JPH0760972A - Manufacture of ink jet head - Google Patents
Manufacture of ink jet headInfo
- Publication number
- JPH0760972A JPH0760972A JP21432193A JP21432193A JPH0760972A JP H0760972 A JPH0760972 A JP H0760972A JP 21432193 A JP21432193 A JP 21432193A JP 21432193 A JP21432193 A JP 21432193A JP H0760972 A JPH0760972 A JP H0760972A
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- nozzle
- ink
- water repellency
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インクジェットヘッド
の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an ink jet head.
【０００２】[0002]
【従来の技術】インクジェットヘッドの一般的な流路基
板の構成は、流路溝を形成してある面に蓋板を被せてイ
ンク流路を作り、インク流路の先端にノズル部を設けて
ある。インク流路の途中には加圧室が設けてあり、これ
らの加圧室と対向する流路基板または蓋板の外面に圧電
素子を設け、加圧室内のインクにエネルギーを付与可能
にしてある。2. Description of the Related Art A general flow path substrate of an ink jet head has a structure in which an ink flow path is formed by covering a surface on which a flow path groove is formed with an ink flow path, and a nozzle portion is provided at a tip of the ink flow path. is there. A pressure chamber is provided in the middle of the ink flow path, and a piezoelectric element is provided on the outer surface of the flow path substrate or cover plate facing these pressure chambers so that energy can be applied to the ink in the pressure chamber. .
【０００３】加圧室でエネルギーを付与されたインク
は、細いインク流路を通ってノズル部から吐出される。
インク流路内のインクは、毛細管現象によって進行する
ため、インク流路は親水性が高いことが望ましい。その
ため、インク流路を構成する部材には親水性の高い材料
を採用し、または親水性を高くするために親水性処理を
施したりしている。これに対し、ノズル部は、インクを
ノズルの先端から分離して、勢いよく飛び出させるため
には撥水性が高いことが望まれている。このため、ノズ
ル部を構成する部材として撥水性の高い材料を用い、親
水性が高い流路基板を構成する部材と、撥水性が高いノ
ズル部を構成する部材とを積層することが行われてい
る。Ink to which energy is applied in the pressurizing chamber is ejected from the nozzle portion through a narrow ink flow path.
Since the ink in the ink flow path progresses by a capillary phenomenon, it is desirable that the ink flow path has high hydrophilicity. Therefore, a material having a high hydrophilicity is adopted for the member forming the ink flow path, or a hydrophilic treatment is applied to increase the hydrophilicity. On the other hand, the nozzle portion is required to have high water repellency in order to separate the ink from the tip of the nozzle and forcefully eject the ink. Therefore, a material having high water repellency is used as a member forming the nozzle portion, and a member forming the channel substrate having high hydrophilicity and a member forming the nozzle portion having high water repellency are laminated. There is.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記したよう
に、流路基板とノズル部とを別部材によって構成する
と、インクジェットヘッドの部品点数が増え、かつ組み
立て工数も増えるのでコスト高の原因となっている。However, as described above, if the flow path substrate and the nozzle section are formed by separate members, the number of parts of the ink jet head and the number of assembling steps increase, which causes a high cost. ing.
【０００５】本発明の目的は、ノズル部を流路基板と一
体とし、インク流路は親水性が高く、そしてノズル部は
撥水性を高くする処理を施すことにより、性能の秀れた
インクジェットヘッドを安価に製造可能にすることにあ
る。An object of the present invention is to provide an ink jet head having excellent performance by integrating the nozzle portion with the flow path substrate, the ink flow path is highly hydrophilic, and the nozzle part is treated to have high water repellency. Is to be manufactured at low cost.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明のインクジェットヘッドの製造方法は、流
路基板にインク流路部及びノズル部を形成する工程と、
インク流路部に表面処理により親水性を施す親水性処理
工程と、ノズル部に表面処理により撥水性を施す撥水性
処理工程とを含むところに特徴がある。In order to achieve the above object, a method of manufacturing an ink jet head according to the present invention comprises a step of forming an ink flow path part and a nozzle part on a flow path substrate,
It is characterized in that it includes a hydrophilic treatment step of imparting hydrophilicity to the ink flow path portion by surface treatment and a water repellent treatment step of imparting water repellency to the nozzle portion by surface treatment.
【０００７】撥水性処理工程としては、無電解複合メッ
キ法によりノズル部に撥水性を有する物質を共析させる
か、あるいは無電解メッキ法によりノズル部をメッキ処
理した後に電着法によりノズル部に撥水性を有する物質
を析出させることが望ましい。As the water repellent treatment step, a substance having water repellency is co-deposited on the nozzle portion by electroless composite plating, or the nozzle portion is plated by the electroless plating method and then deposited on the nozzle portion by electrodeposition. It is desirable to deposit a substance having water repellency.
【０００８】[0008]
【作用】流路基板に形成されたインク流路部に親水性処
理を施して、インクの流通を促進し、同じ流路基板に形
成されたノズル部に撥水性処理を施すことにより、イン
クの噴出を容易にする。したがって、同一の流路基板に
親水性を有するインク流路部と撥水性を有するノズル部
とを設けることができ、性質の相反するものでも別部材
とする必要がなく、インクジェットヘッド構成が簡単に
なる。The ink flow path portion formed on the flow path substrate is subjected to a hydrophilic treatment to promote the flow of ink, and the nozzle portion formed on the same flow path substrate is subjected to a water repellent treatment. Makes the gush easier. Therefore, it is possible to provide the hydrophilic ink flow channel portion and the water repellent nozzle portion on the same flow channel substrate, and it is not necessary to use separate members even if they have contradictory properties, and the inkjet head configuration can be simplified. Become.
【０００９】撥水性処理工程として、無電解複合メッキ
法によりノズル部に撥水性を有する物質を共析させれ
ば、ノズル部の撥水性が一層向上する。In the water repellent treatment step, if a substance having water repellency is co-deposited on the nozzle portion by electroless composite plating, the water repellency of the nozzle portion is further improved.
【００１０】また、撥水性処理工程として、無電解メッ
キ法によりノズル部をメッキ処理した後に電着法によ
り、ノズル部に撥水性を有する物質を析出させれば、ノ
ズル部の撥水性がより一層向上する。Further, in the water repellent treatment step, if a substance having water repellency is deposited on the nozzle portion by the electrodeposition method after the nozzle portion is plated by the electroless plating method, the water repellency of the nozzle portion is further improved. improves.
【００１１】[0011]
【実施例】以下本発明の実施例について図面を参照して
説明する。本発明に係るインクジェットヘッドは、流路
基板に形成されたインク流路に親水性処理を施し、ノズ
ル部に撥水性処理を施すところに特徴があり、他の一般
的構成については従来技術と同様の構成及び製造法を採
用しているので、ここでは、流路基板についてのみ説明
することとする。Embodiments of the present invention will be described below with reference to the drawings. The inkjet head according to the present invention is characterized in that the ink flow path formed on the flow path substrate is subjected to a hydrophilic treatment and the nozzle portion is subjected to a water repellent treatment, and other general configurations are the same as those of the prior art. Since the configuration and the manufacturing method are adopted, only the flow path substrate will be described here.
【００１２】図４に示すように、流路基板１は円板部１
ａの両側に組み立て用の突部１ｂ，１ｂを有し、板面に
は２４本のインク流路部２が放射状に設けてある。流路
基板１としては、メッキ処理が容易なＡＢＳ樹脂の射出
成形品を採用している。各インク流路部２には、流路基
板１の縁部１ｃの内側に沿って、図示しない蓋板に設け
られたインク供給孔と連通するインク受け部２ａが形成
されている。また、受け部２ａに続いて設けられた加圧
室２ｂ及び加圧室からインクを流路基板１の中心部に向
けて導く流出部２ｃが形成してある。各流出部２ｃの先
端部には、紙面に垂直方向に貫通するノズル部３…が形
成してある。各ノズル部３は、流路基板１の板厚方向に
垂直に設けられており、入り口部３ａを大きくし、出口
部３ｂを小さくするテーパ状に形成してある（図２参
照）。As shown in FIG. 4, the flow path substrate 1 has a disc portion 1
Assembling projections 1b and 1b are provided on both sides of a, and 24 ink flow passages 2 are radially provided on the plate surface. The flow path substrate 1 is an ABS resin injection-molded product that is easy to plate. An ink receiving portion 2a, which communicates with an ink supply hole provided in a lid plate (not shown), is formed in each ink flow passage portion 2 along the inner side of the edge portion 1c of the flow passage substrate 1. Further, a pressure chamber 2b provided subsequent to the receiving portion 2a and an outflow portion 2c for guiding the ink from the pressure chamber to the central portion of the flow path substrate 1 are formed. Nozzle portions 3 ... Penetrating in the direction perpendicular to the plane of the drawing are formed at the tip of each outflow portion 2c. Each nozzle portion 3 is provided perpendicularly to the plate thickness direction of the flow path substrate 1, and is formed in a tapered shape that enlarges the inlet portion 3a and reduces the outlet portion 3b (see FIG. 2).
