sealing body, a lead, and a relay lead, wherein one end of the lead is housed inside the sealing body and the other end is sealed. An electronic device, comprising: an electronic component, which is extended to the outside of a stopper, and has one end of the relay lead electrically connected to the lead and the other end exposed on the surface of the sealing body. 9. The semiconductor device according to claim 7, further comprising a heat transfer member exposed to the outside of the sealing body, and the semiconductor chip being thermally connected to the heat transfer member. 8. An electronic device for multiple mounting according to item 8. 10. The electronic component has a heat transfer member and a heat receiving member which are respectively exposed on the surface of the sealing body, and the heat transfer member and the heat receiving member are thermally connected to each other. The electronic device for multiple mounting according to claim 8. 11. A conductor layer electrically connected to the semiconductor chip is provided on an upper main surface of the semiconductor encapsulant in which the semiconductor chip is encapsulated, and leads of another semiconductor encapsulant are connected to the conductor layer. A semiconductor device for multiple mounting, which is characterized in that