JPH08130144A - Manufacturing for chip-type inductor - Google Patents

Manufacturing for chip-type inductor

Info

Publication number
JPH08130144A
JPH08130144A JP26736894A JP26736894A JPH08130144A JP H08130144 A JPH08130144 A JP H08130144A JP 26736894 A JP26736894 A JP 26736894A JP 26736894 A JP26736894 A JP 26736894A JP H08130144 A JPH08130144 A JP H08130144A
Authority
JP
Japan
Prior art keywords
kneading
winding core
manufacturing
chip
conductive wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26736894A
Other languages
Japanese (ja)
Other versions
JP2992869B2 (en
Inventor
Nobuo Mamada
信雄 儘田
Hirotoshi Tanaka
博敏 田中
Makoto Saito
誠 斉藤
Nobuhiro Umeyama
信浩 梅山
Kenichiro Nogi
謙一郎 野木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP6267368A priority Critical patent/JP2992869B2/en
Publication of JPH08130144A publication Critical patent/JPH08130144A/en
Application granted granted Critical
Publication of JP2992869B2 publication Critical patent/JP2992869B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE: To provide a manufacturing method for a chip-type inductor with uniform frequency characteristics in impedance in mass production without a decrease in impedance according to the stress, by preventing stress to a magnetic body when compression is caused in a baking step. CONSTITUTION: In a manufacturing method, a kneaded material 8 made of magnetic raw powder and binder is fed under pressure to an extrusion molding machine 5, in which a linear conductor is covered with an outer coating of kneaded material 8 to mold a bar-shaped body 9. After that the bar-shaped body 9 is baked to form a chip-type inductor. In these steps, the linear conductor is coated with an organic material before the molding step, in which the outer coating body around the linear conductor is formed from the kneaded material 8, and the organic coating material is removed at a baking step.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば、信号線より発
生する高調波や電磁波障害ノイズを除去するために利用
される、焼成した磁性コアを用いたチップ形インダクタ
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type inductor using a fired magnetic core, which is used for removing harmonics and electromagnetic interference noise generated from signal lines.

【0002】[0002]

【従来の技術】従来、高調波ノイズの除去に用いるため
に、成形金型内に予め導線例えば白金線を挿通させた
後、結合材とフェライト粉末を混練させた混練材を供給
し、該金型の口金部から導線の入った成形体を押し出
し、これを焼成して、図4に示すように直線状の導線1
を内蔵したインダクタ本体2を作成し、その両端に外部
電極3、3を形成して成るインダクタが知られている。
2. Description of the Related Art Conventionally, in order to remove harmonic noise, a conductive wire such as a platinum wire is previously inserted into a molding die, and then a kneading material obtained by kneading a binder and ferrite powder is supplied to the molding die. A molded body containing a conductive wire is extruded from the die of the mold, and the molded body is fired to form a linear conductive wire 1 as shown in FIG.
An inductor is known in which an inductor main body 2 having a built-in capacitor is created and external electrodes 3 are formed at both ends thereof.

【0003】[0003]

【発明が解決しようとする課題】上記のインダクタは、
混練材が硬化する際の収縮により、磁性コアに応力がか
かり、インピーダンス値が応力に応じて低下し、量産時
において、インピーダンス値の周波数特性がばらつくと
いう不具合があった。
DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
There is a problem that stress is applied to the magnetic core due to contraction when the kneading material is hardened, the impedance value is reduced according to the stress, and the frequency characteristic of the impedance value varies during mass production.

【0004】本発明は、線状及びコイル状の導線を内蔵
するチップ形インダクタにおいて、上記のような不具合
を解消することをその目的とするものである。
It is an object of the present invention to eliminate the above-mentioned problems in a chip-type inductor containing a wire conductor and a coil conductor.

【0005】[0005]

【課題を解決するための手段】上記の目的を達成するた
めに、請求項1記載の発明は、直線状導線を包囲して磁
性体原料粉末と結合材を混練した混練材により外被体を
形成した後焼成して成るチップ状インダクタの製造方法
において、該直線状導線を包囲して混練材により外被体
を形成する前に、該直線状導線の外周に有機物を被覆
し、焼成の際、有機物の消失させることを特徴とする。
請求項2記載の発明は、磁性体原料粉末と結合材を混練
した混練材により巻芯を形成し、該巻芯に外周を有機物
で被覆した導線をコイル状に巻回した後、導線を巻回し
た該巻芯を包囲して前記混練材により外被体を形成し、
次いで焼成して成り、焼成の際、前記有機物を消失させ
ることを特徴とする。請求項2記載の発明において、有
機物は、摩擦係数の高い材料であることが好ましい。請
求項4記載の発明は、磁性体原料粉末と結合材を混練し
た混練材により巻芯を形成し、該巻芯に有機物を塗布し
た後、導線をコイル状に巻回し、該導線を巻回した巻芯
を包囲して前記混練材により外被体を形成し、次いで焼
成して成り、焼成の際、前記有機物を消失させることを
特徴とする。請求項5記載の発明は、磁性体原料粉末と
結合材を混練した混練材により巻芯を形成し、該巻芯に
導線をコイル状に巻回した後、該導線及び巻芯に有機物
を塗布し、該導線を巻回した巻芯を包囲して前記混練材
により外被体を形成し、次いで焼成して成り、焼成の
際、前記有機物を消失させることを特徴とする。請求項
1、2、3、4又は5記載の発明において、導線は、束
線であることが好ましい。
In order to achieve the above-mentioned object, the invention according to claim 1 forms a jacket with a kneading material which surrounds a linear conductor wire and kneads a magnetic material powder and a binder. In the method for manufacturing a chip-shaped inductor formed and fired, an organic material is coated on the outer periphery of the linear conductor before surrounding the linear conductor and forming a jacket with a kneading material. , Characterized by eliminating organic matter.
According to a second aspect of the present invention, a winding core is formed from a kneading material obtained by kneading a magnetic material powder and a binder, and a conducting wire having an outer periphery coated with an organic substance is wound around the winding core in a coil shape, and then the conducting wire is wound. An envelope is formed of the kneading material surrounding the turned core.
It is characterized in that it is formed by firing, and the organic substance disappears during firing. In the invention according to claim 2, it is preferable that the organic material is a material having a high friction coefficient. According to a fourth aspect of the present invention, a winding core is formed from a kneading material obtained by kneading a magnetic material powder and a binder, an organic material is applied to the winding core, and then the conductive wire is wound into a coil shape, and the conductive wire is wound. It is characterized in that the wound core is surrounded to form an outer cover by the kneading material and then fired, and the organic matter disappears during firing. According to a fifth aspect of the present invention, a winding core is formed from a kneading material obtained by kneading a magnetic material raw material powder and a binder, a conductive wire is wound around the winding core in a coil shape, and then an organic substance is applied to the conductive wire and the winding core. It is characterized in that it surrounds a winding core around which the conductor wire is wound to form an outer cover from the kneading material and then fires it, and the organic matter disappears during firing. In the invention according to claim 1, 2, 3, 4 or 5, it is preferable that the conducting wire is a bundled wire.

【0006】[0006]

