JPH0756058A - Semiconductor laser module - Google Patents

Abstract

PURPOSE:To omit the evaluation of an optical system after the end of all of assembling to eliminate unnecessary used parts and evaluation time by fixing an optical unit in a cylindrical inner package provided with an attaching piece for fixing to an outer package and storing the inner package in the outer package and fixing the attaching piece to the outer package. CONSTITUTION:An optical unit 10 provided with a semiconductor laser element 11 and an optical fiber 151 is fixed in a cylindrical inner package 20 which is provided with an attaching piece 21 for fixing to an outer package 30a, and the inner package 20 is stored in the outer package 30a, and the attaching piece 21 is fixed to the outer package 30a. Consequently, the inner package 20 is assembled in the outer package 30a without applying a distortion, a stress, or the like to the optical unit, and the evaluation of the optical system after the end of all of assembling is omitted if only excellent articles are selected and are assembled after the evaluation of the optical system of the optical unit 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser module used as a light source of an optical transmission system, and more particularly to a structure for housing an optical unit in an external package.

[0002]

2. Description of the Related Art FIG. 3 is a sectional view showing a conventional semiconductor laser module. This semiconductor laser module
The optical unit 10 having the coaxial structure is built in a rectangular package (for example, dual in-line type) 30.

The optical unit 10 includes a semiconductor laser element 11 and a monitor photodiode 12 as a stem 1.
The semiconductor laser device 11 mounted on the device 3 is mounted.
The optical fiber 151 is formed by pulling out the electrode of (1) to the electrode lead 14 and optically coupled to the semiconductor laser element 11. In this case, the tip of the optical fiber 151 is attached to the holder 16
And the holder 16 is fixed to the stem 13 with the tip of the optical fiber 151 facing the semiconductor laser device 11.
It is fixed to.

The electrode leads 14 of the optical unit 10 and the external terminals 31 of the rectangular package 30 are electrically connected by, for example, soldering. In assembling the semiconductor laser module having the above structure, first, the optical unit 10 is completed, and is fixed to the bottom surface of the rectangular package 30 and the optical fiber 152.
Is fixed to the fiber outlet 32 of the rectangular package 30, and then the lid 33 of the rectangular package 30 is closed.

In the conventional example as described above, the optical unit 1
After completing 0, the optical fiber 15 of the optical unit 10
2 needs to be fixed to the rectangular package 30,
When the optical fiber 152 is fixed to the rectangular package 30, strain, stress, etc. are applied to the optical fiber 152.

Therefore, the evaluation of the optical system of the semiconductor laser module is performed in consideration of the fact that strain, stress, etc. are applied to the optical fiber 152 in the process of fixing the optical unit 10 to the rectangular package 30 as described above. This is done after all the assembly of the laser module is completed.

Accordingly, even if the optical system unit 10 whose optical system has not been evaluated is defective,
It may be assembled in the rectangular package 30 as it is, and use parts (rectangular package 30) are wasted.

Even if the optical system is evaluated after the optical unit 10 is completed and only good products are selected and assembled into the rectangular package 30, all the semiconductor laser module assemblies are assembled as described above. The evaluation of the optical system needs to be performed again after the end, which wastes the evaluation time.

[0009]

As described above, in the conventional semiconductor laser module, the defective parts of the optical system unit are assembled into the external package as they are, or the parts used are wasted, or after the completion of the optical unit. There is a problem that evaluation time is wasted by performing the evaluation of the optical system after the assembly is completed.

The present invention has been made to solve the above problems, and it becomes possible to assemble an optical unit in an external package so as not to apply strain, stress or the like,
After evaluating the optical system of the optical unit, select only good products and assemble them in an external package.
It is possible to omit the evaluation of the optical system after completing the entire assembly,
An object of the present invention is to provide a semiconductor laser module capable of preventing waste of used parts and evaluation time.

