JPH0799777A - High-voltage power circuit - Google Patents

High-voltage power circuit

Info

Publication number
JPH0799777A
JPH0799777A JP5241415A JP24141593A JPH0799777A JP H0799777 A JPH0799777 A JP H0799777A JP 5241415 A JP5241415 A JP 5241415A JP 24141593 A JP24141593 A JP 24141593A JP H0799777 A JPH0799777 A JP H0799777A
Authority
JP
Japan
Prior art keywords
board
voltage power
voltage
sub
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5241415A
Other languages
Japanese (ja)
Other versions
JP3363540B2 (en
Inventor
Takashi Nakahara
隆 中原
Takashi Soya
隆志 征矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP24141593A priority Critical patent/JP3363540B2/en
Publication of JPH0799777A publication Critical patent/JPH0799777A/en
Application granted granted Critical
Publication of JP3363540B2 publication Critical patent/JP3363540B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Landscapes

  • Control Or Security For Electrophotography (AREA)
  • Dc-Dc Converters (AREA)

Abstract

PURPOSE:To obtain a high-voltage power circuit which can control a minute current as well and is of high precision and low cost by a construction wherein a block controlling and outputting a high voltage and the minute current is mounted as a two-storied sub-board on a main board of a high-voltage power source part. CONSTITUTION:A boosting-rectifying circuit part comprising capacitors and diodes for boosting, load resistors for discharge, resistors for output, etc., is mounted on a sub-board 5, and the sub-board is disposed, with the component side down, above a main board 6 of a high-voltage power source part with conductive support members J1, J2, J3 and J4 interposed. By using printed circuit boards being relatively inexpensive and having low insulation resistances, according to this constitution, it is made possible to control a high-voltage output precisely by a minute current and, besides, to make a device small in size.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば複写機、レーザ
プリンタ等の画像記録装置の静電写真プロセスに用いら
れる高圧電源回路に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-voltage power supply circuit used in an electrostatic photography process of an image recording device such as a copying machine or a laser printer.

【0002】[0002]

【従来の技術】従来、この種の静電写真プロセスに用い
られる高圧電源は、コロナ放電を発生させるために、約
10KVの高電圧が必要であり、その生成には、フライ
バックトランス等が用いられ、そのフライバックトラン
スの絶縁ケース上の端子から、直接高圧出力が、高圧電
線を介して高圧負荷に印加されていた。
2. Description of the Related Art Conventionally, a high voltage power supply used in this type of electrostatographic process requires a high voltage of about 10 KV to generate corona discharge, and a flyback transformer or the like is used to generate it. Then, the high-voltage output was directly applied to the high-voltage load from the terminal on the insulating case of the flyback transformer via the high-voltage wire.

【0003】[0003]

【発明が解決しようとする課題】近年、静電写真プロセ
スを用いた画像記録装置は、レーザプリンタに代表され
るように、小型化,低コスト化が進み、比較的低電圧
(1〜5KV)の印加で済む接触帯電プロセスが主流に
なりつつある。
In recent years, the image recording apparatus using the electrostatographic process has been reduced in size and cost, as represented by a laser printer, and has a relatively low voltage (1 to 5 KV). The contact charging process, which requires only the application of electricity, is becoming mainstream.

【0004】しかしながら、これら接触帯電プロセスは
数μAの低電流制御が必要条件と成り、絶縁体であるプ
リント基板の絶縁抵抗値が、微少電流制御においては無
視できなくなり、絶縁距離を大きくしたり、絶縁抵抗値
の高いプリント基板材料を用いなければならないという
問題点があった。
However, these contact charging processes require a low current control of several μA, and the insulation resistance value of the printed circuit board, which is an insulator, cannot be neglected in the micro current control, and the insulation distance is increased. There is a problem that a printed circuit board material having a high insulation resistance must be used.

【0005】本発明は、以上のような問題点にかんがみ
てなされたもので、比較的安価で絶縁抵抗値の低いプリ
ント基板材料を用いてこの種の高電圧出力を微少電流で
精度良く制御することができ、またこれら高電圧/微少
電流の出力端の絶縁抵抗を比較的小スペースで大きくす
ることのできる手段の提供を目的としている。
The present invention has been made in view of the above problems, and controls a high voltage output of this kind with a small current with high precision by using a relatively inexpensive printed circuit board material having a low insulation resistance value. It is also an object of the present invention to provide a means capable of increasing the insulation resistance at the output end of these high voltage / micro currents in a relatively small space.

【0006】[0006]

【課題を解決するための手段】このため、本発明におい
ては、高電圧,微少電流を制御,出力するブロックを高
圧電源部主基板上に2階建て副基板として実装するよう
構成することにより、前記目的を達成しようとするもの
である。
Therefore, in the present invention, a block for controlling and outputting a high voltage and a minute current is mounted as a two-story sub-board on the high-voltage power supply main board. It is intended to achieve the above object.

【0007】[0007]

【作用】以上のような本発明構成により、例えば低コス
トのインバータトランスを用いて昇圧回路により、5K
V程度の高圧を出力する場合、比較的低コストの例えば
紙フェノール等のプリント基板を用いて昇圧回路部を2
階建て副基板上に構成することにより、数μAの微少電
流をも制御可能な、高精度,低コストの高圧電源回路を
実現し得る。
With the above-described structure of the present invention, for example, a low-cost inverter transformer is used to boost the voltage to 5K
When outputting a high voltage of about V, the booster circuit unit is composed of a relatively low-cost printed circuit board such as paper phenol.
By constructing on a floor sub-board, it is possible to realize a high-accuracy, low-cost high-voltage power supply circuit capable of controlling even a minute current of several μA.

【0008】[0008]

【実施例】以下、本発明を実施例に基づいて説明する。
図1に、本発明に係るこの種の高圧電源回路の第1実施
例の一出力部分図を、また図2に、この実施例の2階建
て副基板の実装図を示す。図1において、1は出力制御
部、2,3は、各電圧制御部、4は静電写真プロセスの
等価高圧負荷である。Q1,Q2,Q3,Q4は、各ト
ランスT1,T2の制御および駆動用の各トランジス
タ、また、C1,C2,C3,C4,C5及び、D1,
D2,D3,D4,D5は、それぞれ昇圧用の各コンデ
ンサと各ダイオードである。R1,R2は放電用の各負
荷抵抗、R3は出力抵抗を示す。
EXAMPLES The present invention will be described below based on examples.
FIG. 1 shows an output partial view of a first embodiment of a high-voltage power supply circuit of this type according to the present invention, and FIG. 2 shows a mounting diagram of a two-story sub-board of this embodiment. In FIG. 1, 1 is an output control unit, 2 and 3 are voltage control units, and 4 is an equivalent high-voltage load in the electrostatographic process. Q1, Q2, Q3 and Q4 are transistors for controlling and driving the transformers T1 and T2, and C1, C2, C3, C4, C5 and D1,
D2, D3, D4 and D5 are boosting capacitors and diodes, respectively. R1 and R2 are load resistors for discharging, and R3 is an output resistor.

【0009】R7は、高圧負荷4を介し、GNDに流れ
る電流を検出するための検出抵抗である。J1,J2,
J3,J4は、図2に示す2階建て副基板5上に構成さ
れている昇圧回路部と、高圧電源部主基板6とを電気的
に接続するための導電性材料の各支持部材を示す。その
他の本発明実施例の説明に直接関与しない構成素子は説
明を省略する。
R7 is a detection resistor for detecting the current flowing through the GND via the high voltage load 4. J1, J2
Reference numerals J3 and J4 denote respective support members made of a conductive material for electrically connecting the booster circuit section formed on the two-story sub-board 5 shown in FIG. 2 and the high-voltage power supply main board 6. . Descriptions of other constituent elements not directly related to the description of the embodiments of the present invention will be omitted.

【0010】トランスT1及びトランスT2が昇圧さ
れ、各支持部材J1,J2,J3,J4を介して昇圧整
流回路部である副基板5に電圧が印加され、出力抵抗R
3を介して、高圧負荷4に高電圧が印加される。高圧負
荷を流れた電流はGNDラインを介して、検出抵抗R7
に流れ込む。検出抵抗R7に発生した電圧を基に各電圧
制御部2,3がトランスT1,T2の1次側に加える電
圧を制御し、高圧負荷に流れる電流を制御する。
The transformers T1 and T2 are boosted, and a voltage is applied to the sub-board 5 which is a boosting rectifier circuit section through the respective supporting members J1, J2, J3, J4, and the output resistance R
A high voltage is applied to the high voltage load 4 via 3. The current flowing through the high-voltage load is connected to the detection resistor R7 via the GND line.
Flow into. Based on the voltage generated in the detection resistor R7, the voltage control units 2 and 3 control the voltage applied to the primary side of the transformers T1 and T2 to control the current flowing in the high voltage load.

