JPH08104808A - Radiation-sensitive resin composition - Google Patents

Abstract

PURPOSE: To obtain the subject composition capable of giving pattern-fashioned film improved in film loss problem, good in contrast and excellent in electrical and mechanical properties and thus directly usable as an electrical insulation material because of its being composed of a heat-resistant imide ring-bearing polymer. CONSTITUTION: This radiation-sensitive resin composition comprises (A) a polyisoimide obtained by reaction chiefly between pyromellitic dianhydride and/or 3,3',4,4'-biphenyltetracarboxylic dianhydride and an aromatic diamine mixture composed of diaminodiphenylsulfone, diaminodiphenyl ether and p- phenylenediamine at a molar ratio of (10-90):(10-90):(0-35) and (B) a compound presenting acidity on being irradiated with radiation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation-sensitive resin composition having a reduced film thickness after pattern formation, that is, a reduced film thickness and a good contrast.

[0002]

2. Description of the Related Art A polyimide resin having excellent heat resistance and electric characteristics is used for an interlayer insulating film and a protective film of a semiconductor device. When forming an interlayer insulating film or the like using a polyimide resin, for example, a solution of polyamic acid that is a precursor of the polyimide resin is applied on the surface of the substrate, and the polyimide film is formed by heat treatment of this, and then the polyimide A radiation-sensitive film is provided on the surface of the film, a predetermined pattern is formed by irradiation with radiation (hereinafter referred to as “exposure”) and development, and then the underlying polyimide film is selectively etched to have a predetermined pattern. Obtain a polyimide film.

However, such a process has complicated steps. Therefore, it is desired to develop a heat-resistant radiation-sensitive material in which the patterned film formed of the radiation-sensitive film can be used as it is as an interlayer insulating film. As such a material, a photosensitive resin using a polyimide precursor is well known. For example, as a polyimide precursor, a polyamic acid into which a methacryloyl group is introduced through an ester bond or an ionic bond is known (JP-A-56-38038). In this case, a high temperature treatment is performed after image formation to dehydrate and ring the polyamic acid to obtain a polyimide pattern, but the film loss due to dehydration at this time poses a problem.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a radiation-sensitive resin composition capable of forming a patterned film composed of a polymer having a heat-resistant imide ring and having excellent electrical and mechanical properties. It is to provide things. Another object of the present invention is to provide a radiation-sensitive resin composition that enables a patterned film composed of a polymer having an imide ring to be directly used as an insulating material after forming the patterned film. Is. Still another object of the present invention is to
It is an object of the present invention to provide a radiation-sensitive resin composition in which the problem of film loss when forming a patterned film is improved and which has good contrast.

[0005]

Means for Solving the Problems The above-mentioned object is (A) at least one aromatic tetracarboxylic acid selected from pyromellitic dianhydride and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride. Carboxylic dianhydride, diaminodiphenyl sulfone (hereinafter referred to as "DDS"), diaminodiphenyl ether (hereinafter referred to as "DDE")
And P-phenylenediamine (hereinafter referred to as “PPD”), the molar ratio of the three aromatic diamines is 10 to 90:
A polyisoimide obtained mainly by reacting with an aromatic diamine mixture of 10 to 90: 0 to 35, and (B) a compound which exhibits acidity upon irradiation with radiation (hereinafter,
“Acid generator”) is contained in the radiation-sensitive resin composition.

The present invention will be described in detail below, which will make clear the objects, configurations, advantages and effects of the present invention. In the radiation-sensitive resin composition of the present invention, the polyisoimide used as the resin component is at least one selected from pyromellitic dianhydride and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride. The molar ratio of the aromatic tetracarboxylic dianhydride and the three aromatic diamines of DDS, DDE and PPD is 10 to 90:
A polyisoimide obtained mainly by reacting with an aromatic diamine mixture of 10 to 90: 0 to 35, which is 3
The molar ratio of the aromatic diamines is preferably 15-8.
5:15 to 85: 0 to 30, more preferably 20 to 8
It is 0:20 to 8: 0 to 25. 90% DDS
If it exceeds 10 mol%, it will be difficult to form the obtained polyisoimide as a coating film, and if it is less than 10 mol%, the solubility of the obtained polyisoimide will decrease. Furthermore, the DDE ratio exceeds 90 mol%, or the PPD ratio is 3%.
Even if it exceeds 5 mol%, the solubility of the obtained polyisoimide in the solvent is lowered.