[0011]

A semiconductor laser module of the present invention is provided with an optical fiber in which an electrode of the semiconductor laser element is pulled out to an electrode lead while the semiconductor laser element is mounted on a stem and the semiconductor laser element is optically coupled to the semiconductor laser element. The optical unit, the semiconductor laser element of the optical unit, and the optical fiber tip end portion are supported and fixed in a state of being housed inside, and the optical fiber is pulled out to the outside through the center portion coaxially. The supported cylindrical inner package, a mounting piece projecting from the outer side of the cylindrical package, and contacting the mounting piece so as to face the inner package while supporting and fixing the inner package in a state of being housed therein, the optical unit And an external package having an external terminal electrically connected to the electrode lead.

[0012]

In this semiconductor laser module, an optical unit including a semiconductor laser element and an optical fiber is fixed in a cylindrical inner package having a mounting piece for fixing the inner package in the outer package. And the attachment piece is fixed to the external package.

Therefore, it becomes possible to assemble the internal package to the external package so that no distortion or stress is applied to the optical unit. After evaluating the optical system of the optical unit, only good products are selected and the internal package is selected. By assembling the package into the external package, the evaluation of the optical system after the completion of the entire assembly can be omitted, and it is possible to prevent the waste of the used parts and the evaluation time.

[0014]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 schematically shows a sectional structure of a semiconductor laser module according to a first embodiment of the present invention.

In the semiconductor laser module shown in FIG. 1, with the semiconductor laser element 11 mounted on the stem 13, the electrodes of the semiconductor laser element 11 are drawn out to the electrode leads 14 and the optical fiber 15 optically coupled to the semiconductor laser element 11 is provided. Optical unit 10 provided and this optical unit 1
No. 0 semiconductor laser element 11 and the end portion of the optical fiber are supported and fixed in a state of being housed therein, and the optical fiber 15 is supported in a state of being pulled out to the outside through the center portion coaxially. Inner package 20
(For example, a cylindrical package) and a mounting piece 21 protruding from the outside of the cylindrical package 20 (for example, a ring-shaped flange formed on the outer peripheral portion of the cylindrical package).
And facing and contacting the flange 21, and supporting and fixing the cylindrical package 20 in a state of being housed therein,
Box-shaped external package 30 having external terminals 31 electrically connected to the electrode leads 14 of the optical unit 10.
a (for example, a dual in-line type rectangular package).

The optical unit 10 is provided with a stem 13 on which a semiconductor laser element 11 and a monitor photodiode 12 are mounted, and a holder 16 supporting an optical fiber 15, and the semiconductor laser element 11 and the optical fiber 1 are prepared.
The stem 13 and the holder 16 are brought into contact with each other while the tip of the No. 5 is opposed, and the contact surface is fixed by welding or soldering using a YAG laser.

In the optical fiber 15, an optical fiber main body (core wire) 151 is wrapped with a jacket 152, and the tip of the optical fiber main body 151 is processed into a lens shape.
When assembling the above-mentioned semiconductor laser module,
The optical unit 10 is inserted into the cylindrical package 20, and the optical fiber 15 of the optical unit 10 is inserted into the cylindrical package 2.
It is fixed to the fiber take-out portion 22 of 0.

At this time, the contact surface between the outer peripheral surface of the stem 13 of the optical unit 10 and the inner peripheral surface of the cylindrical package 20 is set to Y.
It is fixed by welding or soldering using an AG laser. Then, the flange 21 of the cylindrical package 20 is inserted and fixed in the rectangular package 30a. At this time, the contact surface between the one surface of the flange 21 of the cylindrical package 20 and the end surface of the rectangular package 30a is fixed by module welding or resistance heating welding using a YAG laser, and the electrode lead 14 of the stem 31 and the rectangular package 30a are fixed. The electrode lead 31 of is electrically connected by, for example, soldering,
The lid 33 of the rectangular package 30a is fixed.

According to the semiconductor laser module of the above embodiment, the optical unit 10 having the coaxial structure including the semiconductor laser element 11 and the optical fiber 15 is provided in the rectangular package 3.
It is fixed in a cylindrical package 20 having a flange 21 for fixing to 0a, the cylindrical package 20 is housed in a rectangular package 30a, and the flange 21 is fixed to the rectangular package 30a.

