JPH08139232A - Hybrid integrated circuit device, its socket and their connection structure - Google Patents

Abstract

PURPOSE: To eliminate an alignment hole by ensuring alignment of a substrate with a socket. CONSTITUTION: At the outer circumference of a memory module substrate 15 whereupon a plurality of memory ICs 11 are mounted, only an index beveling part 20 is formed at the corner on the first pin side on the alignment edge side of a terminal 18 and no alignment hole is provided on the substrate. On one edge side of the main body 31 of a memory module connecting socket 30, a mounting part 32 whereupon contacts 33 are arranged is formed, an index protruding part 36 which meshes with the beveling part 20 is formed at one edge of the mounting part 32, and claws 37 and 38 are formed on the edge side opposite to the mounting part so as to hold the outer circumference edge of the substrate 15. Thus, alignment of the memory module with the socket is ensured by the holding of the substrate outer circumference edge by the holding claws and the meshing of the index beveling part with the protruding part, and the memory IC is electrically connected to the contact of the socket through the terminal. The memory IC mounting area is increased by the elimination of the alignment hole, and density and degree of freedom of electric wiring are improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device for a semiconductor device, and more particularly to a technique for connecting the hybrid integrated circuit device and a socket, which is effective for use in a memory module, for example.

[0002]

2. Description of the Related Art As a memory module which is an example of a hybrid integrated circuit device, a plurality of semiconductor devices configured as memories are mounted on a first main surface and a second main surface of a rectangular substrate. , Each semiconductor device is electrically connected to a plurality of terminals arranged on one end side of the substrate.

When this memory module is mounted on a computer or undergoes an electrical characteristic test, it is generally practiced to electrically connect the memory module to a computer or a tester via a socket. . In such a case, in order to securely electrically connect the terminals of the memory module and the contacts of the socket,
At least one pair of alignment holes are opened on the substrate side of the memory module, and alignment protrusions are projected on the socket side, and the alignment between the module and the socket is ensured by fitting the holes and the protrusions.

As an example in which such a hybrid integrated circuit device is described, there is JP-A-5-101854.

[0005]

However, in the above-mentioned memory module, since the holes for alignment are formed in the substrate, the mounting area of the semiconductor device on the substrate is reduced accordingly, and However, there is a problem that the wiring freedom of the wiring on the surface of the substrate and the interlayer wiring inside the substrate is reduced.

It is an object of the present invention to provide a technique for connecting a hybrid integrated circuit device and a socket, which is capable of omitting the alignment hole while ensuring the alignment between the substrate and the socket.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, in the hybrid integrated circuit device, a plurality of semiconductor devices are mounted over the entire main surface of a substrate on which a quadrilateral is formed, and only the index chamfer indicating the direction is provided on the outer peripheral portion of the substrate. It is characterized in that it is formed at one corner portion on the end side where the terminal electrically connected to the semiconductor device is arranged.

The socket to which the hybrid integrated circuit device is connected includes a quadrilateral body having a size substantially equal to the semiconductor device mounting main surface of the substrate, and the terminal is provided on one end side of the body. A plurality of contacts to be electrically connected to each other are arranged, and each contact is configured to press against each terminal, and an index convex portion meshes with the index chamfered portion on one side of the contact group of the main body. The main body is formed in a shape, and a holding claw is formed on an end side opposite to the contact group arrangement end side of the main body so as to press the outer peripheral edge of the substrate.

[0011]

When the hybrid integrated circuit device and the socket are connected, the index chamfered portion is engaged with the index convex portion while the substrate of the hybrid integrated circuit device is superposed on the body of the socket, and the substrate is held by the pressing claw. When the outer peripheral edge of the socket is pressed and the contacts of the socket are pressed against the terminals of the board, the board of the hybrid integrated circuit device is held by the body of the socket, and the terminals are electrically connected to the contacts. It will be connected.

According to the above-mentioned means, the positioning and holding of the hybrid integrated circuit device and the socket are ensured by the pressing of the outer peripheral edge of the substrate by the pressing claws and the meshing between the index chamfered portion and the convex portion. It is possible to omit the opening of the positioning hole in the substrate. By omitting the formation of the positioning hole in the substrate of the hybrid integrated circuit device, the mounting area of the semiconductor device on the substrate can be increased, and the electric wiring density and the degree of freedom of layout can be increased.

[0013]

1 is an exploded perspective view showing a connection structure of a memory module and a socket according to an embodiment of the present invention. FIG. 2 shows a memory module according to an embodiment of the present invention, (a) is a front view, (b) is a bottom view,
(C) is an enlarged side view and (d) is an enlarged side sectional view.
FIG. 3 shows a socket which is an embodiment of the present invention.
(A) is a front view, (b) is a plan view, and (c) is an enlarged side view. FIG. 4 shows an assembled state of a connection structure of a memory module and a socket which is an embodiment of the present invention.
(A) is a front view, (b) is a plan view, and (c) is an enlarged side sectional view.

In this embodiment, the hybrid integrated circuit device according to the present invention is configured as a memory module. The memory module 10 is a semiconductor integrated circuit device (hereinafter referred to as a memory IC) 11 having a memory.
Is a module that is mechanically and electrically connected to a plurality of units (eight units in this embodiment) via a substrate.

In this embodiment, the memory module 1
The package 12 of the memory IC 11 forming 0 is formed into a small outline package (hereinafter referred to as SOP). The SOP 12 is a resin sealing body 1 formed of an insulating resin in a rectangular flat plate shape.
3 and a plurality of (12 in this embodiment) outer leads 14 protruding from the resin encapsulant 13 and bent in a gull-wing shape. The twelve outer leads 14 are made of resin. Six pieces are distributed on each of the long side surfaces of the sealing body 13 and arranged in a row. The outer lead 14 is electrically connected to a semiconductor pellet (not shown) in which a memory is formed via an inner lead and a bonding wire which are resin-sealed inside the resin sealing body 13. There is.

A substrate 15 for modularizing a plurality of memory ICs 11 includes a main body 16 formed in a rectangular flat plate shape using an insulating substrate such as a glass / epoxy resin plate or a ceramic plate. The first main surface (front surface) and the second main surface (back surface) of the main body 16 are formed by regularly arranging as many lands 17 as the number of outer leads 14 of the mounted memory IC 11. That is, the number of lands 1 corresponding to the number of outer leads 14 of one memory IC 11 (12 in this embodiment).
One set is composed of seven groups, and a plurality of sets (four sets in this embodiment) are arranged in a line in the longitudinal direction of the main body 16 on the first main surface and the second main surface of the main body 16. . In each set, the group of lands 17 is distributed in a number corresponding to the number of outer leads 14 in a row (6 in this embodiment), and is arranged in a row in the lateral direction of the main body 16. The outer land rows in the pair of land groups located at both ends of the row are arranged at positions extremely close to both short sides of the main body 16.

Then, each land 17 is subjected to surface treatment (not shown) such as solder plating to improve solder wettability. When mounting the memory IC 11 on the substrate 15, a solder paste (not shown) is applied to the group of lands 17 by an appropriate means such as a screen printing method. The memory IC 11 is soldered to the substrate 15 by reflow soldering in a state where the outer leads 14 are aligned with the respective lands 17 and adhered by the solder paste.

In the state of being soldered and mounted in this way, the first main surface and the second main surface of the substrate 15 are provided with 4
The eight memory ICs 11 mounted one by one are arranged close to each other in a row with the rows of the outer leads 14 parallel to the lateral direction of the main body 16. Moreover, the substrate 15
The four memory ICs 11, which are respectively mounted on the first main surface and the second main surface, are mounted on the entire surfaces of the first main surface and the second main surface of the substrate 15.
That is, the memory IC mounting surface is formed over the entire first and second main surfaces of the substrate 15 by the group of lands 17.

A large number of terminals 18 are arranged on one long side (hereinafter referred to as the lower end side) of the rectangular shape of the substrate body 16 in a line along the lower end side with an equal pitch, and each terminal 18 is arranged. The main body 16 has a U-shaped cross section over the first main surface, the side surface of the lower end side, and the second main surface. For example, the terminal 18 is formed by applying a lithographic process to a copper foil that is previously bonded to the substrate body 16, or
It is formed by an appropriate means such as a screen printing method, a vapor deposition method using a metal mask, or a plating method.

Electric wirings 19 (only internal wirings are representatively shown in FIG. 2) are formed on the first main surface, the second main surface of the substrate body 16 and inside the main body, respectively. The wiring 19 is wired so as to electrically connect each terminal 18 and each land 17 appropriately. This electrical wiring 19
Is formed by a suitable method such as a method of forming a copper foil previously bonded to the substrate body 16 by performing a lithographic process, a screen printing method, a vapor deposition method using a metal mask, a plating method, or the like.

An index chamfered portion 20 indicating the direction of the memory module 10 is formed in a so-called C chamfer (right-angled isosceles triangle) shape at one corner portion on the lower end side where the terminals 18 of the substrate body 16 are arranged. There is. The corner portion of the substrate body 16 on which the index chamfered portion 20 is arranged is the memory module 1 among the terminals 18 group.
The corner portion on the side where the so-called first pin of 0 is located. Further, the size of the index chamfered portion 20 is the maximum size within a range that does not interfere with the nearest terminal 18 (usually the first pin), and the remaining three corner portions of the substrate body 16, that is, The size of the substrate body 16 is set to the minimum size that can be distinguished from the chamfered portion that is generally formed for the reason of molding and the prevention of stress concentration.

The socket 30 to which the memory module 10 configured as described above is connected has a main body 31 integrally formed with an insulating material such as epoxy resin. The socket body 31 is formed in a rectangular flat plate shape slightly larger than the substrate body 16 of the memory module 10. On one long side (hereinafter, referred to as a lower end side) of the rectangle of the socket body 31, a channel-shaped (side groove-shaped) contact attachment portion 32 is provided so as to project on the first main surface side (hereinafter, referred to as a front side). Has been done. The groove length of the contact mounting portion 32 is set to be equal to the entire length of the socket body 31, and the groove width thereof is larger than the thickness of the module substrate 15 by the amount to which the contact is mounted. The height of the side wall of the contact mounting portion 32 opposite to the socket main body 31 is substantially equal to the height of the terminal 18 of the memory module 10, and the memory I mounted on the front side.
The height is set so as not to interfere with the lower end surface of the resin sealing body 13 of C11.

The terminal 18 is placed in the groove of the contact mounting portion 32.
The same number of contacts 33 electrically connected to the terminal 18 are arranged and fixed in a line with a pitch equal to the groove length direction (hereinafter, left and right direction). The contact 33 is integrally bent and formed using a conductive material having a spring property such as phosphor bronze, and has a terminal contact portion 34 that comes into contact with the terminal 18 and a pin portion that comes into contact with an external terminal such as a computer or a tester. And 35. Terminal contact part 3
4 is formed in a substantially lyre frame shape when viewed from the side, and when the terminal 18 is pushed in from the upper end opening, the terminal 18 is sandwiched by elastic forces from the three sides of the front, back and bottom, It is designed to maintain contact with 18. The pin portion 35 is provided so as to protrude vertically downward from the terminal contact portion 34, and is fixed to the contact mounting portion 32 in a state of penetrating the bottom wall of the contact mounting portion 32 and protruding downward.

At the left end of the bottom of the groove of the contact mounting portion 32, an index convex portion 36 formed in the shape of a right-angled isosceles triangular prism is horizontally provided with its slope facing inward. The left end portion of the contact mounting portion 32 on which the index convex portion 36 is arranged is the end portion of the socket 30 on the side where the so-called first pin is located. Further, the size of the index convex portion 36 is set to a maximum size within a range where it does not interfere with the closest contact 33 and corresponds to the index chamfered portion 20 formed in the memory module 10. .

Further, a pair of vertical pressing claws 37 and horizontal pressing claws 38 are arranged at both left and right ends on the upper end side opposite to the contact mounting portion 32 of the socket body 31, and project forward. There is. Each of the vertical pressing claw 37 and the horizontal pressing claw 38 is formed in a prismatic shape having a rectangular cross section, and is erected so as to form a right angle with the first main surface (front surface) of the socket body 31. The inner side surface of the vertical pressing claw 37, that is, the lower surface, is formed as an inclined surface that approaches (falls down) the contact mounting portion 32 as it moves away from the first main surface (goes forward), and the memory module 10 is mounted in the socket 30. Module substrate body 1 in the assembled state
The front side edge of the upper end side of 6 is pressed by being engaged from above and from the front. The inner side surface of the horizontal pressing claw 38 is formed as an inclined surface which approaches the front side lateral pressing claw away from the first main surface (goes forward), and the memory module 10 is mounted in the socket 30. In this state, the front side edge of the lateral end side of the module board body 16 is pressed laterally and from the front side.

Next, a mounting operation of the memory module 10 having the above-described structure in the socket 30 will be described. This description clarifies the structure of the connection structure of the memory module and the socket, which is an embodiment of the present invention.

When the memory module 10 and the socket 30 are connected, the lower end side of the memory module 10 in which the terminals 18 are arranged is in the groove of the contact mounting portion 32 of the socket 30, and the index chamfered portion 20 is the index convex portion 36. It is arranged and inserted so as to be engaged. At the time of this insertion, the memory module board 15 is slightly tilted upward to avoid interference with the pair of vertical pressing claws 37 and horizontal pressing claws 38 of the socket 30 at the upper end side, and the upper side is rearward after the insertion. Then, the left and right corners of the upper end of the memory module substrate body 16 are pushed into the left and right vertical pressing claws 37 and the horizontal pressing claws 38.

