JPH08174262A - Excimer laser machining method - Google Patents

Excimer laser machining method

Info

Publication number
JPH08174262A
JPH08174262A JP6325191A JP32519194A JPH08174262A JP H08174262 A JPH08174262 A JP H08174262A JP 6325191 A JP6325191 A JP 6325191A JP 32519194 A JP32519194 A JP 32519194A JP H08174262 A JPH08174262 A JP H08174262A
Authority
JP
Japan
Prior art keywords
excimer laser
ink
ink ejection
water
repellent film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6325191A
Other languages
Japanese (ja)
Inventor
Yasuhiro Fujiwara
康弘 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6325191A priority Critical patent/JPH08174262A/en
Publication of JPH08174262A publication Critical patent/JPH08174262A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide an excimer laser machining method which enables machining of hard-to-work materials with excimer laser. CONSTITUTION: A water-repellant film 5 having an inefficient workability by excimer laser is held between an ink discharge head member 4 and a member 7 which have a satisfactory workability, and irradiated with an excimer laser beam 6 so as to work the entirety simultaneously. Consequently, the absorptivity of excimer laser energy is high on the member which is set in close contact to the water-repellant film 5, enabling the water-repellant film 5 to be machined simultaneously when the member 7 with the satisfactory workability is machined.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、エキシマレーザエネル
ギの吸収率が低くエキシマレーザによる加工性の悪いエ
キシマレーザ難加工材料のエキシマレーザ加工方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an excimer laser processing method for excimer laser difficult-to-process materials having a low excimer laser energy absorption rate and poor excimer laser processability.

【0002】[0002]

【従来の技術】一般にエキシマレーザによる加工はその
加工精度及びアブレーション加工という加工原理により
加工領域以外にダメージを与えにくい高精度加工工法と
して微細加工に広く用いられている。
2. Description of the Related Art Generally, excimer laser processing is widely used for fine processing as a high-precision processing method that hardly damages other than the processing region due to its processing accuracy and ablation processing principle.

【0003】エキシマレーザの加工特性をよく利用した
事例としてインクジェットプリンタのインク吐出用ヘッ
ドのインク吐出口の形成加工がある。一般にインク吐出
口径は、φ30μm〜φ40μmの微少なものであるこ
とと形成部材の加工性より、加工領域以外にダメージを
与えにくい高精度加工工法としてエキシマレーザを用い
ることが多い。
As an example of well utilizing the processing characteristics of the excimer laser, there is processing for forming an ink ejection port of an ink ejection head of an ink jet printer. In general, an excimer laser is often used as a high-precision processing method in which damage to areas other than the processing area is less likely to occur due to the fact that the diameter of the ink ejection port is as small as 30 μm to 40 μm and the workability of the forming member.

【0004】以下、インクジェットプリンタのインク吐
出用ヘッドのインク吐出口の形成加工を例に説明する。
The process of forming the ink ejection port of the ink ejection head of an ink jet printer will be described below as an example.

【0005】一般に、インクジェットプリンタにおいて
はインク吐出用ヘッドのインク吐出口近傍にインクが不
均一に溜まることにより生じる吐出インクの飛行曲がり
による印字ドット位置ずれやスプラッシュの発生を防止
するために、インク吐出口近傍の表面に撥水処理を施し
インク溜まりを防止しているものが多い。位置ずれ、ス
プラッシュについては印字品質的に非常に悪いものであ
る。インク吐出口を形成する部材にはポリイミドやポリ
エーテル等のポリマーフィルムが用いられており、撥水
剤としてはフッ素樹脂やサイトップ(旭ガラス(株)
製)等をコーティングする方法が取られている。
In general, in an ink jet printer, ink ejection is performed in order to prevent print dot positional deviation and splash due to flight deflection of ejected ink caused by non-uniform accumulation of ink in the vicinity of an ink ejection port of an ink ejection head. In many cases, water repellent treatment is applied to the surface near the outlet to prevent ink accumulation. The misalignment and splash are very bad in print quality. A polymer film such as polyimide or polyether is used for the member forming the ink ejection port, and as the water repellent, a fluororesin or CYTOP (Asahi Glass Co., Ltd.) is used.
Manufactured) is used.