【0011】図2は、昇圧整流回路部である副基板5の
実装略図を示すもので、(a)図は副基板の斜視図、
(b)図はそれを反転した状態での装着図である。副基
板5上に搭載されている各部品には個々に符号は付して
いないが、いずれも図1におけるコンデンサC1,C
2,C3,C4,C5;ダイオードD1,D2,D3,
D4,D5;抵抗R1,R2,R3等に相等する各素子
である。この副基板5は(b)図に示すように、各支持
部材J1,J2,J3,J4を介して、高圧電源部主基
板6に部品面を下にした、(a)図の反転状態で実装さ
れている。
FIG. 2 shows a mounting schematic diagram of the sub-board 5 which is a boost rectification circuit section. FIG. 2 (a) is a perspective view of the sub-board,
FIG. 6B is a mounting view in which it is reversed. Each component mounted on the sub-board 5 is not individually labeled, but the capacitors C1 and C in FIG.
2, C3, C4, C5; diodes D1, D2, D3
D4, D5: Respective elements corresponding to the resistors R1, R2, R3, etc. As shown in FIG. 7B, the sub-board 5 has the component surface facing down to the main board 6 of the high-voltage power supply unit via the supporting members J1, J2, J3, and J4. It is implemented.

【0012】通常、紙フェノール等の比較的安価なプリ
ント基板は、高温高湿度下で、1010Ω程度の絶縁抵抗
値を有している。この絶縁抵抗値は、公知のように、各
部品が基板に接する面積が大きい程、また部品電極部の
距離が短い程小さくなる。高圧負荷に流れる電流の検出
部がGNDパターンであるため、高電圧を発生する昇圧
整流回路部が高圧電源主基板6上に存在した場合、高圧
電源主基板6上には、縦横無尽に多数のGNDパターン
が這い廻っているため、誤検知の原因となる可能性があ
る。従って、高電圧発生部は、極力GNDパターンが存
在する主基板上6の接触面積を少なくするのが望まし
い。特に高圧負荷4の抵抗値が大きいほど、電流制御精
度は低下する。
Usually, a relatively inexpensive printed circuit board such as paper phenol has an insulation resistance value of about 10 10 Ω under high temperature and high humidity. As is well known, this insulation resistance value becomes smaller as the area where each component contacts the substrate is larger and the distance between the component electrode portions is shorter. Since the detection unit of the current flowing through the high-voltage load has the GND pattern, when the boost rectification circuit unit that generates a high voltage is present on the high-voltage power supply main board 6, a large number of vertical and horizontal lines are provided on the high-voltage power supply main board 6. Since the GND pattern crawls around, it may cause erroneous detection. Therefore, it is desirable that the high-voltage generating unit reduces the contact area on the main substrate 6 where the GND pattern is present as much as possible. In particular, the greater the resistance value of the high voltage load 4, the lower the current control accuracy.

【0013】(第2実施例)図3は、本発明の第2の実
施例を示す実装図であり、回路構成は図1におけると同
様である。
(Second Embodiment) FIG. 3 is a mounting view showing a second embodiment of the present invention, and the circuit configuration is the same as that in FIG.

【0014】昇圧整流回路部が構成されている2階建て
の副基板5は、主基板6に、前記図2(b)と同様に、
はんだ付け面を上にして実装されている。P1は、パタ
ーンにはんだ塗布した電極端子である。P1は、図1に
おける出力抵抗R3を介した高圧出力端に相等し、コル
イばね形状を有する端子7を介して直接高圧負荷4に電
圧を印加する。高圧出力部がはんだ塗布したパターンで
あり、主基板6上に存在しないため、安価で漏洩電流の
少い出力部を構成し得る。
A two-story sub-board 5 having a step-up rectification circuit section is formed on the main board 6 in the same manner as in FIG. 2B.
Mounted with the soldering side up. P1 is an electrode terminal soldered on the pattern. P1 is equivalent to the high-voltage output terminal via the output resistor R3 in FIG. 1, and directly applies a voltage to the high-voltage load 4 via the terminal 7 having a Koly spring shape. Since the high-voltage output portion is a solder-applied pattern and does not exist on the main board 6, an inexpensive output portion with a small leakage current can be formed.