When the module board 15 is placed on the socket body 31, the index chamfered portions 20 of the module board 15 are engaged with the index protrusions 36 of the socket body 31, and a pair of vertical pressing claws 37 are provided. The lateral pressing claws 38 press the outer peripheral edge of the module board body 16, and the contacts 33 of the socket 30 are pressed against the terminals 18 of the module board 15. In this state, due to the elastic force of the elastic deformation of the vertical pressing claw 37 and the horizontal pressing claw 38 and the elastic force of the contact 33, the outer peripheral edge of the module substrate body 16 causes the vertical pressing claw 37 and the horizontal pressing claw 38 to move. Since it is pressed against the inclined surface of the module substrate 15, the module substrate 15 is held in the socket 30 with an elastic force.

Since the index chamfered portion 20 and the index convex portion 36 are meshed with each other in the state where the module substrate 15 is held in the socket 30 in this way, each terminal 18 is brought into contact with the contact 33 which is designated in advance. The parts are respectively sandwiched by the parts 34 and are in an electrically connected state. Therefore, the memory IC 11 mounted on the memory module 10 can be electrically taken out to the outside through the outer lead 14, the land 17, the electric wiring 19, the terminal 18 and the contact 33, and the connection structure 40 of the memory module and the socket can be obtained. .

Incidentally, when the electrical characteristic inspection is performed on the memory module 10, the pin portion 35 of each contact 33 of the socket 30 has a testing board (not shown) of an electrical characteristic inspection device (tester). No)) will be connected. Further, when the memory module 10 is installed in a computer as an external storage device, each contact 3 of the socket 30 is used.
The pin portion 35 of No. 3 is connected to a printed wiring board of a computer, an expansion memory board or the like (not shown).

In use in which the electrical characteristic inspection is performed, the memory module 10 which is the inspection object is used.
Are to be sequentially replaced with respect to the tester for each inspection object. Memory module 10 as the inspection object
At the time of replacement, the memory module 10 is removed from the socket 30 while the socket 30 is still connected to the testing board. in this case,
While slightly pushing down the module substrate 15 against the elastic force of the contacts 33, the upper side is pulled toward you to release the engagement with the left and right vertical pressing claws 37 and the horizontal pressing claws 38, so that the memory module 10 Can be easily removed from the socket 30.

Further, when the memory module 10 is mounted as an external storage device of a computer, the memory module 10 is not frequently replaced. However, in the case of replacement, the memory module 10 can be removed from the socket 30 by the same operation as in the case where the electrical characteristic inspection is performed. In addition, the memory module 10 and the socket 3
0 and 0 may be removed together from the printed wiring board or the expansion memory board of the computer.

According to the above embodiment, the following effects can be obtained. (1) By forming only the index chamfered portion that indicates the direction on the outer peripheral portion of the memory module substrate in a predetermined corner portion, it is possible to omit the opening of the positioning hole in the memory module substrate. The mounting area of the IC can be increased by at least the area of the positioning holes, and the positioning holes need not be avoided, so that the degree of freedom of the electrical wiring density and the layout of the electrical wiring can be increased.

(2) The socket to which the memory module is connected is provided with a main body having a size substantially equal to that of the memory module board, and an index convex portion that meshes with the index chamfered portion of the memory module is formed on one end side of the main body. By forming a pressing claw that presses the outer peripheral edge of the memory module board on the opposite side of the main body, the memory module and the socket are positioned and held by pressing the outer peripheral edge of the pressing claw, and the index chamfer and the convex portion. Each memory I mounted on the memory module can be secured by meshing with the memory module.
C can be properly electrically connected to the socket contact group through the terminal group of the memory module substrate.

(3) Further, the positioning and holding of the memory module and the socket can be easily released by releasing the pressing of the outer peripheral edge of the substrate by the pressing claw, so that the memory module can be easily removed from the socket.

(4) By the above (2) and (3),
The memory module can be electrically connected to the electrical characteristic inspection device, computer, etc. through the socket, and the memory module can be removed from the electrical characteristic inspection device, computer, etc., ensuring the replacement of the memory module. can do.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the index chamfer is not limited to the C chamfer, but may be the R chamfer.

The semiconductor device mounted on the module substrate is not limited to a memory IC, but may be another IC such as a logic (logical device) IC, an active element (device) such as a transistor array, or a passive element such as a capacitor or an inductor. May be.

