JPH08191192A - Electronic component retaining equipment - Google Patents

Electronic component retaining equipment

Info

Publication number
JPH08191192A
JPH08191192A JP1653495A JP1653495A JPH08191192A JP H08191192 A JPH08191192 A JP H08191192A JP 1653495 A JP1653495 A JP 1653495A JP 1653495 A JP1653495 A JP 1653495A JP H08191192 A JPH08191192 A JP H08191192A
Authority
JP
Japan
Prior art keywords
chassis
led
printed board
electronic component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1653495A
Other languages
Japanese (ja)
Other versions
JP2835824B2 (en
Inventor
Koji Yamashita
浩二 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akai Electric Co Ltd
Original Assignee
Akai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akai Electric Co Ltd filed Critical Akai Electric Co Ltd
Priority to JP1653495A priority Critical patent/JP2835824B2/en
Publication of JPH08191192A publication Critical patent/JPH08191192A/en
Application granted granted Critical
Publication of JP2835824B2 publication Critical patent/JP2835824B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Led Device Packages (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE: To make an independent holder unnecessary, reduce the number of components and realize cost reduction, by maintaining the attitude of an LED with a protrusion of a chassis which penetrates a printed board. CONSTITUTION: Protrusions 4a are collectively formed in one body to a chassis 4 together with a positioning boss 4b. Square holes 3c are made on a printed board 3 together with a positioning hole 3d. Lead legs 1a of an LED 1 are inserted into holes 3a of the printed board 3 and soldered together with other electronic components. In the state that the printed board 3 is fixed on the chassis 4, the boss 4b is engaged with the hole 3d, the protrusions 4a penetrate the square holes 3c, and the attitude of the LED 1 is maintained with the protrusions 4a. The inner sides of the protrusions 4a are sloped. When the LED 1 is slantingly mounted on the printed board 3, the attitude is corrected when the printed board 3 is fixed on the chassis 4, and the LED 1 is maintained in the normal attitude.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明はVTR(ビデオテープ
レコーダ)等において用いられているLED(発光ダイ
オード)等の電子部品を保持する保持装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding device for holding electronic parts such as LEDs (light emitting diodes) used in VTRs (video tape recorders) and the like.

【0002】[0002]

【従来の技術】一般に、VTR等では、図3にその概略
を示すように、磁気テープの端部を検出するためのフォ
トカプラが用いられている。図3において、符号1は赤
外線を発するLED、2は赤外線を検出するセンサ、3
は前記LED1及びセンサ2等の電子部品をマウントし
たプリント基板であり、図における下面にはパターン配
線が施されている。4は機器全体の組み付けを行なうシ
ャーシ、5はカセットテープの巻取り機構等(図示せ
ず)を支持するメカシャーシ、6はメカシャーシ5に固
定された発光用プリズム、7は受光用プリズム、8はカ
セットである。このカセット8に収納された磁気テープ
の始端、終端に相当するリーダ部、トレーラ部は赤外線
が通過し得る材料で構成されている。
2. Description of the Related Art Generally, in a VTR or the like, a photocoupler for detecting an end portion of a magnetic tape is used, as shown schematically in FIG. In FIG. 3, reference numeral 1 is an LED which emits infrared rays, 2 is a sensor which detects infrared rays, and 3
Is a printed circuit board on which electronic parts such as the LED 1 and the sensor 2 are mounted, and a pattern wiring is provided on the lower surface in the drawing. Reference numeral 4 is a chassis for assembling the entire apparatus, 5 is a mechanical chassis for supporting a cassette tape winding mechanism and the like (not shown), 6 is a light emitting prism fixed to the mechanical chassis 5, 7 is a light receiving prism, 8 Is a cassette. The leader part and the trailer part corresponding to the beginning and end of the magnetic tape stored in the cassette 8 are made of a material through which infrared rays can pass.