【0015】(第3実施例)図4は、前記第2実施例を
さらに実用的にした第3の実施例の実装図であり、
(a)図は分解斜視図、(b)図は装着図を示す。5は
2階建ての副基板、6は主基板、8は絶縁ケース、9
は、この絶縁ケース8から突出している保持支柱であ
る。(b)図は、高圧電源部を上記絶縁ケース8に装着
した図で、主基板6には(a)図に示すように、切抜き
穴10が穿設されており、絶縁ケース8に装着した状態
で保持支柱9が切抜き穴10から出て、副基板5に接触
する。副基板5は、各支持部材J1,J2,J3,J4
で電気的導通も兼ねて2階建て式に保持されているが、
(b)図に示すように、不図示の端子7(図3参照)か
らの機械的応力fによって押されているため、その力を
受けるために保持支柱9が作用する。さらに、保持支柱
9は、主基板6との接触を極力小さくすることが可能で
あり、また絶縁体でもあることから、電気的な特性,特
に漏洩電流には何ら影響を及ぼすことがない。
(Third Embodiment) FIG. 4 is a mounting view of a third embodiment in which the second embodiment is made more practical,
(A) is an exploded perspective view, (b) is a mounting view. 5 is a two-story sub-board, 6 is a main board, 8 is an insulating case, 9
Are holding columns protruding from the insulating case 8. FIG. 6B is a diagram in which the high-voltage power supply unit is mounted on the insulating case 8. The main board 6 is provided with a cutout hole 10 as shown in FIG. In this state, the holding column 9 comes out of the cutout hole 10 and comes into contact with the sub-board 5. The sub-board 5 is composed of the support members J1, J2, J3, J4.
It is held in a two-story style for electrical continuity,
(B) As shown in the figure, since it is pushed by the mechanical stress f from the terminal 7 (not shown) (see FIG. 3), the holding column 9 acts to receive the force. Further, since the holding column 9 can minimize the contact with the main substrate 6 and is also an insulator, it has no influence on the electrical characteristics, particularly the leakage current.

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
この種の高圧電源において、高電圧で微少電流を出力す
るブロックを、2階建て副基板上に構成し、高圧電源主
基板と、この2階建て副基板との連結に導電性を支持部
材を用い、この支持部材をも含めて高圧電源回路を構成
し、さらに、2階建て副基板上に、高圧出力端子を設け
るようにしたため、比較的安価で、絶縁抵抗の低いプリ
ント基板を用いて、高電圧出力を微少電流で精度良く制
御することが可能となった。また、高電圧,微少電流の
出力端の絶縁抵抗を大きくすることが比較的小さなスペ
ースで容易に構成でき、装置の小型化にも寄与し得る。
As described above, according to the present invention,
In this type of high-voltage power supply, a block for outputting a minute current at high voltage is constructed on a two-story sub-board, and a conductive support member is connected to the high-voltage power supply main board and the two-story sub-board. A high voltage power supply circuit including this supporting member is used, and a high voltage output terminal is provided on a two-story sub-board, so that a relatively inexpensive printed circuit board with low insulation resistance is used. It became possible to control the high voltage output with a small current with high precision. Further, it is possible to easily increase the insulation resistance at the output end of high voltage and minute current in a relatively small space, which can contribute to downsizing of the device.

【図面の簡単な説明】[Brief description of drawings]

【図1】 高圧電源回路の第1実施例の一出力部分図FIG. 1 is an output partial view of a first embodiment of a high voltage power supply circuit.

【図2】 第1実施例の2階建て副基板の実装図FIG. 2 is a mounting diagram of a two-story sub-board according to the first embodiment.

【図3】 第2実施例の実装図FIG. 3 is a mounting diagram of the second embodiment.

【図4】 第3実施例の実装図FIG. 4 is a mounting diagram of the third embodiment.