【００１３】これらの各インク流路部２には、親水性処
理が施してあり、ノズル部３の出口部３ｂには、撥水性
処理が施してある。流路基板１のインク流路部側１ｅに
は、図示しない蓋板が被せてあり、その上にさらに図示
しないインクプール基板が積層してある。Each of these ink flow path portions 2 is subjected to a hydrophilic treatment, and the outlet portion 3b of the nozzle portion 3 is subjected to a water repellent treatment. The ink flow path portion side 1e of the flow path substrate 1 is covered with a cover plate (not shown), and an ink pool substrate (not shown) is further laminated thereon.
【００１４】次に流路基板の製造方法について説明す
る。流路基板１は、ＡＢＳ樹脂の射出成形により製造す
る。このとき、インク流路部２及びノズル部３も同時に
形成される。Next, a method of manufacturing the flow path substrate will be described. The flow path substrate 1 is manufactured by injection molding of ABS resin. At this time, the ink flow path portion 2 and the nozzle portion 3 are also formed at the same time.
【００１５】次にインク流路部２に親水性処理を施す。
親水性処理工程は、クロム酸・硫酸液中に流路基板１全
体を浸漬し、流路基板全体を洗浄することにより行われ
る。クロム酸・硫酸により表面が活性化し、このクロム
酸・硫酸に浸漬された流路基板全体の表面に親水性が付
与される。この結果、流路基板１のインク流路部２の親
水性が向上するとともに、ノズル面側１ｄのメッキ処理
も容易になる。Next, the ink flow path portion 2 is subjected to a hydrophilic treatment.
The hydrophilic treatment step is performed by immersing the entire channel substrate 1 in a chromic acid / sulfuric acid solution and washing the entire channel substrate. The surface is activated by chromic acid / sulfuric acid, and hydrophilicity is imparted to the entire surface of the flow path substrate immersed in this chromic acid / sulfuric acid. As a result, the hydrophilicity of the ink flow path portion 2 of the flow path substrate 1 is improved, and the plating process on the nozzle surface side 1d is facilitated.
【００１６】次に、流路基板１のノズル部３の撥水性処
理工程は、流路基板のノズル面側１ｄに無電解複合メッ
キを施すことにより行われる。Next, the water repellent treatment step of the nozzle portion 3 of the flow path substrate 1 is performed by applying electroless composite plating to the nozzle surface side 1d of the flow path substrate.
【００１７】無電解複合メッキは、Ｎｉ−Ｐ溶液中にノ
ズル面だけを静かに浸漬することにより行われる。図１
に示すように、このメッキ処理により流路基板１のノズ
ル面１ｄ及びノズルの出口部３ｂにのみ、Ｎｉ−Ｐのメ
ッキ層からなる撥水性を有する物質の層４が形成され
る。このとき、ノズル部３の出口部３ｂの直径は数十μ
ｍと微小なものであるため、メッキ液を強制的に循環さ
せない限り内部にはメッキがつかないので、ノズル面側
１ｄ及びノズル部の出口部３ｂにだけメッキが施され
る。The electroless composite plating is performed by gently immersing only the nozzle surface in the Ni-P solution. Figure 1
As shown in FIG. 5, by this plating process, the water-repellent substance layer 4 made of the Ni-P plating layer is formed only on the nozzle surface 1d of the flow path substrate 1 and the nozzle outlet portion 3b. At this time, the diameter of the outlet portion 3b of the nozzle portion 3 is several tens of μ.
Since it is so small as to be m, plating cannot be applied to the inside unless the plating solution is forcedly circulated. Therefore, only the nozzle surface side 1d and the outlet portion 3b of the nozzle portion are plated.
【００１８】無電解複合メッキ法として、ふっ素樹脂の
粒子を共析させるメッキ液を用いると、ノズル部３の出
口部３ｂの内周面に撥水性の高いふっ素樹脂が共析して
被覆するためノズル部の撥水性を向上させることができ
る。When a plating solution for co-depositing fluororesin particles is used as the electroless composite plating method, the highly water-repellent fluororesin is codeposited and coated on the inner peripheral surface of the outlet 3b of the nozzle section 3. The water repellency of the nozzle part can be improved.
【００１９】他の実施例として、図３に示すように、流
路基板１１のノズル面に無電解メッキ層１４を形成し、
さらにその上に電着塗装により、撥水性の高い物質、例
えばアクリル系あるいはアミノアルキド樹脂系などの物
質１５を被覆する。こうすると、ノズル部１３の撥水性
が向上し、さらにインクの吐出が良好になる。As another embodiment, as shown in FIG. 3, an electroless plating layer 14 is formed on the nozzle surface of the flow path substrate 11,
Further, a material 15 having high water repellency, for example, a material 15 such as an acrylic type or aminoalkyd resin type is coated thereon by electrodeposition coating. By doing so, the water repellency of the nozzle portion 13 is improved, and the ink ejection is improved.
【００２０】無電解メッキ層１４は、電着塗装の下地処
理としてのみ機能させる場合には、Ｃｕなどの金属メッ
キ層であれば何でもよいが、ふっ素樹脂など撥水性の高
い物質を共析させた無電解メッキ層とすればさらに撥水
性の高いものが得られる。The electroless plating layer 14 may be any metal plating layer such as Cu when it functions only as a base treatment for electrodeposition coating, but a substance having high water repellency such as fluororesin is co-deposited. If the electroless plating layer is used, one having higher water repellency can be obtained.
【００２１】なお、本実施例では、流路基板の素材とし
て、メッキ性の良好なＡＢＳ樹脂を採用しているが、こ
れをガラスやセラミック等他の基板材料で構成した場合
にも同様に適用可能である。In this embodiment, the ABS resin having good plating property is used as the material of the flow path substrate, but the same applies to the case where the ABS resin is made of other substrate material such as glass or ceramics. It is possible.
【００２２】[0022]
【発明の効果】本発明によれば、流路基板のインク流路
部に親水性処理を施し、ノズル部に撥水性処理を施す行
程を経てインクジェットヘッドを製造するものであるた
め、高い親水性を要求される部分と、これと相反する性
質である高い撥水性を要求される部分を同一の素材によ
って構成することができる。このため、インクジェット
ヘッドの構成が簡単となり、インクジェットヘッドのコ
ストの引き下げに寄与する。According to the present invention, since the ink jet head is manufactured through the process of subjecting the ink flow path portion of the flow path substrate to the hydrophilic treatment and the nozzle portion to the water repellent treatment, a high hydrophilic property is obtained. It is possible to form the part required to have the same material as the part required to have high water repellency, which is the opposite property. For this reason, the configuration of the inkjet head is simplified, which contributes to reduction in the cost of the inkjet head.
【００２３】また、撥水性処理工程として、無電解複合
メッキ法により、ノズル部に撥水性を有する物質を共析
させるようにすれば、ノズル部の撥水性が向上し、さら
に性能の秀れたインクジェットヘッドが得られる。さら
にまた、無電解メッキ法によりノズル部をメッキした後
に、電着法により撥水性の高い物質を析出させるように
すれば、さらに一層秀れたインクジェットヘッドが製造
可能になる。Further, in the water repellent treatment step, if a substance having water repellent property is co-deposited on the nozzle part by the electroless composite plating method, the water repellent property of the nozzle part is improved and the performance is further improved. An inkjet head is obtained. Furthermore, if a highly water-repellent substance is deposited by the electrodeposition method after the nozzle portion is plated by the electroless plating method, an even more excellent inkjet head can be manufactured.
【図１】流路基板のノズル部に無電解メッキ法により撥
水性処理を施した状態を示すモデル図である。FIG. 1 is a model diagram showing a state in which a water repellent treatment is applied to a nozzle portion of a flow path substrate by an electroless plating method.
【図２】撥水性処理前の流路基板の状態を示すモデル図
である。FIG. 2 is a model diagram showing a state of a flow path substrate before water repellent treatment.
【図３】流路基板のノズル部に無電解メッキ処理を施
し、その上に電着法により撥水性処理を施した状態を示
すモデル図である。FIG. 3 is a model diagram showing a state in which a nozzle portion of a flow path substrate is subjected to electroless plating treatment, and a water repellent treatment is applied thereon by an electrodeposition method.
【図４】流路基板の流路部側の構成例を示す平面図であ
る。FIG. 4 is a plan view showing a configuration example of a flow path portion side of a flow path substrate.
１，１１ 流路基板 ２，１２ インク流路部 ３，１３ ノズル部 ４，１４ 無電解メッキ法により形成された撥水
性を有する物質 １５ 電着法により形成された撥水性を有す
る物質1, 11 Channel substrate 2, 12 Ink channel section 3, 13 Nozzle section 4, 14 Water-repellent substance formed by electroless plating method 15 Water-repellent substance formed by electrodeposition method
Claims (3)
形成する工程と、 上記インク流路部に表面処理により親水性を施す親水性
処理工程と、 上記ノズル部に表面処理により撥水性を施す撥水性処理
工程とを含むことを特徴とするインクジェットヘッドの
製造方法。1. A step of forming an ink flow path section and a nozzle section on a flow path substrate, a hydrophilic treatment step of imparting hydrophilicity to the ink flow path section by surface treatment, and a water repellent property of the nozzle section by surface treatment. And a water-repellent treatment step for applying the method.
は、無電解複合メッキ法により上記ノズル部に撥水性を
有する物質を共析させることを特徴とするインクジェッ
トヘッドの製造方法。2. The method of manufacturing an ink jet head according to claim 1, wherein the water repellent treatment step is a step of co-depositing a water repellent substance on the nozzle portion by an electroless composite plating method.
は、無電解メッキ法により上記ノズル部をメッキ処理し
た後に電着法により上記ノズル部に撥水性を有する物質
を析出させることを特徴とするインクジェットヘッドの
製造方法。3. The water repellent treatment step according to claim 1, wherein the nozzle portion is plated by an electroless plating method, and then a water repellent substance is deposited on the nozzle portion by an electrodeposition method. Method for manufacturing an inkjet head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21432193A JP3168780B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21432193A JP3168780B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0760972A true JPH0760972A (en) | 1995-03-07 |
| JP3168780B2 JP3168780B2 (en) | 2001-05-21 |
Family
ID=16653828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21432193A Expired - Lifetime JP3168780B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3168780B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001124789A (en) * | 1999-10-22 | 2001-05-11 | Ngk Insulators Ltd | Micropipette and dispenser |
| JP2002540386A (en) * | 1999-03-23 | 2002-11-26 | ハーン−シッカート−ゲゼルシャフト フュア アンゲヴァンテ フォルシュンク エー ファウ | Fluid control device with format conversion function |
| JP2004077490A (en) * | 2003-09-16 | 2004-03-11 | Ngk Insulators Ltd | Micropipette and dispensing device |
| JP4681749B2 (en) * | 2001-03-28 | 2011-05-11 | キヤノン株式会社 | Probe carrier management method, probe carrier manufacturing apparatus, and probe carrier management apparatus |
| JP2018521703A (en) * | 2015-06-15 | 2018-08-09 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Oral cleaning device with improved nozzle design |
-
1993
- 1993-08-30 JP JP21432193A patent/JP3168780B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002540386A (en) * | 1999-03-23 | 2002-11-26 | ハーン−シッカート−ゲゼルシャフト フュア アンゲヴァンテ フォルシュンク エー ファウ | Fluid control device with format conversion function |
| US6855293B1 (en) | 1999-03-23 | 2005-02-15 | Hahn-Schickard-Gesellschaft Fuer Angewandte Forschung E.V. | Fluids manipulation device with format conversion |
| JP2001124789A (en) * | 1999-10-22 | 2001-05-11 | Ngk Insulators Ltd | Micropipette and dispenser |
| JP4681749B2 (en) * | 2001-03-28 | 2011-05-11 | キヤノン株式会社 | Probe carrier management method, probe carrier manufacturing apparatus, and probe carrier management apparatus |
| JP2004077490A (en) * | 2003-09-16 | 2004-03-11 | Ngk Insulators Ltd | Micropipette and dispensing device |
| JP2018521703A (en) * | 2015-06-15 | 2018-08-09 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Oral cleaning device with improved nozzle design |
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| Publication number | Publication date |
|---|---|
| JP3168780B2 (en) | 2001-05-21 |
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