JPH08115939A - Structure of wire clamp mechanism in wire bonder - Google Patents
Structure of wire clamp mechanism in wire bonderInfo
- Publication number
- JPH08115939A JPH08115939A JP6250582A JP25058294A JPH08115939A JP H08115939 A JPH08115939 A JP H08115939A JP 6250582 A JP6250582 A JP 6250582A JP 25058294 A JP25058294 A JP 25058294A JP H08115939 A JPH08115939 A JP H08115939A
- Authority
- JP
- Japan
- Prior art keywords
- clamper
- wire
- clamper body
- clamp mechanism
- leaf spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、トランジスター又はＩ
Ｃの製造に際してワイヤボンディングを行うためのワイ
ヤボンディング装置において、ワイヤの切断等に際して
ワイヤをクランプするためのワイヤクランプ機構の構造
に関するものである。The present invention relates to a transistor or I
The present invention relates to the structure of a wire clamp mechanism for clamping a wire when cutting the wire in a wire bonding apparatus for performing wire bonding when manufacturing C.
【０００２】[0002]
【従来の技術】一般に、ワイヤボンディング装置による
ワイヤボンディングは、従来から良く知られているよう
に、ボンディングツールの一つであるところのキャピラ
リツールに挿通したワイヤの下端にボール部を形成し、
このボール部を前記キャピラリツールの下降動にて第１
ボンディング箇所に接合し、次いで、前記キャピラリツ
ールが第２ボンディング箇所に移動してワイヤの途中を
第２ボンディング箇所に接合し、そして、ワイヤをクラ
ンプ装置でクランプした状態で、前記キャピラリツール
をクランプ装置の一緒に上昇動することでワイヤを切断
すると言う方法で行われる。2. Description of the Related Art Generally, in wire bonding by a wire bonding apparatus, a ball portion is formed at the lower end of a wire inserted into a capillary tool, which is one of bonding tools, as well known in the art.
This ball part is first moved by the downward movement of the capillary tool.
Then, the capillary tool is moved to the second bonding point, the middle of the wire is bonded to the second bonding point, and then the capillary tool is clamped by the clamp device. It is done by the method of cutting the wire by moving up together.
【０００３】この場合、従来のワイヤボンディング装置
においては、そのワイヤクランプ機構を、左右一対のク
ランパー体から成る鋏型にして、その一方のクランパー
体を、前記キャピラリツールが取付くホーンに対する支
持部材に取付ける一方、他方のクランパー体を、前記一
方のクランパー体に対してボールベアリングを介して回
動自在に枢着し、この他方のクランパー体を、両クラン
パー体の他端に設けた電磁石等にて、開閉回動するよう
に構成している。In this case, in the conventional wire bonding apparatus, the wire clamp mechanism is made into a scissor type consisting of a pair of left and right clampers, and one of the clampers is used as a supporting member for the horn to which the capillary tool is attached. On the other hand, while the other clamper body is mounted, the other clamper body is rotatably pivoted to the one clamper body through a ball bearing, and the other clamper body is attached to the other end of both clamper bodies by an electromagnet or the like. , Is configured to open and close.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来における
ワイヤクランプ機構では、前記したように、一対のクラ
ンパー体のうち一方のクランパー体を固定し、この一方
のクランパー体に対して他方のクランパー体を、ボール
ベアリングにて回動自在に枢着し、この他方のクランパ
ー体を開閉回動するように構成しているが、前記他方の
クランパー体の回動角度は、１ｄｅｇ以下と言うよう
に、きわめて小さいことにより、前記ボールベアリング
における各ボールは、略同じ箇所で極く僅かに転動する
のみの状態になって、潤滑油切れが発生し易いから、他
方のクランパー体の開閉に作動不良が多発するばかり
か、磨耗が大きくて耐久性が低いと言う問題があった。However, in the conventional wire clamp mechanism, as described above, one clamper body of the pair of clamper bodies is fixed, and the other clamper body is fixed to the other clamper body. , The other clamper body is rotatably and pivotally mounted by a ball bearing, and the other clamper body is opened and closed. The rotation angle of the other clamper body is extremely small, as described below. Due to the small size, each ball in the ball bearing is in a state of rolling very slightly at substantially the same place, and running out of lubricating oil is likely to occur, so that malfunction of the other clamper frequently occurs. Not only that, but there was a problem that the wear was great and the durability was low.
