JPH08120467A - Production of fine parts and apparatus therefor - Google Patents

Abstract

PURPOSE: To provide a method and apparatus for producing fine parts capable of producing these fine parts in large quantities at a low cost. CONSTITUTION: This apparatus is composed of a fine parts forming means 1 which executes sputter vapor deposition of a tungsten, i.e., a material to be worked, on an oxidized film of SiO2 , etc., formed on a semiconductor wafer, then etches this tungsten to a desired shape, thereby forming the fine parts on the oxidized film, a liquid tank 3 in which a soln. 2 for dissolving the oxidized film is housed, a draining means 5 which drains the soln. 2 in this liquid tank 3 via a drain pipe 4 connected to the liquid tank 3, a filter 6 which is installed at this drain pipe 4 and has many small holes and a vibrating means 7 which vibrates the filter 6 during the filtration of the soln. 2. After the fine parts are desorbed from the semiconductor wafer in the soln. 2, the soln. 2 is discharged and is passed through the filter 6, by which the fine parts in the soln. 2 are recovered on the filter 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine part manufacturing technique, and more particularly to a fine part manufacturing method and apparatus utilizing etching or lithography in semiconductor manufacturing.

[0002]

2. Description of the Related Art The techniques described below are for studying the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

Fine parts, eg scanning tunneling microscope
(Scanning Tunneling Microscope) and near-field microscope (Near
The probe (tungsten, 0.1 mm diameter) used in the Field Microscope is FIB (Focused Ion).
Beam).

Further, the manufacturing method of the aperture (opening of the lens diaphragm) used in the near-field microscope is carried out by vapor-depositing aluminum on quartz glass having a sharp tip and scraping off the aluminum only at the tip. ing.

Regarding the probe and the aperture,
For example, it is described in “Optical Alliance” by Sumio Hosaka (Author), January 1991, pp. 25-27.

Further, with respect to parts of medical products such as artificial hearts, which are an example of minute parts, the parts are often processed by hand (a lathe or the like is operated with an accuracy of 1/100 mm). ).

Here, as a method of manufacturing a fine component, for example, as shown in Japanese Patent Application Laid-Open No. 4-4128, a sheet member made of synthetic resin is processed by lathe or punching to produce an unshrinkable component. After that, it is known to manufacture small and delicate fine parts by heat-shrinking and molding.

[0008]

However, in the above-mentioned technique, since the probe and the aperture are microfabricated one by one and manufactured, the manufacturing time is too long and the cost is high.

Further, there is a limit to miniaturization in the aperture, and it is an extremely large technical problem to manufacture a small aperture especially in a near-field microscope.

Further, in a manufacturing method in which a sheet member made of a synthetic resin is subjected to heat shrinkage after being machined, a lathe, a punching machine or the like is used, and it is presumed that there is a limit to miniaturization.

Further, there is a problem that parts manufactured by hand, such as minute parts used for medical products, cannot be manufactured in large quantities at low cost.

[0012] Therefore, an object of the present invention is to provide a method and apparatus for manufacturing fine parts which can be manufactured in large quantities at low cost.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0014]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, in the method of manufacturing a fine component according to the present invention, after forming a work material on a thin film formed on a substrate, the work material is etched to form the fine component on the thin film. Then, the substrate on which the fine component is formed is immersed in a solution that dissolves the thin film to dissolve the thin film to separate the substrate and the fine component, and then the solution is passed through a filtering material. The fine parts are collected on the filter material.

The method for producing the fine parts is to inject a surfactant into the solution and to vibrate the filter material when the solution is filtered.

Further, in the apparatus for manufacturing a micro component according to the present invention, after forming a work material on a thin film formed on a substrate, the work material is etched to form the micro component on the thin film. Fine part forming means, a liquid tank containing a solution for dissolving the thin film, a drain means for discharging the solution in the liquid tank through a drain pipe connected to the liquid tank, and a drain pipe installed And a filter medium having a large number of small holes.

Further, in the small holes of the filter medium, the diameter of the inner surface into which the solution is injected is larger than that of the opposite outer surface.

The manufacturing apparatus is provided with a vibrating means for vibrating the filter material when filtering the solution.

The solution contained in the liquid tank contains a surfactant.

[0021]

According to the above-mentioned means, a fine part forming means for forming a fine part on a thin film formed on a substrate, a liquid tank containing a solution for dissolving the thin film, and a liquid tank connected to the liquid tank. By having the filter material installed in the drainage pipe and having a large number of small holes, the fine parts formed on the substrate can be separated from the substrate in the solution and further taken out by the filter material.

