JPH08113208A - Pressure bonding heater-controlling device for bank note-binding machine - Google Patents

Abstract

PURPOSE: To bind bank notes with tapes bonded surely by providing a control means that reads out time required for bonding the tapes in accordance with the temperature at a heating part out of a tape bonding data storage, based on signals received from a temperature sensor. CONSTITUTION: A heater control device is composed of a heating part for bonding tapes and a temperature sensor 8, and controls the temperature at the heating part so that the temperature can be set at a standard level. Namely, the control device has a tape bonding data storing means that stores temperature and time required for tape bonding and a control means 11 which reads out from the storing means the time required for bonding in accordance with the temperature at the heating part. The control means 11 is equipped with a function that stops binding processing function when the temperature at the heating part detected by signals from the temperature sensor 8 is lower than the lowest limit while setting a new standard temperature when the detected temperature is within a range from the lowest limit to the standard temperature, using the detected temperature as a new standard. Therefore, the time required for bonding can be read out when the temperature at the heating part is at the standard level, and heating and bonding are processed with the heating part engaged in bonding for the required time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crimping heater control device in a bill binding device in which a binding tape is wound around the outer periphery of a group of bills stacked in a predetermined number so as to form a stacked bill. is there.

[0002]

2. Description of the Related Art Conventionally, as a crimping heater control device for a bill binding device of this type, in which a tape is wound around a predetermined number of accumulated bills and the tapes are heat-bonded at an optimum temperature, for example, Jikken Sho 57-. The thing of 32084 gazette (publicly known example) is proposed.

In summary of its contents, this control device is
When the main switch is turned on to heat the heater, and the temperature detection circuit that is sensitive to the heat generation temperature of the heater detects the optimum temperature that is the optimum temperature for heat-bonding the tape, the heat generation of the heater is stopped and the heater is stopped. When the temperature of (3) falls below an appropriate temperature, the heater is made to generate heat again, and the temperature of the heater is always kept substantially constant.

[0004]

In the above-mentioned known example, when the temperature of the heater reaches a proper temperature, the heat generation is stopped, and when the temperature falls below the proper temperature, the heat generation is controlled again. However, even if the heat generation is stopped because the temperature of the heater has reached an appropriate temperature, the temperature of the heater may temporarily exceed the appropriate temperature.In this way, the bonding process is performed at a temperature higher than the appropriate temperature. Then, since the bonding time remains set so as to correspond to the optimum temperature, the bonding process is performed with the bonding time corresponding to the optimum temperature, so that the bonding time longer than the required bonding time suitable for the temperature of the heater. Since the tape is heated, as a result, the adhesive of the tape is hardened by heat slowly, which may cause a problem such as peeling of the adhesive portion.

Further, if the temperature of the heater falls below an appropriate temperature and the heater is caused to generate heat, the temperature of the heater does not immediately rise but falls below the appropriate temperature, and at this time, the bonding process is performed. Then, there is a problem that the adhesive time is short with respect to the temperature of the heater and the tape is difficult to adhere.

In addition, even if the temperature of the heater does not reach an appropriate temperature due to a place where the bill binding device is installed, environmental conditions such as temperature, characteristics of the heater, or some trouble in the device, the display is made. In the section, since the standby state for constantly heating the heater is continuously displayed, not only the bundling process cannot be performed, but also a trouble occurs, or the temperature of the heater is lower than the optimum temperature due to the above conditions. There was a risk that the timing of maintenance and inspection would be lost because I could not even know if it would only go up.

A first object of the present invention is to reliably bond the tape by being constructed so that an appropriate bonding time can be determined according to the temperature of the heater so as to adapt to the characteristics of the heater, the heat generation temperature and the environmental conditions. It is to provide what can form a banknote bundle with excellent quality.

It is a second object of the present invention to provide a heater capable of storing the bondable temperature as a reference temperature and controlling the temperature of the heater to be constant.

A third object of the present invention is to make it possible to newly set the reference temperature in accordance with the temperature of the heater, and to carry out an optimum tape bonding process corresponding to changes in environmental conditions and heater characteristics. Is to provide things.

[0010]

The structural features of the present invention for achieving the above object are as follows.

According to a first aspect of the present invention, there is provided a heater portion to which the tape is adhered, and a temperature sensor for detecting the temperature of the heater portion. In the crimp heater control device of the banknote binding device that is controlled to, the tape adhering temperature and the tape adhering data storage unit that stores the required tape adhering time corresponding to the adhering temperature, and the signal received from the temperature sensor. Based on the above, there is provided a crimping heater control device for a banknote binding device, which has a control device capable of reading the adhering time corresponding to the temperature of the heater portion from the tape adhering data storage device.

According to a second aspect of the present invention, the tape bonding data storage means has a function of storing any one of the adherable temperatures as a reference temperature. It is a pressure bonding heater control device.

According to a third aspect of the present invention, the control means binds the heater portion if the temperature of the heater portion is lower than the lower limit temperature based on a signal from the temperature sensor after the heater portion is operated for a predetermined time. 3. A function to stop the function and to set the temperature as a new reference temperature if the temperature of the heater is within the range from the lower limit temperature to the reference temperature. It is a pressure bonding heater control device of the described bill binding device.

[0014]

[Operation] Since the structure of the present invention is as described above, when it is detected that the temperature of the heater portion has reached the reference temperature suitable for the adhesive processing of the tape, the required adhesive time is stored in the data storage means. Read from the heater part, and the heater part is involved in the tape for the bonding time and performs the heating and bonding process. Since the reference temperature in this case can be set by being corrected according to the actual temperature of the heater, The heater always takes part in the tape at the appropriate temperature for the required time and makes it adhere to the tape. Furthermore, as long as the temperature of the heater part keeps the reference temperature range, the new reference temperature is added. However, when the temperature of the heater portion does not reach the lower limit temperature, the tape adhering process is disabled to improve the safety of the binding process.

[0015]

[Examples] Next, a bill binding device BM which is an example of the present invention will be described with reference to the drawings.

As shown in FIG.
The holding members 1 and 2 for holding the banknotes (S) having a predetermined number of about 0 stacked in the vertical direction are attached to a rotary disk 3 for rotating the holding members 1 and 2, and are held diagonally above them. A feed roller 4 for feeding the tape 7 is provided between the members 1 and 2 and the accumulated banknote S, and a cutter 5 for cutting the tape T fed by a predetermined amount is provided below the roller 4.

A heat-bonding member 6A for heat-bonding the tape T wound around the holding members 1 and 2 and a heater 6B for heating the same are provided on the side of the rotary disk 3. The heater 6B and the heat-bonding member 6A are partially supported by two holding arms 7A, 7B (not shown) so that one end of the heat-bonding member 6A is at a position for holding the accumulated banknote S from the position shown in the drawing. It is configured so that it can move while pressing one end to the other end of the upper surface with a predetermined pressure.

A temperature sensor 8 for detecting the temperature of the heater 6B is provided in the heater 6C (the heater 6B and the thermal bonding member 6A).

The bundling device drive unit 9 and the display unit 10 for driving the bill bundling device BM are shown in FIG.
Illustration of a binding start key for binding processing is omitted.

FIG. 2 is a functional block diagram of the bill bundling device BM. The control means 11 receives the detection signal of the temperature sensor 8 and judges whether or not the heater portion 6C is at the reference temperature and the heater. The unit 6C can be turned on / off and the binding unit driving unit 9 and the display unit 10 can be operated.

The relationship between the normal bonding time and the heat-bondable temperature is that the lower the temperature, the longer the bonding time of the tape T,
The higher the temperature, the shorter the bonding time, but the ROM 20 (tape bonding data storage means) is divided into a plurality of stages in the temperature range of the heater portion 6C that allows the tape T to be bound to be thermally bonded. Further, the optimum bonding time corresponding to each stage is stored in advance, and any one of the stages in the temperature range where bonding is possible is set and stored as a reference temperature.

