JPH08167113A - Thin-film magnetic head and production of thin-film magnetic head - Google Patents

Abstract

PURPOSE: To easily provide a thin-film magnetic head which does not induce the disconnection of coils at the time of working a sliding width and is free from a contour effect by forming first and second intermediate part magnetic cores to the film thickness corresponding to a track width and forming the surface parallel with the track width direction of a magnetic gap part G non-parallel with the surface formed with coil patterns. CONSTITUTION: This thin-film magnetic head has a first core half body which is laminated with a lower magnetic core 14 and the first intermediate part magnetic core 15 and a second core half body which consists of the second intermediate part magnetic core 17 having an end 16a constituting the magnetic gap part G with the end 15a of the first intermediate part magnetic core 15 and an upper magnetic core 17 laminated on this second intermediate part magnetic core 16. A coupling magnetic path 18 connects the other ends of the first and second half core half bodies to each other. A laminated structure consisting of respective constituting members, such as coil patterns, etc., formed of thin films of conductive materials is formed around this coupling magnetic path 18 in the state of embedding the structure into an insulating layer. The first and second intermediate part magnetic cores 15, 16 are so formed that at least one film thickness corresponds to the track width and that the surface parallel with the track width direction of the magnetic gap part G is made non-parallel with the surface formed with the coil patterns.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head and a method of manufacturing the thin film magnetic head.

[0002]

2. Description of the Related Art A magnetic recording / reproducing system capable of extremely easily recording an information signal on a recording medium and reproducing the information signal from the recording medium is used as a means for recording / reproducing an information signal in many technical fields. Widely adopted. With respect to magnetic recording and reproduction, there has been a strong demand for high-density recording, and a structure known as a horizontal thin-film magnetic head has been used, for example, for floating in a fixed disk drive (HDD). It is well known that the magnetic head of this type has been widely used in the past. Further, in recent years, in a VTR as well, a high-density magnetic recording / reproducing characteristic, a high frequency characteristic, etc. have been obtained as a high-performance magnetic head capable of satisfying various demands such as high quality recording / reproducing image and realization of high-density recording / reproducing. Attention has been focused on a thin-film magnetic head which is excellent in, and attempts have been made to use the thin-film magnetic head as a rotary magnetic head for a VTR.

As is well known, the conventional horizontal type thin film magnetic head is made of a non-magnetic material as shown in the plan view of FIG. 11 by applying, for example, a photolithography method or various film forming techniques. The lower magnetic core (not shown in the figure because it is located below the upper magnetic core described later), the insulating thin film of a non-magnetic material, the coil pattern 2 of a thin film of a conductive material, the non-magnetic material of The insulating thin film, the upper magnetic core 3 and the like are sequentially laminated. Reference numeral 4 is a bonding pad for pulling out a lead wire. As illustrated in FIG. 4, in the conventional horizontal type thin film magnetic head, since the surfaces of the above-mentioned thin films are formed in parallel with the surface of the substrate 1 parallel to the paper surface, the lower core and the upper core are formed. The magnetic gap portion formed between the thin film magnetic layer 3 and the magnetic gap portion 3 has a track width direction in the lateral direction on the paper surface and a magnetic gap length direction (gap length direction) perpendicular to the paper surface. The relative movement direction between the head and the magnetic recording medium is a direction perpendicular to the paper surface (however, in the case of azimuth recording, when the azimuth angle is θ, a direction deviated by θ degrees from the direction perpendicular to the paper surface). .

The thin film magnetic head used in the VTR is not used as a flying type thin film magnetic head, but a recording / reproducing operation is performed with the magnetic gap portion of the thin film magnetic head in good contact with the magnetic tape. Used as it is done. Therefore, in the thin-film magnetic head used in the VTR, the area that slides on the magnetic tape surface including the magnetic gap portion of the thin-film magnetic head is configured as a small area that exhibits a good contact state with the magnetic tape surface. like,
So-called sliding width processing is applied to the vicinity of the magnetic gap of the thin film magnetic head. 12 (a) and 12 (b) show the sliding width machining performed near the magnetic gap of the thin film magnetic head.
FIG. 12 (a),
The shaded portions 5 and 6 in (b) are the portions to be removed by the sliding width processing. 12 (a),
W in (b) indicates the sliding width W set in the track width direction of the magnetic gap by the sliding width processing performed near the magnetic gap of the thin film magnetic head.

[0005]

However, the above-mentioned sliding width processing performed near the magnetic gap of the thin film magnetic head is
For example, it is performed by mechanical processing using a dicing saw or the like. However, during the sliding width processing by the mechanical processing, the coil may be broken as illustrated in FIG. 12A, for example. Therefore, the coil of the thin-film magnetic head is formed in a portion separated from the magnetic gap portion so that the coil is not broken during the sliding width machining. However, when the coil is formed in the portion separated from the magnetic air gap as described above, the magnetic path length becomes long and the efficiency of the thin film magnetic head is lowered.

In order to solve the above-mentioned problems, Japanese Patent Laid-Open Publication No. Hei 3-235211 proposes a condition for optimizing the winding width value of the coil so that the coil is not broken by machining. However, this Japanese Patent Laid-Open No. 3-235211
Since the horizontal type thin film magnetic head described in the publication is the thin film magnetic head having the configuration described with reference to FIGS. 11 and 12, the sliding width set in the track width direction of the magnetic gap is Since the direction of the coil and the winding surface of the coil are parallel to each other, in order to prevent disconnection of the coil during processing of the sliding width in the depth direction of the magnetic gap, it is possible to achieve a high accuracy of about the coil line width. Sliding width machining is required to be performed under control operation. Also, as illustrated in FIG. 14, each successive thin film having a surface parallel to the surface 1 a of the substrate 1 is formed on the substrate to form a magnetic gap G between the lower core 11 and the upper core 3. In the conventional thin-film magnetic head that is configured, the magnetic gap is located at the central portion in the moving direction of the magnetic tape at the sliding part with the magnetic tape that is provided so as to obtain good sliding characteristics with respect to the magnetic tape. For this purpose, a substrate 8 made of a non-magnetic material, for example, a low-melting glass material 13 is used on the side of the protective film 12 deposited on the upper core 3 in the thin film magnetic head (see also the portion of drawing number 8 in FIG. 13). ) Is joined.

