JPH08176882A - Plating bath for producing bright-tin plated material without performing reflow treatment - Google Patents

Plating bath for producing bright-tin plated material without performing reflow treatment

Info

Publication number
JPH08176882A
JPH08176882A JP32339194A JP32339194A JPH08176882A JP H08176882 A JPH08176882 A JP H08176882A JP 32339194 A JP32339194 A JP 32339194A JP 32339194 A JP32339194 A JP 32339194A JP H08176882 A JPH08176882 A JP H08176882A
Authority
JP
Japan
Prior art keywords
tin
plating
plating bath
plated steel
steel sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32339194A
Other languages
Japanese (ja)
Inventor
Hiromitsu Date
博充 伊達
Tomoya Oga
智也 大賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP32339194A priority Critical patent/JPH08176882A/en
Publication of JPH08176882A publication Critical patent/JPH08176882A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE: To provide an acid tin plating bath with which a tin plated steel sheet having beautiful brightness can be produced without performing reflow treatment. CONSTITUTION: This plating bath for performing bright tin plating consists of 0.1 to 1.0mol/l of an organic sulfonic acid, 0.1 to 0.85mol/l of tin (II) and a brightener contg. 5×10<-4> to 0.015mol/l of a surfactant having an oxyethylene chain and 2×10<-3> to 0.02mol/l of an aromatic carbonyl compound having a double bond (s). By using the plating bath, a tin plated steel sheet having beautiful brightness can be produced without performing reflow treatment after the electrolysis and accordingly, the economical effect due to the elimination of this production stage is great.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、缶等の材料に用いられ
る錫めっき鋼板を製造する際に用いられる酸性錫めっき
浴に関する。さらに詳しくは、リフロー処理なしで金属
光沢を有する錫めっきが得られるめっき浴に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an acidic tin plating bath used for producing tin-plated steel sheets used for materials such as cans. More specifically, it relates to a plating bath that can obtain tin plating having a metallic luster without reflow treatment.

【0002】[0002]

【従来の技術】ブリキに代表される錫めっき鋼板は美麗
な金属光沢を有し、耐食性にも優れた材料であることか
ら、古くから広く用いられており、現在なおその需要は
大きい。錫のめっき方法については、希少資源で高価な
錫の使用を減少する必要性から、現在では溶融めっきに
代わり、電気めっきによる製造が一般的となっている。
最も広く用いられているめっき浴はフェロスタン浴とい
う、フェノールスルホン酸を酸成分とした酸性めっき浴
である。近年では、特開平4−228595号公報に開
示されているように、アルキルスルホン酸を酸成分とし
て用いる錫めっき液も開発されている。
2. Description of the Related Art Tin-plated steel sheets represented by tinplate have been used widely since ancient times because they have a beautiful metallic luster and are excellent in corrosion resistance. Regarding the tin plating method, electroplating is now generally used instead of hot dip plating because of the need to reduce the use of tin, which is expensive due to scarce resources.
The most widely used plating bath is a ferrostan bath, which is an acidic plating bath containing phenolsulfonic acid as an acid component. In recent years, a tin plating solution using an alkyl sulfonic acid as an acid component has been developed, as disclosed in JP-A-4-228595.

【0003】いずれの酸性錫めっき浴によっても電析し
たままの錫は白く、金属光沢が乏しい。これは電析錫の
形態がミクロに見れば粒状で、光を散乱することに起因
している。DI缶のように缶壁がしごき加工によって金
属光沢が現れる場合は別として、溶接缶のように缶壁の
錫が加工をほとんど受けない用途に用いる場合は、電気
めっき後、加熱により錫を一旦溶融する、いわゆるリフ
ロー処理を行うことによって美しい金属光沢を有する錫
めっき鋼板を製造している。
The tin as electrodeposited by any acidic tin plating bath is white and has a poor metallic luster. This is because the morphology of the electrodeposited tin is microscopic when viewed microscopically and scatters light. Aside from the case where the can wall shows a metallic luster due to ironing as in the case of DI cans, when used for applications where tin on the can wall undergoes almost no processing such as in welded cans, tin is once heated after electroplating. A tin-plated steel sheet having a beautiful metallic luster is manufactured by performing a so-called reflow treatment of melting.

【0004】[0004]

【発明が解決しようとする課題】前記のリフロー処理に
よって美麗な金属光沢を得ることが一般的となっている
が、リフロー処理を行うことによる工程の増加や加熱に
要するエネルギーの消費、さらには操業管理の必要性等
の問題点をかかえている。本発明は、錫めっき後のリフ
ロー処理を行わなくても美麗な金属光沢を有する錫めっ
き鋼板を製造することのできる酸性錫めっき浴を提供す
ることを目的とする。
It is general to obtain a beautiful metallic luster by the above-mentioned reflow treatment, but the reflow treatment increases the number of steps, consumes energy required for heating, and further increases the operation. It has problems such as the necessity of management. It is an object of the present invention to provide an acidic tin plating bath capable of producing a tin-plated steel sheet having a beautiful metallic luster without performing a reflow treatment after tin plating.

【0005】[0005]

【課題を解決するための手段】本発明者らは、光沢めっ
きが得られる光沢添加剤をはじめ各めっき浴組成につい
て種々検討した結果、本発明に至ったものである。本発
明は、0.1〜1.0mol/lの有機スルホン酸、
0.1〜0.85mol/lの錫(II)、およびオキシ
エチレン鎖を有する界面活性剤5×10-4〜0.015
mol/lと二重結合を有する芳香族カルボニル化合物
2×10-3〜0.02mol/lとからなる光沢添加剤
を含むことを特徴とする光沢錫めっきが得られるめっき
浴を要旨とするものである。
The present inventors have accomplished the present invention as a result of various studies on various plating bath compositions including a brightening additive capable of obtaining bright plating. The present invention comprises 0.1 to 1.0 mol / l of organic sulfonic acid,
0.1 to 0.85 mol / l tin (II), and a surfactant having an oxyethylene chain 5 × 10 −4 to 0.015
The subject is a plating bath capable of obtaining bright tin plating, characterized in that the plating bath contains a brightening additive comprising mol / l and an aromatic carbonyl compound having a double bond of 2 × 10 −3 to 0.02 mol / l. Is.

【0006】[0006]

【作用】以下に本発明について詳細に説明する。本発明
の錫めっき浴では酸成分として有機スルホン酸を用い
る。有機スルホン酸濃度は0.1〜1.0mol/lに
限定する。有機スルホン酸濃度0.1mol/lで電界
液のpHは約1.2であり、電解時に陰極近傍でpHが
上昇しても錫(II)イオンは安定であるが、これより低
い濃度では陰極近傍でpHが上昇すると錫(II)イオン
が不安定となって水酸化物の沈殿が生ずる。一方、有機
スルホン酸濃度が1.0mol/lより濃いと排水中の
有機物濃度が高くなり、排出時の処理費用が嵩むように
なる。
The present invention will be described in detail below. In the tin plating bath of the present invention, organic sulfonic acid is used as an acid component. The organic sulfonic acid concentration is limited to 0.1 to 1.0 mol / l. The pH of the electrolytic solution is about 1.2 at an organic sulfonic acid concentration of 0.1 mol / l, and tin (II) ions are stable even if the pH rises near the cathode during electrolysis. When the pH increases in the vicinity, the tin (II) ion becomes unstable and hydroxide precipitates. On the other hand, when the concentration of organic sulfonic acid is higher than 1.0 mol / l, the concentration of organic substances in the waste water becomes high, and the treatment cost at the time of discharge increases.

【0007】本発明では錫(II)濃度は0.1〜0.8
5mol/lとする。本発明はブリキに代表される錫め
っき鋼板を製造することを前提としているので、従来の
錫めっきと同等あるいはそれ以上の生産性が経済的な観
点から要求される。したがって、錫めっきの電流密度は
10A/dm2以上であることが必要である。このよう
な電流密度域の操業においては、0.1mol/l未満
の錫(II)濃度では陰極電流効率が低く、電析錫が樹枝
状となるいわゆるめっきやけが生じやすい。錫(II)が
0.85mol/lを超えると高濃度化によるめっき性
能の向上が認められなくなるとともに、スラッジ(錫酸
化物の沈殿)の増加、ストリップのめっき液持ち出し量
の増加のため、経済的に不利である。
In the present invention, the tin (II) concentration is 0.1 to 0.8.
It is 5 mol / l. Since the present invention is premised on the production of tin-plated steel sheets represented by tinplate, productivity equal to or higher than that of conventional tin plating is required from the economical point of view. Therefore, the current density of tin plating needs to be 10 A / dm 2 or more. In the operation in such a current density region, at a tin (II) concentration of less than 0.1 mol / l, the cathode current efficiency is low, and so-called plating burn, in which the deposited tin becomes dendritic, is likely to occur. When tin (II) exceeds 0.85 mol / l, improvement in plating performance due to high concentration is not observed, and sludge (precipitation of tin oxide) increases and strip plating solution carry-out amount increases, which is economical. Is disadvantageous.

【0008】建浴時の錫は、可溶性の二価の錫塩、金属
錫または錫(II)酸化物SnOとして加える。金属錫と
SnOの溶解速度は低いので、迅速な建浴のためには錫
塩の使用が好ましい。めっき浴の酸成分に相当する有機
スルホン酸錫(II)の添加が最適だが、経済的な理由か
ら比較的安価な硫酸錫(II)を用いてもよい。予め有機
スルホン酸を加えてpHを2未満、好ましくは1.2以
下にした溶液に少しずつ溶解しながら加えていく。一度
に多量に加えると水酸化物の沈殿を生じやすい。
[0008] Tin in the bath is added as a soluble divalent tin salt, metallic tin or tin (II) oxide SnO. Due to the low dissolution rate of metallic tin and SnO, the use of tin salts is preferred for rapid bath construction. Although it is optimal to add tin (II) organic sulfonate corresponding to the acid component of the plating bath, tin (II) sulfate, which is relatively inexpensive, may be used for economic reasons. Organic sulfonic acid is added in advance to adjust the pH to less than 2, preferably 1.2 or less, and the solution is gradually added while being dissolved. Addition of a large amount at one time tends to cause precipitation of hydroxide.

【0009】酸性有機スルホン酸浴によって電気錫めっ
きを行う場合、光沢添加剤を添加しないと電析錫が粗な
柱状となり、析出効果、光沢、めっき密着性、耐食性が
著しく悪化する。このような錫めっき鋼板は缶用材料と
して使用することは不可能である。光沢添加剤としてオ
キシエチレン鎖(CH2 CH2 O)n を有する界面活性
剤を単独で使用した場合、この界面活性剤のオキシエチ
レン鎖が陰極である鋼板表面の錫結晶成長点に優先的に
吸着して結晶成長を阻害するために均一電着性が向上
し、比較的微細な結晶が生成する。電析した錫は1μm
程度の粒状となり、表面に凹凸が存在するため、表面外
観は白色を呈し、いわゆる金属光沢は生じない。めっき
原板として表面粗度Raが鋼板の圧延方向で0.19μ
m、幅方向で0.27μmの鋼板を用いた場合、JIS
Z 8741によって鋼板の圧延方向で測定した60
°鏡面光沢度(Gs60°)は、最も光沢の優れた錫め
っき鋼板で430であった。これにリフロー処理を行え
ば十分な光沢が得られるが、電解処理のみで光沢の優れ
た錫めっき鋼板を得るという本発明の目的を達成しな
い。
When electrolytic tin plating is carried out in an acidic organic sulfonic acid bath, if a gloss additive is not added, the deposited tin will have a rough columnar shape, and the deposition effect, gloss, plating adhesion and corrosion resistance will be markedly deteriorated. Such a tin-plated steel sheet cannot be used as a material for cans. When a surfactant having an oxyethylene chain (CH 2 CH 2 O) n is used alone as a gloss additive, the oxyethylene chain of this surfactant is preferentially applied to the tin crystal growth point on the surface of the steel plate where the cathode is the cathode. Since it is adsorbed and inhibits crystal growth, the throwing power is improved and relatively fine crystals are produced. Electrodeposited tin is 1 μm
Since the particles have a certain degree of granularity and the surface has irregularities, the surface appearance is white and so-called metallic luster does not occur. The surface roughness Ra of the plating original plate is 0.19 μ in the rolling direction of the steel plate.
m, when using a steel plate of 0.27 μm in the width direction, JIS
60 measured in the rolling direction of the steel sheet according to Z 8741
The specular glossiness (Gs60 °) was 430 for the tin-plated steel sheet having the highest gloss. Sufficient luster can be obtained by subjecting this to reflow treatment, but the purpose of the present invention of obtaining a tin-plated steel sheet with excellent luster by only electrolytic treatment is not achieved.

【0010】そこで、本発明者らは、電解処理のみで美
しい金属光沢を有する錫めっき鋼板を得るための光沢添
加剤について鋭意検討を重ねた結果、光沢添加剤とし
て、オキシエチレン鎖(CH2 CH2 O)n を有する界
面活性剤だけでなく、二重結合を有する芳香族カルボニ
ル化合物φ−CH=CH−CO−(φは芳香環)を併用
することでリフローブリキ並みの金属光沢を有する錫め
っきが実現できることを見いだした。すなわち、錫の結
晶を微細化し、均一電着性を向上させるという界面活性
剤の効果に加え、鋼板の物理的凸部に強く吸着してその
部分の電析を阻害することによって電析錫を平滑化する
芳香族カルボニル化合物の効果が同時に作用することに
よる相乗効果によって、リフロー処理材に匹敵する金属
光沢、すなわちGs60°で550以上を得ることを可
能にした。
Therefore, the inventors of the present invention have made extensive studies as to a gloss additive for obtaining a tin-plated steel sheet having a beautiful metallic luster only by electrolytic treatment, and as a result, as a gloss additive, oxyethylene chain (CH 2 CH 2 2 O) n not only a surfactant but also an aromatic carbonyl compound having a double bond φ-CH = CH-CO- (φ is an aromatic ring) is used together to provide tin having a metallic luster similar to that of reflow tin. We have found that plating can be realized. That is, in addition to the effect of the surfactant to refine the crystal of tin and improve the uniform electrodeposition property, it is strongly adsorbed to the physical convex portion of the steel sheet and inhibits the electrodeposition of that portion, so that the deposited tin is The synergistic effect of the simultaneous effect of the smoothing aromatic carbonyl compound makes it possible to obtain a metallic luster comparable to that of the reflow treated material, that is, 550 or more at Gs 60 °.

【0011】オキシエチレン鎖を有する界面活性剤とし
ては、POOA(ポリオキシエチレンオクタデシルアミ
ン)、ENSA(エトキシ化α−ナフトールスルホン
酸)、PEG(ポリエチレングリコール)を用いるとよ
い。その濃度は、5×10-4〜0.015mol/lが
適している。5×10-4mol/lより低濃度では陰極
への吸着量が少なく、錫が均一電着するという光沢添加
剤としての効果が見られない。一方、0.015mol
/lより高濃度では陰極への吸着量過多でめっき密着不
良となる。
As the surfactant having an oxyethylene chain, POOA (polyoxyethylene octadecylamine), ENSA (ethoxylated α-naphtholsulfonic acid), PEG (polyethylene glycol) may be used. A suitable concentration is 5 × 10 −4 to 0.015 mol / l. When the concentration is lower than 5 × 10 −4 mol / l, the amount adsorbed on the cathode is small, and tin is electrodeposited uniformly, which is not effective as a gloss additive. On the other hand, 0.015 mol
When the concentration is higher than 1 / l, the amount of adsorption to the cathode is too large, resulting in poor plating adhesion.

【0012】二重結合を有する芳香族カルボニル化合物
としては、ベンザルアセトン、シンナムアルデヒドを用
いるとよい。芳香族カルボニル化合物の濃度は2×10
-3〜0.02mol/lがよい。0.02mol/lよ
り高濃度では陰極への吸着量過多となりめっき密着性、
陰極電流効率が低下する。一方、2×10-3mol/l
より低濃度では界面活性剤を単独で用いてめっきした場
合と変わりがなく、光沢めっきが得られない。
As the aromatic carbonyl compound having a double bond, benzalacetone or cinnamaldehyde may be used. The concentration of aromatic carbonyl compound is 2 × 10
-3 to 0.02 mol / l is preferable. When the concentration is higher than 0.02 mol / l, the amount of adsorption on the cathode becomes excessive and the plating adhesion,
Cathode current efficiency decreases. On the other hand, 2 × 10 -3 mol / l
At a lower concentration, there is no difference from when plating is performed by using a surfactant alone, and bright plating cannot be obtained.

【0013】めっき浴中の鉄イオンによって増加するス
ラッジの生成量をより低く抑える必要があれば、めっき
浴中にα−オキシカルボン鎖等の鉄イオンマスク剤を添
加してもよい。光沢めっきは付着量によって外観が異な
るが、この傾向は通常の錫めっき鋼板と同じである。こ
れはめっき付着量が少ないほど鋼板表面の隠ぺい率が低
いことに起因する。光沢錫めっきは錫が均一に電着する
ため、従来の錫めっき鋼板よりは低付着量で原板の隠ぺ
い率が高い。光沢めっきの効果が現れるのは0.4g/
2 以上の付着量の場合である。通常使用される錫めっ
き鋼板のうち付着量の最も多い22.4g/m2 までは
めっき付着量過多を示唆する現象は現れなかった。これ
より多い付着量については商業価値が低いと考え、確認
しなかった。
If it is necessary to suppress the amount of sludge generated by the iron ions in the plating bath to a lower level, an iron ion masking agent such as α-oxycarboxylic chain may be added to the plating bath. The appearance of bright plating differs depending on the amount of adhesion, but this tendency is the same as with ordinary tin-plated steel sheets. This is because the hiding ratio of the steel sheet surface is lower as the coating amount is smaller. With bright tin plating, tin is electrodeposited uniformly, so the amount of coating is lower and the hiding ratio of the original plate is higher than with conventional tin-plated steel plates. The effect of bright plating is 0.4g /
This is the case when the adhesion amount is m 2 or more. Among the commonly used tin-plated steel sheets, the phenomenon showing an excessive coating weight did not appear up to 22.4 g / m 2, which had the highest coating weight. It was not confirmed that the amount of adhesion was higher than that of commercial value because it had low commercial value.

【0014】めっき浴温は30〜70℃が好ましい。3
0℃より低いと光沢めっきが得られないし、めっきやけ
が生じやすくなる。一方、70℃より高温では酸を含む
蒸気の発生が多く、操業性が悪化する。電流密度は10
〜200A/dm2 が好ましい。10A/dm2 より低
電流密度では十分な光沢が得られない。一方200A/
dm2 より高電流密度ではめっきやけが生じやすい。た
だし、これは従来のフェロスタンラインを利用してのめ
っきの場合であって、ストリップとめっき液がより速い
相対速度を持つようなラインを使えばより高い電流密度
での製造も可能となるであろう。
The plating bath temperature is preferably 30 to 70 ° C. Three
If the temperature is lower than 0 ° C, bright plating cannot be obtained and plating burns easily. On the other hand, when the temperature is higher than 70 ° C., steam containing acid is often generated and the operability is deteriorated. Current density is 10
˜200 A / dm 2 is preferable. At a current density lower than 10 A / dm 2 , sufficient gloss cannot be obtained. On the other hand, 200A /
At a current density higher than dm 2 , plating burn is likely to occur. However, this is the case of plating using a conventional ferrostan line, and if a line where the strip and the plating solution have a higher relative speed is used, it is possible to manufacture at a higher current density. Ah

【0015】光沢めっきは、めっき液とストリップがと
もに静止した状態での電解では得にくいが、通常のブリ
キラインでのストリップの通板速度、すなわち100m
/分以上であればストリップとめっき液の相対速度は十
分で、めっき液の流動について特に考慮せずに製造する
ことができる。
Bright plating is difficult to obtain by electrolysis with both the plating solution and the strip being stationary, but the strip running speed in a normal tin line, that is, 100 m
If it is not less than / minute, the relative speed between the strip and the plating solution is sufficient, and the production can be performed without particularly considering the flow of the plating solution.

【0016】[0016]

【実施例】以下に本発明の実施例を説明する。表面粗度
Raが鋼板の圧延方向で0.19μm、幅方向で0.2
7μmの冷延鋼板を脱脂、酸洗、水洗後、表1に示すよ
うに、有機スルホン酸、錫(II)、オキシエチレン鎖を
有する界面活性剤、二重結合を有する芳香族カルボニル
化合物を含むめっき液を用いて電気めっきした。
Embodiments of the present invention will be described below. The surface roughness Ra is 0.19 μm in the rolling direction of the steel sheet and 0.2 in the width direction.
After degreasing, pickling, and washing a 7-μm cold-rolled steel sheet, as shown in Table 1, organic sulfonic acid, tin (II), a surfactant having an oxyethylene chain, and an aromatic carbonyl compound having a double bond are contained. It electroplated using the plating solution.

【0017】電気めっきは、浴温45℃、電流密度10
0A/dm2 で錫付着量2.8g/m2 となるよう通電
して行った。アノードはチタンに白金めっきした不溶性
アノードを使用した。得られた錫めっき鋼板に対して下
記の評価を行った。 a)陰極電流効率 めっき鋼板の錫付着量を希塩酸中で電解剥離することに
よって測定し、理論付着量に対する百分率を陰極電流効
率とした。陰極電流効率は95%以上が求められる。
Electroplating is carried out at a bath temperature of 45 ° C. and a current density of 10
Was performed energized so that the tin coating weight 2.8 g / m 2 at 0A / dm 2. The anode used was an insoluble anode made by plating platinum on titanium. The following evaluation was performed on the obtained tin-plated steel sheet. a) Cathode current efficiency The amount of tin deposited on the plated steel sheet was measured by electrolytic stripping in dilute hydrochloric acid, and the percentage of the theoretical amount deposited was defined as the cathode current efficiency. The cathode current efficiency is required to be 95% or more.

【0018】b)めっき光沢 JIS Z 8741の方法により、錫めっき鋼板の光
沢度Gs60°を測定した。光の入射、反射の方向は、
めっき原板の圧延方向とした。光沢度は、本実施例で用
いた鋼板表面粗度の場合、550以上が外観上望まれ
る。 c)めっき密着性 錫めっき鋼板にカッターで地鉄に達するスクラッチを1
mmの格子状に入れ、二液化エポキシフェノール接着剤
(主剤と硬化剤よりなるもの)でティンフリースチール
と貼り合わせた。引張り試験機で錫めっき鋼板とティン
フリースチールを引き剥し、格子の5%以上が地鉄と錫
めっきの界面で剥離したものを密着性不良とした。
B) Plating Luster The gloss Gs 60 ° of the tin-plated steel sheet was measured by the method of JIS Z 8741. The incident and reflected directions of light are
The rolling direction of the original plating plate was used. In the case of the steel plate surface roughness used in this example, a glossiness of 550 or more is desired in terms of appearance. c) Plating adhesion Scratch that reaches the base metal with a cutter on a tin-plated steel sheet 1
It was put in a grid shape of mm and bonded to Tin-free steel with a two-liquefied epoxy phenol adhesive (comprising a main agent and a curing agent). The tin-plated steel plate and the tin-free steel were peeled off by a tensile tester, and 5% or more of the grid was peeled off at the interface between the base metal and the tin plating, and the adhesion was poor.

【0019】以上の各種の評価方法を表1に示す。表1
で明らかなように、本発明で規定する有機スルホン酸濃
度、錫(II)濃度、界面活性剤濃度、芳香族カルボニル
化合物濃度からなるめっき液を用いると光沢の極めて高
い錫めっきが高電流効率で得られた。また、めっき密着
性も良好であった。
Table 1 shows the various evaluation methods described above. Table 1
As is clear from the above, when a plating solution consisting of the organic sulfonic acid concentration, the tin (II) concentration, the surfactant concentration, and the aromatic carbonyl compound concentration specified in the present invention is used, tin plating with extremely high gloss can be obtained with high current efficiency. Was obtained. The plating adhesion was also good.

【0020】比較例1は有機スルホン酸濃度が低いため
に電解により陰極近傍のpHが錫(II)イオンの不安定
領域にまで上昇し、錫の水酸化物の沈殿が生じた。比較
例2は有機スルホン酸濃度が高く、良好な錫めっき鋼板
が得られるが、排水処理の経済的な問題がある。比較例
3は錫(II)濃度が低く、めっきやけが生じ、電流効率
も低かった。
In Comparative Example 1, since the organic sulfonic acid concentration was low, the pH in the vicinity of the cathode was increased to the tin (II) ion unstable region by electrolysis, and tin hydroxide precipitates. Comparative Example 2 has a high organic sulfonic acid concentration and can obtain a good tin-plated steel sheet, but it has an economical problem of wastewater treatment. In Comparative Example 3, the tin (II) concentration was low, plating burns occurred, and the current efficiency was low.

【0021】比較例4は優れた錫めっきが得られたが、
より低錫濃度の浴からの錫めっきと差がないため、経済
的な面から避けた法がよい錫濃度域である。比較例5は
界面活性剤濃度が低く、析出した錫の分布が不均一であ
り、光沢外観は得られなかった。比較例6は界面活性剤
濃度が高すぎるため、めっき密着性が劣っていた。
In Comparative Example 4, excellent tin plating was obtained,
There is no difference from the tin plating from a bath with a lower tin concentration, so the tin concentration range is a method that is economically avoided. In Comparative Example 5, the surfactant concentration was low, the distribution of the precipitated tin was non-uniform, and a glossy appearance was not obtained. In Comparative Example 6, since the surfactant concentration was too high, the plating adhesion was poor.

【0022】比較例7は芳香族カルボニル化合物の濃度
が低く、通常の錫めっき鋼板としては十分な光沢が得ら
れるが、リフロー処理ブリキに代わる用途に十分なだけ
の光沢めっきは得られなかった。比較例8は芳香族カル
ボニル化合物濃度が高く、めっき密着不良となった。
In Comparative Example 7, the concentration of the aromatic carbonyl compound was low, and sufficient luster was obtained as an ordinary tin-plated steel sheet, but not sufficient luster plating for use in place of the reflow treatment tin plate. In Comparative Example 8, the aromatic carbonyl compound concentration was high and the plating adhesion was poor.

【0023】[0023]

【表1】 [Table 1]

【0024】[0024]

【発明の効果】本発明により、電解後のリフロー処理を
行わないでも美麗な光沢を有する錫めっき鋼板を得るこ
とができるので、工程省略による経済的な効果が大き
い。
According to the present invention, a tin-plated steel sheet having a beautiful luster can be obtained without performing a reflow treatment after electrolysis. Therefore, the economical effect is large by omitting the steps.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 0.1〜1.0mol/lの有機スルホ
ン酸、0.1〜0.85mol/lの錫(II)、および
オキシエチレン鎖を有する界面活性剤5×10-4〜0.
015mol/lと二重結合を有する芳香族カルボニル
化合物2×10-3〜0.02mol/lとからなる光沢
添加剤を含むことを特徴とする光沢錫めっきが得られる
めっき浴。
1. A surfactant having an organic sulfonic acid of 0.1 to 1.0 mol / l, tin (II) of 0.1 to 0.85 mol / l, and an oxyethylene chain of 5 × 10 −4 to 0. .
A plating bath capable of obtaining bright tin plating, characterized by containing a brightening additive composed of 015 mol / l and an aromatic carbonyl compound having a double bond of 2 × 10 −3 to 0.02 mol / l.
JP32339194A 1994-12-26 1994-12-26 Plating bath for producing bright-tin plated material without performing reflow treatment Withdrawn JPH08176882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32339194A JPH08176882A (en) 1994-12-26 1994-12-26 Plating bath for producing bright-tin plated material without performing reflow treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32339194A JPH08176882A (en) 1994-12-26 1994-12-26 Plating bath for producing bright-tin plated material without performing reflow treatment

Publications (1)

Publication Number Publication Date
JPH08176882A true JPH08176882A (en) 1996-07-09

Family

ID=18154217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32339194A Withdrawn JPH08176882A (en) 1994-12-26 1994-12-26 Plating bath for producing bright-tin plated material without performing reflow treatment

Country Status (1)

Country Link
JP (1) JPH08176882A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6797142B2 (en) 2001-05-24 2004-09-28 Shipley Company, L.L.C. Tin plating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6797142B2 (en) 2001-05-24 2004-09-28 Shipley Company, L.L.C. Tin plating
US7160629B2 (en) 2001-05-24 2007-01-09 Shipley Company, L.L.C. Tin plating

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