The semiconductor device is not limited to being mounted on both the first main surface and the second main surface of the substrate, but may be mounted on only one main surface. In addition, the number of semiconductor devices mounted on the board,
The form, size, number of outer leads, etc. of the package are
It can be appropriately selected according to the required conditions.

In the above description, the case where the invention made by the present inventor is mainly applied to the connection technology of the memory module and the socket which is the background field of application has been described, but the invention is not limited thereto and the same. The present invention can be applied to general hybrid integrated circuit devices such as modules in which a plurality of semiconductor devices of the same type or a plurality of semiconductor devices of different types are mounted on the substrate, sockets thereof, and connection techniques thereof.

[0042]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By forming only the index chamfer indicating the direction on the outer peripheral portion of the quadrilateral board on which a plurality of semiconductor devices are mounted over the entire main surface, it is possible to omit the formation of the positioning hole in the board. Therefore, the mounting area of the semiconductor device on the substrate can be increased and the degree of freedom of the electric wiring density and the layout of the electric wiring can be increased.

The socket is provided with a main body having a size substantially equal to that of the substrate. An index convex portion that engages with an index chamfered portion of the substrate is formed on one end side of the main body, and a substrate is provided on the opposite end side of the main body. By forming the pressing claw that presses the outer peripheral edge of the board, the positioning and holding of the board and the socket can be secured by pressing the outer peripheral edge of the board by the pressing claw and engaging the index chamfered part and the convex part. Each of the semiconductor devices thus formed can be properly electrically connected to the contact group of the socket through the terminal group of the substrate.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a connection structure of a memory module and a socket which is an embodiment of the present invention.

FIG. 2 shows a memory module according to an embodiment of the present invention, (a) is a front view, (b) is a bottom view, and (c).
Is an enlarged side view and (d) is an enlarged side sectional view.

FIG. 3 shows a socket which is an embodiment of the present invention, (a) is a front view, (b) is a plan view, and (c) is an enlarged side view.

FIG. 4 shows an assembled state of a connection structure of a memory module and a socket, which is an embodiment of the present invention, (a)
Is a front view, (b) is a plan view, and (c) is an enlarged side sectional view.

[Explanation of symbols]

10 ... Memory module (hybrid integrated circuit device), 11
... Memory IC (semiconductor device), 12 ... SOP, 13 ...
Resin sealing body, 14 ... Outer leads, 15 ... Substrate, 16 ...
Substrate body, 17 ... Land, 18 ... Terminal, 19 ... Electrical wiring, 20 ... Index chamfer, 30 ... Socket, 3
DESCRIPTION OF SYMBOLS 1 ... Socket main body, 32 ... Contact mounting part, 33 ... Contact, 34 ... Terminal contact part, 35 ... Pin part, 36 ... Index convex part, 37 ... Vertical pressing claw, 38 ... Horizontal pressing claw, 40 ... Memory module And socket connection structure.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Michiaki Sugiyama 5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Hitate Cho-LS Engineering Co., Ltd.

Claims (3)

[Claims] 1. A plurality of semiconductor devices are mounted on a main surface of a quadrilateral substrate, and each semiconductor device is electrically connected to a plurality of terminals arranged on one side of the substrate. In the hybrid integrated circuit device, the semiconductor device group is mounted over the entire main surface of the substrate, and only the index chamfer indicating the direction is provided on the outer peripheral portion of the substrate at one corner of the terminal group arrangement end side. And a hybrid integrated circuit device. 2. A socket to which the hybrid integrated circuit device according to claim 1 is connected, comprising a quadrilateral body having a size substantially equal to a main surface of a semiconductor device mounting surface of the substrate, A plurality of contacts electrically connected to the terminals are arranged on one end side of the main body, and each contact is configured to press against each terminal. One side of the contact group of the main body has an index protrusion. The portion is formed in a shape that meshes with the index chamfered portion, and a pressing claw is formed on an edge of the main body opposite to the contact group arrangement edge so as to press the outer peripheral edge of the substrate. A socket characterized by that. 3. A connection structure of the hybrid integrated circuit device according to claim 1 and the socket according to claim 2, wherein a substrate of the hybrid integrated circuit device is superposed on a body of the socket. , The index chamfer is meshed with the index protrusion, the pressing claw presses the outer peripheral edge of the board, and each contact of the socket is pressed against each terminal of the board to electrically A connection structure for a hybrid integrated circuit device and a socket, wherein the connection structure is connected to a socket.