JPH08110640A - Resin composition, permanent resist resin composition and these hardened articles - Google Patents

Abstract

PURPOSE: To ensure high resolution, to attain easy development with an aq. alkali soln., to also ensure superior solvent and plating soln. resistances and to produce a printed circuit board having such heat resistance that it withstands a high temp. in a soldering process. CONSTITUTION: Each of this resin compsn. and this permanent resist resin compsn. for a printed circuit board contains multifunctional epoxy resin having an epoxy equiv. of 120-500, phenol novolak having one or more acryloyl or methacryloyl groups as a multifunctional phenol compd. obtd. by condensing a phenol compd. having two phenolic hydroxyl groups in each molecule with formaldehyde in the presence of an acidic catalyst, an epoxy acrylate or epoxy methacrylate compd., a diluent made of a photopolymerizable and thermally reactive monomer and a photopolymn. initiator.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition useful as a permanent resist for printed wiring boards and a cured product thereof.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board has been manufactured by a subtractive method in which a copper clad laminate is used and an unnecessary portion of a circuit of a copper foil is removed by etching. This subtractive method is a fine pattern, It is difficult to form a high-density wiring board, and there are drawbacks such as small diameter through holes and via holes that cannot be uniformly formed by electroplating. It is the current situation.

On the other hand, recently, a full additive method has been attracting attention, in which an adhesive layer is formed on a laminated plate made of an insulating base material, and a circuit and a through hole are formed thereon by electroless plating. In this method, the accuracy of the conductor pattern is determined only by the transfer accuracy of the plating resist, and since the conductor part is formed only by electroless plating, even through-holes with high throwing power and even through-holes can be formed even on substrates with high aspect ratio through-holes. It is possible to perform plating. The additive method, which has been considered to be suitable for general consumers until now, has begun to be put into practical use as an industrial, high-density, high-multilayer substrate manufacturing process.

[0004]

Generally, in an additive method for manufacturing a substrate for consumer use, a plating resist pattern is transferred by a screen printing method. However, in order to manufacture a printed wiring board having high density wiring, ,
It becomes necessary to form a plating resist pattern by photolithography, that is, to adopt a photoadditive method using a photoresist. Photoresist suitable for photoadditive method has sensitivity, resolution,
In addition to the original characteristics of photoresist such as developability, the following characteristics are required. Since development is limited to 1,1,1-trichloroethane-based organic solvent or alkaline aqueous solution, it can be developed by either, can withstand electroless plating that is carried out under high temperature and highly alkaline conditions for a long time, plating After processing, it has excellent solder resist characteristics as a permanent resist, and 260 in the soldering process.
It has heat resistance to withstand temperatures of around ℃ and solvent resistance to organic solvents that wash the flux used during soldering, and it does not reduce the thermal reliability of the entire substrate even when laminated. . At present, photoresists that can be used in this additive method are also on the market, but it is still insufficient.

Therefore, it is an object of the present invention that a resist having a high pattern accuracy can be formed by a photographic method by development using an alkaline aqueous solution, and the resist can sufficiently withstand the electroless copper plating solution of the full additive method, and A permanent resist resin composition having heat resistance that can withstand temperatures around 260 ° C during the soldering process and solvent resistance to organic solvents that wash the flux used during soldering, and that can be used without removing the final product. The present invention is to provide a cured product and a cured product thereof.

[0006]

In order to achieve the above object, a resin composition, a permanent resist resin composition for a printed wiring board and a cured product thereof according to the present invention have the following composition and are used as a permanent resist. And the ability to produce a printed wiring board using this resist resin composition.

That is, the present invention comprises the following components (a),
The present invention relates to a resin composition comprising (b), (c), (d) and (e), a permanent resist resin composition for a printed wiring board, and a cured product thereof. (A) a polyfunctional epoxy resin having an epoxy equivalent of 120 to 500, and (b) a polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule with formaldehyde under an acidic catalyst, A phenol novolak having one or more acryloyl groups or methacryloyl groups, (c) an epoxy acrylate or an epoxy methacrylate compound, (d) a diluent comprising photopolymerization and a heat-reactive monomer, and (v) a photopolymerization initiator.

