JPH08149794A - Forced-air cooling semiconductor device - Google Patents

Abstract

PURPOSE: To obtain a forced-air cooling semiconductor device in which the air for cooling a snubber resistor is prevented from concentrating at a part and uniform cooling is realized with uniform air flow rate. CONSTITUTION: A cooling air regulator comprising a partition board 8, an air tunnel 9A, and a louver 9a is disposed additionally between a semiconductor stack 1 and a snubber unit having a snubber resistor 4. Consequently, the direction of the air for cooling the snubber resistor 4 can be regulated to prevent concentration of the cooling air thus cooling the snubber resistor 4 uniformly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a forced air cooling type semiconductor device having a semiconductor stack having a semiconductor element and cooling fins combined therein and a snubber unit having a snubber resistance.

[0002]

2. Description of the Related Art As an example of a conventional forced air cooling type semiconductor device of this type, there is one configured as shown in FIGS. Inside the semiconductor stage 10, a semiconductor stack 1 including a semiconductor element 3 having cooling fins 2 on both sides.
A snubber unit including a snubber resistor 4 and a converging capacitor 5, an anode reactor 6, and a wind guide cover 7 having an opening 21 are housed and fixed. in this case,
The cooling air introduced from the opening 21 is the semiconductor stack 1
The structure is such that cooling air flows through the inner cooling fins 2 to the snubber resistance 4 at the rear.

When the semiconductor device having the above structure is used in a forced air cooling type semiconductor power converter, a cooling fan (not shown) is provided at any place in the power converter board. The cooling air introduced from the opening 21 is produced. The inside of the semiconductor stage 10 is configured so that the cooling air passes through the cooling fin 2 from the opening 21 of the air guide cover 7 and cools the snubber resistor 4.

[0004]

In the conventional forced air cooling type semiconductor device described above, the flow of the forced cooling air for cooling the snubber resistor 4 concentrates in a part in the linear direction from the cooling fins 2, so that there is uneven cooling. Occurs, cooling efficiency deteriorates,
There was a problem that the required air volume could not be obtained.

Further, if the required air volume cannot be obtained, the snubber resistance 4 is deteriorated, which has a fatal effect such as disconnection or fire spread.
The present invention has been made to solve such a problem, and it is possible to prevent a partial concentration of the cooling air that cools the snubber resistance of the snubber unit and to obtain a uniform air volume without uneven cooling. An object is to provide a semiconductor device.

[0006]

According to the first aspect of the present invention,
A semiconductor stack in which at least a semiconductor element and a cooling fin are combined and a snubber unit having at least a snubber resistance are mounted on the semiconductor stage, and a wind guide cover is provided on the semiconductor stage so as to surround the semiconductor stack and the snubber unit. , Inside the space formed by this air guide cover and the semiconductor stage,
An air-cooled semiconductor device in which cooling air is guided from the outside to forcibly cool the semiconductor stack and the snubber unit sequentially is provided with a cooling air adjusting device that adjusts the cooling air guided to the snubber unit to be uniform. It is a forced air cooling type semiconductor device.

According to a second aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device is arranged between the semiconductor stack and the snubber unit, and is provided in the wind tunnel and inside thereof. It is a forced air cooling type semiconductor device configured by a louver for adjusting the wind direction.

According to a third aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device is arranged between the semiconductor stack and the snubber unit, and is provided in the wind tunnel and inside thereof. It is a forced air cooling type semiconductor device configured by a cooling air diffusion grid.

According to a fourth aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device has a cooling wind formed in a position corresponding to the cooling fins of the semiconductor stack on the air guide cover. The opening portion for guiding the cooling air is a forced air cooling type semiconductor device which is an opening portion separately provided in the air guiding cover and which directly takes in the cooling air into the snubber unit.

According to a fifth aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device is disposed between the semiconductor stack and the snubber unit, and the cooling fin of the semiconductor stack is provided. The forced air cooling type semiconductor device is a louver for allowing the cooling air introduced from the rear stage side to the snubber unit to have a spread.

According to a sixth aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device is disposed between the semiconductor stack and the snubber unit, and a cooling fin of the semiconductor stack is provided. Forced air cooling type semiconductor device composed of a duct for preventing the cooling air introduced from the rear side to the snubber unit from leaking to the outside, and a partition plate provided inside the duct to spread the cooling air. Is.

According to a seventh aspect of the present invention, in the forced air cooling type semiconductor device according to the first aspect, the cooling air adjusting device is provided on the rear stage side of the snubber unit and has a cooling fan for spreading the cooling air. Is a forced air cooling type semiconductor device.

[0013]

According to the invention described in any one of claims 1 to 7, since the cooling air adjusting device is provided, the cooling air direction for cooling the snubber resistance of the snubber unit can be adjusted,
Partial concentration of cooling air can be prevented, uneven cooling can be eliminated, and snubber resistance can be cooled uniformly.

[0014]

Embodiments of the semiconductor device of the present invention will now be described with reference to the drawings. The same parts as those in the conventional example shown in FIGS. 13 and 14 are designated by the same reference numerals and their description will be omitted.

<First Embodiment> FIG. 1A is a plan view for explaining a first embodiment (an embodiment corresponding to claim 2), and FIG. 2 shows a side view of FIG. There is. As is apparent from both figures, the difference from the above-mentioned conventional example is that the partition plate 8
A cooling air adjusting device including a wind tunnel 9A and a louver 9a is newly provided between the semiconductor stack 1 and the snubber unit having the snubber resistor 4.

The partition plate 8 has, for example, a frame shape surrounded by four sides and is provided to prevent the cooling air flowing from the opening 21 from leaking to a place other than the snubber resistance 4. As shown in FIG. 1 (b) <enlarged perspective view of the wind tunnel 9A of FIG. 1 (a)>, the wind tunnel 9A has a rectangular frame, and a plurality of louvers 9a are arranged inside each other with a space therebetween. And are rotatably supported. Specifically, knock pins 11 are fixed to the upper and lower ends of the louver 9a, and the knock pins 11 are inserted into holes (not shown) formed in the upper and lower plates of the wind tunnel 9A, which allows the louver 9a to rotate. The other louver 9a is similarly configured.

Therefore, by adjusting the rotation angle of the louver 9a, the cooling air obtained by the cooling fan (not shown) is blown into the inside from the opening 21, and the cooling air passes through the outer peripheral portion of the cooling fin 2 and the partition plate. After passing through 8, the louvers 9a provided inside the wind tunnel 9A are guided to the snubber resistance 4 through the louvers 9a and the louvers 9a. The direction of the cooling air in this case can be changed by manually adjusting the angle of the louver 9a. Therefore, by optimally adjusting the louver 9a, it is possible to prevent the cooling air from partially concentrating on the snubber resistor 4, eliminate uneven cooling, and uniformly cool the snubber resistor.

<Second Embodiment> FIG. 3A is a plan view showing a second embodiment (corresponding to claim 3), and FIG. 4 is a side view of FIG. As is clear from both figures, the difference from the above-mentioned conventional example is that the cooling air adjusting device including the partition plates 8 and 8a, the wind tunnel 9B, and the louver 9b is provided between the semiconductor stack 1 and the snubber unit having the snubber resistor 4. , Is newly provided.

The partition plate 8 has, for example, a frame shape surrounded by four sides, and is provided to prevent the cooling air flowing from the opening 21 from leaking to a place other than the snubber resistance 4. The partition plate 8a is provided on the partition plate 8 for adjusting the direction of the cooling air.

As shown in FIG. 2 (b) <enlarged perspective view of the wind tunnel 9B of FIG. 2 (a)>, the wind tunnel 9B has a rectangular frame in which a plurality of louvers 9b are arranged in a lattice pattern. The cross-sectional area of the passage in which the cooling air passes is smaller on the central portion side of the wind tunnel 9B than on the other portion.

With this configuration, as in the first embodiment, it is possible to prevent the cooling air from partially concentrating on the snubber resistor 4, eliminate uneven cooling, and cool the snubber resistor uniformly. Specifically, the cooling air guided from the opening 21 passes through the outer peripheral portions of the cooling fins 2 and the partition plates 8 and 8a, and then the lattice-shaped louver 9 provided inside the wind tunnel 9B.
Since it passes through b, the cooling air is diffused. Therefore, wind tunnel 9B
Thus, the cooling air of the snubber resistor 4 can be prevented from partially concentrating, uneven cooling can be eliminated, and the snubber resistor 4 can be cooled uniformly.