However, the low melting point glass material 13 for bonding
Is more easily worn than materials such as the substrate 8 and the protective film 12 made of a non-magnetic material. Therefore, when the thin-film magnetic head is used, the bonding portion formed by the low-melting glass material 13 provided near the magnetic gap G is used. Since uneven wear is caused, there is a problem in that stable sliding characteristics are obtained. In addition, as described above, it takes a lot of man-hours to join a substrate of a non-magnetic material by using a low melting point glass for joining. Therefore, it has been a problem for mass production and cost reduction of the thin film magnetic head. See also FIG.
In the conventional thin film magnetic head as illustrated in FIG.
Since the ends of the lower core 11 and the upper core 3 forming the magnetic gap G are exposed in the sliding portion of the thin film magnetic head in a state of being close to and parallel to the magnetic gap G, Due to the shape effect (contour effect) generated corresponding to the shape and size of the magnetic pole, the reproduction output characteristic of the thin film magnetic head is shown in FIG.
The curved line α has a wavy shape as illustrated.

Further, the bonding pads 4 and 4 for pulling out the lead wires in the conventional thin film magnetic head are provided in a portion having a small area, as illustrated in FIGS. 12 (a), 12 (b), 13 and the like. Has been. As shown in FIG. 13, the thin-film magnetic head has a head assembly support 7
, The lead wire lead-out bonding pads 4 and 4 are located on the inclined surface with a narrow area in the thickness direction of the head chip. Therefore, the lead wire lead-out bonding pads 4 and 4 and the connecting wire 9 are attached. , 10 is also difficult to connect. Furthermore, the head assembly support 7 is provided with magnetic air gaps having different azimuth angles.
When a double azimuth head configured by sticking two thin film magnetic heads is attached, the distance between the two thin film magnetic heads is extremely narrow, such as several hundreds of micrometers, and the two thin film magnetic heads are Since the lead wire lead-out bonding pads of the head are arranged so as to face each other, there is a problem that the soldering or wire bonding process cannot be performed as it is.

The problem of the position of the bonding pad for pulling out the lead wire in the above-mentioned conventional thin film magnetic head is, for example, as disclosed in JP-A-3-295010, heads of many thin film magnetic heads on a non-magnetic substrate. After forming the chips, the head chip of each thin film magnetic head is obtained by cutting the substrate along a cutting line orthogonal to the diagonally intersecting cutting line, and a bonding pad is formed on the inclined cutting surface of the substrate. It can be solved by positioning it, but
As mentioned above, the bonding pad is arranged on the inclined surface, and since it is a cut surface, there is a restriction from the manufacturing method to make it a large area. Since the operation is required, there is a problem in mass production.

In many cases, a plurality of rotary magnetic heads are mounted on one rotary drum in a VTR, but in the conventional VTR, each rotary magnetic head is a separate head assembly support. Are attached to each of the above-mentioned individual magnetic heads attached to the individual head assembly supports so that they are attached to predetermined positions individually. Since the mounting state was adjusted, as the high density recording / reproducing progressed, the mounting and adjusting work of the rotary magnetic head became difficult. The conventional thin film magnetic head has many problems as described above when it is used for a rotary magnetic head of a VTR, and a solution to them has been required.

[0011]

The present invention may be described as a substrate made of a non-magnetic material (a substrate made of a non-magnetic material or a non-magnetic material substrate) provided with a base film made of an insulating material. ), A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core, and the first core half described above. A second intermediate magnetic core having an end forming a magnetic gap between the first intermediate magnetic core and an end of the first intermediate magnetic core, and one end of the second intermediate magnetic core. Between a second core half body having a laminated structure of an upper magnetic core laminated in a connected state, and the other end portion of the first core half body and the other end portion of the second core half body described above. A coupling magnetic path that connects
A coil pattern made of a thin film of a conductive material formed around the coupling magnetic path, a lead wire bonding pad, and thin films such as a protective film are sequentially laminated, and in a state parallel to the track extension direction. The film thickness of at least one of the first and second intermediate magnetic cores having magnetic gaps in a state non-parallel to the formation surface of each thin film used is configured to correspond to the track width. The thin film magnetic head and the thin film magnetic head having the above-described configuration are provided on a disk-shaped substrate made of a non-magnetic material, which is provided with a base film made of an insulating material and has a diameter slightly larger than the diameter of the rotating drum. In each of a plurality of predetermined positions in the above, the magnetic gap portion of the thin film magnetic head is laminated so as to be located at the end portion of the outer peripheral surface of the substrate made of the non-magnetic material. The thin-film magnetic head and the thin-film magnetic head described above are provided with a base film made of an insulating material and have a plurality of predetermined positions on a disk-shaped non-magnetic material substrate having a diameter slightly larger than the diameter of the rotating drum. In each of the above, the magnetic gap of the thin-film magnetic head is laminated in such a manner that it is located at the end of the outer peripheral surface of the substrate made of the non-magnetic material, and the disk-shaped non-magnetic material is also formed. Provided is a thin-film magnetic head in which the outer peripheral edge of a substrate is thin.

[0012]