The main repeating structure of the polyisoimide is represented by the following formula (1)

[0008]

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(In the formula (1), R ¹ is DDS, DD
E or a residue of PPD, R ² is a pyromellitic dianhydride or 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride residue, and R ³ and R ⁴ are the same or Differently, it is a hydrogen atom, a methyl group or an ethyl group. At least one of the two carboxyl groups and / or alkoxycarbonyl groups contained in the repeating structure represented by the formula (1) is converted to an imide group or an isoimide group together with an amide bond. Here, a carboxyl group contained in these repeating structures,
With respect to the total amount of the alkoxycarbonyl group, the imide group and the isoimide group, the total amount of the imide group and the isoimide group is 50 to 100 mol%, and the isoimide group is 50 mol% or more, preferably 70 mol% or more. is there.

The polyisoimide has the following formula (2):

[0011]

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(In the formula (2), R ¹ is the above formula (1)
It is synonymous with R ¹ of. ) A mixture of three aromatic diamines represented by the following formulas in a specific ratio,

[0013]

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(In the formula (3), R ² is the above formula (1)
It is synonymous with R ² of. ) And at least one aromatic tetracarboxylic dianhydride represented by the formula (1) and other aromatic tetracarboxylic dianhydrides, aromatic diamines and diamines containing an organosiloxane skeleton are added, and a suitable solvent ( Hereinafter, it can be produced by reacting in a "polymerization solvent") to prepare a polyamic acid that is a precursor polymer, and then performing dehydration ring closure.

The amount of the other aromatic tetracarboxylic dianhydride added in the above reaction is the same as that of pyromellitic dianhydride and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride. The amount used is 25 mol% or less, and the amount of the other aromatic diamine and diamine containing an organosiloxane skeleton used is 25 mol% or less of the amount used of DDS, DDE and PPD. Here, other aromatic tetracarboxylic dianhydrides include, for example, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride and 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride. Anhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride An anhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride and the like can be mentioned. Other aromatic diamines include m-phenylenediamine, o-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-di (4 "-aminophenoxy) diphenyl sulfone, 3,3'-dimethylbenzidine and the like. Examples of the diamine containing an organosiloxane skeleton include the following formulas (4) and (5).

[0016]

[Chemical 4]

(In the formula (4), R ⁵ and R ⁶ are the same or different and are an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 12 carbon atoms, and R ^{7 to} R ¹⁰ are the same or different. , An alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 12 carbon atoms, and j is an integer of 1 to 10 respectively.)

[0018]

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(In the formula (5), R ¹¹ and R ¹² are
Identical or different, and is synonymous with the case of R ⁵ and R ⁶ in formula (4), wherein R ^{13 to} R ¹⁶ are the same or different and are represented by formula (4)
Of R ^{7 to} R ¹⁰ , and k is an integer of 1 to 10. ) Can be mentioned.

When synthesizing the polyamic acid, 1 mol of the aromatic tetracarboxylic dianhydride is used.
The wholly aromatic diamine and the diamine containing an organosiloxane skeleton are preferably used in an amount of 0.8 to 1.2 mol.
The amount of the polymerization solvent used may be appropriately set according to various conditions, but the total weight of the reaction raw materials is usually 1 to 50% by weight, preferably 2 to 30% by weight, based on the total weight of the solution.
Is the amount. The reaction temperature is usually 80 ° C. or lower, preferably 0 to 60 ° C., and the reaction time is usually
1 to 200 hours.