The shape, width, etc. of the lattice-shaped louver 9b are not limited to the example shown in the figure, but are determined by the number of snubber resistors 4, the shape and size of the semiconductor stage 10.

<Third Embodiment> FIG. 5 is a plan view showing a third embodiment (corresponding to claim 4), and FIG. 6 is a side view of FIG. As is clear from both figures, the difference from the above-mentioned conventional example is that the cooling air adjusting device is configured as follows. That is, although the opening A21 for flowing the cooling air around the cooling fins 2 is provided in the air guiding cover 7A as in the conventional case, the snubber is directly provided without the cooling fins 2 separately from the opening 21. The opening 22 is provided so that the cooling air is taken into the resistor 4.

In this way, the opening 22 is formed in the air guide cover 7A.
By forming the above, it is possible to prevent a partial concentration of the cooling air of the snubber resistor 4 and to uniformly cool the snubber resistor 4. The size, shape, etc. of the opening B22 are not limited to those shown in the figure, but are determined by the number of snubber resistors 4, the shape and size of the semiconductor stage 10.

<Fourth Embodiment> FIG. 7 is a plan view showing a fourth embodiment (corresponding to claim 5), and FIG. 8 is a side view of FIG. As is clear from both figures, the difference from the above-mentioned conventional example is that the cooling air adjusting device is configured as follows. A fan-shaped louver 8C is directly attached to the cooling fins 2 of the semiconductor stack 1.

Since the fan-shaped louvers 8C are attached to the cooling fins 2 as described above, the cooling air for cooling the snubber resistance 4 is diffused, so that a partial concentration of the cooling air is prevented and the cooling unevenness is eliminated and evenly distributed. The snubber resistor 4 can be cooled.

The number, angle, size, etc. of the louvers 8C are not limited to those shown in the figure, but are determined by the number of snubber resistors 4, the outer shape and size of the semiconductor stage 10. <Fifth Embodiment> FIG. 9 is a plan view showing a fifth embodiment (corresponding to claim 6), and FIG. 10 is a side view of FIG. As is apparent from both figures, the difference from the above-mentioned conventional example is that a cooling air adjusting device including a partition plate 8b and a duct 8D is provided between the semiconductor stack 1 and the snubber resistor 4. In addition to the snubber resistance 4, the duct 8D prevents cooling air from leaking, and at the same time, a partition plate 8b in the duct 8D causes a turbulent flow in the cooling air to diffuse the cooling air.

With this structure, the duct 8
D prevents snubber resistance 4 from partially concentrating in the cooling air,
It is possible to uniformly cool the snubber resistor 4 by eliminating uneven cooling.

The number, the angle, and the size of the partition plate 8b are not limited to those shown in the figure, but are determined by the number of snubber resistors 4, the shape and size of the semiconductor stage 10. <Sixth Embodiment> FIG. 11 is a plan view showing a sixth embodiment (corresponding to claim 7), and FIG. 12 is a side view of FIG. As is apparent from both figures, the difference from the above-described conventional example is that a cooling fan 8E for spreading the cooling air is provided on the subsequent stage side (downstream side of the cooling air) of the snubber resistor 4 as a cooling air adjusting device. It is a thing. The cooling fan 8E in this case is normally installed at any of the locations (not shown) in the semiconductor power converter board and is arranged at the rear side of the snubber resistor 4, that is, at the rear side of the semiconductor stage 10.

As described above, by providing the cooling fan 8E, the air drawn from the opening of the air guide cover 7 can be discharged to the outside of the semiconductor stage 10 and spread to the cooling air flowing through the snubber resistor 4. Can have Therefore, it is possible to prevent a partial concentration of the cooling air of the snubber resistor 4 to eliminate the uneven cooling and to uniformly cool the snubber resistor. The present invention is not limited to the above-mentioned embodiment, and may be a cooling air adjusting device in which at least two of the first to sixth embodiments are combined.

[0031]

According to the present invention, it is possible to prevent a partial concentration of cooling air for cooling the snubber resistance of a semiconductor device including a semiconductor stack having at least semiconductor elements and cooling fins combined and a snubber unit having at least a snubber resistance. It is possible to provide a forced air cooling type semiconductor device capable of obtaining a uniform air flow without uneven cooling.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a first embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a diagram for explaining a second embodiment of the present invention.

FIG. 4 is a side view of FIG.

FIG. 5 is a plan view showing a third embodiment of the present invention.

6 is a side view of FIG.

FIG. 7 is a plan view showing a fourth embodiment of the present invention.

FIG. 8 is a side view of FIG. 7;

FIG. 9 is a plan view showing a fifth embodiment of the present invention.

FIG. 10 is a side view of FIG. 9;

FIG. 11 is a plan view showing a sixth embodiment of the present invention.

FIG. 12 is a side view of FIG. 11.

FIG. 13 is a plan view of a conventional semiconductor device.

FIG. 14 is a side view of FIG. 13;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor stack, 2 ... Cooling fins, 3 ... Semiconductor element, 4 ... Snubber resistance, 5 ... Snubber capacitor, 6 ... Anode reactor, 7 ... Wind guide cover, 8 ... Partition plate,
8a ... partition plate, 8b ... partition plate, 8A ... partition plate, 8B ... partition plate, 8C ... louver, 8D ... duct, 8E ... cooling fan, 9A ... wind tunnel, 9B ... wind tunnel, 9a ... louver, 9b ... lattice, 10 … Semiconductor stage, 11… Knock pin, 21…
Opening, 22 ... Opening.

Claims (7)

[Claims] 1. A semiconductor stack on which at least a semiconductor element and a cooling fin are combined and a snubber unit having at least a snubber resistance are mounted on a semiconductor stage, and the semiconductor stage and the snubber unit are surrounded by wind. In a wind-cooled semiconductor device in which a guiding cover is provided, cooling air is introduced from the outside into the space formed by the air guiding cover and the semiconductor stage to forcibly cool the semiconductor stack and the snubber unit sequentially. A forced air cooling type semiconductor device, comprising a cooling air adjusting device for adjusting the cooling air guided to the snubber unit to be uniform. 2. The forced air cooling type semiconductor device according to claim 1, wherein the cooling air adjusting device is arranged between the semiconductor stack and the snubber unit, and comprises a wind tunnel and a wind direction adjusting louver provided inside the wind tunnel. A forced air cooling type semiconductor device characterized in that 3. The forced air cooling type semiconductor device according to claim 1, wherein the cooling air conditioning device is arranged between the semiconductor stack and the snubber unit, and comprises a wind tunnel and a cooling air diffusing grid provided therein. A forced-air-cooled semiconductor device characterized by being configured. 4. The forced air cooling type semiconductor device according to claim 1, wherein the cooling air adjusting device has an opening formed in the air guiding cover at a position corresponding to the cooling fins of the semiconductor stack for guiding cooling air. A forced-air-cooling type semiconductor device, which is an opening provided separately on the air-guiding cover and which directly takes in the cooling air to the snubber unit. 5. The forced air cooling type semiconductor device according to claim 1, wherein the cooling air adjusting device is disposed between the semiconductor stack and the snubber unit, and the snubber unit is arranged from a rear stage side of a cooling fin of the semiconductor stack. A forced-air-cooling type semiconductor device, which is a louver for expanding the cooling air guided to the air. 6. The forced air cooling type semiconductor device according to claim 1, wherein a cooling air adjusting device is disposed between the semiconductor stack and the snubber unit, and the snubber unit is provided from a rear stage side of a cooling fin of the semiconductor stack. A forced-air-cooling type semiconductor device comprising a duct for preventing the cooling air guided to the outside from leaking to the outside, and a partition plate provided inside the duct for spreading the cooling air. 7. The forced air cooling type semiconductor device according to claim 1, wherein the cooling air adjusting device is a cooling fan that is provided at a rear stage side of the snubber unit and that causes the cooling air to spread. Forced air cooling type semiconductor device.