A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core, and the first core half described above. A second intermediate magnetic core having an end forming a magnetic gap with the end of the first intermediate magnetic core in the core half, and connected to one end of the second intermediate magnetic core. Second by the laminated structure with the upper magnetic core which is laminated in a laminated state
Core half, the other end of the first core half and the second
In the insulating layer, a laminated magnetic path for connecting between the other end of the core half body and a laminated structure of each constituent member such as a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path. In addition to being configured in an embedded state, a lead wire lead-out bonding pad, a protective film, and the like are provided with a base film made of an insulating material by applying film forming technology, photolithography technology, etching means, and polishing means. A thin-film magnetic head, which is formed on a substrate made of a non-magnetic material material in order and the film thickness of at least one of the first and second intermediate magnetic cores corresponds to the track width, is The plane parallel to the track width direction of the magnetic gap formed between the ends of the first and second intermediate magnetic cores is not parallel to the plane on which the coil pattern is formed, and the sliding width of the thin film magnetic head. The direction of processing To become a direction substantially parallel to the direction of the forming surface of yl pattern, sliding width processing of the thin film magnetic head can be easily implemented. Further, the thin-film magnetic head having the above-described configuration set on the substrate made of a non-magnetic material having a base film made of an insulating material has a diameter slightly larger than the diameter of the rotary drum. A plurality of thin films in which the magnetic gaps of the thin-film magnetic head are oriented in a predetermined direction at each of a plurality of predetermined positions on the circumference of the boundary of the one or more circular regions. A set of a plurality of thin-film magnetic heads formed on a substrate made of a non-magnetic material as a set of a plurality of thin-film magnetic heads to be mounted on one rotating drum by disposing a magnetic head is a non-magnetic body. Since it can be taken out as a rotary magnetic head structure constructed on a substrate made of material and attached to the rotary drum, the rotary magnetic head can be accurately mounted by simple adjustment work on the rotary drum. It is possible.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The specific contents of the thin film magnetic head and the method of manufacturing the thin film magnetic head of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows a non-magnetic material substrate provided with a base film made of an insulating material by applying a film forming technique, a photolithography technique, an etching means and a polishing means according to the method of manufacturing a thin film magnetic head of the present invention. A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core in the thin film magnetic head to be constructed; A second intermediate magnetic core having an end that forms a magnetic gap with the end of the first intermediate magnetic core in the first core half, and the second intermediate magnetic core Second core half having a laminated structure with an upper magnetic core laminated in a state of being connected to one end of the core, the other end of the first core half and the other end of the second core half Explain the correspondence between each part and the coupling magnetic path that connects the parts It is a perspective view for, 14 in FIG. 1 is the lower magnetic core, 15
Is a first part connected to a part of the lower magnetic core 14 described above.
Is the magnetic core of the middle part of the.

Reference numeral 16 denotes a second intermediate magnetic core, a part of the second intermediate magnetic core 16 is connected to the upper magnetic core 17, and the first intermediate magnetic core 15 described above is provided. A nonmagnetic inorganic insulator 36 (see FIG. 1) is interposed between the end portion 15a of the second magnetic core 16 and the end portion 16a of the second intermediate magnetic core 16 to form a magnetic gap G. Further, the other end of the first intermediate magnetic core 15 and the other end of the second intermediate magnetic core 16 are coupled by a coupling magnetic path 18 made of a ferromagnetic material. A coil pattern made of a conductive material in the thin film magnetic head (see 39 in FIG. 4) is formed around the coupling magnetic path 18. The surface on which the coil pattern is formed has an end portion 15 a of the first intermediate magnetic core 15 and a second intermediate magnetic core 16
Is not parallel to the track width direction of the magnetic gap G formed between the end portion 16a and the end portion 16a.

Therefore, the sliding width machining for the thin film magnetic head can be carried out by forming notches (grooves) shown as 26 and 27 in FIG. 9, but the above notches (grooves). Since 26 and 27 are configured along a plane parallel to the above-mentioned coil pattern forming surface or other thin film surface, even when the above sliding width processing is performed so as to form a narrow sliding width, Accidents where the coil pattern is cut during sliding width machining do not occur. 9 (a) is a plan view, FIG. 9 (b) is a front view, and FIG. 9 (c).
FIG. 10 is a vertical sectional side view taken along the line AA in FIG. 9 is provided with a thin film magnetic head structure described later with reference to FIGS. 5 to 7, that is, a base film made of an insulating material is provided and has a diameter slightly larger than the diameter of the rotary drum. At a plurality of predetermined positions on the disk-shaped non-magnetic material substrate 20, the magnetic gap of the thin-film magnetic head is located at the outer peripheral surface end of the non-magnetic material substrate. When performing a sliding width process on a thin film magnetic head in a thin film magnetic head structure constructed by laminating the thin film magnetic head of 1 above on a substrate made of a non-magnetic material, the outer peripheral edge of the disk-shaped magnetic material substrate By machining in a direction such that the thickness of the cut portion is reduced, the cutout portions (grooves) 26, 2 in FIG. 9 are formed.
7 can be easily formed. The thin film magnetic head with a small sliding width has a good contact state between the thin film magnetic head and the magnetic tape, which stabilizes the recording / reproducing operation and
The magnetic tape can be easily put into a stable running state.

In the present invention, the film forming technique, the photolithography technique, the etching means and the polishing means are applied,
After sequentially forming the constituent members of a large number of thin-film magnetic heads on a non-magnetic material substrate provided with a base film made of an insulating material, and forming a large number of thin-film magnetic heads on the non-magnetic material substrate, Although the thin film head formed on the non-magnetic material substrate is taken out, many thin film heads to be formed on the non-magnetic material substrate provided with the base film made of the insulating material described above in the present invention. The thin film magnetic head is illustrated in FIG. 5, for example, as a plurality of circular regions 19, 19, 19 having a diameter slightly larger than the diameter of the rotating drum on which the thin film magnetic head is to be used.
In each of a plurality of predetermined positions on the circumference of the boundary of each of the regions 19, 19, 19 ... In, the magnetic gap portion of the thin film magnetic head has a predetermined orientation. Thus, from the non-magnetic material substrate 20 on which a large number of thin film magnetic heads are formed, a plurality of thin film magnetic heads formed on the non-magnetic material substrate as a set of a plurality of thin film magnetic heads to be attached to one rotating drum. By taking out a set of individual thin film magnetic heads as an integrated thin film magnetic head structure and attaching it to the rotary drum, a plurality of rotary magnetic heads can be simultaneously and accurately attached to the rotary drum by simple adjustment work. .