As the above-mentioned polymerization solvent, those which are inactive to the reaction raw materials and can dissolve them can be used. Polymerization solvents preferably used include amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone (hereinafter referred to as "NMP"); heterocyclic solvents such as pyridine, picoline, lutidine, quinoline and isoquinoline; phenol. , A phenolic solvent such as cresol; or an aprotic polar solvent such as dimethyl sulfoxide. Further, a solvent such as an aromatic hydrocarbon such as benzene, toluene or xylene; an ether such as dioxane may be mixed with the above-mentioned polymerization solvent.

The polyisoimide used in the present invention is obtained by subjecting the polyamic acid thus obtained to a ring closure together with an amide bond of a partial carboxyl group and / or alkoxycarbonyl group with a dehydrating agent for isoimidation or isoimidation and imidization. be able to. Here, isoimidization or isoimidization and imidization are the polymerization solvent containing polyamic acid as it is,
Alternatively, it is further diluted with a polymerization solvent so that the concentration of the polyamic acid is usually 5 to 10% by weight.
Further, as a preferable dehydrating agent that can be used for performing isoimidization or isoimidization and imidization,
Acid anhydrides such as acetic anhydride and trifluoroacetic anhydride; chlorides such as phosgene, thionyl chloride and tosyl chloride; phosphorus compounds such as phosphorus trichloride, triphenyl phosphite and diethyl phosphoric acid cyanide; N, N-dicyclohexylcarbodiimide And N, N-2 substituted carbodiimides and the like. Of these, trifluoroacetic anhydride is particularly preferable. These dehydrating agents are appropriately selected and used according to the types of aromatic tetracarboxylic dianhydride and aromatic diamine used. In addition, it is preferable to use 10 to 600 parts by weight of these dehydrating agents with respect to 100 parts by weight of polyamic acid.

Furthermore, in order to facilitate the progress of the dehydration ring closure, a tertiary aliphatic amine such as trimethylamine, triethylamine, tributylamine, diisopropylethylamine; N, N-dimethylaniline, 1,8-bis (N, N) An aromatic amine such as -dimethylamino) naphthalene; pyridine, lutidine, quinoline, isoquinoline,
It is preferable to use a heterocyclic compound such as 1,8-diazabicyclo [5.4.0] undecene as an accelerator in an amount of 10 to 400 parts by weight in combination with 100 parts by weight of polyamic acid in combination with the dehydrating agent. it can.

The isoimidization or isoimidation and imidization by dehydration ring closure are carried out by mixing the dehydrating agent and, if necessary, the promoter with a polyamic acid and reacting them. This reaction is 0 ~ 200 ℃
At a temperature of 0, more preferably 0
The temperature is ˜150 ° C.

The amount of the carboxyl group, the alkoxycarbonyl group, the imide group and the isoimide group in the obtained polyisoimide depends on the amount of these groups and the aromatic diamine, aromatic tetracarboxylic dianhydride, dehydrating agent and accelerator used. The relationship with the reaction conditions such as the reaction temperature and the reaction time can be experimentally obtained in advance and can be set within a predetermined range based on this knowledge.

The target polyisoimide can be obtained by removing the solvent from the polyisoimide solution thus obtained at a temperature of 0 to 150 ° C. under normal pressure or reduced pressure. In addition, a sufficiently dehydrated and dried alcohol solvent such as a large excess of methanol or ethanol; an ether solvent such as diethyl ether or diisopropyl ether; methyl ethyl ketone, isobutyl ketone or methyl isobutyl ketone (hereinafter referred to as "MIBK"). The polyisoimide can also be obtained by pouring the polyisoimide solution into a poor solvent such as a ketone solvent and reprecipitating the solution.

The solution viscosity of the polyisoimide obtained as described above is usually 0.5 to 5 when measured at a concentration of 10% by weight in NMP at 25 ° C. using an EL type rotational viscometer.
It is 200 poise, preferably 1 to 100 poise, and more preferably 2 to 20 poise. The obtained polyisoimide has excellent solubility in an organic solvent, and can be used in an aprotic polar solvent such as NMP, N, N-dimethylacetamide, or dimethylsulfoxide at a polyisoimide concentration of 10% by weight or more. It is melted.