【０００５】また、ボールベアリングには微小なガタ付
きが存在することのために、他方のクランパー体の開閉
に作動不良が発生する場合があるばかりか、ボールベア
リングを使用するので、枢着部が大型化し、且つ、重量
が増大することが問題であった。本発明は、これら問題
を解消したワイヤクランプ機構を提供することを技術的
課題とするものである。Further, since the ball bearing has a slight backlash, there may be a case where the other clamper body opens and closes improperly. Moreover, since the ball bearing is used, the pivoting portion is There has been a problem that the size is increased and the weight is increased. The present invention aims to provide a wire clamp mechanism that solves these problems.
【０００６】[0006]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、「ワイヤボンディング装置におけるボ
ンディングツール付きホーン体に対する支持部材等に取
付けた一方のクランパー体と、この一方のクランパー体
に対して開閉回動自在に枢着した他方のクランパー体
と、この他方のクランパー体を開閉回動するための作動
機構とを備えて成るワイヤクランプ機構において、前記
他方のクランパー体の一方のクランパー体に対する枢着
部に薄い板ばね体を配設し、この板ばね体の両端部を前
記両クランパー体に対して、他方のクランパー体が当該
板ばね体の屈曲によって開閉回動するように固着す
る。」と言う構成にした。In order to achieve this technical object, the present invention provides a "one clamper body attached to a support member or the like for a horn body with a bonding tool in a wire bonding apparatus, and the other clamper body. A wire clamp mechanism comprising another clamper body pivotally attached to the other clamper so as to be freely opened and closed, and an operating mechanism for opening and closing the other clamper body, wherein one clamper body of the other clamper body is provided. A thin leaf spring body is arranged at a pivotally attached portion to the both ends, and both end portions of the leaf spring body are fixed to the both clamper bodies so that the other clamper body is opened and closed by bending of the leaf spring body. "."
【０００７】[0007]
【発明の作用・効果】このように構成することにより、
両クランパー体のうち他方のクランパー体における一方
のクランパー体に対する開閉回動を、薄い板ばね体の屈
曲によって行うことができ、この他方のクランパー体に
おける一方のクランパー体に対する枢着部に、従来のよ
うに潤滑油切れが発生したり、ガタツキが存在したりす
ることを確実に防止できるから、他方のクランパー体の
開閉に可動不良が発生することを大幅に低減できると共
に、耐久性を大幅に向上できるのである。[Operation and effect of the invention] With this configuration,
Opening and closing of one clamper body of the other clamper body of the two clamper bodies can be performed by bending a thin leaf spring body, and a conventional pivoting portion of the other clamper body with respect to the one clamper body has a conventional structure. As it is possible to reliably prevent running out of lubricating oil and the presence of rattling, it is possible to greatly reduce the occurrence of malfunctions in opening and closing the other clamper body, and to greatly improve durability. You can do it.
【０００８】しかも、本発明は、板ばね体による枢着で
あるために、枢着部を小型・軽量化を図ることができる
効果をも有する。Moreover, the present invention has the effect that the pivoting portion can be reduced in size and weight because it is pivotally attached by the leaf spring body.
【０００９】[0009]
【実施例】以下、本発明の実施例を、図１〜図４の図面
について説明する。この図において符号１は、ワイヤボ
ンディング装置における本体を示し、この本体１には、
ホーン体２が、その支持部材３を介して振動可能に支持
されており、このホーン体２の先端には、ボンディング
ツールの一つであるところのキャビラリツール４が取付
けられ、このキャビラリツール４にはワイヤ５が挿通さ
れている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 1 indicates a main body of the wire bonding apparatus.