FIG. 6 shows a number of thin film magnetic heads to be formed on a substrate 20 made of a non-magnetic material provided with a base film made of an insulating material. The magnetic gaps of the respective thin film magnetic heads are arranged at predetermined four positions on the circumference of the boundary of one circular region 19 having a slightly large diameter so as to have a predetermined orientation, A set of four thin-film magnetic heads to be attached to one rotating drum from the non-magnetic material substrate 20 is formed on the non-magnetic material substrate 20 as an integrated thin-film magnetic head structure. Therefore, a case is shown in which it is cut out and used at the position shown by the dotted line in the figure. 7B, a set of four thin film magnetic heads H, H ... Which should be attached to one rotating drum as described above is a substrate 20 of a non-magnetic material as an integrated thin film magnetic head structure. FIG. 8 is a diagram showing a state in which the upper state is attached to a rotating drum (upper drum) 21 shown in FIG. 7A with attaching screws 22.

Next, in FIGS. 8A to 8D, a plurality of thin films are formed from a substrate 20 of a non-magnetic material provided with a base film made of an insulating material on which a large number of thin film magnetic heads are formed. FIG. 9A is a perspective view showing a configuration example of various thin film magnetic head structures in which a set of magnetic heads is taken out as an integrated thin film magnetic head structure, and FIG. 8A is to be attached to one rotating drum. A set of four thin film magnetic heads H, H ...
In the state where the thin film magnetic head structure is integrally formed on the disk-shaped substrate 20 made of a non-magnetic material,
A configuration mode is shown in which a central hole 23 for mounting position regulation is provided in the center of the substrate. As described above, the central hole 23 for restricting the mounting position provided in the center of the substrate has an integral thin film magnetic head assembly having a set of four thin film magnetic heads H, H ... Which should be mounted on one rotating drum. To significantly simplify the adjustment work when properly mounting the to the rotary drum.

In FIG. 8B, a set of four thin film magnetic heads H, H ... To be attached to one rotating drum is a substrate 20 made of a non-magnetic material as an integrated thin film magnetic head assembly.
In the state of being formed above, a central hole 23 for restricting the mounting position is provided at the center thereof, and the peripheral surface of the portion between the mounting portions of the thin film magnetic heads H, H ... Has a small diameter. The magnetic tape running on the peripheral surface of the rotary drum can be run in a stable running state. As described above, the four thin film magnetic heads H, H to be attached to one rotary drum are ...
If the peripheral surface of the portion between the mounting portions of the thin film magnetic heads H, H ... Mounted on the integral thin film magnetic head structure having the set of At the time of rotation operation, negative pressure is generated between the small-diameter portion of the peripheral surface and the magnetic tape to improve the contact state between the sliding portion of the thin-film magnetic head and the magnetic tape, and stabilize the recording / reproducing operation. In addition, it makes it easy to put the magnetic tape in a stable running state.

Further, FIGS. 8C and 8D show two or four thin film magnetic heads H arranged at point symmetry with the central mounting position regulating hole 23 as the axis of symmetry. , H ...
The integrated thin film magnetic head assembly consisting of the above group is formed on the non-magnetic material substrate 20, and the thin film magnetic head assembly illustrated in FIGS. 8C and 8D is the same. A thin-film magnetic head assembly having a configuration in which recording and reproducing operations are performed by itself being fixed to a rotation shaft and being driven and rotated, that is, a configuration in which the rotation drum (upper drum) is not fixed. FIG. 8C shows a case where a set of two thin film magnetic heads H and H is formed on the non-magnetic material substrate 20 as an integrated thin film magnetic head structure, and is attached to the center of the substrate. Center hole 23 for position regulation
8D, a set of four thin film magnetic heads H, H ... Is formed on the non-magnetic material substrate 20 as an integrated thin film magnetic head structure. In the state of being in the state of being installed, a center hole 23 for mounting position regulation is provided in the center of the
The groove 2 is formed on the peripheral surface of the portion between the thin film magnetic heads H, H.
4, the groove 24 also produces a negative pressure between the groove 24 and the magnetic tape when the thin film magnetic head structure is rotated, so that the sliding portion of the thin film magnetic head and the magnetic tape come into contact with each other. The recording / reproducing operation can be made stable and the magnetic tape can be stably run.

Further, in the present invention, a set of a plurality of thin film magnetic heads H, H is formed as an integrated thin film magnetic head structure on a substrate 20 of a non-magnetic material provided with a base film made of an insulating material. As shown in FIG. 10, the bonding pads 28 and 29 in the preformed state can be formed with a margin in a wide space of the substrate 20 made of a non-magnetic material, and the bonding pads 28 and 29 made of the above-mentioned non-magnetic material can be formed. Board 2
It is obvious that the connecting work of the connecting wires 30 and 31 to the bonding pads 28 and 29 formed on the zero can be easily performed.

Next, the film forming technique, the photolithography technique, the etching means, and the polishing means are applied to successively form the thin-film magnetic head on the non-magnetic material substrate provided with the underlying film made of an insulating material. An outline of how the thin-film magnetic head of the present invention is manufactured by stacking is described with reference to the drawings. First, in FIG. 2, reference numeral 20 is a substrate made of a non-magnetic material (or a substrate made of a non-magnetic insulating material) used as a substrate of a thin film magnetic head. As shown in FIG. 5 or FIG. , A large number of thin film magnetic heads H, H ... Are formed at the same time.
The description of each step described below is given focusing on one thin film magnetic head formed on the substrate 20. The substrate 20 made of a non-magnetic material used as the substrate of the above-mentioned thin film magnetic head is a wafer made of a non-magnetic insulating material,
For example, a suitable material is selected from BaTiO3 wafer, CaTiO3 wafer, Al2O3-TiC material wafer, and other materials.

On the substrate 20 made of a non-magnetic material shown in FIG. 2A, a thin film of a non-magnetic inorganic insulating material is formed by using a vacuum film forming technique such as a vacuum deposition method or a sputtering method. It is also possible to configure 32 as a base film in advance. The thin film 32 of the nonmagnetic inorganic insulating material has a film thickness of, for example, 1 μm to 10 μm. The constituent materials of the thin film 2 are Al2O3, ZrO2, TiO2,
A suitable material may be selected and used from among non-magnetic inorganic insulating materials such as SiO2. It should be noted that the above-mentioned Al2O3, ZrO2, and TiO are also used as constituent materials used in forming the thin film of the nonmagnetic inorganic insulating material in a plurality of subsequent steps.
2, a suitable material may be selected and used from among the non-magnetic inorganic insulating materials such as SiO2.

