JPH0799133A - Feedthrough capacitor array - Google Patents

Abstract

PURPOSE:To provide a feedthrough capacitor array having lead terminals which are firmly supported by a holding member so that can be soldered perpendicular to a dielectric ceramic. CONSTITUTION:A feedthrough capacitor array has surface electrodes around a plurality of through holes 12 on one main surface of dielectric ceramic 11 having the through holes 12 and has rear electrodes 14 on the other main surface of the same ceramic 11, opposite to the surface electrodes 13. A plurality of lead terminals 15 are inserted through the through holes 12 of this dielectric ceramic 11. A holding member 17 has a plurality of through holes 18 corresponding to the positions of the through holes 12 of the dielectric ceramic 11. The lead terminals 15 are inserted through those through holes 18 and the holding member 17 is brought into contact with the other main surface of the dielectric ceramic 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to one of the electrodes provided by inserting lead terminals through a plurality of through holes provided in a dielectric ceramic and facing the main surface of the dielectric ceramic. The present invention relates to a feedthrough capacitor array in which lead terminals are conductively fixed.

[0002]

2. Description of the Related Art A conventional feedthrough capacitor array of this type is shown in FIGS. In the feedthrough capacitor array, a surface electrode 3 is provided around each of the through holes 2 on one main surface of a plate-shaped dielectric ceramic 1 having a plurality of through holes 2, and the other main surface of the dielectric ceramic 1 is provided. Further, a back surface electrode 4 is provided so as to face the front surface electrode 3. Then, the lead terminals 5 are inserted into the plurality of through-holes 2, respectively, and the bead-shaped holding member 7 is inserted into the lead terminals 5 led out to the other main surface side of the dielectric porcelain 1. 8 is applied to the other main surface of the dielectric ceramic 1. The through hole 8 of the holding member 7 through which the lead terminal 5 is inserted is tightly fitted into the lead terminal 5 and holds the lead terminal 5 perpendicularly to the surface of the dielectric ceramic 1. In this state, the lead terminal 5 is conductively fixed to the surface electrode 3 with the solder 6.

In this feedthrough capacitor array, the lead terminal 5 and the holding member 7 are passed through the holes provided in the chassis of the electronic device corresponding to the positions of the through holes 2 of the dielectric porcelain 1, and the back electrode 4 is placed on the chassis. Conductively fixed with solder or the like. Further, the lead terminal 5 is connected to the signal line between the circuit inside the chassis and the circuit outside. As a result, noise mixed in the signal line is released to the chassis and removed.

[0004]

In the conventional feedthrough capacitor array described above, each lead terminal 5 is inserted through a single holding member 7. The holding member 7 is in the form of beads having a small diameter. The holding force of the lead terminal 5 is extremely weak. That is, even if one end surface of the holding member 7 is strongly pressed against the back surface electrode 4 formed on the surface of the dielectric ceramic 1, since the diameter thereof is small, the force for suppressing the inclination of the lead terminal 5 is poor. Moreover, since the frictional force between the lead terminal 5 and the holding member 7 is small, it is difficult to fix the holding member 7 in a state where the holding member 7 is pressed against the surface of the dielectric ceramic 1. Therefore, like the lead terminal 5 and the holding member 7 on the left side in FIG. 4, the holding member 7 is displaced from the lead terminal 5, and they are inclined with respect to the dielectric ceramic 1. Then, in this state, the lead terminal 5 is fixed to the surface electrode 3 with the solder 6.

When the holding member 7 and the lead terminal 5 are fixed to the dielectric porcelain 1 in an inclined manner as described above, the holding member 7 does not enter the hole of the chassis and the lead terminals 5 are not spaced uniformly. Then, there was a problem that it interfered with connecting it to the circuit. Therefore, in view of the problems of the conventional feedthrough capacitor array, an object of the present invention is to provide a feedthrough capacitor array in which the holding force of the lead terminal by the holding member is strong and the lead terminal is not inclined from the dielectric ceramic.

[0006]

That is, according to the present invention,
In order to achieve the above object, a dielectric ceramic 11 having a plurality of through holes 12, a surface electrode 13 disposed around the through hole 12 on one main surface of the dielectric ceramic 11, and the dielectric A back surface electrode 14 provided on the other main surface of the body porcelain 11 so as to face the front surface electrode 13, and the plurality of through holes 12
A plurality of lead terminals 15 each of which is conductively fixed to the surface electrode 13 and a lead terminal 15 which is led out to the other main surface side of the dielectric ceramic 11 while being inserted into In a feedthrough capacitor array having a holding member 17 that holds the lead terminal 15 in contact with the other main surface of the porcelain 11, a plurality of holding members 17 are provided corresponding to the positions of the through holes 12 of the dielectric porcelain 11. Through holes 18, and a plurality of lead terminals 15 are provided in these through holes 18.
There is provided a feedthrough capacitor array in which a through capacitor is inserted.