A horn body 2 is oscillatably supported via a supporting member 3, and a cavitation tool 4, which is one of bonding tools, is attached to the tip of the horn body 2, A wire 5 is inserted through 4.
【００１０】符号６は、前記ワイヤ５に対するワイヤク
ランプ機構を示し、このワイヤクランプ機構６は、前記
支持部材３の上面に、ねじ７にて取付け一方のクランパ
ー体８と、この一方のクランパー８に対して開閉回動自
在に枢着される他方のクランパー体９と、これら両クラ
ンパー体８，９の他端間に位置して、前記他方のクラン
パー体９を一方のクランパー８に対して開閉作動するた
めの電磁石等の開閉作動機構１０とから成り、この両ク
ランパー体８，９の先端部に固着したクランプ片１７，
１８にて、前記キャビラリツール４に挿通したワイヤ５
をクランプする。Reference numeral 6 denotes a wire clamp mechanism for the wire 5. The wire clamp mechanism 6 is attached to the upper surface of the support member 3 with a screw 7 and is attached to one clamper body 8 and one clamper 8. The other clamper body 9 pivotally attached to the other clamper and the other clamper body 9 located between the other ends of the two clamper bodies 8 and 9 are opened and closed with respect to the one clamper 8. And an opening / closing mechanism 10 such as an electromagnet for holding the clamp pieces 17, which are fixed to the tips of the clampers 8 and 9.
At 18, the wire 5 inserted through the cavity tool 4
Clamp.
【００１１】そして、前記一方のクランパー８に対して
他方のクランパー体９を開閉回動自在に枢着するに際し
ては、両クランパー体８，９の上面及び下面に突起部８
ａ，８ｂ，９ａ，９ｂを一体的に突出し、両クランパー
体８，９の上面における突起部８ａ，９ａの間、及び下
面における突起部８ｂ，９ｂの間の各々に薄い板ばね体
１１，１２を装架し、この両板ばね体１１，１２の両端
を、その各々の突起部８ａ，８ｂ，９ａ，９ｂに対し
て、当て座金板１３，１４付きねじ１５，１６のねじ込
みにて、前記他方のクランパー体９が当該両板ばね体１
１，１２の屈曲で開閉回動するように固着する。When the other clamper body 9 is pivotally attached to the one clamper 8 so as to be freely opened and closed, the protrusions 8 are formed on the upper and lower surfaces of both clamper bodies 8, 9.
a, 8b, 9a, 9b are integrally projected, and thin leaf spring bodies 11, 12 are provided between the protrusions 8a, 9a on the upper surfaces of both clamper bodies 8, 9 and between the protrusions 8b, 9b on the lower surfaces. By mounting both ends of the leaf spring bodies 11 and 12 onto the respective projecting portions 8a, 8b, 9a and 9b of the pad washers 13 and 14 with screws 15 and 16 The other clamper body 9 is the leaf spring body 1 concerned.
It is fixed so that it can be opened and closed by bending 1 and 12.
【００１２】このように構成することにより、両クラン
パー体８，９のうち他方のクランパー体９における一方
のクランパー体８に対する開閉回動を、両薄い板ばね体
１１，１２の屈曲によって行うことができるから、この
他方のクランパー体９における一方のクランパー体８に
対する枢着部に、従来のように潤滑油切れが発生した
り、ガタツキが存在したりすることを確実に防止できる
のである。With this configuration, the opening / closing rotation of the other clamper body 9 of the two clamper bodies 8 and 9 with respect to the one clamper body 8 can be performed by bending the thin leaf spring bodies 11 and 12. Therefore, it is possible to reliably prevent the occurrence of lubricating oil shortage and the presence of rattling at the pivotal connection portion of the other clamper body 9 with respect to the one clamper body 8 as in the conventional case.