【0006】しかしながら、上記のごとくインク吐出口
を形成する部材にポリマーフィルムを用い撥水剤として
フッ素樹脂を用いた場合、インク吐出口形成後に撥水剤
をコーティングしようとするとインク吐出口内部は親水
性を要求される為インク吐出口を避けてコーティングせ
ねばならないことなどより技術的に難しく、また手間が
かかる為予めコーティングを施した後にインク吐出口を
形成する工法が好ましいが、エキシマレーザエネルギの
吸収率が高い加工性の比較的良好なポリマーフィルムに
対し、フッ素樹脂はエキシマレーザエネルギの吸収率が
低く加工性が悪いため全く加工されなかったり、吐出口
上に膜状に加工残りが発生することがある。
However, when a polymer film is used for the member forming the ink ejection port as described above and a fluororesin is used as the water repellent agent, if the water repellent agent is coated after the ink ejection port is formed, the inside of the ink ejection port becomes hydrophilic. Since it is required that the ink ejection port be coated, it is technically more difficult to coat the ink ejection port, and since it takes time and labor, a method of forming the ink ejection port after applying the coating in advance is preferable. In contrast to a polymer film with a high absorption rate and relatively good workability, fluororesin has a low absorption rate of excimer laser energy and has poor workability, so it is not processed at all, or a film-like unprocessed residue occurs on the discharge port. Sometimes.

【0007】[0007]

【発明が解決しようとする課題】このようにエキシマレ
ーザによりインク吐出口形成の際、撥水膜が加工されな
い場合はもちろん膜状の加工残りが発生するとインク吐
出の状態は悪く、撥水膜が機能しないため印字品質を満
足しないばかりか吐出がなされないこともあり得るとい
う問題点を有している。
As described above, when the water-repellent film is not processed by the excimer laser when the water-repellent film is not processed, of course, when a film-shaped unprocessed residue is generated, the ink-discharge condition is bad and the water-repellent film is not formed. Since it does not function, not only the print quality is not satisfied, but also ejection may not be performed.

【0008】本発明は上記問題点を解決するためのもの
で、その目的はエキシマレーザによる加工性の悪い材料
のエキシマレーザによる加工を可能にし、表面にエキシ
マレーザによる加工性の悪い撥水膜が施されているイン
ク吐出用ヘッド部材にエキシマレーザにてインク吐出口
を撥水膜の機能を損なうことなく形成し、吐出安定性に
優れ高い印字品質を得ることのできるエキシマレーザ加
工方法を提供することを目的とする。
The present invention is intended to solve the above problems, and an object thereof is to enable processing of a material having poor workability by an excimer laser by an excimer laser, and a water-repellent film having a poor workability by an excimer laser on a surface. Provided is an excimer laser processing method capable of forming an ink ejection port on an existing ink ejection head member by an excimer laser without impairing the function of a water-repellent film, and achieving excellent printing stability and high printing quality. The purpose is to

【0009】[0009]

【課題を解決するための手段】上記目的を達成するため
に本発明は、エキシマレーザエネルギの吸収率が低い材
料をエキシマレーザエネルギの吸収率が高い材料に挟み
込み双方の材料を同時にエキシマレーザにより加工する
ものである。
In order to achieve the above object, the present invention sandwiches a material having a low absorptance of excimer laser energy with a material having a high absorptivity of excimer laser energy, and simultaneously processes both materials by an excimer laser. To do.

【0010】[0010]

【作用】本発明は上記加工方法により、エキシマレーザ
エネルギの吸収率が低い材料を確実に加工することがで
きる。
According to the present invention, a material having a low absorptance of excimer laser energy can be reliably processed by the above processing method.

【0011】[0011]

【実施例】以下に、本発明のエキシマレーザ難加工材料
のエキシマレーザ加工方法の一実施例についてインクジ
ェットプリンタのインク吐出用ヘッドの製造を示し説明
する。
EXAMPLE An example of an excimer laser processing method for an excimer laser difficult-to-process material of the present invention will be described below by showing the manufacture of an ink ejection head of an ink jet printer.

【0012】図1は本発明の一実施例におけるエキシマ
レーザ加工方法によるインク吐出用ヘッドの加工概念図
である。図1において、1はインク吐出用ヘッドのイン
ク吐出口表面、2はインク吐出口、3はインク流路、4
はインク吐出口2及びインク流路3を構成するインク吐
出ヘッド部材、5はインク吐出ヘッド部材4のインク吐
出口表面1に形成された撥水膜、6はエキシマレーザ
光、7はエキシマレーザエネルギ吸収率が高くエキシマ
レーザ加工性の良好な部材である。
FIG. 1 is a conceptual diagram of processing an ink ejection head by an excimer laser processing method according to an embodiment of the present invention. In FIG. 1, 1 is a surface of an ink ejection port of an ink ejection head, 2 is an ink ejection port, 3 is an ink flow path, 4
Is an ink ejection head member forming the ink ejection port 2 and the ink flow path 3, 5 is a water-repellent film formed on the ink ejection port surface 1 of the ink ejection head member 4, 6 is an excimer laser beam, and 7 is an excimer laser energy. It is a member having a high absorptivity and good excimer laser processability.

【0013】エキシマレーザ光6は、被加工部材に達す
る経路上の光学系及び加工形状のパターンを有するマス
クにより所定の加工形状になっており、このエキシマレ
ーザ光6を被加工部材に投影照射することにより加工が
行われる。
The excimer laser light 6 has a predetermined processing shape by means of an optical system on a path reaching the member to be processed and a mask having a pattern of the processing shape, and the excimer laser light 6 is projected and irradiated onto the member to be processed. By doing so, processing is performed.