The epoxy resin of the component (a) used in the present invention is preferably a bisphenol A type (or F type) epoxy resin, and when the average molecular weight is more than 1000, it is preferable in terms of developability using an alkaline aqueous solution. Absent.

The component (b), phenol novolac, is a polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule with formaldehyde under an acidic catalyst, and an acrylate or methacrylate having a glycidyl group. Is obtained by reacting. In order to obtain a permanent resist which is photopolymerized and has an excellent alkali developability and good pattern accuracy, 0.1 to 0.6 equivalent of epoxy group of acrylate or methacrylate having a glycidyl group is equivalent to 1 equivalent of hydroxyl group of phenol novolac. Appropriate. Examples of the phenol compound having two phenolic hydroxyl groups in the molecule include bisphenol A, bisphenol F or bisphenol S, and derivatives thereof. As the acrylate or methacrylate having a glycidyl group, for example, glycidyl acrylate and glycidyl methacrylate are preferable because of their reactivity and availability.

(C) The epoxy acrylate or epoxy methacrylate compound is not particularly limited, but includes bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, phenol novolac type epoxy compound,
It is obtained by reacting an epoxy compound such as a cresol novolac type epoxy compound or an aliphatic epoxy compound with acrylic acid or methacrylic acid. When the purpose is to improve the water solubility in alkalis and the adhesion to an insulating substrate or a metal, the following method is preferred.
(1) After the reaction of the above-mentioned epoxy compound with acrylic acid or methacrylic acid, oxalic acid, malonic acid, succinic acid, glutamic acid, adipic acid, maleic acid, fumaric acid, phthalic acid or terephthalic acid, etc. Number 5-10
It is reacted with a carboxylic acid compound having 0 carboxyl group or an anhydride thereof. Alternatively, (2) in the reaction, the epoxy group of the epoxy compound is allowed to remain by a subsequent carboxylic acid modification amount, and then oxalic acid, malonic acid, succinic acid, glutamic acid, adipic acid, maleic acid, fumaric acid, phthalic acid. It may be reacted with an acid or a dicarboxylic acid such as terephthalic acid or its anhydride. At this time, when the oxidation number is small, the alkali water solubility is poor, and when it is too large, it becomes a factor that deteriorates the properties as a resist such as chemical resistance at the time of curing and electrical properties.

(D) Examples of the diluent comprising a photopolymerizable and thermoreactive monomer include acrylate or methacrylate compounds having at least one hydroxyl group in one molecule. For example, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, butanediol monoacrylate glycerol methacrylate, phenoxy hydroxypropyl acrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, or glycerol dimethacrylate. Etc. Alternatively, a photopolymerizable monomer such as glycidyl acrylate or glycidyl methacrylate having a glycidyl group is used. Preferred monomers are glycidyl acrylate and glycidyl methacrylate, which can react with carboxylic acid and phenolic hydroxyl group for chemical resistance after thermosetting. Usually, the amount of the diluent as the component (d) is preferably 1 to 5 times the equivalent of the residual phenolic hydroxyl group or carboxylic acid group after the thermosetting reaction of the epoxy resin as the component (a).

(E) As the photopolymerization initiator, benzophenone, benzoylbenzoic acid, 4-phenylbenzophenone, benzophenones such as hydroxybenzophenone, benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether,
Benzoin alkyl ethers such as benzoin isobutyl ether, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 4-t
-Butyl-trichloroacetophenone, acetophenones such as diethoxyacetophenone, thioxanthone,
2-chlorothioxanthone, 2-methylthioxanthone,
Examples thereof include thioxanthones such as 2,4-dimethylthioxanthone and alkylanthraquinones such as ethylanthraquinone and butylanthraquinone. These may be used alone or as a mixture of two or more kinds. The addition amount of this photopolymerization initiator is usually 0.1 to
Used in the range of 10% by weight.

In addition, an ultraviolet ray inhibitor, a thermal polymerization inhibitor, a plasticizer, etc. may be added to the permanent resist of the present invention, if necessary, for storage stability. Further, an acrylate monomer, a methacrylate monomer, a vinyl monomer or the like may be added to adjust the viscosity.

The permanent resist resin composition of the present invention comprising these components has high resolution and excellent developability with an aqueous alkaline solution. In particular, regarding the solubility in an alkaline aqueous solution, a polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule of component (b) with formaldehyde under an acidic catalyst,
This is due to the phenolic hydroxyl group of the phenol novolac having at least one or more acryloyl group or methacryloyl group and the carboxylic acid group of the water-soluble functional group of the epoxy acrylate or epoxy methacrylate compound of the component (c). And as described above, the photo-cured product having these functional groups remaining is a resist having poor alkali resistance, chemical resistance, electrical properties, etc., but the permanent resist resin composition of the present invention is photo-cured and after development. Is a resin composition mainly composed of a thermosetting reaction, and after the post heat treatment, the epoxy resin of the component (a) and the glycidyl group of the component (d) are
It undergoes a thermosetting reaction with the phenolic hydroxyl group in the component (b) and the carboxylic acid group in the component (c) to form a main skeleton having excellent required properties. Therefore, it becomes a permanent resist cured product that withstands electroless plating performed for a long time under high temperature and highly alkaline conditions.

The permanent resist resin composition according to the present invention comprises
It is applied to the adhesive for full additive in a thickness of 20 to 60 μm, and is subjected to heat treatment at 60 to 100 ° C. for about 5 to 10 minutes to be solvent-removed and solidified or prepolymerized to form a resist layer. Alternatively, a film-like material which is previously applied onto a carrier film and prepolymerized under the same conditions as above may be laminated on the adhesive layer.

[0016]

EXAMPLES The present invention will be described below based on examples. (Synthesis Example 1) Synthesis of methacryloyl group-containing phenol novolac Phenolite LF-48 as phenol novolac
71 (manufactured by Dainippon Ink and Chemicals, Inc.) 2 g of 800 g (approximately 4 equivalents of OH) of nonvolatile 60% methyl ethyl ketone solution
Into a flask, add 0.2 g of hydroquinone and 284 g (2 mol) of glycidyl methacrylate, and add 110
Warmed to ° C. After adding 1 g of tributylamine thereto, the mixture was reacted with stirring at 110 ° C. for 5 hours.

(Synthesis Example 2) Synthesis of methacryloyl group-containing phenol novolak 4,4'-isopropylidenediphenol 2280 g
(10 mol) 1220 g (15 mol) of formalin (37%) and 10 g of oxalic acid were charged into a pressure reaction vessel at 120 ° C.
The reaction was carried out for 4 hours at (pressure of 2.5 kg / cm 2), and after completion of the reaction, dehydration was carried out under reduced pressure and heating was carried out until the resin temperature reached 140 ° C. After cooling, the mixture was pulverized, and the resin content was adjusted to 60% with a methyl ethyl ketone solvent to obtain a phenol novolak. 2g of the above phenol novolac 800g (OH approx. 4 equivalents)
Into a flask, add 0.2 g of hydroquinone and 284 g (2 mol) of glycidyl methacrylate, and add 110
Warmed to ° C. After adding 1 g of tributylamine thereto, the mixture was reacted with stirring at 110 ° C. for 5 hours.

(Synthesis Example 3) Synthesis of carboxyl group-containing epoxy acrylate Bisphenol A type epoxy resin
After adding 760 g (4 equivalents) of Epicoat 828 (made by Yuka Shell Epoxy: epoxy equivalent 190) and 1 g of methoxyphenol as a polymerization inhibitor, acrylic acid 288 g
(4 mol), 1 g of benzyldimethylamine was added to give 10
The mixture was reacted at 0 ° C. for 6 hours with stirring. Then succinic anhydride 1
60 g (1.6 mol) was added, and the mixture was reacted with stirring at 80 ° C. for 3 hours.

(Synthesis Example 4) Synthesis of carboxyl group-containing epoxy acrylate In a 2 l flask, 760 g (4 equivalents) of Epicoat 828, 1 g of methoxyphenol as a polymerization inhibitor and 1 g of benzyldimethylamine were added and heated to 100 ° C. Then, 180 g (2.5 mol) of acrylic acid was added dropwise over 1 hour, and the mixture was reacted with stirring at 100 ° C. for 6 hours. Then, 234 g (1.6 mol) of adipic acid was added, and the mixture was stirred and reacted for 2 hours.

Example 1 15 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 1, 15 g of carboxyl group-containing epoxy acrylate of Synthesis Example 3 and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 (manufactured by Ciba-Geigy) as a photoinitiator and a thermosetting accelerator. 0.2 g of triphenylphosphine was added to obtain a permanent resist resin composition.

Example 2 15 g of Epicoat 828,
45 g of the methacryloyl group-containing phenol novolac of Synthesis Example 1, 15 g of the carboxyl group-containing epoxy acrylate of Synthesis Example 4 and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 as a photoinitiator and 0.2 g of triphenylphosphine as a heat curing accelerator were mixed. Was added to obtain a permanent resist resin composition.

Example 3 15 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 1, 15 g of epoxy acrylate V-5510 (manufactured by Dainippon Ink and Chemicals, Inc.) and 15 g of glycidyl methacrylate were mixed, and Irgacure 65 as a photoinitiator.
13 g and 0.2 g of triphenylphosphine as a thermosetting accelerator were added to obtain a permanent resist resin composition.

Example 4 10 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 1, 10 g of epoxy acrylate V-5510 and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 as a photoinitiator and 0.2 g of triphenylphosphine as a thermosetting accelerator were added. A permanent resist resin composition was prepared.

Example 5 15 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 1, 15 g of epoxy acrylate SP-4010 (manufactured by Sankyo Kasei Co., Ltd.) and glycidyl methacrylate 15
g, and 3 g of Irgacure 651 as a photoinitiator
And triphenylphosphine as a heat curing accelerator.
2 g was added to obtain a permanent resist resin composition.

Example 6 10 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 1 and 10 g of epoxy acrylate SP-4010
And 15 g of glycidyl methacrylate are mixed, and 3 g of Irgacure 651 as a photoinitiator and a thermosetting accelerator are mixed.
0.2 g of triphenylphosphine was added to obtain a permanent resist resin composition.

Example 7 15 g of Epicoat 828,
45 g of the methacryloyl group-containing phenol novolac of Synthesis Example 2, 15 g of the carboxyl group-containing epoxy acrylate of Synthesis Example 3 and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 (manufactured by Ciba Geigy) as a photoinitiator and a thermosetting accelerator. 0.2 g of triphenylphosphine was added to obtain a permanent resist resin composition.

Example 8 15 g of Epicoat 828,
45 g of the methacryloyl group-containing phenol novolac of Synthesis Example 2, 15 g of the carboxyl group-containing epoxy acrylate of Synthesis Example 4 and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 as a photoinitiator and 0.2 g of triphenylphosphine as a thermosetting accelerator were used. Was added to obtain a permanent resist resin composition.

Example 9 15 g of Epicoat 828,
45 g of methacryloyl group-containing phenol novolac of Synthesis Example 2, 15 g of epoxy acrylate V-5510 (manufactured by Dainippon Ink and Chemicals, Inc.) and 15 g of glycidyl methacrylate were mixed, and Irgacure 65 as a photoinitiator.
13 g and 0.2 g of triphenylphosphine as a thermosetting accelerator were added to obtain a permanent resist resin composition.