With this, it is not necessary to take out the minute parts one by one from the substrate, so that the minute parts can be mass-produced and the cost of the minute parts can be reduced.

Furthermore, since it is not necessary to take out the fine parts one by one from the substrate, it is possible to manufacture the fine parts with reduced mechanical damage such as scratches, deformation or damage on the appearance.

Further, by taking out the fine parts by the filter material, even the fine parts having mechanically weak points can be taken out without being deformed.

In the small holes of the filter medium, the diameter of the inner surface into which the solution is poured is larger than the diameter of the opposite outer surface, so that the fine parts in the small holes can be taken out easily. can do.

Further, a vibrating means for vibrating the filter medium when the solution is filtered is installed, and by vibrating the filter medium during the filtration, it is possible to introduce fine parts into the small holes of the filter medium.

Further, by injecting the surfactant into the solution, it is possible to prevent the detached fine parts from reattaching to the substrate.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a structural conceptual view showing an embodiment of the structure of a fine part manufacturing apparatus according to the present invention, and FIG. 2 is an embodiment of a structure of a filter medium installed in the fine part manufacturing apparatus of the present invention. 3A to 3F are sectional views showing, in order of steps, an example of a method for manufacturing a probe which is an embodiment of the fine component according to the present invention.

In the semiconductor manufacturing technology, the method and apparatus for manufacturing fine parts described in this embodiment are the etching process for etching the material to be processed, the lithography process for developing the resist, and the ashing process for removing the resist. And so on.

First, the structure of the apparatus for manufacturing fine parts according to the present embodiment will be described. On a thin film formed on a semiconductor wafer 11 which is a substrate, for example, an oxide film 12 such as SiO ₂ , a work material (here, tungsten) is formed. 13 will be described below), and then the tungsten film 13 is etched (etched) into a desired shape to form an oxide film 12.
Inside the liquid tank 3 through the fine component forming means 1 for forming the fine component 14 thereon, the liquid tank 3 containing the solution 2 for dissolving the oxide film 12, and the drain pipe 4 connected to the liquid tank 3. It is composed of a drainage means 5 for draining the solution 2 and a filter 6 which is a filter medium installed in the drainage pipe 4 and having a large number of small holes 6a.

Here, the filter 6 is in the form of a mesh made of, for example, a fluorine resin,
In the small hole 6a installed in the filter 6, the inside diameter 6c of the inner surface 6b into which the solution 2 is injected is the opposite outer surface 6b.
It is formed larger than the diameter 6e of d.

Further, the manufacturing apparatus is provided with a vibrating means 7 for vibrating the filter 6 when filtering the solution 2.

Further, the drain pipe 4 is provided with a valve 17 for adjusting the flow rate when the solution 2 is discharged.

The drainage means 5 discharges the solution 2 in the liquid tank 3 by using pressure or pressure reduction. For example, in the case of pressurization, the solution 2 is kept in a closed state of the liquid tank 3. The solution 2 is discharged to the outside of the liquid tank 3 by sending N ₂ gas or the like to the liquid surface of.

In the case of depressurization, a vacuum pump or the like is used as an example of the drainage means 5 to remove the solution 2 in the liquid tank 3 from the liquid tank 3.
To the outside.

Further, a surfactant 8 is injected into the solution 2 in order to prevent the detached fine parts 14 from reattaching to the semiconductor wafer 11.

Next, a method of manufacturing the fine parts of this embodiment will be described.

In this embodiment, a probe used in a scanning tunneling microscope will be taken up as an example of the fine component 14 to be manufactured, and its manufacturing method will be described.

First, as shown in FIG. 3A, a thin oxide film 12 (SiO ₂ film) is formed on a semiconductor wafer 11, and tungsten 13 is sputter-deposited on the entire surface thereof. Further, as shown in FIG.
The positive resist 15 is developed on top.

After that, HCl: H ₂ O ₂ = 5: 1, or H ₂ SO ₄ : H
By placing the semiconductor wafer 11 in an etching solution such as ₂ O = 5: 1, tungsten 1 is added as shown in FIG.
Etch 3. At this time, since the etching solution is less likely to flow under the positive resist 15, the tungsten 13 is etched into a shape in which a part thereof is left.

Further, using a gas such as NF ₃ or C ₂ F ₆ , the tungsten 13 is etched as shown in FIG. 3D.

After that, the positive resist 15 is once removed by ashing, and the positive resist 16 is developed again as shown in FIG.

Further, again using a gas such as NF ₃ or C ₂ F _6, as shown in FIG.
Are etched, and then the positive resist 16 is removed by ashing.

As a result, the probe, which is the fine component 14, can be formed on the oxide film 12 of the semiconductor wafer 11.

The height of the processed probe is 10 μm.
Although it is of a degree, it can be formed even if the lateral width is about several hundreds of μm.

After that, the semiconductor wafer 11 on which the probe is formed is put into a solution 2 (see FIG. 1) in which HF and NH ₄ F are mixed, and the oxide film 12 (SiO ₂ film) below the tungsten 13 is placed.
Is dissolved, and the probe is detached from the semiconductor wafer 11 in the solution 2.

Here, since the probe is made of tungsten 13, the solution 2 containing HF and NH ₄ F is mixed.
It hardly dissolves against. As a result, the probe can be detached from the semiconductor wafer 11.

After that, as shown in FIGS. 1 and 2, the valve 17 installed in the drainage pipe 4 is opened, and the solution 2 is discharged using the drainage means 5 such as a vacuum pump. At this time, the solution 2 flowing through the drain pipe 4 is filtered by the filter 6, and further, the filter 6 is vibrated by the vibrating means 7 during the filtration so that the probe, which is the fine component 14, is moved to the filter 6.
The small hole 6a.

As a result, the processed fine parts 14 are collected on the filter 6.

Next, according to the method and apparatus for manufacturing a fine component of this embodiment, the following effects can be obtained.

That is, the fine part forming means 1 for forming the fine parts 14 on the oxide film 12 formed on the semiconductor wafer 11 which is the substrate, and the liquid tank 3 containing the solution 2 for dissolving the oxide film 12. , The filter 6, which is a filter medium installed in the drainage pipe 4 connected to the liquid tank 3 and having a large number of small holes 6a, allows the fine parts 14 formed on the semiconductor wafer 11 to be in solution 2. It can be separated from the semiconductor wafer 11 and then taken out by the filter 6.

As a result, it is not necessary to take out the fine components 14 one by one from the semiconductor wafer 11, so that the fine components 14 can be manufactured in large quantities and the fine components 1 can be manufactured.
The price of 4 can be reduced.

Further, since it is not necessary to take out the fine components 14 one by one from the semiconductor wafer 11, it is possible to manufacture the fine components 14 with reduced mechanical damage such as scratches, deformation or damage on the appearance. As a result, the yield of the fine components 14 can be improved.

Further, by taking out the micro component 14 by the filter 6, even the micro component 14 having a mechanically weak portion can be taken out without being deformed. As a result, the yield of the fine parts 14 can be improved as described above.

In the small hole 6a of the filter 6, the inner diameter 6c of the inner surface 6b into which the solution 2 is injected is formed larger than the outer diameter 6e of the opposite outer surface 6d. It is possible to make it easier to take out the contained micro component 14.

Further, a vibrating means 7 for vibrating the filter 6 when filtering the solution 2 is installed, and the filter 6 is vibrated during the filtration.
By vibrating, the fine component 14 can be guided into the small hole 6a of the filter 6. As a result, fine parts 1
4 can be taken out easily.

Furthermore, by injecting the surfactant 8 into the solution 2, it is possible to prevent the detached fine component 14 from being reattached to the semiconductor wafer 11. As a result, the collection efficiency of the micro component 14 can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above-mentioned embodiment, the method of manufacturing a probe used in a scanning tunneling microscope or the like has been described. However, even if it is a dice type or convex fine powder having a simpler shape than the probe, It can be manufactured by the same method as in the above-mentioned embodiment.

Further, when the fine parts are made of an organic material such as photoresist, the same method as in the above embodiment can be used.

That is, a thin SiO ₂ film is formed on a semiconductor wafer (substrate), and a positive resist is developed on the SiO ₂ film to have a desired shape.
Dissolve the SiO ₂ film. After that, the positive resist processed in the solution is separated from the semiconductor wafer, and the solution is filtered by a filter (filter material), whereby the positive resist can be collected on the filter.

Also, when the fine parts are manufactured by joining dissimilar metals, they can be manufactured by the same method as in the above embodiment.

That is, a thin SiO ₂ film is formed on a semiconductor wafer (substrate), a metal such as tungsten (hereinafter referred to as metal A) is formed in a desired shape, and then another material such as aluminum is formed. Metal (hereinafter, referred to as metal B) is sputter-deposited on the entire surface of the semiconductor wafer. Then, a positive resist is developed in a position corresponding to the metal A (immediately above the metal A) in the same shape as the metal A (thickness may be different).

Further, after etching the metal B (only the metal B formed on the metal A remains, and the metal B formed in other places is removed), the positive resist is removed by ashing. It is possible to form a processed fine component by joining two metals. afterwards,
By separating the fine parts from the semiconductor wafer in the solution and filtering the solution with a filter (filter material), the fine parts can be collected on the filter.

[0066]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). Fine component forming means for forming fine components on a thin film formed on a substrate, a liquid tank containing a solution for dissolving the thin film, and a large number of small holes installed in a drain pipe connected to the liquid tank By including the filtering material having the above, it is possible to separate the fine component formed on the substrate from the substrate in the solution, and further to take it out by the filtering material. As a result, it is not necessary to take out the fine components one by one from the substrate, so that the fine components can be mass-produced and the price of the fine components can be reduced.

(2). Since it is not necessary to take out the minute parts one by one from the substrate, it is possible to manufacture minute parts with reduced mechanical damage such as scratches, deformation, or damage on the appearance. As a result, the yield of fine parts can be improved. Furthermore, even dice-type or convex-type fine powder can be produced.

(3). By taking out the fine parts with the filter material, even the fine parts having mechanically weak points can be taken out without being deformed. As a result, the yield of fine parts can be improved as described above.

(4). In the small holes of the filter medium, the diameter of the inner surface into which the solution is injected is formed to be larger than the diameter of the opposite outer surface, so that it is possible to easily take out the fine component that has entered the small holes.

(5). A vibrating means for vibrating the filter medium when the solution is filtered is installed, and by vibrating the filter medium during filtration, it is possible to guide the fine parts into the small holes of the filter medium. As a result, it is possible to easily take out the fine component.

(6). By injecting the surfactant into the solution, it is possible to prevent the detached fine parts from reattaching to the substrate. As a result, the collection efficiency of fine parts can be improved.

(7). By using the method for manufacturing a fine component according to the present invention, the fine component can be made of an organic material such as photoresist.

(8). By using the method for producing a fine component according to the present invention, the fine component can be produced by joining dissimilar metals.

[Brief description of drawings]

FIG. 1 is a structural conceptual view showing an embodiment of the structure of a manufacturing apparatus for fine parts according to the present invention.

FIG. 2 is a partially enlarged cross-sectional view showing an embodiment of the structure of the filter medium installed in the apparatus for manufacturing fine parts of the present invention.

3 (a) to 3 (f) are cross-sectional views showing, in the order of steps, an example of a method for manufacturing a probe which is an embodiment of the fine component according to the present invention.

[Explanation of symbols]

 1 Fine Part Forming Means 2 Solution 3 Liquid Tank 4 Drain Pipe 5 Drainage Means 6 Filter (Filtration Material) 6a Small Hole 6b Inner Surface 6c Diameter 6d Outer Surface 6e Diameter 7 Vibration Means 8 Surfactant 11 Semiconductor Wafer (Substrate) 12 Oxide Film ( Thin film) 13 Tungsten (workpiece) 14 Fine parts 15 Positive resist 16 Positive resist 17 Valve

Claims (7)

[Claims] 1. A substrate on which a fine component is formed by forming a workpiece on a thin film formed on a substrate and then etching the workpiece to form a fine component on the thin film. By immersing the thin film in a solution that dissolves the thin film to separate the substrate and the fine parts from each other, and then the solution is passed through a filter medium to collect the fine parts on the filter medium. A method for manufacturing a fine component, comprising: 2. The method for producing a fine component according to claim 1, wherein a surfactant is injected into the solution. 3. The method for producing a micro component according to claim 1, wherein the filter material is vibrated when the solution is filtered. 4. A fine part forming means for forming a fine part on the thin film by forming a work on the thin film formed on a substrate and then etching the work, and the thin film. A liquid tank containing a solution to be dissolved, a drainage means for discharging the solution in the liquid tank via a drain pipe connected to the liquid tank, and a large number of small holes installed in the drain pipe are provided. An apparatus for manufacturing fine parts, comprising: 5. The microparts manufacturing apparatus according to claim 4, wherein in the small holes of the filter medium, the diameter of the inner surface into which the solution is injected is larger than the diameter of the opposite outer surface. An apparatus for manufacturing fine parts, which is characterized in that 6. The microparts manufacturing apparatus according to claim 4 or 5, further comprising a vibrating means for vibrating the filtering material when the solution is filtered. apparatus. 7. The apparatus for producing fine parts according to claim 4, 5 or 6, wherein the solution is a solution in which a surfactant is injected.