Since the optical fiber 15 is also fixed when the optical unit 10 is assembled into the cylindrical package 20, it is not necessary to assemble the optical unit 10 directly thereafter. Since no distortion or stress is applied, deterioration of the optical system does not occur.

When the cylindrical package 20 is assembled into the rectangular package 30a, the cylindrical package 2
Since the flange 21 provided at 0 is used, distortion, stress, etc. are not applied to the fixed portion of the cylindrical package 20 and the optical unit 10, and the optical system is not deteriorated.

Therefore, after the optical unit 10 is assembled into the cylindrical package 20, the optical system of the optical unit 10 is evaluated and only the good products are selected to assemble the cylindrical package 20 into the rectangular package 30a. The evaluation of the optical system after the completion of the entire assembly can be omitted, and it is possible to prevent waste of the used parts and the evaluation time.

In addition, after the optical unit 10 is assembled into the cylindrical package 20, the optical system of the optical unit 10 is evaluated, and the present invention is not limited to the dual-in-line rectangular package 30a as in the above-described embodiment, but various types are available. It is possible to select and assemble other rectangular packages having different shapes (butterfly type packages, etc.), and it is possible to efficiently manufacture (in a short time) a semiconductor laser module having a rectangular package having a desired shape. .

Further, the optical unit 10 is not limited to the above embodiment, and an optical system with a fiber having a coaxial structure (for example, an optical system having a lens) which can be fixed to the cylindrical package 20 can be used.

FIG. 2 schematically shows a sectional structure of a semiconductor laser module according to the second embodiment of the present invention. This semiconductor laser module is different from the semiconductor laser module shown in FIG. 1 in the optical unit 10a,
Since the others are the same, the same reference numerals as those in FIG. 1 are attached. The optical unit 10a includes a semiconductor laser device 11
And at least one lens 17 provided between the end of the optical fiber 15 and the end of the optical fiber 15.
The lens 17 is held by the first holder 181, and the tip end of the optical fiber 15 is held by the second holder 182 in a state of being wrapped by the metal tube 19, which is the second holder. 182 is the first holder 18
It is fixed at 1.

[0026]

As described above, according to the semiconductor laser module of the present invention, the optical unit can be assembled in the external package so that the optical unit is not distorted or stressed, and the optical system of the optical unit is assembled. After the evaluation, the non-defective product is selected and assembled in the external package, so that the evaluation of the optical system after the completion of the entire assembly can be omitted, and the use parts and the evaluation time can be prevented from being wasted.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor laser module according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a semiconductor laser module according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a conventional semiconductor laser module.

[Explanation of symbols]

10, 10a ... Optical unit, 11 ... Semiconductor laser element, 12 ... Monitor photodiode, 13 ... Stem,
14 ... Electrode lead, 15 ... Optical fiber, 151 ... Optical fiber main body (core wire), 152 ... Envelope, 16 ... Holder, 17
… Lens, 20… Cylindrical package, 21… Flange,
22 ... Fiber outlet, 30a ... Rectangular package,
31 ... External terminal, 33 ... Lid.

Claims (2)

[Claims] 1. An optical unit provided with an optical fiber optically coupled to the semiconductor laser device while the electrode of the semiconductor laser device is pulled out to an electrode lead with the semiconductor laser device mounted on the stem, and the semiconductor laser device of the optical unit. And a cylindrical inner package that supports and fixes the optical fiber tip portion accommodated therein, and supports the optical fiber in a state where the optical fiber passes through the center portion coaxially and is pulled out to the outside. A mounting piece protruding from the outside of the package, and an external terminal which is in contact with the mounting piece so as to oppose and is fixedly supported in a state where the inner package is housed inside and electrically connected to an electrode lead of the optical unit. And an external package having the semiconductor laser module. 2. The semiconductor laser module according to claim 1, wherein the optical unit includes at least one lens provided between the semiconductor laser element and a tip of an optical fiber facing the semiconductor laser element. A semiconductor laser module characterized by: