JPH08125119A - Semiconductor device - Google Patents

Abstract

PURPOSE: To shorten the dimension of the laminate of a flat semiconductor element and a heat dissipation fin in the breadthwise direction by a structure wherein a wiring board mounting electric protective components, e.g. resistors or capacitors, being connected in parallel with each semiconductor element is disposed coaxially with the laminate. CONSTITUTION: A laminate 4 comprising flat semiconductor elements 2 and heat dissipation fins 3 arranged alternately is provided coaxially, at the opposite ends thereof, with wiring boards 9 where a conductor layer is formed on one side of an insulator plate. The wiring boards 9 are pressed together with the flat semiconductor elements 2 and the heat dissipation fins 3 to come into contact therewith. Conductor layers 10a-10e are formed in a predetermined pattern on one side of the wiring board 9 and connected with electric protective components, e.g. capacitors C or resistors R. The wiring boards 9 are also connected with terminals P, N and U, V, W. The laminate 4 is clamped by means of stands 5, 5 through an insulation spacer 6 and secured by means of stud bolts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a plurality of flat semiconductor elements are pressure-contacted to each other on a concentric shaft, and in particular, considering the arrangement of electrical protection parts such as resistors and capacitors, The present invention relates to a miniaturized semiconductor device.

[0002]

2. Description of the Related Art A schematic structure of a conventional semiconductor device of this type will be described with reference to a plan view of FIG. 5 and a circuit diagram of FIG. In FIG. 5, the semiconductor device 1 has a structure in which a plurality of (six in the figure) flat semiconductor elements 2 are pressure-contacted on a concentric axis. In this example, a thyristor is used as the flat semiconductor element 2.

The semiconductor element 2 and the block-shaped heat radiation fins 3 are alternately arranged in the axial direction to form a laminated body 4. Stands 5 are arranged at both ends of the laminated body 4 via insulating spacers 6, stud bolts 7, 7 are inserted between the stands 5, 5, and the pressure aligning mechanism (not shown) is used to form the stand 5. A pressing force is applied to the flat semiconductor element 2 in the laminated body 4.

The circuit configuration of the semiconductor device 1 forms a three-phase bridge circuit using thyristors TH1 to TH6 as shown in FIG. In the figure, K1 to K6 are cathode electrodes, G1 to G6 are gate electrodes, and CS and RS are surge voltage absorbing protection components connected in parallel to the thyristors TH1 to TH6. U, V and W are AC input terminals, and P and N are DC output terminals.

The thyristors TH1 to TH6 are arranged as flat semiconductor elements 2 as shown in FIG. 5, and an electrical protection component 8 is provided to these semiconductor elements 2 as a semiconductor device 1.
Are arranged on both sides in the width direction W.

[0008]

In the above conventional semiconductor device 1, since the electrical protection component 8 for the flat semiconductor element 2 is arranged so as to project in the width direction of the semiconductor device 1, the size of the device is increased. However, there is a problem to be solved that it cannot fully meet the demand for the reduction of the occupied space.

[0009]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor device which can sufficiently contribute to miniaturization.

[0010]

A semiconductor device according to the present invention is a semiconductor device in which a laminated body in which a plurality of flat semiconductor elements and heat radiation fins are alternately arranged on a concentric axis is pressure-contacted, A wiring board having electrical protection components such as resistors and capacitors connected in parallel with the respective semiconductor elements is arranged on the axis concentric with the body.

[0011]

A semiconductor device according to the present invention is a wiring board on which electrical protection components such as resistors and capacitors connected in parallel to the respective semiconductor elements are mounted on a concentric axis with a laminated body of flat semiconductor elements and heat radiation fins. Since the arrangement is provided, the widthwise dimension of the laminate can be reduced, and the overall size of the device can be reduced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic view of a semiconductor device according to the first embodiment of the present invention. In the figure, a wiring board 9 in which a conductor layer is formed on one surface of a plate made of an insulator is provided at both ends of a laminated body 4 in which flat semiconductor elements 2 and heat radiation fins 3 are alternately arranged. 4 is inserted on a concentric axis with the flat semiconductor element 2 and the heat radiation fin 3 and is in pressure contact. Details of the wiring board 9 are shown in FIGS. In these figures, on one surface of the wiring board 9,
Conductor layers 10a, 10b, 10c having a predetermined pattern shape,
10e is formed. These conductor layers 10a-10
A plurality of sets of electrical protection components 8 such as resistors R and capacitors C, three sets in the figure, are connected in parallel so as to straddle between e. One terminal of the plurality of electrical protection components 8 is commonly connected to the conductor layer 10a, and the other terminal is individually connected to the independent conductor layers 10b, 10c, 10e.

The common conductor layer 10a is one polarity common part of the flat semiconductor element 2. That is, in FIG. 1, the wiring boards 9 are arranged on both sides in close contact with the radiation fins 3 from which the terminals P and N are drawn out, and the terminals U, V, W are drawn out to the conductor layer 10a of the wiring board 9 on the right side in the drawing. A connection indicated by a chain double-dashed line is applied from the radiation fin 3. In addition, an independent conductor layer 10 of the wiring board 9 at the left end in the figure
The connections indicated by the two-dot chain lines are also applied to b, 10c, and 10d, respectively, as shown in the figure. FIG. 2 shows the second aspect of the present invention.
2 is a semiconductor device showing the embodiment of FIG. In this example, the laminated body 4
In two rows, and the wiring board 9 is arranged only on one end of the laminated body 4. These laminated bodies 4 are structured to be fixed between the stands 5 and 5 via insulating spacers 6 by stud bolts (not shown). Since the other structure is similar to that of the conventional semiconductor device shown in FIG. 5, its detailed description is omitted.

[0014]

As described above, according to the present invention, electrical protection components such as resistors and capacitors connected in parallel to each semiconductor element are mounted on the concentric axis of the laminated body of the flat semiconductor element and the heat radiation fin. Since the wiring board is arranged, the widthwise dimension of the laminated body can be reduced, and the size of the entire device can be reduced, which is an excellent effect.

[Brief description of drawings]

FIG. 1 is a schematic view of a semiconductor device showing a first embodiment of the present invention.

FIG. 2 is a schematic view of a semiconductor device showing a second embodiment of the present invention.

FIG. 3 is a plan view of a wiring board used for the semiconductor device.

FIG. 4 is a side view of the wiring board.

FIG. 5 is a plan view of a conventional semiconductor device.

FIG. 6 is a circuit diagram of the semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Flat semiconductor element 3 Radiating fin 4 Laminated body 5 Stand 6 Insulation spacer 7 Stud bolt 8 Electrical protection component 9 Wiring board 10a, 10b, 10c, 10d Conductor layer

Claims (2)

[Claims] 1. A semiconductor device in which a laminated body, in which a plurality of flat semiconductor elements and heat radiation fins are alternately arranged on a concentric axis, is contacted under pressure, wherein each laminated semiconductor element is concentric with the laminated body. A semiconductor device having a wiring board on which electrical protection components such as resistors and capacitors connected in parallel are mounted. 2. A plurality of sets of the protection component are mounted on the wiring board, and one terminal of the plurality of sets is connected on a common conductor layer, and the other terminal is on a separate conductor layer. And a common conductor layer of the wiring board is connected to a common part of one polarity of the flat semiconductor element, and the other independent conductor layer is connected to the other polarity of the flat semiconductor element. The semiconductor device according to claim 1.