【0014】インク吐出用ヘッドの製造では図2に示す
形状の形成加工を行うが、本実施例の場合、被加工部材
すなわちインク吐出ヘッド部材4にエキシマレーザエネ
ルギ吸収率が高い加工性の良好な材料としてポリイミド
フィルムを用いた。もちろん他の加工性良好な材料とし
てポリエーテルサルフォン(PES)等も利用することが
できる。また、撥水膜5としてサイトップを用い、ポリ
イミドフィルムのインク吐出ヘッド部材4のインク吐出
口表面1にスピンコート法にて塗布し、その後180℃
で60分間の乾燥を行い膜厚1μm程度とした。この撥
水膜5を有するインク吐出ヘッド部材4に対しエキシマ
レーザ光6にてインク吐出口2、インク流路3を加工し
た。図3は、インク流路3の形成方法を示す図である
が、インク流路3のパターンにしたエキシマレーザ光6
をインク吐出ヘッド部材4に投影照射し加工を行いイン
ク流路3を形成する。図4は本発明を用いない場合のイ
ンク吐出口2の加工状態を示す図であるが、図3に示さ
れるインク流路3の形成後インク吐出口2のパターンに
したエキシマレーザ光6をインク吐出ヘッド部材4に撥
水膜5の反対面より投影照射し加工を行うと、ポリイミ
ドフィルムのインク吐出ヘッド部材4に対し、サイトッ
プの撥水膜5はエキシマレーザ光6を透過しやすく、そ
の為エキシマレーザエネルギが撥水膜5に充分吸収され
ず加工が行えない。しかしながら、図1に示すように撥
水膜5に密着させインク吐出ヘッド部材4とで撥水膜5
を挟み込むように他の部材7を設置する。この部材7は
エキシマレーザエネルギの吸収率の高いエキシマレーザ
加工性の良好な材料でなければならず、この部材7には
ポリイミドフィルムを用いた。この状態でインク吐出口
2のパターンにしたエキシマレーザ光6をインク吐出ヘ
ッド部材4に撥水膜5の反対面より投影照射し部材7に
至るまで加工を行うと、部材7に撥水膜5を透過して吸
収されたエキシマレーザエネルギにより部材7がアブレ
ーション加工される際に撥水膜5も同時に加工され撥水
膜5にインク吐出口2が形成される。この時、撥水膜5
が膜厚1μm程度の薄膜であることと部材7が撥水膜5
に密着して設置されていることにより、ポリイミドフィ
ルムのインク吐出ヘッド部材4のインク吐出口2の口径
と撥水膜5のインク吐出口2の口径はほぼ等しくなり、
インク吐出口2の近傍には充分な撥水膜5が形成でき
た。
In the manufacture of the ink ejection head, the formation processing of the shape shown in FIG. 2 is performed. In the case of this embodiment, the work piece, that is, the ink ejection head member 4, has a high excimer laser energy absorption rate and good workability. A polyimide film was used as the material. Of course, polyether sulfone (PES) or the like can be used as another material having good processability. Further, CYTOP is used as the water-repellent film 5 and is applied to the surface 1 of the ink discharge port of the polyimide film ink discharge head member 4 by spin coating, and then 180 ° C.
And dried for 60 minutes to a film thickness of about 1 μm. The ink discharge head member 4 having the water repellent film 5 was processed with the excimer laser light 6 to process the ink discharge port 2 and the ink flow path 3. FIG. 3 is a diagram showing a method of forming the ink flow path 3, in which the excimer laser light 6 having the pattern of the ink flow path 3 is formed.
Is projected onto the ink discharge head member 4 for processing to form the ink flow path 3. FIG. 4 is a diagram showing a processed state of the ink discharge port 2 when the present invention is not used. However, the excimer laser light 6 formed into the pattern of the ink discharge port 2 after forming the ink flow path 3 shown in FIG. When the ejection head member 4 is subjected to projection irradiation from the opposite surface of the water repellent film 5 for processing, the water repellent film 5 of CYTOP easily transmits the excimer laser light 6 to the ink ejection head member 4 of the polyimide film. Therefore, the excimer laser energy is not sufficiently absorbed by the water repellent film 5 and processing cannot be performed. However, as shown in FIG. 1, the water-repellent film 5 is adhered to the water-repellent film 5 and the ink-repellent head member 4.
Another member 7 is installed so as to sandwich. This member 7 must be a material having a high excimer laser energy absorption rate and good excimer laser processability, and a polyimide film was used for this member 7. In this state, when the excimer laser light 6 having the pattern of the ink ejection port 2 is projected and irradiated onto the ink ejection head member 4 from the surface opposite to the water repellent film 5, the member 7 is processed. When the member 7 is ablated by the excimer laser energy that has been transmitted through and is absorbed, the water repellent film 5 is also simultaneously processed and the ink ejection port 2 is formed in the water repellent film 5. At this time, the water-repellent film 5
Is a thin film having a thickness of about 1 μm, and the member 7 is a water repellent film 5.
Since it is installed in close contact with, the diameter of the ink discharge port 2 of the polyimide film ink discharge head member 4 and the diameter of the ink discharge port 2 of the water-repellent film 5 become substantially equal.
A sufficient water-repellent film 5 could be formed in the vicinity of the ink ejection port 2.