"Lower limit temperature to a" shown in FIG. 2 in which the temperature range in which the tape T can be adhered is divided into a plurality of stages means "greater than or equal to the lower limit temperature and less than a".
The same applies to “b”, “b to c”, ... It should be noted that only “g to upper limit temperature” is “g or more and not more than upper limit temperature”.

In the RAM 30, the reference temperature of the heater section 6C can be rewritten. For example, as will be described in detail later, the temperature of the heater section 6C is equal to the lower limit temperature and the reference temperature after a predetermined time elapses after the machine power is turned on. When it is within the range of the temperature, the temperature can be stored as a new reference temperature and presented to the control means 11.

Next, the reference temperature setting process for observing the heat generation temperature characteristic of the heater portion 6C, which is performed when the power source of the machine body is started up, will be described with reference to the flowchart shown in FIG.

[SP11, 12, 13] When the heater section 6C is caused to generate heat when the power source of the machine is operated, the control means 11 receives a detection signal from a temperature sensor 8 (thermistor) for detecting the temperature of the heater section 6C and receives a reference temperature. You can see if it has reached.

As a control for keeping the temperature of the heater portion 6C constant at the reference temperature, the heater portion 6C that has generated heat as described above is used.
When the temperature reaches the reference temperature, the heat generation is stopped, or the heater 6C that has stopped the heat generation divides the reference temperature to cause the heater 6C to generate heat. Even if the heater 6C is heated / stopped, the temperature of the heater 6C may exceed or fall below the reference temperature. Therefore, considering the temperature difference from the reference temperature at this time, the upper and lower limits are set. It is better to set the reference temperature to other stages that do not include it.

[SP19, 20] The heater section 6C is caused to generate heat as the power source of the machine is operated, and the characteristics of the heater section 6C and the environmental conditions (temperature, etc.) in which it is installed even after a predetermined time has passed, or
If the temperature of the heater portion 6C has not reached the reference temperature due to a trouble, the control means 11 determines whether the temperature of the heater portion 6C is lower than the bonding lower limit temperature or exceeds the lower limit temperature based on the signal from the temperature sensor 8. To detect

The predetermined time means a time sufficient to reach the reference temperature after the heater 6C is operated.

[SP21] If the temperature of the heater 6C is within the range between the lower limit temperature and the reference temperature, the temperature is stored in the RAM 30 as a new reference temperature, and the process proceeds to step 14 to display that the binding is possible. Display on 10.

[SP22, 23] Further, if the temperature of the heater portion 6C is lower than the lower bonding temperature, the heat generation of the heater portion 6C is stopped, and the display portion 10 is informed of this as a heater failure, and the binding process cannot be performed. To control.

[SP14, 15, 16, 17] When the temperature of the heater section 6C reaches the reference temperature, the display section 10 indicates that the binding process is possible, and the heat generation of the heater section 6C is stopped, so that the heater section is stopped. When the temperature of 6C falls below the reference temperature, the heating of the heater portion 6C is started again.

[SP170, 171, 18] Here, when the reference temperature newly set in step 21 is close to the lower limit temperature, the heat generation of the heater is stopped and the temperature of the heater is changed in steps 15 and 16. Even if the heater portion 6C is made to generate heat after the reference temperature is divided, the temperature of the heater portion 6C may once fall below the reference temperature and also below the lower limit temperature at this time. If it is determined that the temperature is higher than the lower limit temperature, the process proceeds to the next step 18, and the heater 6C is heated until the temperature of the heater 6C reaches the reference temperature. Further, when the temperature of the heater portion 6C is lower than the lower limit temperature, there is a possibility that the adhesive failure of the tape T may occur during the binding process.
In addition to displaying that the display unit 10 is waiting,
Prevent binding processing.

Next, the bundling process control will be described with reference to the flowchart shown in FIG.

[SP1] As described above, the reference temperature setting process is performed when the machine body power is turned on, and if the bundling process is possible, the display unit 10 displays a message to that effect.

[SP2, 3, 4, 5] The temperature sensor 8 receives the binding start signal by pressing the binding start key after the display that the binding process is possible is displayed on the display unit 10.
The bonding time corresponding to the detected temperature is read from the ROM 20 based on the signal output from the ROM 20, and the bundling operation is performed based on the read bonding time. This bonding time is held by the heater portion 6C described later. 1 is the time required to press the top surface of No. 1 from one end to the other end.

The following operations are performed as the binding operation.

When a predetermined number of stacked banknotes S are transferred between the holding members 1 and 2, the feed roller 4 for feeding the tape T is driven and the tape T is held between the holding member 1 and the stacking banknote S. Sent in.

When the tape T is fed, the holding members 1 and 2 are
Is moved in a direction of holding the stacked banknote S, and holds the tape T and the stacked banknote S (arrows a and b).

When the holding members 1 and 2 hold the tape T, the rotary disk 3 rotates, the tape T is wound around the holding members 1 and 2, and the holding members 1 and 2 rotate once or twice. Be stopped.

When the rotary disk 3 stops, the holding arm 7A,
7B and the cutter 5 are driven to first cut the tape T wound around the peripheral surfaces of the holding members 1 and 2 (arrow C), and immediately after that, the cut tape T is cut from one end of the upper surface of the holding member 1. The tape T is heat-bonded by moving while being pressed to the other end (arrows D and E), the heater portion 6C returns to the position shown in FIG. 1 again, and the binding process ends.

[0041]

The remarkable effects brought about by the present invention described above are as follows.

(1) The control means reads out the adhesion time corresponding to the temperature of the heater from the tape adhesion data storage means,
Since the heater portion is made to participate in the tape for the required time, a reliable tape bonding process can be guaranteed.

(2) Since the tape adhering data storage means can newly store the adherable temperature as a reference temperature according to the characteristics of the heater, etc., the heater is always kept in the required adhering processing temperature state without excess or deficiency. Therefore, the tape bonding process can be performed more reliably.

(3) If the temperature of the heater part is within the range of the reference temperature, the reference temperature itself is newly set so as to match the heater part, and if the temperature is below the lower limit temperature, the binding process is stopped. With this, it is possible to perform the optimum processing corresponding to changes in the environmental conditions and the characteristics of the heater section.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a main part of a binding device according to the present invention.

FIG. 2 is a functional block diagram of the heater control device of FIG.

FIG. 3 is a flowchart illustrating the operating state of FIG.

FIG. 4 is a flowchart illustrating an operating state of FIG.

[Explanation of symbols]

 BM Bundling means S Stacked banknotes T Tape 6A Heat bonding member 6B Heater 6C Heater section 8 Temperature sensor 10 Display section 11 Control means 20 ROM 30 RAM

Claims (3)

[Claims] 1. A banknote bundling device having a heater unit for adhering a tape and a temperature sensor for detecting the temperature of the heater unit, and controlling the temperature of the heater unit to a reference temperature based on a signal output from the temperature sensor. In a pressure-bonding heater control device of the apparatus, a tape bonding data storage unit that stores a tape bonding temperature and a required tape bonding time corresponding to the bonding temperature, and the tape based on a signal received from a temperature sensor. A pressure-bonding heater control device for a banknote binding device, comprising control means capable of reading an adhesion time corresponding to a temperature of a heater portion from an adhesion data storage means. 2. The pressure bonding heater control device for the banknote binding device according to claim 1, wherein the tape adhesion data storage means has a function of storing any of the adherable temperatures as a reference temperature. . 3. The control means stops the binding process function if the temperature of the heater section is lower than a lower limit temperature based on a signal from a temperature sensor after the heater section is operated for a predetermined time. The bill binding device according to claim 1 or 2, further comprising a function of setting the temperature of the heater portion as a new reference temperature if the temperature of the heater portion is within a range from the lower limit temperature to the reference temperature. Crimping heater controller.