JPH08161859A - Tape cartridge - Google Patents

Abstract

PURPOSE: To simply set up and fix an IC memory plate at a prescribed position inside a main body case even when the IC memory plate has variation in thick ness in the tape cartridge having the IC memory plate incorporated in the main body case. CONSTITUTION: A holding wall 17 is erected between a back wall 12 and a reel on the inner bottom surface of a lower case 3 opposite the back wall 12 leaving a space slightly wider than a standard plate thickness of the IC memory plate 14. A pressing rib 19 is provided at a lower end of a surface opposite the back wall 12 of the holding wall 17, and this rib 19 is formed with an inclined surface 19a for pressing lower end part of the IC memory plate 14 against the side of the back wall 12. On the other hand, a pressing rib 24 is also provided on an inner surface of an upper case 2, and this rib 24 is formed with an inclined surface 24a for pressing an upper end part of the IC memory plate 14 against the side of a back wall 22. The IC memory plate 14 is moved along the upper and lower inclined surfaces 19a and 24a to the side of the back walls 12 and 22 and is fixed under the state of close contact with the back walls 12 and 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a magnetic tape
The present invention relates to a tape cartridge containing a semiconductor integrated circuit memory board such as a C memory board.

[0002]

2. Description of the Related Art A tape cartridge of this type is known, for example, from Japanese Patent Laid-Open No. 63-166085. There, a memory device for storing the characteristic data of the magnetic tape or the setting data at the time of recording such as recording mode and voice recording data is exposed on the outer surface of the main body case so that the terminal portion that contacts the connection terminal on the VTR side is exposed to the outside. Embedded in one.

[0003]

However, in the conventional example in which the memory element is integrally molded in the body case,
There is a problem that the forming process of the main body case becomes complicated.
As a means for solving such a problem, for example, as shown in FIG. 2, a holding wall 17 facing the back wall 12 of the lower case 3 of the main body case 1 is provided upright, and the holding wall 17 and the back wall 12 are provided between the holding wall 17 and the back wall 12. It is conceivable to adopt a post-assembly form in which the semiconductor integrated circuit memory board 14 is inserted and mounted from above. According to this, since the semiconductor integrated circuit memory board 14 is assembled later, the forming process of the main body case 1 becomes easy, but
The thickness of the semiconductor integrated circuit memory board 14 varies due to manufacturing, and the thickness is different in the range of ± 0.2 to ± 0.15 mm. If the setting is difficult and the thickness of the semiconductor integrated circuit memory board 14 is thinner than the distance, rattling of the memory board 14 is likely to occur in the main body case 1, resulting in a contact failure with the connection terminal on the VTR side. The problem arises.

An object of the present invention is to obtain a tape cartridge capable of simplifying the molding of the main body case by adopting a rear assembly form instead of embedding the semiconductor integrated circuit memory board in the main body case. . Further, an object of the present invention is to stably and securely fix the semiconductor integrated circuit memory plate even if the thickness of the semiconductor integrated circuit memory plate has a slight variation, thereby ensuring the reliability and stability of the contact with the connection terminal on the VTR side. To get a tape cartridge that can be enhanced.

[0005]

According to a first aspect of the present invention, a reel 5 around which a magnetic tape 4 is wound inside a main body case 1 formed by abutting upper and lower cases 2 and 3 as shown in the drawings, In the tape cartridge containing the semiconductor integrated circuit memory board 14, the holding wall 17 is opposed to the rear wall 12 at a predetermined interval between the rear wall 12 and the reel 5 on the inner bottom surface of the lower case 3. And the pressing rib 19 is provided at the lower end of the surface of the holding wall 17 that faces the rear wall 12 and the pressing rib 19
On the surface facing the rear wall 12 of the
The pressing rib 24 is provided so as to project downward from the inner surface of the upper case 2 corresponding to the upper side of the holding wall 17, and the pressing rib 24 spreads downward on the surface facing the rear wall 22 of the upper case 2 of the pressing rib 24. A sloped surface 24a is provided, and the semiconductor integrated circuit memory board 14 has its upper and lower ends between the rear wall 12 and 22 and the pressing ribs 19 and 24 at the upper and lower ends by the sloped surfaces 19a and 24a. It is characterized in that it is clamped and fixed so as to be pressed to the 22 side.

According to a second aspect of the present invention, the reel 5 around which the magnetic tape 4 is wound and the semiconductor integrated circuit memory board 14 are housed inside the main body case 1 formed by abutting the upper and lower cases 2 and 3. In the tape cartridge, the pressing portion 30 having elasticity is provided between the rear wall 12 on the inner bottom surface of the lower case 3 and the reel 5 so as to face the rear wall 12 at a predetermined interval and the base portion 30a at one end thereof. The semiconductor integrated circuit memory plate 14 is pressed against the rear wall 12 by the elastic abutment action of the free end 30b of the pressing plate 30 between the rear wall 12 and the pressing plate 30. It is pinched and fixed so that

[0007]

According to the first aspect of the present invention, the semiconductor integrated circuit memory board 14 is provided with the rear wall 12 and the holding wall 17 of the lower case 3.
If you drop it from above between it and the memory board 1
The lower end of 4 is the inclined surface 1 of the pressing rib 19 on the lower case 3 side.
9a to the rear wall 12 side, then the lower case 3
When the upper case 2 is abutted against the upper case 2, the upper end of the memory plate 14 is pressed against the rear wall 22 side of the upper case 2 by the inclined surface 24a of the pressing rib 24 on the upper case 2 side. Therefore, the semiconductor integrated circuit memory board 14 having a little variation in board thickness
It is possible to obtain a state in which all of them are stably and closely fixed to the rear walls 12 and 22.

According to the second aspect of the present invention, when the semiconductor integrated circuit memory plate 14 is inserted between the rear wall 12 of the lower case 3 and the pressing plate 30, the memory plate 14 is attached to the free end 30b of the pressing plate 30. The state of being pressed against the rear wall 12 by the elastic contact action and closely fixed to the rear wall 12 is obtained.

[0009]

【Example】

(First Embodiment) FIGS. 1 to 3 show a first embodiment of a tape cartridge according to the present invention. 1 and 2, the body case 1 is a plastic upper and lower case 2
・ Match 3 together and combine them with screws P etc.
A pair of reels 5 around which the magnetic tape 4 is wound are arranged on the left and right sides of the main body case 1. The magnetic tape 4 pulled out from one reel 5 is guided by the tape guides 8 provided at the front left and right tape outlets 7 of the main body case 1 and wound on the other reel 5. A tape loading pocket 9 is provided in the center of the front surface of the main body case 1, that is, between the left and right tape outlets 7. The magnetic tape 4 led out to the pocket 9 of the main body case 1 is the front lid 1 when not in use.
0, a back cover 11 and an upper cover (not shown) to cover and protect each.

In FIG. 2, between the rear wall 12 on the inner bottom surface 3a of the lower case 3 and the reel 5, a reel surrounding wall 13 for restricting a radial floating limit of the reel 5 is provided.
It is provided in an arc shape along the outer periphery of the. A space portion is formed between the reel surrounding wall 13 and the rear wall 12, and a semiconductor integrated circuit such as an IC or LSI for storing specifications and characteristic data of the magnetic tape 4 or setting data at the time of recording in the space portion. Memory board 14 (hereinafter, simply memory board 1
4 ) Built-in. This memory board 14 is shown in FIG.
As shown in FIG. 5, the semiconductor chip 16 is mounted on one surface of the substrate 15 and the plurality of contacts 18 are mounted on the multiple surfaces for printed wiring.

As shown in FIGS. 1 and 3, the retaining wall 17 is provided between the rear wall 12 on the inner bottom surface 3a of the lower case 3 and the reel surrounding wall 13 in preparation for the incorporation of the memory plate 14. It is projected integrally from 3a. The holding wall 17 is arranged so as to face the rear wall 12 with a space slightly larger than the standard thickness of the memory plate 14. Holding wall 1
One or several (two in the illustrated example) pressing ribs 19 are provided at the corners where the lower end of the surface of 7 facing the back wall 12 and the inner bottom surface 3a intersect. This pressing rib 19 has an inner bottom surface 3
There is an upwardly sloping sloped surface 19a that slopes downward toward a, and a sandwiching groove 20 having a sectionally splaying shape is formed between this sloped surface 19a and the back wall 12. The rear wall 12 has a slit 21 for exposing the contact 18 of the memory plate 14 to the outside. On the other hand, a pressing rib 24 is also provided at the corner where the rear wall 22 and the upper wall 23 of the upper case 2 corresponding to the upper side of the holding wall 17 are provided.
An inclined surface 24a opposite to the inclined surface 19a is formed on the pressing rib 24 so as to form a holding groove 25 having a downwardly expanding cross-section between the lower end portion and the back wall 22.

At the time of assembling this tape cartridge, the lower case 3 accommodates the required parts such as the reel 5 and the contact point 18 faces the rear wall 12 between the rear wall 12 and the holding wall 17 of the memory plate 14. Drop it. Then, the lower end portion of the memory plate 14 slides down the inclined surface 19a and is moved toward the rear wall 12 so that the holding groove 2 is held.
The contact 18 is made to face the slit 21 while being fitted in the slot 0. At this time, the height of the memory plate 14 is set to the lower case 3
Since it is set slightly higher than the height of the back wall 12 of
The upper end of the rear wall 12 is housed in a state of protruding slightly above the upper end of the rear wall 12. Next, the lower case 3 and the upper case 2
Since the upper end portion of the memory plate 14 is pressed against the rear wall 22 by the inclined surface 24a of the pressing rib 24 of the upper case 2 by covering the upper surface of the upper case 2, the memory plate 14 does not fall toward the holding wall 17 and at the same time, the memory plate 14 does not fall down. 14 is also pressed downward, and its lower end is press-fitted into the holding groove 20 on the lower case 3 side. As a result, the memory plate 14 becomes the back wall 1
A fixed state is obtained in which the contact point 18 is fixed in a vertical state in which the contact point 18 is exposed to the slit 21.

Since the semiconductor chip 16 of the memory plate 14 often projects from the substrate 15, a notch 26 is formed in a part of the rib surrounding wall 13 as shown in FIG. The semiconductor chip 16 is positioned to avoid contact interference with it. As shown in FIG. 1, an inclined surface 17a is provided at the upper end of the holding wall 17 so that the memory plate 14 can be easily inserted between the holding wall 1 and the back wall 12.

In this way, the upper and lower ends of the memory plate 14 are inclined surfaces 19a and 24 of the upper and lower pressing ribs 19 and 24, respectively.
Since the memory plate 14 is pressed against the rear wall 12/22 side by a, all of the memory plate 14 is fixed in close contact with the rear wall 12/22 even if the thickness of the memory plate 14 varies a little. Therefore, when the connection terminal on the VTR side comes into pressure contact with the contact 18 of the memory plate 14, the memory plate 14 does not tilt or move inward of the case due to the contact pressing force, and the contact function is reliable. Can be improved. The memory plate 14 can be easily fixed in place without using a special fixing member simply by dropping it and mounting it, and moreover, it can withstand contact pressure sufficiently.

In the above embodiment, the height dimension of the memory plate 14 is set to be slightly higher than the height of the rear wall 12 of the lower case 3 as shown in FIG.
If the height dimension of the lower case 3 is lower than the height of the rear wall 12 of the lower case 3, the pressing ribs 24 on the upper case 2 side are not
It is also possible to provide it so as to project further downward than the lower end of 2, and to press the upper end of the memory plate 14 against the rear wall 12 side of the lower case 3 by the inclined surface 24 a at the lower end of the pressing rib 24.

(Second Embodiment) FIG. 4 shows a second embodiment of the present invention. In this embodiment, separately from the reel surrounding wall 13,
Resin with high elasticity such as polyacetal, or S
The pressing plate 30 is formed of a metal material such as US into an arc shape along the outer periphery of the reel 5, and the base 3 at one end of the pressing plate 30 is formed.
0a is cantilevered by fixing the reel surrounding wall 13 to the end of the notch formed by notching a part of the reel surrounding wall 13. This pressing plate 3
The distance between the free end (free end) 30b at the other end of 0 and the back wall 12 is set to be narrower than the standard thickness of the memory plate 14.