【作用】請求項1記載の発明において、前記外被体は焼
成すると収縮するが、外被体と導線との間に介在する有
機物は消失し、空隙ができるので、この空隙により外被
体の収縮分が吸収され、外被体に導線による応力が加わ
らない。。請求項2、4又は5記載の発明において、導
線の外周を被覆する有機物、巻芯に塗布した有機物又は
コイル状に巻回された導線及び巻芯に塗布した有機物
は、焼成の際に消失し、そこに空隙ができるので、焼成
により外被体が収縮してもその収縮分は空隙で吸収さ
れ、外被体には収縮による応力が加わらない。請求項
1、2、3、4又は5記載の発明において、導線は、束
線であると、同じ断面積の一本の導線よりも撓みやすい
ので、外被体の焼成による収縮が、導線の変形を介して
有機物の消失による空隙で有効に吸収される。請求項2
記載の発明において、導線の外周を被覆する有機物が摩
擦係数の高い材料であると、外被体を形成するとき、巻
芯に巻回した導線の巻きくずれを防止することができ
る。
In the invention according to claim 1, the outer cover shrinks when fired, but organic substances present between the outer cover and the conductive wire disappear and a void is formed. The shrinkage is absorbed, and no stress is applied to the outer body by the conductive wire. . In the invention according to claim 2, 4 or 5, the organic substance coating the outer periphery of the conductor wire, the organic substance applied to the core, or the conductor wire wound in a coil shape and the organic substance applied to the core disappears during firing. Since voids are formed there, the shrinkage is absorbed by the voids even if the sheath is shrunk by firing, and stress due to shrinkage is not applied to the sheath. In the invention described in claim 1, 2, 3, 4 or 5, if the conductor wire is a bundle wire, the conductor wire is more easily bent than a single conductor wire having the same cross-sectional area. It is effectively absorbed in the voids due to the disappearance of organic matter through the deformation. Claim 2
In the invention described above, when the organic material coating the outer circumference of the conductive wire is a material having a high friction coefficient, it is possible to prevent the winding of the conductive wire wound around the winding core when forming the jacket.

【0007】[0007]

【実施例】以下、本発明の実施例を図面を参照して説明
する。図1は、図4に示すチップ形インダクタの製造方
法の説明図である。先ず、例えばゴム、プラスチックか
ら成る有機物を被覆した導線4を押出し成形機5の透孔
6に挿通し、磁性体原料粉末Bと結合材Sを混練機7で
均等に混練した混練材8を押出し成形機5に加圧送入す
ると、その金型口金から導線4を包囲する混練材8から
成る外被体が形成されて棒体9が送出される。この棒体
9を焼成炉の大きさ又は、下に敷くセッタの形状に合わ
せて切断して、600〜1000℃、例えば900℃で
焼成し、個々のインダクタの寸法に合わせてカッタで切
断する。切断された個々のインダクタ本体2は、バレル
粉と水とでバレル研磨して、角部にアールを付ける。次
いで、銀ペーストをインダクタ本体2の両端面およびそ
れに連なる外周面端部に塗布し焼き付けて外部電極3、
3を形成する。これにより、導線1の端末10、10と
外部電極3とが接続される。外部電極3の銀層には、ニ
ッケル・メッキと半田メッキとが施される。前記焼成に
より、前記有機物は消失し、空隙が形成されるので、外
被体が収縮してもその収縮分は空隙で吸収され、外被体
にはその収縮による応力が加わらず、インピーダンスは
低下しない。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram of a method of manufacturing the chip inductor shown in FIG. First, the conductor 4 coated with an organic material such as rubber or plastic is inserted into the through hole 6 of the extrusion molding machine 5, and the kneading material 8 in which the magnetic material powder B and the binder S are evenly kneaded by the kneading machine 7 is extruded. When pressure-fed into the molding machine 5, an outer jacket body made of the kneading material 8 surrounding the conductor wire 4 is formed from the die die, and the rod body 9 is fed. The rod 9 is cut according to the size of the firing furnace or the shape of the setter to be laid under it, fired at 600 to 1000 ° C., for example 900 ° C., and cut with a cutter according to the size of each inductor. The individual inductor bodies 2 thus cut are barrel-polished with barrel powder and water to have rounded corners. Next, the silver paste is applied to both end faces of the inductor body 2 and the end portions of the outer peripheral surface continuing to the inductor body 2 and baked to form the external electrodes 3,
3 is formed. As a result, the terminals 10 and 10 of the lead wire 1 and the external electrode 3 are connected. The silver layer of the external electrode 3 is nickel plated and solder plated. Since the organic substance disappears and a void is formed by the firing, even if the envelope shrinks, the shrinkage is absorbed by the void, the stress due to the shrinkage is not applied to the envelope, and the impedance decreases. do not do.

【0008】図2は、図3に示すチップ形インダクタの
製造方法の説明図である。図3のチップ形インダクタ
は、コイル状導線1aを内蔵するインダクタ本体2の両
端に外部電極3、3が形成されたものである。その製造
方法を説明すると、磁性体原料粉末Bと結合材Sを混練
機7で均等に混練した混練材8を押出し成形機5aに加
圧送入すると、その金型の口金部から混練材から成る巻
芯である棒体11が送出され、この棒体11に有機物を
被覆した導線4を巻線機12によりコイル状に巻回す
る。この導線4を巻回した棒体11を、混練材8が加圧
送入される押出し成形機5bに挿入し移動させると、導
線4を巻回した棒体11を包囲して混練材から成る外被
体が形成される。これを焼成炉の大きさ又は、下に敷く
セッタの形状に合わせて切断して、600〜1000
℃、例えば900℃で焼成し、個々のインダクタの寸法
に合わせてカッタで切断する。切断された個々のインダ
クタ本体2は、前述と同様に、バレル粉と水とでバレル
研磨して、角部にアールを付ける。次いで、銀ペースト
をインダクタ本体2の両端面およびそれに連なる外周面
端部に塗布し焼き付けて外部電極3、3を形成する。前
記有機物に例えば、ゴムのように摩擦係数の高い材料を
用いると、棒体11に巻回した導線4は、外被体を形成
したとき、巻き崩れを防止することができ、多量生産の
際、インピーダンス値がばらつかない。
FIG. 2 is an explanatory view of a method for manufacturing the chip inductor shown in FIG. The chip inductor of FIG. 3 is one in which external electrodes 3 are formed at both ends of an inductor body 2 having a coil-shaped conductor 1a built therein. The manufacturing method will be described. When the kneading material 8 obtained by uniformly kneading the magnetic material powder B and the binder S by the kneading machine 7 is pressure fed into the extrusion molding machine 5a, the kneading material is formed from the die part of the die. A rod 11 which is a winding core is delivered, and a conductor 4 coated with an organic substance is wound around the rod 11 by a winding machine 12 in a coil shape. When the rod 11 around which the conducting wire 4 is wound is inserted into an extrusion molding machine 5b into which the kneading material 8 is fed under pressure and moved, the rod 11 around which the conducting wire 4 is wound is surrounded by the kneading material. A body is formed. This is cut according to the size of the firing furnace or the shape of the setter to be laid below, and 600 to 1000 is cut.
Baking at a temperature of 900 ° C., for example, and cutting with a cutter according to the size of each inductor. The individual inductor bodies 2 thus cut are barrel-polished with barrel powder and water in the same manner as described above, so that the corner portions are rounded. Next, the silver paste is applied to both end faces of the inductor body 2 and the end portions of the outer peripheral surface continuing to the same, and baked to form the external electrodes 3 and 3. When a material having a high friction coefficient such as rubber is used as the organic material, the conductor wire 4 wound around the rod body 11 can prevent the collapse of the winding when the outer cover is formed, and in mass production. , The impedance value does not vary.

【0009】図2において、有機物を被覆した導線4を
用いる代わりに、押出し成形機5aの金型の口金部から
送出された棒体11に有機物を塗布し(図示せず)、そ
の後導線1を巻線機12により巻回して、押出し成形機
5bに挿入し移動させてもよく、又、押出し成形機5a
の金型の口金部から送出された棒体11に導線1を巻線
機12により巻回し、その後導線1及び棒体11に、図
示しないが有機物を塗布して、押出し成形機5bに挿入
し移動させてもよい。このいずれでも、前記実施例と同
様の効果がえられる。上記実施例において、導線1に束
線を用いると、同じ断面積の1本の導線1を用いた場合
よりも撓みやすいので、焼成の際に導線1と棒体11と
の間にあった有機物の消失による空隙に導線の撓みを介
して外被体の収縮分がより有効に吸収される。
In FIG. 2, instead of using the conductor 4 coated with an organic substance, an organic substance is applied to the rod body 11 (not shown) delivered from the die of the die of the extrusion molding machine 5a (not shown), and then the conductor 1 is attached. It may be wound by the winding machine 12 and inserted into the extrusion molding machine 5b and moved, or the extrusion molding machine 5a.
The conductor 1 is wound around the rod 11 delivered from the die part of the die by the winding machine 12, and then the conductor 1 and the rod 11 are coated with an organic substance (not shown) and inserted into the extrusion molding machine 5b. You may move it. In any case, the same effect as that of the above embodiment can be obtained. In the above-mentioned embodiment, when a bundled wire is used for the conductive wire 1, it is easier to bend than when a single conductive wire 1 having the same cross-sectional area is used. Therefore, the organic matter disappeared between the conductive wire 1 and the rod 11 during firing. The contraction of the outer cover is more effectively absorbed in the void due to the bending of the conductive wire.

【0010】[0010]

【発明の効果】本発明は、上述の構成によれば、磁性体
の焼成の際の収縮によって該磁性体に応力が加わらない
から、応力に応じてインピーダンス値が低下することが
なく、多量生産の際に、インピーダンスの周波数特性に
ばらつきを生じないという効果を有する。
EFFECTS OF THE INVENTION According to the present invention, since the stress is not applied to the magnetic material due to the shrinkage during the firing of the magnetic material, the impedance value does not decrease according to the stress, and the mass production is achieved. In this case, there is an effect that the frequency characteristic of impedance does not vary.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るチップ形インダクタの製造方法の
説明図。
FIG. 1 is an explanatory view of a method for manufacturing a chip inductor according to the present invention.

【図2】本発明に係る他のチップ形インダクタの製造方
法の説明図。
FIG. 2 is an explanatory view of another method for manufacturing a chip inductor according to the present invention.

【図3】上記他のチップ形インダクタの斜視図。FIG. 3 is a perspective view of another chip-type inductor described above.

【図4】従来のチップ形インダクタの1例の斜視図。FIG. 4 is a perspective view of an example of a conventional chip inductor.

【符号の説明】[Explanation of symbols]

1 導線 1a
コイル状導線 2 インダクタ本体 3
外部電極 4 有機物を有する導線 5、5a,5b 押出し成形機 8
混練材 9 外被体である棒体 11 巻芯である棒体
1 conductor 1a
Coiled conductor 2 Inductor body 3
External electrode 4 Conductive wire having organic matter 5, 5a, 5b Extrusion molding machine 8
Kneading material 9 Rod which is a jacket 11 Rod which is a winding core

───────────────────────────────────────────────────── フロントページの続き (72)発明者 梅山 信浩 東京都台東区上野6丁目16番20号 太陽誘 電株式会社内 (72)発明者 野木 謙一郎 東京都台東区上野6丁目16番20号 太陽誘 電株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuhiro Umeyama 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Electric Co., Ltd. (72) Inventor Kenichiro Nogi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Company

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 直線状導線を包囲して磁性体原料粉末と
結合材を混練した混練材により外被体を形成した後焼成
して成るチップ状インダクタの製造方法において、該直
線状導線を包囲して混練材により外被体を形成する前
に、該直線状導線の外周に有機物を被覆し、焼成の際、
有機物の消失させることを特徴とするチップ形インダク
タの製造方法。
1. A method for manufacturing a chip-shaped inductor, comprising enclosing a linear conductor and forming an outer cover with a kneading material obtained by kneading a magnetic material powder and a binder, followed by firing, and enclosing the linear conductor. Then, before forming an outer cover with a kneading material, the outer periphery of the linear conductor is coated with an organic substance, and at the time of firing,
A method for manufacturing a chip-type inductor, characterized in that organic substances disappear.
【請求項2】 磁性体原料粉末と結合材を混練した混練
材により巻芯を形成し、該巻芯に外周を有機物で被覆し
た導線をコイル状に巻回した後、導線を巻回した該巻芯
を包囲して前記混練材により外被体を形成し、次いで焼
成して成り、焼成の際、前記有機物を消失させることを
特徴とするチップ形インダクタの製造方法。
2. A winding core is formed from a kneading material obtained by kneading a magnetic material powder and a binder, and a conductive wire whose outer periphery is coated with an organic material is wound around the winding core in a coil shape, and then the conductive wire is wound. A method for manufacturing a chip-type inductor, comprising surrounding a winding core to form an outer cover with the kneading material, and then firing, wherein the organic substance disappears during firing.
【請求項3】 前記有機物は、摩擦係数の高い材料であ
ることを特徴とする請求項2記載のチップ形インダクタ
の製造方法。
3. The method for manufacturing a chip inductor according to claim 2, wherein the organic substance is a material having a high friction coefficient.
【請求項4】 磁性体原料粉末と結合材を混練した混練
材により巻芯を形成し、該巻芯に有機物を塗布した後、
導線をコイル状に巻回し、該導線を巻回した巻芯を包囲
して前記混練材により外被体を形成し、次いで焼成して
成り、焼成の際、前記有機物を消失させることを特徴と
するチップ形インダクタの製造方法。
4. A winding core is formed from a kneading material obtained by kneading a magnetic material raw material powder and a binder, and an organic substance is applied to the winding core.
It is characterized in that the conductive wire is wound in a coil shape, the winding core around which the conductive wire is wound is surrounded to form an outer cover body by the kneading material, and then firing is performed, and the organic matter disappears during firing. Chip inductor manufacturing method.
【請求項5】 磁性体原料粉末と結合材を混練した混練
材により巻芯を形成し、該巻芯に導線をコイル状に巻回
した後、該導線及び巻芯に有機物を塗布し、該導線を巻
回した巻芯を包囲して前記混練材により外被体を形成
し、次いで焼成して成り、焼成の際、前記有機物を消失
させることを特徴とするチップ形インダクタの製造方
法。
5. A winding core is formed from a kneading material obtained by kneading a magnetic material raw material powder and a binder, a conductive wire is wound around the winding core in a coil shape, and an organic substance is applied to the conductive wire and the winding core. A method for manufacturing a chip-type inductor, comprising surrounding a winding core around which a conductive wire is formed to form an outer cover from the kneading material, and then firing, wherein the organic matter disappears during firing.
【請求項6】 前記導線は束線であることを特徴とする
請求項1、2、3、4又は5記載のチップ形インダクタ
の製造方法。
6. The method of manufacturing a chip inductor according to claim 1, wherein the conductive wire is a bundled wire.
JP6267368A 1994-10-31 1994-10-31 Manufacturing method of chip type inductor Expired - Fee Related JP2992869B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6267368A JP2992869B2 (en) 1994-10-31 1994-10-31 Manufacturing method of chip type inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6267368A JP2992869B2 (en) 1994-10-31 1994-10-31 Manufacturing method of chip type inductor

Publications (2)

Publication Number Publication Date
JPH08130144A true JPH08130144A (en) 1996-05-21
JP2992869B2 JP2992869B2 (en) 1999-12-20

Family

ID=17443866

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135328A (en) * 1997-08-25 1999-05-21 Murata Mfg Co Ltd Inductor and manufacture thereof
JP2010030299A (en) * 2008-07-03 2010-02-12 Ngk Insulators Ltd Ceramic structure and its manufacturing method
US9613742B2 (en) 2013-02-13 2017-04-04 Murata Manufacturing Co., Ltd. Electronic component
JP2021176166A (en) * 2020-05-01 2021-11-04 株式会社村田製作所 Inductor component and inductor structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135328A (en) * 1997-08-25 1999-05-21 Murata Mfg Co Ltd Inductor and manufacture thereof
JP2010030299A (en) * 2008-07-03 2010-02-12 Ngk Insulators Ltd Ceramic structure and its manufacturing method
US9613742B2 (en) 2013-02-13 2017-04-04 Murata Manufacturing Co., Ltd. Electronic component
JP2021176166A (en) * 2020-05-01 2021-11-04 株式会社村田製作所 Inductor component and inductor structure

Also Published As

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JP2992869B2 (en) 1999-12-20

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