【符号の説明】[Explanation of symbols]

1 出力制御部 2,3 電圧制御部 4 高圧負荷 5 2階建て副基板 6 高圧電源主基板 8 絶縁ケース 9 保持支柱 J1,J2,J3,J4 支持部材 P1 電極端子 f 機械的応力 1 Output control part 2, 3 Voltage control part 4 High voltage load 5 Two-story sub board 6 High voltage power supply main board 8 Insulation case 9 Holding column J1, J2, J3, J4 Support member P1 Electrode terminal f Mechanical stress

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 静電写真プロセスに用いられる高圧電源
において、高電圧、微少電流を制御,出力するブロック
を、高圧電源部主基板上に2階建て副基板として構成し
たことを特徴とする高圧電源回路。
1. A high-voltage power supply used in an electrostatographic process, wherein a block for controlling and outputting a high voltage and a minute current is constructed as a two-story sub-board on the main board of the high-voltage power supply section. Power supply circuit.
【請求項2】 前記2階建て副基板上に静電写真写プロ
セス部に印加するための高圧出力端子を設けたことを特
徴とする請求項1記載の高圧電源回路。
2. The high-voltage power supply circuit according to claim 1, wherein a high-voltage output terminal for applying to the electrostatographic process section is provided on the two-story sub-board.
【請求項3】 前記2階建て副基板上の高圧出力端子
を、印刷パターンにはんだ塗布した構成としたことを特
徴とする請求項1記載の高圧電源回路。
3. The high-voltage power supply circuit according to claim 1, wherein the high-voltage output terminals on the two-story sub-board are solder-coated on a printed pattern.
【請求項4】 前記2階建て副基板を前記主基板上に保
持するための支持部材は、これら主基板と副基板とを電
気的に導通させる電気導通部材であることを特徴とする
請求項1記載の高圧電源回路。
4. The supporting member for holding the two-story sub-board on the main board is an electrically conductive member that electrically connects the main board and the sub-board. 1. The high voltage power supply circuit according to 1.
【請求項5】 前記高圧電源主基板を保持するための絶
縁ケースを有し、前記2階建て副基板上に加わる機械的
応力を軽減させるための前記絶縁ケースに保持支持を設
けたことを特徴とする請求項1記載の高圧電源回路。
5. An insulating case for holding the main board of the high-voltage power supply is provided, and holding support is provided to the insulating case for reducing mechanical stress applied on the two-story sub board. The high voltage power supply circuit according to claim 1.
JP24141593A 1993-09-28 1993-09-28 High voltage power supply circuit and image recording device Expired - Fee Related JP3363540B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24141593A JP3363540B2 (en) 1993-09-28 1993-09-28 High voltage power supply circuit and image recording device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24141593A JP3363540B2 (en) 1993-09-28 1993-09-28 High voltage power supply circuit and image recording device

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JPH0799777A true JPH0799777A (en) 1995-04-11
JP3363540B2 JP3363540B2 (en) 2003-01-08

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238372B1 (en) * 2008-07-24 2013-02-28 삼성전자주식회사 Apparatus for supplying high voltage power
US10497631B2 (en) 2015-08-03 2019-12-03 Murata Manufacturing Co., Ltd. Insulated DC-DC converter
CN111497618A (en) * 2019-01-23 2020-08-07 矢崎总业株式会社 Protection circuit unit and power supply device for vehicle
WO2021075171A1 (en) * 2019-10-18 2021-04-22 株式会社日立ハイテク Power supply module and mass spectrometry device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238372B1 (en) * 2008-07-24 2013-02-28 삼성전자주식회사 Apparatus for supplying high voltage power
US10497631B2 (en) 2015-08-03 2019-12-03 Murata Manufacturing Co., Ltd. Insulated DC-DC converter
CN111497618A (en) * 2019-01-23 2020-08-07 矢崎总业株式会社 Protection circuit unit and power supply device for vehicle
CN111497618B (en) * 2019-01-23 2023-08-01 矢崎总业株式会社 Protection circuit unit and power supply device for vehicle
WO2021075171A1 (en) * 2019-10-18 2021-04-22 株式会社日立ハイテク Power supply module and mass spectrometry device
JP2021069140A (en) * 2019-10-18 2021-04-30 株式会社日立ハイテク Power supply module and mass spectroscope

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