The radiation-sensitive resin composition of the present invention contains an acid generator together with the above-mentioned polyisoimide. Examples of the acid generator include quinonediazide compounds represented by the following formulas (Q-1) to (Q-18).

[0029]

[Chemical 6]

[0030]

[Chemical 7]

(In formulas (Q-1) to (Q-18),
X is a hydrogen atom or the following formulas (6) to (8)

[0032]

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Represents any of the groups having a quinonediazide skeleton represented by However, formula (Q-1) to formula (Q-18)
In the compound represented by, at least one X is any of the groups having a quinonediazide skeleton represented by the formulas (6) to (8). Further, in the formula (Q-7), Y
Is the following formula

[0034]

[Chemical 9]

It is one of the divalent groups represented by: As such an acid generator, those in which X is the above formula (8) in the formulas (Q-1) to (Q-18) are preferable. These acid generators are used in an amount of 5 to 50 parts by weight, and particularly 5 to 30 parts by weight, based on 100 parts by weight of the polyisoimide, from the viewpoint of further suppressing film loss after heat treatment after exposure and maintaining a better contrast. It is preferable to mix them in parts. These acid generators can be used alone or in combination of two or more. Further, it is possible to combine a sensitizer having an action of absorbing the energy of radiation into the acid generator and transmitting the energy to the acid generator, thereby increasing the amount of acid generated.

Next, a method for forming a patterned film using the radiation-sensitive resin composition of the present invention will be described below. First, a solution (hereinafter, simply referred to as “photosensitive solution”) including polyisoimide, an acid generator and a solvent is prepared. This photosensitive solution may contain the polymerization solvent used for producing the polyisoimide as it is. Here, the solvent includes, in addition to the polymerization solvent, chloroform, dichloromethane, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane, 1,1. , 1,2-tetrachloroethane, 1,
1,2,2-tetrachloroethane, pentachloroethane,
Hexachloroethane, 1,1-dichloroethylene, 1,2
-Dichloroethylene, trichloroethylene, tetrachloroethylene, chlorobenzene, o-dichlorobenzene,
m-dichlorobenzene, P-dichlorobenzene, 1,2,
Halogen-based solvents such as 4-trichlorobenzene; ether-based solvents such as anisole, 1,4-dioxane, tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl etherno; ethyl ethoxypropionate, ethyl lactate, isoamyl acetate, ethyl acetate Examples thereof include ester solvents and the like. These solvents can be used alone or in combination.

The solid concentration of the photosensitive liquid is 1 to 70% by weight,
In particular, it is preferable that the amount is adjusted to 3 to 50% by weight. This photosensitive solution is spin-coated on a supporting substrate such as a glass substrate, a silicon wafer, and a copper-clad laminated plate, immersed,
It is applied by means such as spraying and dried at 50 to 110 ° C. to form a coating film. The thickness of the coating film can be adjusted in the range of 1 to 200 μm depending on the application means, the solid content concentration of the photosensitive solution, the viscosity, etc., but it is suitable to apply it to 3 to 50 μm. Then, the applied coating film is dried and then exposed through a pattern mask, and after exposure, preferably 10
Post-heating is performed at 0 to 200 ° C. for about 1 to 10 minutes. Radiation for exposure includes ultraviolet rays, visible rays, electron beams, X
Lines, deep ultraviolet rays, etc. can be used. Then, the exposed portion is dissolved and removed with a developing solution to obtain a positive type patterned film.

Examples of the developing solution include the above-mentioned solvents which are used when preparing a photosensitive solution including the polymerization solvent used for preparing polyisoimide. Solvents including these polymerization solvents can be used alone or in combination of two or more as a developing solution. Furthermore, solvents including these polymerization solvents and poor solvents for polyisoimide (for example, methanol, ethanol, isopropyl alcohol, benzene, acetone, methyl ethyl ketone, cyclohexanone, cyclopentanone, toluene,
A mixed solution with xylene, methyl cellosolve, water, etc.) can also be used as the developer.