Example 10 Epicoat 828 10
g, methacryloyl group-containing phenol novolac of Synthesis Example 2 45 g, epoxy acrylate V-5510 10
g and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 as a photoinitiator and 0.2 g of triphenylphosphine as a thermosetting accelerator were added to obtain a permanent resist resin composition.

Example 11 Epicoat 828 15
g, methacryloyl group-containing phenol novolak of Synthesis Example 2 45 g, epoxy acrylate SP-4010
15 g (manufactured by Sankyo Kasei Co., Ltd.) and 15 g of glycidyl methacrylate were mixed, and Irgacure 65 was used as a photoinitiator.
13 g and 0.2 g of triphenylphosphine as a thermosetting accelerator were added to obtain a permanent resist resin composition.

Example 12 Epicoat 828 10
g, methacryloyl group-containing phenol novolak of Synthesis Example 2 45 g, epoxy acrylate SP-40101
0 g and 15 g of glycidyl methacrylate were mixed, and 3 g of Irgacure 651 as a photoinitiator and 0.2 g of triphenylphosphine as a thermosetting accelerator were added to obtain a permanent resist resin composition.

Comparative Example 1 Epoxy acrylate SP
-4010 45 g and glycidyl methacrylate 15 g were mixed, and Irgacure 651 3 g was added as a photoinitiator to obtain a resist resin composition.

Comparative Example 2 Epoxy acrylate V-
5510 45 g and glycidyl methacrylate 15 g were mixed, and Irgacure 651 3 g was added as a photoinitiator to obtain a resist resin composition.

[Production of Additive Method Multilayer Printed Wiring Board] The resin compositions obtained in Examples 1 to 12 and Comparative Example were applied in a thickness of 30 μm on a catalyst-activated adhesive laminate having a catalyst activated treatment. And heat treated at 100 ° C. for 10 minutes. However, in the comparative example, since the liquid was tacky even after the heat treatment, the cover film was brought into contact with the resist. A predetermined pattern was placed on this laminated plate and exposed with a high-pressure mercury lamp exposure device at an irradiation dose of 350 mJ / cm ² .
Then, it was developed with an aqueous sodium hydroxide solution at a spray pressure of ² kg / m ² . After washing with water and drying, the entire surface was exposed to 1 J / cm ² and heat-treated at 150 ° C. for 30 minutes. 70 this
It was immersed in an electroless copper plating solution at 0 ° C. for 10 hours to form an electroless copper plating film of about 20 μm, and an additive method multilayer printed wiring board was produced. Table 1 shows the results of evaluation of resist characteristics in the process of obtaining the additive-type multilayer printed wiring board in this manner.

Table 1 -------------------------------------- Development developability solvent resistance plating solution resistance solder heat resistance-- −−−−−−−−−−−−−−−−−−−−−−−−−−−−− Example 1 ○ ○ ○ ○ Example 2 ○ ○ ○ ○ Example 3 Δ ○ △ △ Example 4 ○ ○ △ △ Example 5 △ ○ ○ ○ Example 6 ○ ○ ○ ○ Example 7 ○ ○ ○ ○ Example 8 ○ ○ ○ ○ Example 9 △ ○ △ △ Example 10 ○ ○ △ △ Implementation Example 11 △ ○ ○ ○ Example 12 ○ ○ ○ ○ −−−−−−−−−−−−−−−−−−−−−−−−−−−−− Comparative Example 1 × Peeling × × Comparative Example 2 × Δ Δ ○ ○ −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−

(Measurement method) 1. Developability ◯: Development is possible, Δ: There is some development residue, X: Development residue 2. Solvent resistance: No change was observed after 20 minutes of immersion in acetone. 3. Plating Resistant Solution: No change was observed in the electroless copper plating process. 4. Solder heat resistance n = 5, 260 ° C for all test pieces,
The case where no change was observed in 20 seconds was marked with “◯”.