【００１３】なお、前記実施例のように、両クランパー
体８，９の上面側と下面側との両方に、板ばね体１１，
１２を配設することにより、他方のクランパー体９を、
その開閉回動に際して捩じれ等を生じることなく、一方
のクランパー体８に対してバランス良く枢着することが
できるのである。As in the above-mentioned embodiment, the leaf spring bodies 11, 11 are provided on both the upper and lower surfaces of both clamper bodies 8, 9, respectively.
By disposing 12 the other clamper body 9,
It is possible to pivotally mount the clamper body 8 on one side in a well-balanced manner without twisting or the like during the opening / closing rotation.
【図１】本発明の実施例を示す正面図である。FIG. 1 is a front view showing an embodiment of the present invention.
【図２】図１のII−II拡大視断面図である。FIG. 2 is an enlarged sectional view taken along line II-II of FIG.
【図３】図１の拡大平面図である。FIG. 3 is an enlarged plan view of FIG.
【図４】ワイヤクランプ機構を分解した状態を平面図で
ある。FIG. 4 is a plan view showing a disassembled state of the wire clamp mechanism.
１ ワイヤボンディング装置の本体 ２ ホーン体 ３ 支持部材 ４ キャピラリツール ５ ワイヤ ６ ワイヤクランプ機構 ８ 一方のクランパー体 ９ 他方のクランパー体 １０ 開閉作動機構 １１，１２ 板ばね体 1 Body of Wire Bonding Device 2 Horn Body 3 Supporting Member 4 Capillary Tool 5 Wire 6 Wire Clamping Mechanism 8 One Clamper Body 9 Other Clamper Body 10 Opening / Closing Mechanism 11, 12 Leaf Spring Body
Claims (2)
ングツール付きホーン体に対する支持部材等に取付けた
一方のクランパー体と、この一方のクランパー体に対し
て開閉回動自在に枢着した他方のクランパー体と、この
他方のクランパー体を開閉回動するための作動機構とを
備えて成るワイヤクランプ機構において、前記他方のク
ランパー体の一方のクランパー体に対する枢着部に薄い
板ばね体を配設し、この板ばね体の両端部を前記両クラ
ンパー体に対して、他方のクランパー体が当該板ばね体
の屈曲によって開閉回動するように固着したことを特徴
とするワイヤボンディング装置におけるワイヤクランプ
機構の構造。1. A clamper body attached to a support member for a horn body with a bonding tool in a wire bonding apparatus, and another clamper body pivotally attached to the one clamper body so as to be freely opened and closed. In a wire clamp mechanism comprising an actuating mechanism for opening and closing the other clamper body, a thin leaf spring body is arranged at a pivotal attachment portion of the other clamper body to one clamper body, and the leaf spring is provided. A structure of a wire clamp mechanism in a wire bonding apparatus, wherein both ends of a body are fixed to the both clamper bodies so that the other clamper body is opened and closed by bending of the leaf spring body.
両クランパー体における左右両側に配設したことを特徴
とするワイヤボンディング装置におけるワイヤクランプ
機構の構造。2. The leaf spring body according to claim 1,
A structure of a wire clamp mechanism in a wire bonding apparatus, which is arranged on both left and right sides of both clampers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25058294A JP3378378B2 (en) | 1994-10-17 | 1994-10-17 | Structure of wire clamp mechanism in wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25058294A JP3378378B2 (en) | 1994-10-17 | 1994-10-17 | Structure of wire clamp mechanism in wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08115939A true JPH08115939A (en) | 1996-05-07 |
| JP3378378B2 JP3378378B2 (en) | 2003-02-17 |
Family
ID=17210039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25058294A Expired - Fee Related JP3378378B2 (en) | 1994-10-17 | 1994-10-17 | Structure of wire clamp mechanism in wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3378378B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100388958B1 (en) * | 2000-12-15 | 2003-06-25 | 삼성테크윈 주식회사 | Pivot of wire clamp |
-
1994
- 1994-10-17 JP JP25058294A patent/JP3378378B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100388958B1 (en) * | 2000-12-15 | 2003-06-25 | 삼성테크윈 주식회사 | Pivot of wire clamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3378378B2 (en) | 2003-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |