JPH079508A - Disk board taking-out device and method - Google Patents

Abstract

PURPOSE:To enable stable continuous molding, by a method wherein yield is improved by controlling a warp of a disc board, and the hindrance by a sprue at the time of taking-out the disk is controlled. CONSTITUTION:In a taking-out device of a disc board 1, the disc board 1 which is molded within molds 4, 5 and a sprue 3 to be generated by a cutting punch 2 boring the central hole in the board 1 are taken out from the molds 4, 5 after mold opening, they are separated from each other and either put or through away on a fixed place, the taking-out device is constituted so that the taking-out device possesses a board separate device and a board taking-out device and when the disc board 1 is separated by a board separate device, the board 1 comes out to a taking-out side away from a punch 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk substrate takeout method and device for taking out a disk substrate for a record carrier such as an injection molded CD (compact disc) or an optical disc from a mold.

[0002]

2. Description of the Related Art A disk substrate for an optical record carrier such as an optical disk is generally formed by an injection molding method in which a resin such as polycarbonate is injected into a mold for molding in view of cost and mass productivity. . After the mold is opened, the disc substrate is punched out at the center hole by a cut punch, and peeled by peeling air blown out from an air slit. The disc substrate is taken out from the mold together with the sprue, and then the disc substrate is transferred to the next process or aligned in a magazine,
The sprue is discarded.

The disk substrate is usually taken out by using a take-out machine. The take-out machine is provided with a substrate suction plate, and this substrate suction plate sucks the disk substrate. The sprue is ejected by the eject pin, and is sprued by the ejector. In this state, it is common to take out both of them from the mold at the same time.

In order to perform such a conventional take-out method in a stable manner, the disc substrate should not be closer to the take-out machine than the sprue. If the disc substrate is taken out from the sprue on the side of the take-out machine, when the disc substrate and the sprue separating disc substrate are transferred to the magazine, the sprue will be caught on the disc substrate or the magazine, etc., and the alignment cannot be performed, resulting in defective take-out. Further, when the sprue is ejected by the eject pin, the disc substrate may collide with the disc substrate and may be peeled off from the substrate suction plate.

In order to satisfy such requirements, conventionally,
The disc substrate is usually supported by a cut punch or the like that opens the center hole so that the disc substrate does not come closer to the ejector side than the sprue at least near the center hole of the disc substrate.

This is because the cut punch punches out the center hole of the substrate and projects the sprue from the disc substrate to the ejector side. Therefore, if the disc substrate is supported by the cut punch or the like, the sprue is ejected from the disc substrate to the ejector side. This is because it can be taken out in a protruding form.

[0007]

However, in this state, the peeling air escapes from the outer peripheral portion of the disc substrate, so that the central hole of the disc substrate is pressed against the outer peripheral portion of the disc substrate while being supported by the fixed portion such as the cut punch. 2 is added, the disc substrate 1 is cut into punches 2 as shown in FIG.
There is a problem in that it may warp like a bowl with the center hole supported by the bottom as a bottom, which causes the disk substrate to warp.

The present invention has been made in view of the above points, and suppresses the warp of the disk substrate to improve the yield, and suppresses the obstacles due to the sprue at the time of taking out, and stable continuous molding is performed. The purpose is to do so.

[0009]

In order to achieve the above-mentioned object, the present invention is configured such that when the disk substrate is peeled off, the substrate is peeled off so as to come out from the cut punch to the take-out side.

Further, it is preferable to have a means for holding the central hole of the disk substrate so that the disk substrate can be taken out while holding the central hole.

Further, a plurality of openable / closable claws may be used as the center hole holding means.

Further, after the disk substrate is peeled off so as to come out from the cut punch to the take-out side, the substrate is taken out at the same time as the sprue, and the substrate is handed over to the next step while the substrate is leveled. It is good practice to drop the sprues and separate them.

[0013]

According to the first aspect of the invention, since the disk substrate is made to come out to the take-out side from the cut punch at the time of peeling, unnecessary pressure is not applied to the outer peripheral portion of the disk substrate, so that the disk substrate warps. Can be suppressed.

According to the second aspect of the invention, the disk substrate can be taken out with the center hole held, so that the substrate can be taken out stably.

Further, according to the third aspect of the invention, since the plurality of claws that can be opened and closed are used as the center hole holding means, the substrate can be easily held and released.

According to the invention of claim 4, the disk substrate is peeled off from the cut punch so as to come out to the take-out side, the substrate is taken out at the same time as the sprue, and then the substrate is transferred to the next step. The substrate was made horizontal, and at that time the sprue was dropped so that it could be separated.
Since the disc substrate and the sprue are separated without the sprue interfering with the disc substrate, stable continuous molding can be performed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be specifically described below with reference to the drawings.

FIG. 1 shows a peeled state of the disc substrate in the disc substrate removing method according to the present invention. The disc substrate 1 is punched out by the cut punch 2 and then peeled by the peeling air blown from an air slit (not shown). At this time, as shown in FIG. 1, the inner peripheral portion of the disk substrate 1 is separated from the cut punch 2, and the outer peripheral portion is supported by the mold 4.

At this time, the peeling air is blown out before the mold is opened, the pressure is preferably 4 kgf / cm ³ or more, and the flow rate is 30 Nl / min or more.

Table 1 shows the warpage of the substrate by the conventional mold releasing method and the mold releasing method of the present invention.

[Table 1] The warpage of the substrate is sufficiently suppressed as compared with the conventional one.

FIG. 3 is a schematic view showing an example of the disk substrate takeout device of the present invention. A substrate holder 7 for holding the center hole of the disc substrate 1 is mounted on the take-out machine 6, and a claw 8 for preventing the substrate from falling is provided at the tip of the substrate holder 7. Opening and closing of the substrate holder 7 is driven by an air cylinder, a motor or the like using a linkage (not shown).

FIG. 4 shows a state in which the substrate holder 7 is closed. FIG. 5 shows a front view of the claw 8 viewed from the substrate side at this time. In this state, the take-out machine 6 moves to the substrate take-out position as shown in the figure, and when it comes to the take-out position, the substrate holder 7 opens to hold the disc substrate 1. FIG. 3 shows this state. FIG. 6 shows a front view of the claw 8 viewed from the substrate side at this time. After that, the disk substrate 1 is taken out and passed to the next step. At this time, the sprue 3 may be taken out by a sprue holder (not shown) provided in the take-out machine 6, or may be ejected by an eject pin (not shown) after the disc substrate is taken out and naturally dropped.

FIG. 7 shows another example of the substrate holder. The substrate holder 7 is formed of an elastic body, and is configured to be bent by being restrained from the outer peripheral direction by a sleeve 9 or the like. The substrate holder 7 is opened by inserting the sleeve 9 toward the substrate, and the substrate holder 7 is closed by removing the sleeve 9.

FIG. 8 shows an example of a take-out device which holds a substrate and a sprue at the same time. Board holder 7
A fulcrum 10 is provided on the side, the sleeve 9 or the like is inserted on the side opposite to the substrate holding side, the substrate holding side is opened, and the sleeve side is closed to hold the sprue 3.

FIG. 9 shows another example of the take-out device which holds the substrate and the sprue at the same time. The substrate holder 7 is made of an elastic material, and the disc substrate 1 is held by opening the substrate holder 7 using the taper angle of the sprue 3. Further, the sprue is held by being sandwiched by the restoring force of the elastic body of the substrate holder 7. The disc substrate 1 is separated by inserting the sleeve 9 and projecting the sprue 3 and removing the sprue 3.

After the disc substrate and the sprue are taken out, the substrate is transferred to the next step. As shown in FIGS. 10 and 11, the disc machine 1 is moved by moving the take-out machine 6 so that the disc substrate 1 becomes horizontal. It is done by handing over. At this time, the sleeve is pulled out to separate the disc substrate 1 and the sprue 3 is naturally dropped. The substrate then flows to the next process or alignment machine.

[0027]

As described above, according to the disk substrate take-out device of the present invention, the disc base is made to come out from the cut punch to the take-out side at the time of peeling, so that unnecessary pressure is applied to the outer peripheral portion of the disc substrate. The warp of the disk substrate can be suppressed because it is free from the influence.

Further, since the disk substrate is taken out with the center hole held, the substrate can be taken out stably.

Further, since a plurality of openable / closable claws are used as the central hole holding means, the substrate can be easily held and opened.

Furthermore, after the disc substrate is peeled off so as to come out from the cut punch to the take-out side and the substrate is taken out at the same time as the sprue, the substrate is handed over to the next step while the substrate is leveled. Since the sprue is dropped so as to be separated, the sprue does not interfere with the disk substrate and the sprue is separated from the disk substrate, so that stable continuous molding can be performed.

[Brief description of drawings]

FIG. 1 is a sectional view showing an operation of an embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional disk substrate take-out device.

FIG. 3 is a schematic view showing an example of a disk substrate takeout device of the present invention.

FIG. 4 is a schematic view showing another operation of the example of the disk substrate take-out device of the present invention.

FIG. 5 is a front view showing an operation of a claw of an example of the disk substrate take-out device of the present invention.

FIG. 6 is a front view showing another operation of the claw of the example of the disk substrate take-out device of the present invention.

FIG. 7 is a sectional view showing an example of a substrate holder of the present invention.

FIG. 8 is a cross-sectional view showing another example of the substrate holder of the present invention.

FIG. 9 is a cross-sectional view showing another example of the substrate holder of the present invention.

FIG. 10 is a cross-sectional view showing an example of a delivery state of the disc substrate of the present invention.

FIG. 11 is a cross-sectional view showing another example of the delivery state of the disc substrate of the present invention.

[Explanation of symbols]

 1 Disk Substrate 2 Cut Punch 3 Sprue 4, 5 Mold 6 Takeout Machine 7 Substrate Holder 8 Claw 9 Sleeve 10 Support Point

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Claims (4)

[Claims] 1. A disk in which a disk substrate to be molded in a mold and a sprue formed by a cut punch for punching a center hole in the substrate are taken out of the mold after the mold is opened, and are separated from each other to be placed or discarded at a predetermined place. The substrate take-out device has a substrate peeling means and a substrate take-out means, and is configured to peel so that when the disc board is peeled by the substrate peeling means, the board is taken out from the cut punch to the take-out side. Disk substrate ejector 2. The disk substrate ejecting device according to claim 1, further comprising means for holding a center hole of the disk substrate, wherein the disk substrate is taken out while the center hole is held. Disk substrate ejector 3. The disk substrate ejecting device according to claim 2, wherein a plurality of openable / closable claws are used as the center hole holding means. 4. A method for removing a disk substrate, wherein a disk substrate and a sprue produced by a cut punch for making a center hole in the substrate are taken out from the mold after mold opening and are placed apart or disposed at a predetermined place by separating them from each other. The substrate is peeled off so as to come out from the cut punch to the take-out side, and the substrate is taken out at the same time as the sprue, and then the substrate is handed over to the next step with the substrate horizontal, and at that time, the sprue is dropped. Disk substrate take-out method characterized in that