【0015】本方法にて実際に加工した結果を以下説明
する。インク吐出ヘッド部材4として厚み100μmの
ポリイミドフィルム、撥水膜5として厚み1μmのサイ
トップ膜、部材7として厚み50μmのポリイミドフィ
ルムを使用し、エキシマレーザ光6のエネルギーを加工
点で800mJ/cm2・pulseに設定し加工を行った。部材7
を用いずに加工を行った場合撥水膜5は全く加工されな
かったが、部材7を用いると撥水膜5に所定寸法(この
場合φ40μm)のインク吐出口2が形成できた。この
インク吐出ヘッド部材4を用いてインク吐出ヘッドを製
作し、印字テストを行ったところ撥水膜5を有さないヘ
ッドと比較して印字ドット位置ずれやスプラッシュの発
生率が低下し印字品質が安定していた。これは、吐出イ
ンクの飛行が安定していることを示しており撥水膜5が
充分機能していると考えられる。よって、本発明の加工
方法により撥水膜5の加工を行えば加工性の悪い撥水膜
5を機能を損ねることなく加工できることが確認でき
た。
The results of actual processing by this method will be described below. A 100 μm thick polyimide film is used as the ink discharge head member 4, a 1 μm thick Cytop film is used as the water repellent film 5, and a 50 μm thick polyimide film is used as the member 7, and the energy of the excimer laser beam 6 is 800 mJ / cm 2 at the processing point.・ Processed after setting to pulse. Member 7
The water-repellent film 5 was not processed at all when the processing was performed without using, but when the member 7 was used, the ink discharge port 2 having a predetermined size (φ40 μm in this case) could be formed in the water-repellent film 5. An ink discharge head was manufactured using this ink discharge head member 4, and a printing test was conducted. As a result, the occurrence rate of print dot misalignment and splash was lower than that of a head having no water-repellent film 5, and print quality was improved. It was stable. This indicates that the flight of the ejected ink is stable, and it is considered that the water-repellent film 5 is sufficiently functioning. Therefore, it was confirmed that if the water-repellent film 5 is processed by the processing method of the present invention, the water-repellent film 5 having poor workability can be processed without impairing its function.

【0016】なお、以上の実施例に記載されている内容
はインクジェットプリンタに使用されるインク吐出ヘッ
ドの撥水膜5の加工についての説明であるが、本発明の
加工方法はエキシマレーザを利用してエキシマレーザ加
工性の悪い部材の加工を行う際にも簡単に応用できる。
Incidentally, the contents described in the above embodiments are explanations of the processing of the water repellent film 5 of the ink ejection head used in the ink jet printer, but the processing method of the present invention uses the excimer laser. It can also be easily applied to the processing of members with poor excimer laser processability.

【0017】[0017]

【発明の効果】本発明は、エキシマレーザエネルギの吸
収率が低い材料をエキシマレーザエネルギの吸収率が高
い材料にて挟み込み双方の材料を同時にエキシマレーザ
により加工することにより、エキシマレーザエネルギの
吸収率が低い材料を確実に加工することができ、例え
ば、インク吐出用ヘッドの製造に応用してエキシマレー
ザエネルギの吸収率が低い撥水膜を有するインク吐出用
ヘッドを加工すれば、インク吐出口近傍にインクが不均
一に溜まることを防止でき、これにより生じる吐出イン
クの飛行曲がりによる印字ドットの位置ずれやスプラッ
シュ等の発生が防止でき印字品質を向上させることがで
きる。
According to the present invention, a material having a low absorptance of excimer laser energy is sandwiched between materials having a high absorptance of excimer laser energy, and both materials are simultaneously processed by an excimer laser to obtain an absorptivity of excimer laser energy. It is possible to reliably process a material with a low water content. For example, if an ink ejection head having a water repellent film with a low absorptance of excimer laser energy is processed by applying it to the manufacture of an ink ejection head, It is possible to prevent non-uniform accumulation of ink, and to prevent misalignment of print dots and splash due to flight deflection of ejected ink, which can improve print quality.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるエキシマレーザ加工
方法によるインク吐出用ヘッドの加工概念図
FIG. 1 is a conceptual diagram of processing an ink ejection head by an excimer laser processing method according to an embodiment of the present invention.

【図2】本発明の一実施例におけるエキシマレーザ加工
方法によるインク吐出用ヘッドの概略断面図
FIG. 2 is a schematic cross-sectional view of an ink ejection head by an excimer laser processing method according to an embodiment of the present invention.

【図3】本発明の一実施例におけるエキシマレーザ加工
方法によるインク吐出用ヘッドのインク流路の形成方法
を示す図
FIG. 3 is a diagram showing a method of forming an ink flow path of an ink ejection head by an excimer laser processing method according to an embodiment of the present invention.