Thus, the memory plate 14 is pressed against the pressing plate 30.
When inserted between the rear wall 1 and the rear wall 12, the memory plate 14 receives the pressing action of the free end 30b of the pressing plate 30 and the rear wall 1.
It will be closely fixed to 2. Therefore, in this case as well, the memory plate 14 has a slight variation in plate thickness, and the rear wall 1
It is fixed in close contact with 2. When the connection terminal on the VTR side comes into pressure contact with the contact 18 of the memory plate 14, the memory plate 14 is pushed back by the elasticity of the pressing plate 30, so that the contact pressure can be increased and the contact function is reliable. Can be improved. In addition, an inclined surface 30c is provided at the upper end of the pressing plate 30 so that the memory plate 14 is pressed against the pressing plate 30.
It is made easy to insert between the rear wall 12 and the back wall 12. The free end 30b of the pressing plate 30 and the end of the reel surrounding wall 13 adjacent to and opposite to the free end 30b are separated from each other by a width slightly wider than the width of the semiconductor chip 16 in order to avoid contact interference with the semiconductor chip 16. There is. In the case of this embodiment, the pressing rib 24 on the upper case 2 side of the first embodiment is not always necessary, but it is preferable to provide the pressing rib 24.

[0018]

According to the invention of claim 1 of the present invention,
Since the semiconductor integrated circuit memory board 14 is not embedded in the main body case 1 but is assembled inside the main body case 1, the main body case 1 can be easily molded. Moreover, the upper and lower end portions of the semiconductor integrated circuit memory board 14 have upper and lower pressing ribs 19.
Since the inclined surfaces 19a and 24a of 24 are pressed against the rear wall 12 and 22, the memory plate 14 can be securely fixed in close contact with the rear wall 12 and 22 even if the thickness of the memory plate 14 varies a little. . Therefore, the reliability and stability of the contact with the connection terminal on the VTR side can be improved.

According to the second aspect of the present invention, similarly, the body case 1 can be easily formed, and the elasticity of the pressing plate 30 can be maintained even when the semiconductor integrated circuit memory board 14 has a slight variation in the board thickness. Since it is pressed against the rear wall 12 side by the action and fixed in a close contact state with the rear wall 12,
It is possible to improve the reliability and stability of the contact with the connection terminal on the VTR side.

[Brief description of drawings]

FIG. 1 is a sectional view taken along line AA in FIG. 2 showing a first embodiment.

FIG. 2 is a plan view of the entire inside showing the first embodiment.

FIG. 3 is a perspective view of a semiconductor integrated circuit memory board and a part of a lower case of the first embodiment.

FIG. 4 is a plan view of the inside of the whole showing a second embodiment corresponding to FIG.

[Explanation of symbols]

 1 Main Case 2 Upper Case 3 Lower Case 5 Reel 12 Rear Wall of Lower Case 14 Semiconductor Integrated Circuit Memory Board 17 Holding Wall 19 Pressing Rib 19a Inclined Surface 22 Upper Case Rear Wall 24 Pressing Rib 24a Inclined Surface 30 Pressing Board 30a Base 30b Free end

Claims (2)

[Claims] 1. A tape cartridge containing a reel 5 around which a magnetic tape 4 is wound, and a semiconductor integrated circuit memory board 14 inside a main body case 1 formed by abutting upper and lower cases 2 and 3 together. A holding wall 17 is erected between the rear wall 12 and the reel 5 on the inner bottom surface so as to face the rear wall 12 at a predetermined interval, and the lower end portion of the surface of the holding wall 17 facing the rear wall 12 is provided. The pressing rib 19 is provided on the upper surface of the pressing rib 19, and the inclined surface 19a of the pressing rib 19 facing the rear wall 12 is provided. Of the pressing rib 24 is provided with a downwardly expanding inclined surface 24a on the surface facing the rear wall 22 of the upper case 2 of the pressing rib 24. 9. A tape cartridge characterized in that a semiconductor integrated circuit memory board (14) is clamped and fixed between 9 and 24 so that the upper and lower ends of the semiconductor integrated circuit memory board (14) are pressed to the rear wall (12, 22) side by the inclined surfaces (19a, 24a). 2. A tape cartridge containing a reel 5 around which a magnetic tape 4 is wound and a semiconductor integrated circuit memory board 14 inside a main body case 1 formed by abutting the upper and lower cases 2 and 3 together. Between the rear wall 12 and the reel 5 on the inner bottom surface, a pressing plate 30 having elasticity is provided at one end of the base portion 30a so as to face the rear wall 12 at a predetermined interval.
The semiconductor integrated circuit memory plate 14 is pressed between the rear wall 12 and the pressing plate 30 toward the rear wall 12 side by the elastic abutment action of the free end 30b of the pressing plate 30. A tape cartridge characterized in that it is clamped and fixed so as to be held.