[0037]

As described above, the permanent resist resin composition for a printed wiring board of the present invention and the cured product thereof have high resolution and are easy to develop with an aqueous alkaline solution, but they are isopropyl alcohol and trichloroethylene. Resistance to methylene chloride, acetone, etc.,
We also manufacture printed wiring boards with excellent resistance to electroless plating that is performed under high temperature and high alkaline conditions for a long time, as well as heat resistance that can withstand temperatures around 260 ° C during the soldering process. Made possible

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location G03F 7/038 503 H05K 3/06 H 3/18 D 7511-4E 3/28 D

Claims (9)

[Claims] 1. The following components (a), (b), (c),
A resin composition comprising (d) and (e). (A) a polyfunctional epoxy resin having an epoxy equivalent of 120 to 500, and (b) a polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule with formaldehyde under an acidic catalyst, A phenol novolak having one or more acryloyl groups or methacryloyl groups, (c) an epoxy acrylate or an epoxy methacrylate compound, (d) a diluent comprising photopolymerization and a heat-reactive monomer, and (v) a photopolymerization initiator. 2. The following components (a), (b), (c),
A permanent resist resin composition for a printed wiring board, which comprises (d) and (e). (A) a polyfunctional epoxy resin having an epoxy equivalent of 120 to 500, and (b) a polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule with formaldehyde under an acidic catalyst, A phenol novolak having one or more acryloyl groups or methacryloyl groups, (c) an epoxy acrylate or an epoxy methacrylate compound, (d) a diluent comprising photopolymerization and a heat-reactive monomer, and (v) a photopolymerization initiator. 3. The permanent resist resin composition for a printed wiring board according to claim 2, wherein the component (a) is a liquid bisphenol A type epoxy resin or a liquid bisphenol F type epoxy resin. 4. A polyfunctional phenol obtained by condensing a phenol compound having two phenolic hydroxyl groups in the molecule as component (b) with formaldehyde under an acidic catalyst,
3. A printed wiring board according to claim 2, which is a phenol novolac obtained by reacting with an acrylate or methacrylate having a glycidyl group and having in the molecule one or more acryloyl or methacryloyl groups and one or more phenolic hydroxyl groups. Permanent resist resin composition. 5. The permanent resist resin composition for a printed wiring board according to claim 2, wherein the component (c) is an epoxy acrylate or epoxy methacrylate compound having a carboxyl group having an acid value of 5 to 100. 6. The diluent according to claim 2, wherein the component (d) is a photopolymerizable and thermoreactive monomer having at least one acryloyl group or methacryloyl group and at least one glycidyl group in one molecule. A permanent resist resin composition for a printed wiring board. 7. The component (a) is a liquid bisphenol A type epoxy resin or a liquid bisphenol F type epoxy resin, and the component (b) is a phenol compound having two phenolic hydroxyl groups in the molecule thereof under formaldehyde and an acidic catalyst. Obtained by reacting a polyfunctional phenol obtained by condensation with a glycidyl group-containing acrylate or methacrylate, and having at least one acryloyl group or methacryloyl group and at least one phenolic hydroxyl group in the molecule. The permanent resist resin composition for a printed wiring board according to claim 2. 8. The component (a) is a liquid bisphenol A type epoxy resin or a liquid bisphenol F type epoxy resin, and the component (b) is a phenol compound having two phenolic hydroxyl groups in the molecule thereof under formaldehyde and an acidic catalyst. Obtained by reacting a polyfunctional phenol obtained by condensation with a glycidyl group-containing acrylate or methacrylate, and having at least one acryloyl group or methacryloyl group and at least one phenolic hydroxyl group in the molecule. 3. The print according to claim 2, wherein the component (d) is a diluent comprising a photopolymerizable and heat-reactive monomer having at least one acryloyl group or methacryloyl group and at least one glycidyl group in one molecule. Permanent resist resin composition for wiring boards. 9. A cured product of the resin composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.