JPH0766746A - Transmitter-receiver - Google Patents
Transmitter-receiverInfo
- Publication number
- JPH0766746A JPH0766746A JP5211730A JP21173093A JPH0766746A JP H0766746 A JPH0766746 A JP H0766746A JP 5211730 A JP5211730 A JP 5211730A JP 21173093 A JP21173093 A JP 21173093A JP H0766746 A JPH0766746 A JP H0766746A
- Authority
- JP
- Japan
- Prior art keywords
- transmission
- cover
- case
- reception
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
- G01S7/032—Constructional details for solid-state radar subsystems
Landscapes
- Transmitters (AREA)
- Transceivers (AREA)
- Structure Of Receivers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、送受信装置に関し、
特にレーダや通信に用いられるフェイズドアレイアンテ
ナ用素子として使用するマイクロ波集積回路等で構成さ
れる送受信装置の構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transmitting / receiving device,
In particular, the present invention relates to the structure of a transmitter / receiver including a microwave integrated circuit used as an element for a phased array antenna used for radar and communication.
【０００２】[0002]
【従来の技術】従来のこの種の送受信装置を図面を用い
て説明する。図９，図１０は、例えば、エリブルックナ
ー編の文献「アスペック オブ モダン レーダー」
アーテックハウス ボストン ロンドン発行(Eli Brook
ner, Editor 「ASPECTS OF MODERN RADAR」 ，Artech Hou
se Boston ・London p292〜293)に示された従来の受信装
置を説明するための平面図および断面図である。2. Description of the Related Art A conventional transmission / reception device of this type will be described with reference to the drawings. 9 and 10 show, for example, the document "Aspec of Modern Radar" edited by Eli Bruckner.
Published by Artec House Boston London (Eli Brook
ner, Editor "A SPECTS OF MODERN RADAR", Artech Hou
se Boston and London p292-293) are a plan view and a cross-sectional view for explaining a conventional receiving device.
【０００３】図において、１は送信系増幅器、２は受信
系増幅器、３は送受切換スイッチ、４は移相器、５は制
御回路、６は送受切換器、７ａ，７ｂは接続ライン基
板、８はケース、９はカバーで、ケース８およびカバー
９はアルミ等の金属材料で形成されている。また、１０
ａ，１０ｂはケース８の側壁に取り付けられた同軸コネ
クタ、１１はケース８の側壁に取り付けられた多極コネ
クタ、１２は開口部であり、図１０に示すようにケース
８には、カバー９が装着され密閉された電磁シールド構
造となっている。In the figure, 1 is a transmission system amplifier, 2 is a reception system amplifier, 3 is a transmission / reception changeover switch, 4 is a phase shifter, 5 is a control circuit, 6 is a transmission / reception changer, 7a and 7b are connection line substrates, 8 Is a case, 9 is a cover, and the case 8 and the cover 9 are made of a metal material such as aluminum. Also, 10
a and 10b are coaxial connectors attached to the side wall of the case 8, 11 is a multi-pole connector attached to the side wall of the case 8, and 12 is an opening. As shown in FIG. It has an electromagnetic shield structure that is attached and sealed.
【０００４】次に動作について説明する。まず、送信時
には、同軸コネクタ１０ａより入力された送信信号が接
続ライン基板７ａを通り移相器４に入力され、位相制御
された後、送受切換スイッチ３に入る。そして、送受切
換スイッチ３を経由した送信信号は、接続ライン基板７
ｂを通って送信系増幅器１に入力され、ここで増幅され
た後、送受切換器６を通って同軸コネクタ１０ｂから出
力され、開口部１２から空間へ送信信号が放射される。Next, the operation will be described. First, at the time of transmission, the transmission signal input from the coaxial connector 10a is input to the phase shifter 4 through the connection line substrate 7a, and the phase is controlled, and then the transmission / reception changeover switch 3 is entered. Then, the transmission signal passed through the transmission / reception changeover switch 3 is transmitted to the connection line board 7
The signal is input to the transmission system amplifier 1 through b, is amplified here, is output from the coaxial connector 10b through the transmission / reception switch 6, and the transmission signal is radiated into the space from the opening 12.
【０００５】一方、受信時には、開口部１２より入力さ
れた受信信号が、同軸コネクタ１０ｂを通り、送受切換
器６を介して受信系増幅器２に入力され、ここで増幅さ
れた後、接続ライン基板７ｂを介して送受切換スイッチ
３に入力される。そして、移相器４により、位相制御が
行われた後、接続ライン基板７ａを通って同軸コネクタ
１０ａから出力される。一方、制御回路５は多極コネク
タ１１から入力された制御信号に従い、送信系増幅器
１、受信系増幅器２、送受切換スイッチ３および移相器
４を駆動する信号を出力する。On the other hand, at the time of reception, a reception signal input from the opening 12 passes through the coaxial connector 10b, is input to the reception system amplifier 2 via the transmission / reception switch 6, is amplified here, and then is connected to the connection line substrate. It is input to the transmission / reception changeover switch 3 via 7b. Then, after the phase is controlled by the phase shifter 4, it is output from the coaxial connector 10a through the connection line substrate 7a. On the other hand, the control circuit 5 outputs a signal for driving the transmission system amplifier 1, the reception system amplifier 2, the transmission / reception changeover switch 3 and the phase shifter 4 according to the control signal input from the multipolar connector 11.
【０００６】[0006]
【発明が解決しようとする課題】上記のような従来の送
受信装置は以上のように、ケース８にカバー９が装着さ
れ密閉されて電磁シールド構造となっているが、ケース
８内部には複数個の集積回路が実装されているため、ケ
ース８内部のサイズが大きくなり、従ってケース８内部
空間の遮断周波数が低くなり、ケース８内部空間に発生
する導波管モードの伝達によってマイクロ波集積回路間
で干渉を起こしたり、さらには発振を起こしたりすると
いう問題点があった。As described above, the above-described conventional transmitter / receiver has an electromagnetic shield structure in which the cover 9 is attached to the case 8 and is hermetically sealed. , The internal size of the case 8 is increased, the cutoff frequency of the internal space of the case 8 is lowered, and the waveguide mode generated in the internal space of the case 8 is transmitted between the microwave integrated circuits. However, there is a problem in that it causes interference and further causes oscillation.
【０００７】この発明は上記のような問題点を解消する
ためになされたもので、マイクロ波集積回路間の干渉や
発振を防止することができる送受信装置を提供すること
を目的としている。The present invention has been made to solve the above problems, and an object thereof is to provide a transmitting / receiving apparatus capable of preventing interference and oscillation between microwave integrated circuits.
【０００８】[0008]
【課題を解決するための手段】この発明に係わる送受信
装置は、接地導体で周囲を囲まれたマイクロ波集積回路
とカバーとの間に、金属リングを設けることとした。In the transmitting / receiving apparatus according to the present invention, a metal ring is provided between the microwave integrated circuit surrounded by the ground conductor and the cover.
【０００９】また、接地導体で周囲を囲まれたマイクロ
波集積回路とカバーとの間に、バネ性の櫛形金属板を設
けることとした。Further, a comb-shaped metal plate having a spring property is provided between the microwave integrated circuit surrounded by the ground conductor and the cover.
【００１０】また、接地導体で周囲を囲まれたマイクロ
波集積回路とカバーとの間に、導電性繊維で被覆された
スポンジを設けることとした。Further, a sponge covered with conductive fibers is provided between the microwave integrated circuit surrounded by the ground conductor and the cover.
【００１１】さらに、この発明に係わる送受信装置は、
ケース中央部に仕切り金属板を設けることとした。Further, the transmitting / receiving device according to the present invention is
A partition metal plate is provided in the center of the case.
【００１２】[0012]
【作用】この発明の送受信装置は、マイクロ波集積回路
あるいはケースとカバーとの間に、金属リング，櫛形金
属板，導電性繊維で被覆されたスポンジまたは仕切り金
属板で接地導体を形成してケース空間を分割し、小さく
することにより、ケースの遮断周波数が高くなり、導波
管モードの伝達が抑制される。In the transmitter / receiver of the present invention, the ground conductor is formed between the microwave integrated circuit or the case and the cover by a metal ring, a comb-shaped metal plate, a sponge covered with conductive fibers or a partition metal plate. By dividing the space and making it smaller, the cutoff frequency of the case becomes higher and the transmission of the waveguide mode is suppressed.
【００１３】[0013]
【実施例】実施例１．以下、この発明の実施例を図面に
ついて説明する。図１，図２はこの発明の実施例１を説
明するための平面図および断面図であり、図において、
１は送信系増幅器、２は受信系増幅器、３は送受切換ス
イッチ、４は移相器、５は制御回路、６は送受切換器、
７ａ，７ｂは接続ライン基板、８はケース、９はカバー
で、このケース８およびカバー９はアルミ等の金属材料
で形成されている。１０ａ，１０ｂはケース８の側壁に
取り付けられた同軸コネクタ、１１はケース８の側壁に
取り付けられた多極コネクタ、１２は開口部であり、図
２に示すようにケース８には、カバー９が装着され密閉
された電磁シールド構造となっている。また、１３ａ，
１３ｂはそれぞれ送信系増幅器１および受信系増幅器２
と、カバー９との間に設けられた矩形状の金属リングで
あり、その上端部はカバー９に導電性接着剤あるいは半
田で固着されて接地導体を形成している。EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are a plan view and a cross-sectional view for explaining Embodiment 1 of the present invention.
1 is a transmission system amplifier, 2 is a reception system amplifier, 3 is a transmission / reception switch, 4 is a phase shifter, 5 is a control circuit, 6 is a transmission / reception switch,
7a and 7b are connection line substrates, 8 is a case, 9 is a cover, and the case 8 and the cover 9 are made of a metal material such as aluminum. Reference numerals 10a and 10b are coaxial connectors attached to the side wall of the case 8, 11 is a multi-pole connector attached to the side wall of the case 8, and 12 is an opening. As shown in FIG. It has an electromagnetic shield structure that is attached and sealed. Also, 13a,
13b is a transmission system amplifier 1 and a reception system amplifier 2 respectively.
And a cover 9 with a rectangular metal ring, the upper end of which is fixed to the cover 9 with a conductive adhesive or solder to form a ground conductor.
【００１４】次に動作について説明する。まず、送信時
には、同軸コネクタ１０ａより入力された送信信号が接
続ライン基板７ａを通り移相器４に入力され、位相制御
された後、送受切換スイッチ３に入る。そして、送受切
換スイッチ３を経由した送信信号は、接続ライン基板７
ｂを通って送信系増幅器１に入力され、ここで増幅され
た後、送受切換器６を通って同軸コネクタ１０ｂから出
力され、開口部１２から空間へ送信信号が放射される。Next, the operation will be described. First, at the time of transmission, the transmission signal input from the coaxial connector 10a is input to the phase shifter 4 through the connection line substrate 7a, and the phase is controlled, and then the transmission / reception changeover switch 3 is entered. Then, the transmission signal passed through the transmission / reception changeover switch 3 is transmitted to the connection line board 7
The signal is input to the transmission system amplifier 1 through b, is amplified here, is output from the coaxial connector 10b through the transmission / reception switch 6, and the transmission signal is radiated into the space from the opening 12.
【００１５】一方、受信時には、開口部１２より入力さ
れた受信信号が、同軸コネクタ１０ｂを通り、送受切換
器６を介して受信系増幅器２に入力され、ここで増幅さ
れた後、接続ライン基板７ｂを介して送受切換スイッチ
３に入力される。そして、移相器４により、位相制御が
行われた後、接続ライン基板７ａを通って同軸コネクタ
１０ａから出力される。一方、制御回路５は多極コネク
タ１１から入力された制御信号に従い、送信系増幅器
１、受信系増幅器２、送受切換スイッチ３および移相器
４を駆動する信号を出力する。On the other hand, at the time of reception, the reception signal input from the opening 12 passes through the coaxial connector 10b, is input to the reception system amplifier 2 via the transmission / reception switch 6, is amplified here, and then is connected to the connection line substrate. It is input to the transmission / reception changeover switch 3 via 7b. Then, after the phase is controlled by the phase shifter 4, it is output from the coaxial connector 10a through the connection line substrate 7a. On the other hand, the control circuit 5 outputs a signal for driving the transmission system amplifier 1, the reception system amplifier 2, the transmission / reception changeover switch 3 and the phase shifter 4 according to the control signal input from the multipolar connector 11.
【００１６】また、図１，図２に示すように、本実施例
１の送受信装置は、矩形状の金属リング１３ａ，１３ｂ
をカバー９に固着させた構造とすることにより、ケース
８内空間すなわちケース８の内壁間間隔を、図９，図１
０に示す従来の装置Ａより小さいＡ1 とすることがで
き、且つ、この間隔Ａ1 の大きさは、設計時に適当に選
択することができ、従ってケース８内の遮断周波数を高
くできる。すなわち、ケース８内壁間の間隔をＡ1 とし
た場合、遮断波長λｃは、λｃ＝２Ａ1 の関係になるた
め、この遮断波長λｃに対応する周波数（遮断周波数）
ｆｃを高くするには内壁間間隔をＡ1 のように小さくす
れば良く、具体的には間隔Ａ1 をこの送受信装置の動作
周波数の波長の１／２以下にすることで、マイクロ波集
積回路間の干渉や発振を充分おさえた装置とすることが
できる。Further, as shown in FIGS. 1 and 2, the transmitting / receiving apparatus of the first embodiment has rectangular metal rings 13a and 13b.
The structure in which the cover is fixed to the cover 9 makes it possible to reduce the space inside the case 8, that is, the distance between the inner walls of the case 8 as shown in FIG.
It is possible to make A 1 smaller than the conventional device A shown in 0, and the size of this interval A 1 can be appropriately selected at the time of design, and therefore the cutoff frequency in the case 8 can be increased. That is, when the distance between the inner walls of the case 8 is A 1 , the cutoff wavelength λc has a relationship of λc = 2A 1 , and therefore the frequency (cutoff frequency) corresponding to this cutoff wavelength λc.
In order to increase fc, the distance between the inner walls may be reduced to A 1 , and specifically, the distance A 1 may be set to ½ or less of the wavelength of the operating frequency of the transmitter / receiver, so that the microwave integrated circuit It is possible to provide a device with sufficiently suppressed interference and oscillation between them.
【００１７】実施例２．上記実施例１では、送信系増幅
器１及び受信系増幅器２とカバー９との間に金属リング
１３ａ，１３ｂを設けることとしたが、遮断周波数を高
くするためには接地導体を用いてケース８の内壁間間隔
を狭くすれば良く、例えば図３，図４に示すように、弾
性力を有するバスタブ状の櫛形金属板１４ａ，１４ｂを
送信系増幅器１及び受信系増幅器２の上面に導電性両面
テープあるいは導電性接着剤で固着し、カバー９を装着
した場合、この櫛形金属板１４ａ，１４ｂの上端がカバ
ー９の内面に接地導通するような構造としても良い。こ
の場合遮断周波数が決定されるケース８内の内壁間間隔
は図４に示すようにＡ2 と小さくすることができる。ま
た、このような構造とすることにより、電子機器たとえ
ば送受信系増幅器１，２とカバー９との間の導通が良好
な構造を得ることができる。Example 2. In the first embodiment described above, the metal rings 13a and 13b are provided between the transmission system amplifier 1 and the reception system amplifier 2 and the cover 9, but in order to increase the cutoff frequency, a ground conductor is used for the case 8. The distance between the inner walls may be narrowed. For example, as shown in FIGS. 3 and 4, bathtub-shaped comb-shaped metal plates 14a and 14b having an elastic force are attached to the upper surfaces of the transmission system amplifier 1 and the reception system amplifier 2 by a conductive double-sided tape. Alternatively, a structure may be adopted in which when the cover 9 is attached by fixing with a conductive adhesive, the upper ends of the comb-shaped metal plates 14a and 14b are grounded to the inner surface of the cover 9. In this case, the interval between the inner walls in the case 8 where the cutoff frequency is determined can be made as small as A 2 as shown in FIG. Further, with such a structure, it is possible to obtain a structure in which the electronic device, for example, the transmission / reception system amplifiers 1 and 2 and the cover 9 have good conduction.
【００１８】実施例３．図５，図６は、この発明の実施
例３を説明するための平面図および断面図であり、１５
ａ，１５ｂはそれぞれ導電性繊維で被覆したスポンジで
ある。この実施例３のように、送信系増幅器１及び受信
系増幅器２とカバー９との間に、導電性繊維で被覆した
スポンジ１５ａ，１５ｂを設け、このスポンジの一方の
面を導電性接着剤で固着するとともに、他方の面をスポ
ンジの弾性力で接触させ、ケース８の内壁間間隔をＡ3
に狭めて、送信系増幅器１及び受信系増幅器２とカバー
９とを接地導通する構造としても良い。このような構造
とすることにより、重量の増加を防ぎ、廉価な構造が得
られる。Example 3. 5 and 6 are a plan view and a sectional view for explaining the third embodiment of the present invention.
Reference characters a and 15b are sponges coated with conductive fibers. As in the third embodiment, sponges 15a and 15b coated with conductive fibers are provided between the transmission system amplifier 1 and the reception system amplifier 2 and the cover 9, and one surface of the sponge is coated with a conductive adhesive. While being fixed, the other surface is brought into contact with the elastic force of the sponge so that the space between the inner walls of the case 8 is A 3
The structure may be such that the transmission system amplifier 1 and the reception system amplifier 2 and the cover 9 are electrically grounded. With such a structure, an increase in weight can be prevented and an inexpensive structure can be obtained.
【００１９】実施例４．図７，図８はこの発明の実施例
４を説明するための平面図および断面図であり、図にお
いて、１６はケース８の中央部を加工して設けた肉厚の
薄い仕切りであり、このように仕切り１６を設け、仕切
り１６の上端部を導電性接着剤でカバー９に接着固定し
て接地導通させ、ケース８内の内壁間間隔の最大幅をＡ
4 としても上記実施例と同様な効果を奏する。Example 4. 7 and 8 are a plan view and a cross-sectional view for explaining a fourth embodiment of the present invention, in which 16 is a thin partition formed by processing the central portion of the case 8. The partition 16 is provided as described above, and the upper end portion of the partition 16 is bonded and fixed to the cover 9 with a conductive adhesive to make the ground conductive.
Even with 4 , the same effect as in the above embodiment can be obtained.
【００２０】なお、上記実施例１〜４では、送信系増幅
器１と受信系増幅器２とを別々に仕切る接地導体を設け
る構造を示したが、接地導体を設ける目的はケース８の
内壁間間隔を小さくすることにあり、従って送信系増幅
器１や受信系増幅器２等のマイクロ波集積回路を複数個
一体化したものと、カバー９との間の適当な位置に、接
地導体を１個あるいは複数個設ける構造としても同様の
効果を奏する。In the above-mentioned first to fourth embodiments, the structure in which the ground conductor for partitioning the transmission amplifier 1 and the reception amplifier 2 is provided separately is shown. Therefore, one or a plurality of ground conductors are provided at an appropriate position between the cover 9 and a plurality of microwave integrated circuits such as the transmission system amplifier 1 and the reception system amplifier 2 which are integrated. The same effect can be obtained with the structure provided.
【００２１】[0021]
【発明の効果】以上説明したようにこの発明は、カバー
とマイクロ波集積回路との間に生じるケース内の内壁間
間隔を接地導体で小さくする構造とすることにより、導
波管モードの伝達によるマイクロ波集積回路間の干渉を
少なくでき、発振を防止できる。As described above, according to the present invention, the structure in which the space between the inner walls in the case generated between the cover and the microwave integrated circuit is made small by the ground conductor is used to transmit the waveguide mode. It is possible to reduce interference between microwave integrated circuits and prevent oscillation.
【００２２】また、干渉や発振を防止するための他の構
造が不用となり、干渉や発振を防止できる小型の装置が
得られる等の効果がある。Further, there is an effect that another structure for preventing the interference and the oscillation is unnecessary, and a small device capable of preventing the interference and the oscillation can be obtained.
【図１】この発明の実施例１を説明するための平面図で
ある。FIG. 1 is a plan view for explaining a first embodiment of the present invention.
【図２】この発明の実施例１を説明するための断面図で
ある。FIG. 2 is a cross-sectional view for explaining the first embodiment of the present invention.
【図３】この発明の実施例２を説明するための平面図で
ある。FIG. 3 is a plan view for explaining the second embodiment of the present invention.
【図４】この発明の実施例２を説明するための断面図で
ある。FIG. 4 is a cross-sectional view for explaining the second embodiment of the present invention.
【図５】この発明の実施例３を説明するための平面図で
ある。FIG. 5 is a plan view for explaining the third embodiment of the present invention.
【図６】この発明の実施例３を説明するための断面図で
ある。FIG. 6 is a cross-sectional view for explaining the third embodiment of the present invention.
【図７】この発明の実施例４を説明するための平面図で
ある。FIG. 7 is a plan view for explaining the fourth embodiment of the present invention.
【図８】この発明の実施例４を説明するための断面図で
ある。FIG. 8 is a cross-sectional view for explaining the fourth embodiment of the present invention.
【図９】従来の装置を説明するための平面図である。FIG. 9 is a plan view for explaining a conventional device.
【図１０】従来の装置を説明するための断面図である。FIG. 10 is a cross-sectional view for explaining a conventional device.
１ 送信系増幅器 ２ 受信系増幅器 ３ 送受切換スイッチ ４ 移相器 ５ 制御回路 ６ 送受切換器 ７ａ，７ｂ 接続ライン基板 ８ ケース ９ カバー １０ａ，１０ｂ 同軸コネクタ １１ 多極コネクタ １２ 開口部 １３ａ，１３ｂ 金属リング １４ａ，１４ｂ 櫛形金属板 １５ａ，１５ｂ 導電性繊維で被覆したスポンジ １６ 仕切り 1 Transmitting system amplifier 2 Receiving system amplifier 3 Transmission / reception selector switch 4 Phase shifter 5 Control circuit 6 Transmission / reception selector 7a, 7b Connection line board 8 Case 9 Covers 10a, 10b Coaxial connector 11 Multipole connector 12 Openings 13a, 13b Metal ring 14a, 14b Comb-shaped metal plates 15a, 15b Sponge coated with conductive fibers 16 Partition
Claims (5)
に、送信系増幅器，受信系増幅器，送受切換スイッチ，
移相器，制御回路，送受切換器，接続ライン基板など、
マイクロ波デバイスやその他の電子機器を組み込んでな
る送受信装置において、 組み込まれた電子機器とケースとの間に生じる空間距離
を小さくし遮断周波数を高くするために、電子機器とカ
バーとの間にこのカバーと電気的に導通させた金属リン
グを挿入してこの間に接地導体を形成したことを特徴と
する送受信装置。1. A transmission system amplifier, a reception system amplifier, a transmission / reception changeover switch, in a case and a cover for shielding electromagnetic waves.
Phase shifters, control circuits, duplexers, connection line boards, etc.
In a transmission / reception device incorporating a microwave device or other electronic equipment, in order to reduce the spatial distance generated between the incorporated electronic equipment and the case and increase the cutoff frequency, this device is installed between the electronic equipment and the cover. A transmitter / receiver characterized in that a metal ring electrically connected to the cover is inserted and a ground conductor is formed between the metal ring and the cover.
に、送信系増幅器，受信系増幅器，送受切換スイッチ，
移相器，制御回路，送受切換器，接続ライン基板など、
マイクロ波デバイスやその他の電子機器を組み込んでな
る送受信装置において、 組み込まれた電子機器とケースとの間に生じる空間距離
を小さくし遮断周波数を高くするために、電子機器とカ
バーとの間にこのカバーと電気的に導通させた櫛形金属
板を挿入してこの間に接地導体を形成したことを特徴と
する送受信装置。2. A transmission system amplifier, a reception system amplifier, a transmission / reception changeover switch, in a case and a cover for shielding electromagnetic waves.
Phase shifters, control circuits, duplexers, connection line boards, etc.
In a transmission / reception device incorporating a microwave device or other electronic equipment, in order to reduce the spatial distance generated between the incorporated electronic equipment and the case and increase the cutoff frequency, this device is installed between the electronic equipment and the cover. A transmitter / receiver characterized in that a comb-shaped metal plate electrically connected to the cover is inserted and a grounding conductor is formed between them.
に、送信系増幅器，受信系増幅器，送受切換スイッチ，
移相器，制御回路，送受切換器，接続ライン基板など、
マイクロ波デバイスやその他の電子機器を組み込んでな
る送受信装置において、 組み込まれた電子機器とケースとの間に生じる空間距離
を小さくし遮断周波数を高くするために、電子機器とカ
バーとの間にこのカバーと電気的に導通させた導電性繊
維で被覆したスポンジを挿入してこの間に接地導体を形
成したことを特徴とする送受信装置。3. A transmission system amplifier, a reception system amplifier, a transmission / reception changeover switch, in a case and a cover for blocking electromagnetic waves.
Phase shifters, control circuits, duplexers, connection line boards, etc.
In a transmission / reception device incorporating a microwave device or other electronic equipment, in order to reduce the spatial distance generated between the incorporated electronic equipment and the case and increase the cutoff frequency, this device is installed between the electronic equipment and the cover. A transmitter / receiver characterized in that a sponge covered with a conductive fiber electrically connected to the cover is inserted and a ground conductor is formed therebetween.
に、送信系増幅器，受信系増幅器，送受切換スイッチ，
移相器，制御回路，送受切換器，接続ライン基板など、
マイクロ波デバイスやその他の電子機器を組み込んでな
る送受信装置において、 組み込まれた電子機器とケースとの間に生じる空間距離
を小さくし遮断周波数を高くするために、ケース内部の
略中央位置にケースと一体形成した仕切りを設け、この
仕切りと上記カバーとを導通させて接地導体を形成した
ことを特徴とする送受信装置。4. A transmission system amplifier, a reception system amplifier, a transmission / reception changeover switch, in a case and a cover for shielding electromagnetic waves.
Phase shifters, control circuits, duplexers, connection line boards, etc.
In a transmitter / receiver that incorporates a microwave device and other electronic equipment, in order to reduce the spatial distance between the incorporated electronic equipment and the case and increase the cutoff frequency, the case is placed approximately at the center of the case. A transmitter / receiver characterized in that an integrally formed partition is provided, and the partition and the cover are electrically connected to each other to form a ground conductor.
導電性繊維で被覆したスポンジ，上記仕切りを挿入する
ことで上記電子機器とケースとの間に生じる空間距離の
最大をこの送受信装置の動作周波数の波長の１／２以下
とすることを特徴とする請求項第１項〜第４項いずれか
に記載の送受信装置。5. By inserting the metal ring, the comb-shaped metal plate, the sponge coated with the conductive fibers, and the partition, the maximum spatial distance generated between the electronic device and the case is determined by the operation of the transceiver. The transmission / reception device according to any one of claims 1 to 4, wherein the frequency is set to 1/2 or less of a wavelength of the frequency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21173093A JP3280479B2 (en) | 1993-08-26 | 1993-08-26 | Transceiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21173093A JP3280479B2 (en) | 1993-08-26 | 1993-08-26 | Transceiver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0766746A true JPH0766746A (en) | 1995-03-10 |
| JP3280479B2 JP3280479B2 (en) | 2002-05-13 |
Family
ID=16610650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21173093A Expired - Fee Related JP3280479B2 (en) | 1993-08-26 | 1993-08-26 | Transceiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3280479B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614389B2 (en) | 2001-11-19 | 2003-09-02 | Hitachi, Ltd. | Vehicle-onboard signal processing device and vehicle-onboard radar system |
| US7599667B2 (en) | 2003-12-17 | 2009-10-06 | Kabushiki Kaisha Toshiba | Wireless communication apparatus and semiconductor device |
-
1993
- 1993-08-26 JP JP21173093A patent/JP3280479B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614389B2 (en) | 2001-11-19 | 2003-09-02 | Hitachi, Ltd. | Vehicle-onboard signal processing device and vehicle-onboard radar system |
| US7019685B2 (en) | 2001-11-19 | 2006-03-28 | Hitachi, Ltd. | Vehicle-onboard signal processing device and vehicle-onboard radar system |
| US7142151B2 (en) | 2001-11-19 | 2006-11-28 | Hitachi, Ltd. | Vehicle-onboard signal processing device and vehicle-onboard radar system |
| US7599667B2 (en) | 2003-12-17 | 2009-10-06 | Kabushiki Kaisha Toshiba | Wireless communication apparatus and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3280479B2 (en) | 2002-05-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |