JPH08123928A - Optical card with ic - Google Patents

Abstract

PURPOSE: To hide the rear of an IC module to prevent it from being unsightly at the time of viewing it from the optical recording face side by fixing the IC module with an adhesive colored with an arbitrary color. CONSTITUTION: An adhesive 3 with which an IC module 2 is adhered and fixed is seen on the front side of the IC module 2 (namely, the rear side). The position of the IC module 2 is not limited, and it can be provided in any position unless overlapping an optical recording part 1. The position of the optical recording part 1 is not limited, and it can be provided in any position unless overlapping the IC module. In this case, the height of the IC module 2 is higher than the thickness of a card base material 4 and is fitted to a recessed part 6, which is formed from the side of the card base material 4 in an area other than the optical recording part 1, and is adhered and fixed. The bottom of the recessed part 6 is in a protective layer 5, and the rear side of the IC module 2 is hided by the adhesive 3 provided on all of the rear of the IC module 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical card with an IC in which an IC module is embedded.

[0002]

2. Description of the Related Art Conventionally, there is known an optical card with an IC, which has an optical recording section and an IC recording section in one card. This card is configured by embedding an IC module in which electrical elements including an IC chip and a wiring circuit are integrated into a known optical card, and records information that does not need to be changed in recording content with high density. The advantage of both of them is well utilized such that the information is recorded in the IC recording section and the information whose recording content needs to be changed is recorded in the IC recording section (for example, see JP-A-61-103287).

[0003]

By the way, in the optical card with an IC as described above, in order to simplify the device for reading or writing the optical recording section and the IC recording section, the IC module has an optical recording surface. There is a background that it is preferable to arrange it so that it can be accessed from the opposite side. However, due to the nature of the optical recording unit that records with light,
The protective layer provided to protect the optical recording portion on the card base material must be transparent, and therefore when an IC module thicker than the thickness of the opaque card base material is embedded in the optical card, the side opposite the optical recording surface. That is, when the IC module is embedded from the back side of the card base material, the protective layer on the optical recording surface is transparent, so that the back side of the IC module is unsightly seen from the optical recording surface and the commercial value of the card is reduced.
Therefore, in the conventional optical card with an IC, the IC module is currently provided on the same side as the optical recording surface.

The present invention has been made in view of the above circumstances. An object of the present invention is to embed an IC module thicker than the thickness of a card substrate on the side opposite to the optical recording surface. It is to provide an optical card with an IC that is visually inferior.

[0005]

In order to achieve the above object, an optical card with an IC according to the present invention is provided with an optical recording section on the back side of a transparent protective layer, and a card substrate is covered with the optical recording section. It is laminated with the transparent protective layer, and is formed in a concave portion formed on the back side of the card base material in a region other than the optical recording portion.
An optical card with an IC in which a C module is embedded is characterized in that the IC module is fixed with an adhesive colored in an arbitrary color.

[0006]

In the optical card with an IC having the above structure, the IC module is arranged on the surface opposite to the optical recording surface, and the back surface of the IC module is opaque when viewed from the optical recording surface side. Although it is in a state of protruding from the transparent protective layer to the transparent protective layer, it serves to prevent the adhesive for bonding and fixing the IC module from covering the back side of the IC module and exposing it.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of an optical card with an IC as one embodiment of the present invention viewed from the front side, FIG. 2 is a plan view viewed from the back side, and FIG. 3 is an enlarged view of the XY section of FIG. FIG.

In FIGS. 1 and 2, reference numeral 1 is an optical recording section which can be seen from the front side of the card, and 2 is an IC module which is seen from the back side of the card. The adhesive 3 that adheres and fixes the IC module 2 is visible. The position of the IC module 2 is not limited to the position shown in FIGS. 1 and 2, and may be provided at any position as long as it does not overlap the optical recording unit 1. Further, the position of the optical recording unit 1 is not limited to the position shown in FIG. 1, and may be provided at any position as long as it does not overlap with the position of the IC module 2.

In this optical card, as shown in FIG. 3, a card base material 14 is laminated on the surface of an optical recording material layer 12 formed on one side of a light transmissive base material 11 with an adhesive layer 13 interposed therebetween.
The transparent protective layer 15 and the surface hardened layer 16 are laminated on the opposite side of the substrate 11. That is, the part of the optical recording material layer 12 corresponds to the optical recording part 1 in FIG. As the card base material 14, a three-layer structure in which an oversheet 14a, a core sheet 14b, and an oversheet 14c are laminated is used.
Print layers 17a and 17b are provided between a and the core sheet 14b and between the oversheet 14c and the core sheet 14b, respectively.
Is provided.

An optical card having such a layer structure is manufactured by the following steps (for example, see Japanese Patent Laid-Open No. 5-20511).

First, a roughened original plate having a low reflectance portion roughened according to an information recording pattern is prepared. Specifically, after forming the photoresist layer on the transparent substrate in the first step, in the second step, the photomask formed according to the information recording pattern is superposed on the photoresist layer by using a mask aligning device. Then, the first exposure (patterning exposure) with ultraviolet rays is performed. Subsequently, in the third step, exposure is performed again (roughening exposure) using a glass plate whose one surface is roughened into fine irregularities. After the exposure, as a fourth step, when the photoresist layer is developed, the photoresist exposed to the ultraviolet light flows away and the photoresist not exposed remains, and the pattern of the photomask is transferred onto the transparent substrate. . As a result, a photoresist layer having a roughened surface is formed as a guide track with a width of about 2.5 μm and a pitch of about 12 μm.

Next, an optical recording medium on which an information recording pattern of a low reflectance portion having a roughened surface is formed is used as a roughened original plate, and a mother mask is reproduced from the roughened original plate by a molding press. To do. Specifically, the roughened original plate prepared above is laminated on a transparent substrate through a molding agent made of a molding resin of an ionizing radiation curable resin or a thermosetting resin, and pressed by a press machine. After irradiating with ultraviolet rays in the performed state, the roughened original plate and the transparent substrate are released from each other, and the pattern is duplicated on the transparent substrate side to form a mother mask.

On the other hand, a surface hardened layer 16 is formed on a transparent base material which will be the transparent protective layer 15 of the optical card. Here, as the base material to be the transparent protective layer 15, polycarbonate (P
C) and other polymethylmethacrylate (PMM)
A), acrylonitrile-styrene copolymer (AS resin), cellulose propionate (CP), cellulose acetate butyrate (CAB), polyvinyl chloride (P)
VC), polyester, etc. can be used.

Then, using the mother mask as a replication master plate for mass replication, the optical recording medium is replicated on the back surface side of the base material to be the transparent protective layer 15 by molding. Specifically, sandwich the replication resin between the back side of the base material and the pattern surface of the mother mask, irradiate ultraviolet rays in a state of pressing with a press machine, and then release the base material and the mother mask to release the base material. Duplicate the pattern on the side. In this way, the low reflectance portion is formed on the surface of the duplicating resin, and the duplicating resin becomes the light-transmissive base material 11 in the optical card.

Subsequently, the optical recording material layer 12 is laminated on a part of the base material 11 so as to cover the low reflectance portion of the light transmissive base material 11 made of the replication resin.

In addition to the above series of steps, the card substrate 14
Is created. The card substrate 14 is the core sheet 1
4b, the printing layer 17a is provided on the optical recording material layer 12 side, and the printing layer 17b is provided on the opposite side, and then the oversheet layer 14a is pasted on the printing layer 17a and the oversheet layer 14c is pasted on the printing layer 17b. To form. Core sheet 14
As b, substances such as opalescent vinyl chloride, polycarbonate, cellulose acetate butyrate (CAB), and cellulose acetate propionate (CAP) can be used, and the thickness may be about 180 to 220 μm. Oversheets 14a and 14c are printed layers 17a and 17 respectively.
Since the card base material 14 has a three-layer structure by protecting the core sheet b and providing the oversheets 14a and 14c on both sides of the core sheet 14b, warpage does not occur during hot pressing. These oversheets 14a and 14c are
It is made of a material such as transparent vinyl chloride, transparent CAB or transparent CAP.

Further, the printing layer 17a on the optical recording material layer side on the core sheet 14b and the printing layer 17b on the opposite side are
Characters and patterns can be printed as usual.

The substrate 1 provided with the optical recording material layer 12
The card base material 14 is laminated on top of the adhesive layer 13 via the adhesive layer 13. In this case, the adhesive layer 13 is the card substrate 14
Since it is in direct contact with the over sheet 14a of the above, it is firmly adhered. An optical card is produced by punching the original fabric produced as described above into a card shape.

Next, the step of embedding the IC module will be described. Here, the IC module 2 is a known one in which electrical elements including an IC chip and a wiring circuit are integrated, and is embedded in a card base material 14 of an optical card. An electrode for connecting the IC module 2 to the external power supply is provided on the back surface of the optical card. To embed the IC module 2 in the card base material 14, a recess suitable for embedding the IC module 2 in the card base material 14 is cut out, the adhesive 3 is applied to the recessed portion, and then the IC module 2 is fitted. It is enough to stick both together. In addition, this IC module 2
The structure and the concrete embedding method in the card base material 14 are conventionally known. The thickness of a card created in this way is generally equal to the thickness of a credit card, etc. 0.68
~ 0.84 mm.

The IC module 2 is placed in the recess of the card substrate 14.
The adhesive 3 for adhering and fixing the IC is located between the IC module 2 and the transparent protective layer 15 in a sectional view,
If the module 2 is to be concealed, the adhesive 3 may be colored. As the adhesive 3, any type of urethane type, epoxy type, acrylic type, vinyl type, etc. can be used,
The method may be any of UV curing type, hot melt type and room temperature curing type. For coloring, pigments, dyes and metallic additives are used. In the case of a pigment system, the hiding power and the adhesive power are selected by adjusting the P / V ratio.
Specifically, in the case of white, the adhesive may be mixed with titanium white or the like.

Hereinafter, the IC according to the present invention will be described with reference to FIGS.
A specific example of the attached optical card will be described. Note that these drawings show a vertical cross section that passes through the optical recording unit and the IC module, and the adhesive layer 13 and the card base material 14 in FIG. 3 are denoted by reference numeral 4 (hereinafter referred to as a card base material), and in FIG. The light-transmissive base material 11, the transparent protective layer 15, and the surface hardened layer 16 are indicated by reference numeral 5 (hereinafter referred to as a protective layer).

The IC module 2 used in the embodiment of FIG. 4 is higher than the thickness of the card base material 4,
In a region other than the optical recording portion 1, the concave portion 6 formed from the card substrate 4 side is fitted and fixed by adhesion. And
The bottom surface of the recess 6 is in the protective layer 5, and the IC module 2
The back surface side of the IC module 2 is hidden by the adhesive 3 provided on the entire back surface of the IC module 2. Card base 4
When a white one was used as the adhesive 3, the hiding power could be increased by using "Bondmaster 70-7310" (manufactured by Kanebo) containing 30% of titanium white as the adhesive 3.

In the embodiment shown in FIG. 5, the IC module 2 is projected from the back side of the card and the edge portion 2a is formed.
Is embedded in a state of being covered with a part of the card base material 4 to hide the edge portion 2a.

In the embodiment shown in FIG. 6, the edge portion 2
Using the thin IC module 2 of a, this edge part 2
By embedding a in the card base material 4 and providing the adhesive 3 on the entire back side of the IC module 2, the hiding power of the edge portion 2a is improved when viewed from the front side. Moreover, the IC module 2 is prevented from protruding from the back side.

It should be noted that a combination of printing on the back surface of the IC module to be embedded, printing on the visible portion of the IC module on the surface of the protective layer, enclosing other concealing material in the recess, printing in the recess to embed the IC module, etc. By doing so, it is possible to further improve the concealed state of the IC module. Only one of these means may be used in combination, or a large number of means may be used in combination.

[0026]

As described above, according to the present invention, the optical recording portion is provided on the back side of the transparent protective layer, and the card substrate is laminated with the transparent protective layer so as to cover the optical recording portion. In an optical card with an IC in which an IC module is embedded in a recess formed on the back side of the card base material in an area other than the optical recording section, the IC module is configured to be fixed with an adhesive colored in an arbitrary color. Therefore, although the IC module thicker than the thickness of the card substrate is embedded on the side opposite to the optical recording surface, the back surface of the IC module is hidden when viewed from the optical recording surface side, so that it is not unsightly.

[Brief description of drawings]

FIG. 1 is a plan view of an optical card with an IC as seen from the surface.

FIG. 2 is a plan view of the same seen from the back side.

3 is a partial cross-sectional view showing an enlarged XY cross section of FIG. 1. FIG.

FIG. 4 is a cross-sectional view of an optical card with an IC as an embodiment of the present invention.

FIG. 5 is a sectional view showing another embodiment of an optical card with an IC.

FIG. 6 is a sectional view showing another embodiment of the optical card with an IC.

[Explanation of symbols]

 1 Optical Recording Section 2 IC Module 3 Adhesive 4 Card Base Material 5 Protective Layer 6 Recess

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location G06K 19/08

Claims (1)

[Claims] 1. An optical recording section is provided on the back side of the transparent protective layer, and a card substrate is laminated with the transparent protective layer so as to cover the optical recording section, and the card base is provided in an area other than the optical recording section. An optical card with an IC, wherein an IC module is embedded in a recess formed on the back side of the material, wherein the IC module is fixed with an adhesive colored in an arbitrary color.