[0007]

In the feedthrough capacitor array according to the present invention,
Since the plurality of lead terminals 15 are inserted into the plurality of through holes 18 provided in the holding member 17, the plurality of lead terminals 15 are held by the single holding member 17. Such a holding member 17 is larger than one in which the individual lead terminals 15 are inserted, and moreover, since a plurality of lead terminals 15 are inserted, the overall frictional force with respect to the lead terminals 15 is also large. Further, at least the lead terminals 15 inserted into the same holding member 17 are held in parallel with each other. For this reason, the lead terminal 5 does not incline with respect to the dielectric porcelain 11 without being displaced from the state in which the holding member 17 contacts the surface of the dielectric porcelain 11. Therefore, the lead terminal 15 is connected to the dielectric ceramic 11
It is fixed vertically to.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a feedthrough capacitor array according to an embodiment of the present invention, and its basic configuration is common to that of the conventional one. That is, the feedthrough capacitor array has a plate-shaped dielectric ceramic 11 having a plurality of through holes 12, and a surface electrode 13 is provided around each of the through holes 12 on one main surface of the dielectric ceramic. 11
A back surface electrode 14 is provided on the other main surface of the above so as to face the front surface electrode 13. The lead terminals 15 are inserted into the plurality of through holes 12, respectively, and the dielectric porcelain 11 shown in FIG.
The lead terminal 15 led out to the lower surface side is inserted into the bead-shaped holding member 17, and the holding member 18 contacts the back surface electrode 14 formed on the other main surface of the dielectric ceramic 11. The through hole 18 of the holding member 17 through which the lead terminal 15 is inserted has a tight fitting dimension with respect to the lead terminal 15, or the lead terminal 15 is partly flattened so that the lead terminal 15 is tightly fitted. It fits.
As a result, the lead terminal 15 is held perpendicular to the surface of the dielectric ceramic 11. In this state, the portion of the lead terminal 15 that is pulled out to the upper surface side of the dielectric porcelain 11 in the figure is conductively fixed to the surface electrode 13 with the solder 16.

Here, the holding member 17 of the illustrated embodiment is
The dielectric porcelain 11 has a plurality of through holes 12 corresponding to the plurality of through holes 12, that is, three through holes 18 in the illustrated embodiment, and each portion having these through holes 18 is integrally formed. For example, the one shown in FIG. 1 has a shape in which there are three cylindrical portions each having a through hole 18 in the center, and the portions facing each other are connected to each other. Such a holding member 17 is preferably made of a resin having an insulating property and elasticity, and particularly preferably made of a fluorine resin.

The holding member 17 as described above has a sufficiently large plane size as compared with a cylindrical member through which the individual lead terminals 15 are inserted. If a plurality of lead terminals 15 are inserted there, the overall frictional force on the lead terminals 15 also increases. Further, at least the three lead terminals 5 inserted into the same holding member 17 are held in parallel with each other.
For this reason, the holding member 17 is less likely to be displaced from the state of contacting the surface of the dielectric porcelain 11, and the lead terminal 5 is not
It is difficult to be inclined with respect to 1.

FIG. 2 shows another example of the shape of the holding member 17. 1A has three holes 18 as in the case of FIG. 1, but has a triangular shape with rounded corners, and the holes 18 are arranged near the corners. The same figure (b) has four holes 18, and the through hole 18
Opposite portions of the cylindrical portion having the are connected to each other and have a hole 19 in the central portion for weight reduction. FIG. 2C shows that the through hole 18 has two holes 18.
Opposing portions of the cylindrical portion having the shape have a shape in which they are connected to each other at a narrower portion. These are all molded integrally, but partly molded separately,
You may connect them by means, such as adhesion.

[0012]

As described above, according to the present invention, since the lead terminal 15 is unlikely to be inclined with respect to the dielectric ceramic 11, the lead terminal 15 is fixed to the dielectric ceramic 11 vertically. And the connection to the circuit of the lead terminal can be performed reliably.

[Brief description of drawings]

FIG. 1 is a partial exploded perspective view of a feedthrough capacitor array according to an embodiment of the present invention and a longitudinal sectional view of a main part of the assembled state.

FIG. 2 is a perspective view showing an example of a holding member used in the feedthrough capacitor array of the present invention.

FIG. 3 is a partially exploded perspective view of a feedthrough capacitor array according to a conventional example.

FIG. 4 is a vertical cross-sectional view of a main part of an assembling state of a feedthrough capacitor array according to the conventional example.

[Explanation of symbols]

 11 Dielectric Porcelain 12 Through Hole of Dielectric Porcelain 13 Front Surface Electrode 14 Back Surface Electrode 15 Lead Terminal 16 Solder 17 Holding Member 18 Through Hole of Holding Member

Claims (1)

[Reference No.] 0005029-01 [Claims] 1. A dielectric porcelain (11) having a plurality of through holes (12), and a surface electrode arranged around the through hole (12) on one main surface of the dielectric porcelain (11). (13)
And a back surface electrode (14) provided on the other main surface of the dielectric porcelain (11) so as to face the front surface electrode (13),
A plurality of lead terminals (15), which are respectively inserted into the plurality of through holes (12) and are electrically conductively fixed to the surface electrode (13), and lead to the other main surface side of the dielectric porcelain (11). In a feedthrough capacitor array having a lead member (15) inserted therein and a holding member (17) for holding the lead terminal (15) by being brought into contact with the other main surface of the dielectric ceramic (11). The holding member (17) has a plurality of through holes (18) corresponding to the positions of the through holes (12) of the dielectric ceramic (11), and these through holes (18)
A feedthrough capacitor array having a plurality of lead terminals (15) inserted therein.