Further, monoethanolamine, diethanolamine, triethanolamine, tetramethylammonium hydroxide, sodium carbonate, potassium carbonate,
An aqueous solution of a basic compound such as sodium phosphate, or a mixed solution of these aqueous solutions and the above solvent can also be used as the developing solution. Here, the concentration of the aqueous solution of the basic compound is usually 0.1 to 20% by weight, preferably 0.5 to
It is 10% by weight. When the poor solvent or the aqueous solution of the basic compound is mixed with the solvent, the amount used is 90 parts by weight or less based on 100 parts by weight of the solvent.

A negative patterned film using the radiation-sensitive resin composition of the present invention can be obtained by appropriately selecting the post-heating conditions and the type of developing solution.

The patterned film formed by development is rinsed with a rinse liquid to remove the developer. As the rinse liquid, a solvent that is miscible with the developer, for example, methanol, ethanol, isopropyl alcohol, benzene, toluene, xylene, methyl cellosolve, water or the like is appropriately selected and used. These can be used alone or in combination of two or more. The patterned film thus obtained is a pattern having heat resistance due to rearrangement of the remaining isoimide ring into an imide ring and further conversion of the amic acid unit into an imide ring by heat treatment at 150 to 450 ° C. It becomes a film.

[0042]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. In the examples,% is based on weight. Example 1 12 mmol 4,4'-DDE and 3,3'-DDS
4 mmol was placed in a flask, and NMP was added so that the concentration became 10% by weight. Stir this, 4,4'-DD
After dissolving E and 3,3′-DDS, with stirring,
16 mmol of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride was added and reacted at 65 ° C. for 7 hours to obtain a polyamic acid solution. NM in the polyamic acid solution
After P was added so that the concentration of polyamic acid was 5% by weight, 16.6 ml of a 50% by weight NMP solution of trifluoroacetic anhydride was added dropwise with vigorous stirring under ice cooling.
After the dropping, the reaction was terminated by stirring at 15 ° C. for 3 hours. The reaction mixture was added to 5 times the volume of dehydrated MIBK with stirring, and stirring was continued for 30 minutes to obtain a yellow powdery precipitate. The powdery precipitate obtained was filtered and dehydrated.
Wash twice with IBK, filter the yellow powder and wash at 50 ° C for 20
After vacuum drying for a period of time, a powdery polymer was obtained. The carboxyl group and alkoxycarbonyl group of the obtained polyisoimide, and the imide group and the isoimide group were quantified by an infrared spectrophotometer. The quantification results are shown in Table 1. Next, 2.0 g of the obtained polyisoimide was added to NMP14.0.
2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester (hereinafter referred to as "Q-10-1") as an acid generator.
Abbreviated. ) 0.4 g (corresponding to 20 parts by weight with respect to 100 parts by weight of polyisoimide) was added to obtain a uniform photosensitive solution. This photosensitive solution was spin-coated on a silicon wafer and dried at 90 ° C. to obtain a coating film having a film thickness of 10.0 μm.
The film thickness at this time is called the initial film thickness. Ultraviolet rays from a high-pressure mercury lamp is applied to this coating film through a pattern mask at 400 mJ /
cm ^{2 was} irradiated. Then, after heating at 100 ° C. for 5 minutes, development was performed with a 1.7 wt% tetramethylammonium hydroxide aqueous solution. After development, rinse with water,
When dried, a clear positive type patterned film was obtained. Then, the patterned film is subjected to 300 nm in a nitrogen atmosphere.
Heat treatment was performed at 5 ° C. for 5 minutes. When the film thickness after the heat treatment was measured, the film thickness was 7.9 μm, and the residual film thickness ratio (ratio of the film thickness after the heat treatment to the initial film thickness) was 79%.

Examples 2 to 7 Polyisoimides were synthesized in the same manner as in Example 1 except that the aromatic tetracarboxylic dianhydride and aromatic diamine shown in Table 1 were used as starting materials. The carboxyl group and alkoxycarboxyl group, and the imide group and the isoimide group of the obtained polyisoimide were quantified by an infrared spectrophotometer, and the results are shown in Table 1. Then, in the same manner as in Example 1, the acid generator shown in Table 2 (corresponding to 20 parts by weight with respect to 100 parts by weight of polyisoimide) was added to prepare a uniform photosensitive solution, which was spin-coated on a silicone wafer. Then, drying, exposure, heating and development were performed, and further heat treatment was performed to obtain a positive type patterned film.

Comparative Examples 1 to 6 Polyisoimides were synthesized in the same manner as in Example 1 except that the aromatic tetracarboxylic dianhydride and aromatic diamine shown in Table 1 were used as starting materials. The carboxyl group and alkoxycarbonyl group of the obtained polyisoimide, and the imide group and the isoimide group were quantified by an infrared spectrophotometer, and the results are shown in Table 1. Then, drying, exposure, heating and development are carried out in the same manner as in Example 1 with or without addition of the acid generator shown in Table 3 (amount corresponding to 20 parts by weight based on 100 parts by weight of polyisoimide). Tried. As a result, in Comparative Examples 1, 3, 4 and 6, the coating film could not be formed because the polyisoimide was not dissolved in NMP. Further, in Comparative Examples 2 and 5, it was difficult to form a coating film because the viscosity of the solution was too low, and a patterned film could not be obtained.

Comparative Example 7 50% by weight NM of trifluoroacetic anhydride as a dehydrating agent
A polyisoimide was synthesized in the same manner as in Example 7 except that the dropping amount of the P solution was changed to 4.5 ml, and the acid generator described in Table 3 (amount corresponding to 20 parts by weight with respect to 100 parts by weight of polyisoimide). In the same manner as in Example 1, an attempt was made to carry out drying, exposure, heating and development. As a result, even the unexposed portion was dissolved during development, and a patterned film could not be obtained.

The abbreviations used in Tables 1 to 3 are as follows. Aromatic tetracarboxylic dianhydride BTDA; 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride PMDA; Pyromellitic dianhydride Aromatic diamine DDE; Diaminodiphenyl ether DDS; Diaminodiphenylsulfone PPD; P -Phenylenediamine acid generator Q-10-1; 1,2-naphthoquinonediazide-5-sulfonic acid ester of 2,3,4-trihydroxybenzophenone Q-11-1; 2,3,4,4'-tetra 1,2-naphthoquinonediazide-5-sulfonic acid ester of hydroxybenzophenone Q-18-1; 1,1-di (4-hydroxyphenyl)
-1- [4- {1- (4-hydroxyphenyl) -1-
1,2-naphthoquinonediazide-5-sulfonic acid ester of methyl} ethylphenyl] ethane

[0047]

Since the patterned film formed from the radiation-sensitive resin composition of the present invention is composed of a polymer having a heat-resistant imide ring, it has excellent electrical properties and mechanical properties and can be directly insulated. It can be used as a material.
Moreover, when forming the patterned film, the problem of film loss is remarkably improved and the contrast is good.

[Table 1]

[Table 2]

[Table 3]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H01L 21/027 (72) Inventor Koji Ikeda 2-11-24 Tsukiji, Chuo-ku, Tokyo Japan Formed Inside Rubber Co., Ltd. (72) Hideetsu Fujiwara 2-11-24 Tsukiji, Chuo-ku, Tokyo Inside Synthetic Rubber Co., Ltd.

Claims (1)

[Claims] 1. (A) At least one aromatic tetracarboxylic dianhydride selected from pyromellitic dianhydride and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and diamino. The molar ratio of the three aromatic diamines of diphenyl sulfone, diaminodiphenyl ether and P-phenylenediamine is 10-90: 10-9.
A radiation-sensitive resin composition comprising a polyisoimide obtained mainly by reacting with an aromatic diamine mixture of 0: 0 to 35, and (B) a compound which exhibits acidity upon irradiation with radiation.