A thin film 3 of a non-magnetic inorganic insulating material is formed on the substrate 20.
2 is formed on the thin film 32 of the material in the state of FIG. 2 (a), for example, vacuum deposition method or sputtering method (good step coverage ... Good pattern coverage ... For example, the magnetic film 33 is formed as shown in FIG. 2B by a vacuum film forming technique such as a bias sputtering method in which a high frequency bias is applied to the substrate. The magnetic film 33 is made of a magnetic material such as Co-based amorphous or FeTaN, and is made of, for example, 4
It is configured to have a film thickness of μm to 5 μm. A photoresist layer 34 is formed on the magnetic film 33 by spin coating, for example, as shown in FIG. Examples of the photoresists include Tokyo Ohka Co., Ltd.
Manufactured OFPR-800 can be used.

A well-known photolithography method is applied to the photoresist layer 34 of FIG. 2C to form a pattern in the shape of the lower magnetic core on the photoresist layer 34 (see FIG. 2D). }. Next, a portion of the magnetic film 33 shown in FIG. 2D, which is not covered with the photoresist layer 34, is removed by applying a means such as ion beam milling, and the magnetic film 33 shown in FIG. As shown in FIG.
The lower magnetic core 14 is formed on the top (see also the plan view of FIG. 3A). Next, by using a vacuum film forming technique such as a vacuum deposition method or a sputtering method on the material shown in FIG. 2 (e), as shown in FIG. Form a thin film 35 of insulating material {see also plan view of FIG. 3 (b)}. The thin film 35 of the non-magnetic inorganic insulating material is made of Al2O3, ZrO2, TiO2,
An appropriate material is selected and used from among non-magnetic inorganic insulating materials such as SiO2 to form a film having a thickness equal to or larger than that of the lower magnetic core 3.

The raised portion of the thin film 35 of the non-magnetic inorganic insulating material in the material as shown in FIG. 2 (f) is polished so as to be shown in FIG. 2 (g). , The lower magnetic core 14 is a thin film 35 of a non-magnetic inorganic insulating material.
It is used as a material in a state of being embedded therein and in which the upper surface of the lower magnetic core 14 is exposed from the thin film 35 of the non-magnetic inorganic insulating material {see also the plan view of (c) of FIG. 3). }. Up to now, a state in which thin film constituent members are sequentially formed on the non-magnetic material substrate by applying the film forming technique, the photolithography technique, the etching means, and the polishing means is shown in FIG. Although the description has been given with reference to the longitudinal cross-sectional view shown in (g), the film forming technique, the photolithography technique, the etching means, and the polishing means are partially or entirely applied in each of the following steps. The state in which the thin film constituent members are sequentially formed is also the same as that described above. Therefore, the following description of the manufacturing process will be made using the plan views shown in FIGS. The illustration and description based on the longitudinal sectional view will not be given.

A film forming technique, a photolithography technique, an etching means, a polishing means, etc. are applied to the material in the state shown in FIG.
And the coupling magnetic path 18 are, for example, Co-based amorphous,
A magnetic material such as FeTaN is used to form the raw material in the state shown in FIG. That is, in FIG.
First, on the entire upper surface of the material in the state shown in (c),
For example, after a film of a magnetic material such as Co-based amorphous or FeTaN having a predetermined thickness is formed, a photoresist layer is applied to the upper surface of the film. Then, a mask member having a predetermined pattern is formed by exposing and developing the photoresist layer by the photolithography method. When the above-mentioned shape of the first intermediate magnetic core 15 is formed by applying the means of ion beam milling,
The end 15a (see FIG. 1) of the first intermediate magnetic core 15 which is a component of the magnetic gap of the thin film magnetic head is the substrate 2
It is necessary to determine the impact direction of the ion beam so that it has a specific angle with respect to the 0 plane. By setting the direction of impact of the ion beam at a specific angle (for example, 70 degrees), it is possible to easily form a magnetic gap having a predetermined azimuth angle in the magnetic gap of the thin film magnetic head. When the remaining part of the mask material is removed, the material in the state shown in FIG. 3D is obtained.

The end portion 15a of the above-mentioned first intermediate magnetic core 15 in the material in the state shown in FIG. 3 (d).
And the end portion 1 of the second intermediate magnetic core 16 which will be described later.
In order to form a magnetic gap G having a predetermined magnetic gap length with the 6a, the material in the state shown in FIG. 3 (c) has a non-magnetic inorganic insulating material (for example, Al2O3,
The thin film 36 of ZrO2, TiO2, SiO2) is formed, for example, by a vacuum film forming technique such as a vacuum evaporation method or a sputtering method to have a film thickness of 0.18 μm to 0.2 μm. Next, the film formation technique, the photolithography technique, the etching means, etc. are applied to form the second intermediate magnetic core 16, and the material in the state shown in FIG. 3E is obtained. The end portion 15a of the first intermediate magnetic core 15 described above in the material in the state shown in FIG.
And the end 16a of the second intermediate magnetic core 16 between the nonmagnetic inorganic insulating material (for example, Al2O3, ZrO2, TiO2) for forming the predetermined magnetic gap length.
2, a thin film 36 of SiO2) forms a magnetic gap portion G having a predetermined magnetic gap length.

Next, the first and second intermediate magnetic cores 1 of the material in the state shown in FIG.
The non-magnetic inorganic insulating material (for example, 5 and 16 and the coupling magnetic path 18) is embedded in the thin film 37 of the non-magnetic inorganic insulating material so as to be in a state as illustrated in FIG. , Al2O3, ZrO2, TiO2, SiO2) thin film 37
Is deposited by a vacuum film forming technique such as a vacuum vapor deposition method or a sputtering method, and the raised portion of the thin film 37 of the non-magnetic inorganic insulating material in the material shown in FIG. 3 (f) is polished. As shown in FIG. 3G, the lower magnetic core 14, the first and second intermediate magnetic cores 15 and 16, the coupling magnetic path 18, etc. are made of a thin film 37 of a non-magnetic inorganic insulating material. It is a material in a state of being embedded therein and in a state in which the upper surfaces of the first and second intermediate magnetic cores 15 and 16, the coupling magnetic path 18, etc. are exposed from the thin film 37 of the non-magnetic inorganic insulating material. It

Then, a photoresist layer {for example, OFPR-80 manufactured by Tokyo Ohka Co., Ltd. described above is formed on the material as shown in FIG. 3G by, for example, a spin coating method.
0} is formed, a well-known photolithography method is applied to the photoresist layer to form a pattern necessary for forming coil grooves, through holes, etc. on the photoresist layer, and the photoresist layer is formed. After exposure through a pattern required for forming coil grooves, through holes, etc., development processing is performed to use the photoresist layer as a mask member.

The material provided with the mask member as described above is placed on the electrode in the vacuum envelope as a member to be etched, and after sealing the vacuum envelope, the vacuum pump is started to remove the vacuum. After performing the exhaust operation in the enclosure, an etching gas (for example, a fluorine-based etching gas such as fluorocarbon such as CHF3 and CHF4) is introduced into the vacuum envelope from an etching gas container serving as an etching gas source. To do. The pressure of the etching gas in the vacuum envelope is made proper, and the high-frequency power is started to be supplied from the high-frequency power source between the electrodes to generate plasma of fluorine-based etching gas such as fluorocarbon, which is then placed on the electrodes. The inorganic insulating film 37 in the member to be etched is dry-etched by the reactive ion etching method using the above-mentioned plasma of CHF3 gas, and the thin film 37 of the non-magnetic inorganic insulating material in the member to be etched shown in FIG. Grooves 38 are formed as shown in h).

When the inorganic insulating film 37 is formed with a groove having a predetermined depth as described above, the etching operation performed in the vacuum envelope is stopped and the material is removed from the vacuum envelope. After removing the mask member by the photoresist layer left on the material in which the coil groove 38 and other grooves are formed, the coil grooves and other grooves are filled with a conductive material (for example, copper) 39. {See (i) of FIG. 3}.
Next, the surface of the material of (i) of FIG.
A coil pattern in which the conductive material 39 is filled in the other grooves is obtained {see (j) in FIG. 3}. As described above, in order to fill the groove with the conductive material 39, the conductive material (for example, copper) may be vapor-deposited by means such as a vacuum vapor deposition method.

Next, as shown in FIG. 4A, a vacuum film forming technique such as a vacuum vapor deposition method or a sputtering method is used on the entire surface of the material shown in FIG. Then, a thin film 40 of a non-magnetic inorganic insulating material is formed. The thin film 40 of the non-magnetic inorganic insulating material is for obtaining insulation between the coil pattern and the magnetic path member. Then
By applying photolithography technology and etching means, the upper part of the second intermediate magnetic core 16 and the coupling magnetic path 1 are formed.
8 is removed to remove the thin film 40 of the non-magnetic inorganic insulating material from the upper portion of the second intermediate magnetic core 16 and the upper portion of the coupling magnetic path 18 as shown in FIG. 4B. Is exposed from the thin film 40 of the non-magnetic inorganic insulating material described above.

A film forming technique and a photolithography technique are applied to the material shown in FIG. 4C to form the upper magnetic core 41 and obtain the material in the state shown in FIG. 4C. . As shown in FIG. 4D, the material in the state shown in FIG. 4C is formed on the entire surface of the material by using a vacuum film forming technique such as a vacuum deposition method or a sputtering method. A thin film 42 of a non-magnetic inorganic insulating material is formed as a protective film, and then a photolithography technique and an etching means (for example, dry etching by a reactive ion etching method) are applied to start a coil pattern start end portion 44 and a coil pattern. After the material shown in FIG. 4 (e) is provided with a through hole at the starting end portion 43 of FIG.
The bonding pads 45, 46 are formed by applying a film forming technique using a low resistance conductive material (eg, copper), a photolithography technique, and an ion milling technique to the material shown in (e) of FIG.
To form.

In the sequential manufacturing process of the thin film magnetic head described above with reference to FIGS. 2 to 4, when one thin film magnetic head is formed on the substrate 20 on which the base film made of an insulating material is provided. However, by applying the film forming technique, the photolithography technique, the etching means, and the polishing means, the constituent members of a large number of thin film magnetic heads are sequentially formed on the non-magnetic material substrate, and a large number of In order to take out the thin film head formed on the non-magnetic material substrate after forming the thin film magnetic head on the non-magnetic material substrate, a large number of mask members used in the manufacturing process are used. A thin film magnetic head for manufacturing may be used. Then, at each of a plurality of predetermined positions on the disk-shaped substrate made of a non-magnetic material provided with a base film made of an insulating material, a magnetic gap portion is provided at an end portion of the outer peripheral surface of the substrate made of a non-magnetic material. When determining the inclination angle of the end portion 15a of the first intermediate magnetic core 15 which is a constituent element of the magnetic gap portion, for each thin film magnetic head in the thin film magnetic head structure that is laminated as a mode to be positioned When the ion beam impinging direction in the applied ion beam milling is specified, the magnetic gap of the thin film magnetic head is
Each thin film magnetic head having a predetermined azimuth angle can be manufactured in a state of being offset by the track width in the film thickness direction of the thin film.

[0036]

As is apparent from the above description, the present invention provides a lower magnetic core and a first intermediate magnetic core which is laminated while being connected to one end of the lower magnetic core. A second intermediate portion having an end portion forming a magnetic gap between the first core half body having a laminated structure of and a first intermediate portion magnetic core end portion of the first core half body described above. A second core half body having a laminated structure of a magnetic core and an upper magnetic core laminated in a state of being connected to one end portion of the second intermediate magnetic core; and the first core half body described above. Lamination by a coupling magnetic path that connects the other end portion and the other end portion of the second core half, and each component such as a coil pattern made of a thin film of a conductive material that is formed around the coupling magnetic path. The structure is embedded in the insulating layer, and the lead wire bonding is performed. By applying film forming technology, photolithography technology, etching means, and polishing means to a pad, a protective film, and the like sequentially on a substrate made of a nonmagnetic material provided with a base film made of an insulating material. Configure the above first,
The present invention provides a thin film magnetic head configured such that the film thickness of at least one of the second intermediate magnetic cores corresponds to the track width, the thin film magnetic head having the first and second intermediate portions thereof. The plane parallel to the track width direction of the magnetic gap formed between the ends of the partial magnetic core is not parallel to the coil pattern forming surface, and the direction in which the sliding width of the thin film magnetic head is processed is the coil. Since the direction is almost parallel to the pattern formation surface, even if the sliding width of the thin-film magnetic head is set to a small value, the coil pattern can be cut during the sliding width processing. The sliding width of the thin-film magnetic head can be easily processed without causing such a problem, and the magnetic gap is formed with respect to the magnetic gap formed between the ends of the first and second intermediate magnetic cores. Due to the non-parallel shape, The reproduction output characteristics of the disk do not show the wavy characteristics due to the shape effect (contour effect) as shown by the curve β in FIG. 15, and further, the reproduction output characteristics of the above-described configuration mode set on the substrate made of the non-magnetic material are used. At each of a plurality of predetermined positions on the circumference of the boundary of said area in one or more circular areas having a diameter slightly larger than the diameter of the rotating drum in which the thin film magnetic head is to be used, Arranging a plurality of thin film magnetic heads so that the magnetic gap of the thin film magnetic head is oriented in a predetermined direction,
As a set of a plurality of thin film magnetic heads to be attached to one rotating drum, a set of a plurality of thin film magnetic heads formed on a substrate made of a non-magnetic material is formed on a substrate made of a non-magnetic material. Since it can be taken out as a rotating magnetic head assembly and attached to the rotating drum, the rotating magnetic head can be accurately attached to the rotating drum by a simple adjustment work. By performing machining to reduce the thickness of the outer peripheral portion of the thin film magnetic head, it is possible to cut the coil pattern even when the sliding width of the thin film magnetic head is set to a small value. It can be easily carried out without raising it, and since the bonding pad can be formed on a wide portion of the substrate, the bonding work of the connecting line is also easy, and the thin film of the present invention is also used. Since the air head does not use glass for the sliding part, there is no joining process and it is easy to manufacture.Besides, uneven wear, which is a problem when glass is used for part of the sliding part, does not occur. According to the invention, all of the above-mentioned conventional problems can be solved well.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining a correspondence relationship between respective parts of a thin film magnetic head of the present invention.

FIG. 2 is a side sectional view of a material of the thin film magnetic head for explaining a part of the manufacturing process of the thin film magnetic head of the present invention.

FIG. 3 is a plan view of a material of the thin film magnetic head for explaining a part of the manufacturing process of the thin film magnetic head of the present invention.

FIG. 4 is a plan view of a material of the thin film magnetic head for explaining a part of the manufacturing process of the thin film magnetic head of the present invention.

FIG. 5 is a plan view of the material of the thin film magnetic head for explaining a part of the manufacturing process of the thin film magnetic head of the present invention.

FIG. 6 is a plan view of a material of the thin film magnetic head for explaining a part of the manufacturing process of the thin film magnetic head of the present invention.

FIG. 7 is a perspective view for explaining how the thin film magnetic head of the present invention is attached to a rotating drum.

FIG. 8 is a perspective view for explaining a thin film magnetic head assembly.

FIG. 9 is a diagram for explaining the sliding width processing of the thin film magnetic head of the present invention.

FIG. 10 is a diagram for explaining a bonding pad of the thin film magnetic head of the present invention.

FIG. 11 is a plan view of a conventional thin film magnetic head.

FIG. 12 is a plan view of a conventional thin film magnetic head.

FIG. 13 is a perspective view of a conventional thin film magnetic head.

FIG. 14 is a front view of a conventional thin film magnetic head.

FIG. 15 is a diagram showing an example of reproduction output characteristics of a thin film magnetic head.

[Explanation of symbols]

14 ... Lower magnetic core, 15 ... First intermediate magnetic core, 1
5a ... End of first intermediate magnetic core 15, 16 ... Second intermediate magnetic core, 16a ... End of second intermediate magnetic core 16, 17 ... Upper magnetic core, 18 ... Made of ferromagnetic material Coupling magnetic path, 20 ... Substrate of non-magnetic material, 23 ... Center hole for mounting position regulation, 24 ... Grooves, 26, 27 ... Notches (grooves) formed by sliding width machining, 28, 29, 45, 46 ...
Bonding pads, 30, 31 ... Connection lines, 32, 3
5, 37, 40, 42 ... Thin film of non-magnetic inorganic insulating material, 3
8 ... Coil groove, 43 ... Coil pattern end portion, 44 ...
Coil pattern start end, G ... magnetic gap, H ... thin film magnetic head,

Claims (9)

[Claims] 1. A lower magnetic core and a first magnetic layer which are laminated in a state of being connected to one end of the lower magnetic core on a substrate made of a non-magnetic material provided with a base film made of an insulating material. A first core half body having a laminated structure with the intermediate magnetic core and an end portion forming a magnetic gap between the end portion of the first intermediate magnetic core in the first core half body described above. A second core half body having a laminated structure of a second intermediate magnetic core and an upper magnetic core laminated in a state of being connected to one end of the second intermediate magnetic core, and the first core described above. A coupling magnetic path connecting between the other end of the core half body and the other end of the second core half body, and a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path, A bonding pad for pulling out the lead wire and each thin film such as a protective film are sequentially laminated, and The film thickness of at least one of the first and second intermediate magnetic cores having magnetic gaps in a state not parallel to the formation surface of each thin film used in a state parallel to the extension direction of the rack Thin-film magnetic head configured so as to correspond to the track width. 2. A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core, and the first core half described above.
A second intermediate magnetic core having an end forming a magnetic gap between the first intermediate magnetic core and an end of the first intermediate magnetic core, and one end of the second intermediate magnetic core. Between a second core half body having a laminated structure of an upper magnetic core laminated in a connected state, and the other end portion of the first core half body and the other end portion of the second core half body described above. A coupling magnetic path for connecting, a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path, a lead wire bonding pad, and sequentially laminating each thin film such as a protective film,
The film thickness of at least one of the first and second intermediate magnetic cores having magnetic gaps that are not parallel to the formation surface of each thin film used in a state parallel to the track extension direction. On a disk-shaped substrate made of a non-magnetic material having a base film made of an insulating material and having a diameter slightly larger than the diameter of the rotating drum. At each of a plurality of predetermined positions, the magnetic gap of each thin film magnetic head described above,
A thin-film magnetic head having a laminated structure so as to be positioned at an end portion of the outer peripheral surface of the non-magnetic material substrate. 3. A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core, and the first core half described above.
A second intermediate magnetic core having an end forming a magnetic gap between the first intermediate magnetic core and an end of the first intermediate magnetic core, and one end of the second intermediate magnetic core. Between a second core half body having a laminated structure of an upper magnetic core laminated in a connected state, and the other end portion of the first core half body and the other end portion of the second core half body described above. A coupling magnetic path for connecting, a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path, a lead wire bonding pad, and sequentially laminating each thin film such as a protective film,
The film thickness of at least one of the first and second intermediate magnetic cores having magnetic gaps that are not parallel to the formation surface of each thin film used in a state parallel to the track extension direction. On a disk-shaped substrate made of a non-magnetic material having a base film made of an insulating material and having a diameter slightly larger than the diameter of the rotating drum. The magnetic gap of each of the thin film magnetic heads is laminated at each of a plurality of predetermined positions in such a manner that the magnetic gaps are located at the end portions of the outer peripheral surface of the non-magnetic material substrate, and the disk-shaped magnetic A thin film magnetic head made by thinning the outer peripheral edge of a body material substrate. 4. The bonding pad for pulling out a lead wire is provided on a surface of a disk-shaped substrate made of a non-magnetic material provided with a base film made of an insulating material. Thin film magnetic head. 5. An outer peripheral surface of the non-magnetic material substrate is provided with a magnetic void portion at each of a plurality of predetermined positions on a disk-shaped non-magnetic material substrate provided with a base film made of an insulating material. The thin-film magnetic heads stacked in such a manner as to be positioned at the end are offset in the film thickness direction of the thin film by the track width, and the magnetic gaps of the thin-film magnetic heads have different azimuth angles. 4. The thin film magnetic head according to claim 2, wherein the thin film magnetic head is configured as follows. 6. A hole for restricting attachment to a rotary drum is provided at a central position of a disk-shaped substrate made of a non-magnetic material provided with a base film made of an insulating material. Any of the thin film magnetic heads. 7. A non-magnetic material made of a non-magnetic material, which is provided at a plurality of predetermined positions on a disk-shaped non-magnetic material substrate provided with a base film made of an insulating material. 3. The outer peripheral surface of the substrate is arranged closer to the center of the non-magnetic material substrate than the outer peripheral surface of the non-magnetic material substrate at the mounting position of each thin film magnetic head.
7. The thin film magnetic head according to claim 6. 8. A film forming technique, a photolithography technique, an etching means and a polishing means are applied on a substrate made of a non-magnetic material provided with a base film made of an insulating material,
A first core half body having a laminated structure of a lower magnetic core and a first intermediate magnetic core laminated in a state of being connected to one end of the lower magnetic core, and the first core half body described above. A second intermediate magnetic core having an end forming a magnetic gap with the end of the first intermediate magnetic core, and a state of being connected to one end of the second intermediate magnetic core. A second core half body having a laminated structure with the upper magnetic core laminated by the above, and a coupling connecting between the other end portion of the first core half body and the other end portion of the second core half body described above. A magnetic path and a bonding pad for leading out a lead wire, as well as forming a laminated structure by each constituent member such as a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path in an insulating layer, The protective film is formed sequentially, and the first and second protective films are formed.
In producing a thin film magnetic head having a structure in which the film thickness of at least one of the intermediate magnetic cores corresponds to the track width, the thin film forming surface used in a state parallel to the track extension direction. In order to form a magnetic air gap that is non-parallel to the opposite end portions of the first and second intermediate magnetic cores, the end portion of the first intermediate magnetic core is formed on the surface on which each thin film is formed. A step of ion beam milling at a predetermined angle in a non-parallel state with respect to, and a non-magnetic inorganic insulating film having a thickness corresponding to the magnetic gap length including the end portion of the first intermediate magnetic core described above. A method of manufacturing a thin-film magnetic head, comprising the steps of depositing and depositing a ferromagnetic material film used for the configuration of the second intermediate magnetic core on the non-magnetic inorganic insulating film. 9. A lower magnetic core and a first intermediate layer laminated in a state of being connected to one end of the lower magnetic core by applying a film forming technique, a photolithography technique, an etching means and a polishing means. Part 1 with a laminated structure with a magnetic core
A second intermediate magnetic core having an end that forms a magnetic gap between the core half and the end of the first intermediate magnetic core in the first core half described above; The second core half body having a laminated structure of the upper magnetic core laminated in a state of being connected to one end portion of the second intermediate magnetic core, the other end portion of the first core half body, and the second core half body. A coupling magnetic path connecting between the other end of the core half and a laminated structure of each component such as a coil pattern made of a thin film of a conductive material formed around the coupling magnetic path is embedded in an insulating layer. In this state, the lead wire bonding pad and the protective film are sequentially formed, and the film thickness of at least one of the first and second intermediate magnetic cores corresponds to the track width. With respect to the surface on which each of the above thin films is used in the state parallel to the extension direction The magnetic gap portion of the non-parallel state first,
A thin film magnetic head having a structure such that it is provided between the opposite ends of the second intermediate magnetic core is set on a substrate made of a non-magnetic material provided with a base film made of an insulating material. At each of a plurality of predetermined positions on the circumference of the boundary of said region in one or more circular regions having a diameter slightly larger than the diameter of the rotating drum to be used. A step of simultaneously forming a plurality of thin film magnetic heads in a state where the magnetic gaps of the heads are arranged in predetermined directions, and a plurality of thin film magnetic heads to be attached to one rotating drum A set of a plurality of thin film magnetic heads formed on a substrate made of a non-magnetic material, and a set of a plurality of thin film magnetic heads formed on a substrate made of a non-magnetic material. Rotating magnetic Method of making a thin film magnetic head comprising a step of taking out a de structure.