【0003】上記図示のものにおいて、LED1から放
射された赤外線は矢印aに沿って進み、発光用プリズム
6の端部で屈折されて2方向に分かれ、矢印b1とb2
とに沿って進む。前記トレーラ部が前記プリズム6,7
の間に位置しているときには、つまり磁気テープの終端
近傍では、前記矢印b1方向の赤外線がこのトレーラ部
を通過してプリズム7に至り、矢印cの方向に進んで前
記センサ2により検出される。尚、図では省略されてい
るが、矢印b2方向に進んだ赤外線は前記リーダ部を通
過して検出されるようになっていて、その構造は前記ト
レーラ部の場合と同様である。
In the above-mentioned figure, the infrared rays emitted from the LED 1 travel along the arrow a, are refracted at the end of the light emitting prism 6 and are divided into two directions, and the arrows b1 and b2.
Follow along. The trailer part is the prisms 6, 7
In the vicinity of the end of the magnetic tape, that is, in the vicinity of the end of the magnetic tape, the infrared rays in the direction of the arrow b1 pass through the trailer portion to reach the prism 7 and proceed in the direction of the arrow c to be detected by the sensor 2. . Although not shown in the drawing, the infrared rays traveling in the direction of the arrow b2 are detected by passing through the reader section, and the structure thereof is the same as that of the trailer section.

【0004】ところで、前記LED1及びセンサ2は指
向性を有する。従って、従来のこの種の装置において
は、LED1及びセンサ2がそれぞれプリズム6,7に
向かって赤外線を放射するように、その位置が保持され
るようになっている。図4は、LED1について、その
指向性を説明するためのものであり、角度θの範囲内に
は充分な量の赤外線が放射される。この指向性について
は、センサ2も略同様の特性を有する。
By the way, the LED 1 and the sensor 2 have directivity. Therefore, in the conventional device of this type, the positions thereof are held so that the LED 1 and the sensor 2 emit infrared rays toward the prisms 6 and 7, respectively. FIG. 4 is for explaining the directivity of the LED 1, and a sufficient amount of infrared rays are emitted within the range of the angle θ. Regarding this directivity, the sensor 2 also has substantially the same characteristics.

【0005】従来、前記LED1等の姿勢を保持するた
めに、図5及び図6に示すホルダーが用いられていた。
この図5は組み立てた状態を示し、図6は組立前の分解
状態を示している。図において、符号9はホルダーであ
り、天面にLED1の頭部よりも若干大きい径の孔を有
し、下部にはフックを有する。前記LED1のリード足
1aには屈折したフォーミング加工が施されている。こ
のリード足1aはプリント基板3の孔3aに挿入され
て、他の電子部品と共に自動半田槽等で半田付けされ
る。また、前記したフックがプリント基板3の角孔3b
に挿入されることにより、ホルダー9はプリント基板3
に取り付けられる。
Conventionally, the holders shown in FIGS. 5 and 6 have been used to hold the posture of the LED 1 and the like.
FIG. 5 shows the assembled state, and FIG. 6 shows the disassembled state before the assembly. In the figure, reference numeral 9 is a holder, which has a hole on the top surface having a diameter slightly larger than the head of the LED 1 and a hook on the lower portion. The lead legs 1a of the LED 1 are bent and formed. The lead legs 1a are inserted into the holes 3a of the printed board 3 and soldered together with other electronic components in an automatic soldering bath or the like. In addition, the above-mentioned hooks are the square holes 3b of the printed circuit board 3.
When the holder 9 is inserted into the printed circuit board 3,
Attached to.

【0006】[0006]

【発明が解決しようとする課題】従来のこの種の装置で
は、前記したように独立したホルダーを用いていたの
で、部品点数が多くなりコストアップになっていた。こ
の発明は、上記の課題に鑑み、部品点数が少なくコスト
の安い、LED等の電子部品の保持装置を提供すること
を目的とするものである。
In the conventional device of this type, since the independent holder is used as described above, the number of parts is increased and the cost is increased. The present invention has been made in view of the above problems, and an object thereof is to provide a holding device for electronic components such as LEDs, which has a small number of components and is inexpensive.