【図4】本発明を用いない場合のインク吐出口の加工状
態を示す図
FIG. 4 is a diagram showing a processed state of an ink ejection port when the present invention is not used.

【符号の説明】[Explanation of symbols]

1 インク吐出口表面 2 インク吐出口 3 インク流路 4 インク吐出ヘッド部材 5 撥水膜 6 エキシマレーザ光 7 部材 1 Surface of Ink Ejection Port 2 Ink Ejection Port 3 Ink Flow Path 4 Ink Ejection Head Member 5 Water Repellent Film 6 Excimer Laser Light 7 Member

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】エキシマレーザエネルギの吸収率が低い材
料をエキシマレーザエネルギの吸収率が高い材料にて挟
み込み双方の材料を同時にエキシマレーザにより加工す
ることを特徴とするエキシマレーザ加工方法。
1. A method of excimer laser processing, wherein a material having a low absorptance of excimer laser energy is sandwiched between materials having a high absorptance of excimer laser energy, and both materials are simultaneously processed by an excimer laser.
【請求項2】エキシマレーザエネルギの吸収率が高い材
料をエキシマレーザエネルギの吸収率が低い撥水剤膜が
設けられた部材の該撥水剤膜に密着するよう設置し、こ
れらをエキシマレーザにて同時に加工することを特徴と
するエキシマレーザ加工方法。
2. A material having a high absorptance of excimer laser energy is placed so as to be in close contact with the water repellent film of a member provided with a water repellent film having a low absorptance of excimer laser energy, and these materials are attached to the excimer laser. An excimer laser processing method characterized in that both are processed simultaneously.
【請求項3】インクジェットプリンタのインク吐出用ヘ
ッドのインク吐出口を形成するエキシマレーザエネルギ
の吸収率が高い部材片面に予めエキシマレーザエネルギ
の吸収率が低い撥水膜を形成し、前記撥水膜に密着する
ようエキシマレーザエネルギの吸収率が高い材料を設
け、これらをエキシマレーザにて加工しインク吐出口を
形成することを特徴とするエキシマレーザ加工方法。
3. A water repellent film having a low absorptance of excimer laser energy is formed in advance on one surface of a member having a high absorptivity of excimer laser energy forming an ink ejection port of an ink ejection head of an ink jet printer. An excimer laser processing method, characterized in that a material having a high absorption rate of excimer laser energy is provided so as to be in close contact with, and an ink discharge port is formed by processing these materials with an excimer laser.
JP6325191A 1994-12-27 1994-12-27 Excimer laser machining method Pending JPH08174262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6325191A JPH08174262A (en) 1994-12-27 1994-12-27 Excimer laser machining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6325191A JPH08174262A (en) 1994-12-27 1994-12-27 Excimer laser machining method

Publications (1)

Publication Number Publication Date
JPH08174262A true JPH08174262A (en) 1996-07-09

Family

ID=18174035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6325191A Pending JPH08174262A (en) 1994-12-27 1994-12-27 Excimer laser machining method

Country Status (1)

Country Link
JP (1) JPH08174262A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105817775A (en) * 2015-01-27 2016-08-03 三星钻石工业股份有限公司 Method and device for processing multilayer substrate by laser beam
CN107685199A (en) * 2016-07-28 2018-02-13 三星钻石工业股份有限公司 Laser processing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105817775A (en) * 2015-01-27 2016-08-03 三星钻石工业股份有限公司 Method and device for processing multilayer substrate by laser beam
JP2016137499A (en) * 2015-01-27 2016-08-04 三星ダイヤモンド工業株式会社 Method and device for processing multilayer substrate with laser beam
CN105817775B (en) * 2015-01-27 2020-10-23 三星钻石工业股份有限公司 Method and apparatus for processing multilayer substrate using laser beam
CN107685199A (en) * 2016-07-28 2018-02-13 三星钻石工业股份有限公司 Laser processing device

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