【0007】[0007]

【課題を解決するための手段】上記の課題を解決し、前
記目的を達成するためのこの発明の電子部品保持装置
は、LED等の電子部品のリード足が半田付けされたプ
リント基板をシャーシに固定したときに、この電子部品
の姿勢が保持されるようにした電子部品保持装置であっ
て、前記シャーシと一体にこのシャーシから立ち上げら
れたホルダー用の突起を備え、前記シャーシにプリント
基板が固定された状態で、前記突起が貫通するように、
このプリント基板には孔を設け、前記プリント基板が前
記シャーシに固定された状態で前記電子部品が前記突起
により保持されるようにしたことを特徴とするものであ
る。
SUMMARY OF THE INVENTION To solve the above problems and to achieve the above object, an electronic component holding device of the present invention is a printed circuit board having lead legs of electronic components such as LEDs soldered to a chassis. An electronic component holding device configured to hold the posture of the electronic component when fixed, wherein the electronic component holding device includes a protrusion for a holder that is integrally raised with the chassis and is raised from the chassis, and a printed circuit board is attached to the chassis. In the fixed state, so that the protrusion penetrates,
This printed circuit board is provided with a hole, and the electronic component is held by the protrusion in a state where the printed circuit board is fixed to the chassis.

【0008】[0008]

【作用】上記のように構成された電子部品保持装置で
は、プリント基板をシャーシに固定することにより、前
記突起が前記孔を貫通し、前記プリント基板に取付られ
ている電子部品が前記突起により保持される。
In the electronic component holding device configured as described above, by fixing the printed circuit board to the chassis, the protrusion penetrates the hole, and the electronic component mounted on the printed circuit board is held by the protrusion. To be done.

【0009】[0009]

【実施例】以下に、この発明の一実施例を図1について
説明する。図1(a)は組立状態を示し、(b)は組立
前の分解された状態を示す。図において、符号4aは突
起、4bは位置決めボスであり、これらはシャーシ4と
一体に形成され、このシャーシから立ち上げられてい
る。3cは角孔、3dは位置決め孔であり、これらはプ
リント基板3に設けられている。符号1は前記したLE
Dであり、そのリード足1aには屈折したフォーミング
が施されている。このリード足1aはプリント基板3の
孔3aに挿入されて、他の電子部品と共に自動半田槽等
で半田付けされる。前記プリント基板3は周知の手段に
より前記シャーシ4に固定される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG. 1A shows an assembled state, and FIG. 1B shows a disassembled state before assembly. In the figure, reference numeral 4a is a protrusion, and 4b is a positioning boss, which are integrally formed with the chassis 4 and are raised from this chassis. 3c is a square hole and 3d is a positioning hole, which are provided on the printed circuit board 3. Reference numeral 1 is the LE described above
The lead leg 1a has a curved shape. The lead legs 1a are inserted into the holes 3a of the printed board 3 and soldered together with other electronic components in an automatic soldering bath or the like. The printed circuit board 3 is fixed to the chassis 4 by a known means.

【0010】図1(a)に示すように、シャーシ4にプ
リント基板3が固定された状態にすると、前記ボス4b
が前記位置決め孔3dに嵌合され、かつ前記突起4aが
角孔3cに貫通されて、この突起4aにより前記LED
1の姿勢が保持される。前記突起4aの内側は斜面にな
っていて、仮にLED1が傾いてプリント基板3に実装
されていても、シャーシ4にプリント基板3を固定する
際にはその姿勢が矯正され、正規の姿勢に保持される。
As shown in FIG. 1A, when the printed circuit board 3 is fixed to the chassis 4, the boss 4b is removed.
Is fitted into the positioning hole 3d, and the protrusion 4a is penetrated into the square hole 3c.
The posture of 1 is maintained. The inside of the protrusion 4a is an inclined surface, and even if the LED 1 is inclined and mounted on the printed circuit board 3, when the printed circuit board 3 is fixed to the chassis 4, the attitude is corrected and the normal attitude is maintained. To be done.

【0011】前記LED1は、仮にホルダーが無い場合
でも、屈折されたリード足1aによって前記フォーミン
グの方向にはその姿勢が保たれるが、このフォーミング
方向とは直交方向には姿勢が変わりやすい。このため、
上記実施例では、LED1のリード足1aの前記したフ
ォーミング方向と直交する位置に突起4aが設けられて
いる。
Even if there is no holder, the LED 1 maintains its posture in the forming direction by the bent lead legs 1a, but the posture is likely to change in the direction orthogonal to the forming direction. For this reason,
In the above-described embodiment, the projection 4a is provided on the lead leg 1a of the LED 1 at a position orthogonal to the forming direction.

【0012】上記実施例では、突起4aの内側に斜面を
設けたが、図2のように、突起4aの内側の斜面の下端
部にLED1の底面を受ける段部を設けることにより、
LED1の姿勢の矯正を一層確実にすることができる。
In the above embodiment, the sloped surface is provided inside the projection 4a. However, as shown in FIG. 2, a stepped portion for receiving the bottom surface of the LED 1 is provided at the lower end of the sloped surface inside the projection 4a.
The posture of the LED 1 can be corrected more reliably.

【0013】[0013]

【発明の効果】この発明は以上のように構成されている
ので、安価にしてかつ確実にLED等の電子部品の姿勢
を保持することができる。
Since the present invention is configured as described above, the attitude of electronic parts such as LEDs can be reliably maintained at a low cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例を示すものであり、(a)
は組立状態の概略正面図、(b)は組立前の概略分解斜
視図である。
FIG. 1 shows an embodiment of the present invention, (a)
Is a schematic front view of an assembled state, and (b) is a schematic exploded perspective view before assembly.

【図2】この発明の他の実施例を示す概略正面図であ
る。
FIG. 2 is a schematic front view showing another embodiment of the present invention.

【図3】従来例を示す概略正面図である。FIG. 3 is a schematic front view showing a conventional example.

【図4】LEDの発光特性を説明するための図である。FIG. 4 is a diagram for explaining light emission characteristics of LEDs.

【図5】従来例を示す概略正面図である。FIG. 5 is a schematic front view showing a conventional example.

【図6】従来例を示す概略分解斜視図である。FIG. 6 is a schematic exploded perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 LED 1a リード足 2 センサ 3 プリント基板 3a 孔 3b 角孔 3c 角孔 3d 位置決め孔 4 シャーシ 4a 突起 4b 位置決めボス 5 メカシャーシ 6 発光用プリズム 7 受光用プリズム 8 カセット 9 ホルダー 1 LED 1a lead leg 2 sensor 3 printed circuit board 3a hole 3b square hole 3c square hole 3d positioning hole 4 chassis 4a protrusion 4b positioning boss 5 mechanical chassis 6 light emitting prism 7 light receiving prism 8 cassette 9 holder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 LED等の電子部品のリード足が半田付
けされたプリント基板をシャーシに固定したときに、こ
の電子部品の姿勢が保持されるようにした電子部品保持
装置であって、 前記シャーシと一体にこのシャーシから立ち上げられた
ホルダー用の突起を備え、前記シャーシにプリント基板
が固定された状態で、前記突起が貫通するように、この
プリント基板には孔を設け、前記プリント基板が前記シ
ャーシに固定された状態で前記電子部品が前記突起によ
り保持されるようにしたことを特徴とする電子部品保持
装置。
1. An electronic component holding device for holding a posture of an electronic component such as an LED when the printed circuit board to which lead legs of the electronic component are soldered is fixed to the chassis. A holder protrusion that is integrally raised with the chassis, and a hole is formed in the printed circuit board so that the protrusion penetrates when the printed circuit board is fixed to the chassis. An electronic component holding device, wherein the electronic component is held by the protrusion in a state of being fixed to the chassis.
JP1653495A 1995-01-06 1995-01-06 Electronic component holding device Expired - Lifetime JP2835824B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1653495A JP2835824B2 (en) 1995-01-06 1995-01-06 Electronic component holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1653495A JP2835824B2 (en) 1995-01-06 1995-01-06 Electronic component holding device

Publications (2)

Publication Number Publication Date
JPH08191192A true JPH08191192A (en) 1996-07-23
JP2835824B2 JP2835824B2 (en) 1998-12-14

Family

ID=11918941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1653495A Expired - Lifetime JP2835824B2 (en) 1995-01-06 1995-01-06 Electronic component holding device

Country Status (1)

Country Link
JP (1) JP2835824B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249713A (en) * 2010-05-31 2011-12-08 Mitsubishi Electric Corp Electronic component and semiconductor device with electronic component
EP3193568A3 (en) * 2002-12-10 2017-08-16 Marquardt GmbH Circuit carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3193568A3 (en) * 2002-12-10 2017-08-16 Marquardt GmbH Circuit carrier
JP2011249713A (en) * 2010-05-31 2011-12-08 Mitsubishi Electric Corp Electronic component and semiconductor device with electronic component

Also Published As

Publication number Publication date
JP2835824B2 (en) 1998-12-14

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