JPH0752795B2 - Electronic device cooling structure - Google Patents
Electronic device cooling structureInfo
- Publication number
- JPH0752795B2 JPH0752795B2 JP61253806A JP25380686A JPH0752795B2 JP H0752795 B2 JPH0752795 B2 JP H0752795B2 JP 61253806 A JP61253806 A JP 61253806A JP 25380686 A JP25380686 A JP 25380686A JP H0752795 B2 JPH0752795 B2 JP H0752795B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- fan
- electronic device
- air
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子装置の冷却構造に係り、特に防音に好適な
空冷電子装置の冷却構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device, and more particularly to a cooling structure for an air-cooled electronic device suitable for soundproofing.
近年、電子計算機に代表される各種電子装置はその高密
度実装化が著しく、これら電子機器の冷却を行うことが
重要になっている。また、従来の電子計算機は、主に空
調された室内で使われてきたが、小形化とともにオフィ
ス等の空調室以下で使用する場合が増えてきた。この場
合には、騒音や塵による電子装置筐体内の汚れの問題が
クローズアップされて来る。In recent years, various electronic devices typified by electronic computers are remarkably mounted in high density, and it is important to cool these electronic devices. Further, the conventional electronic computer has been mainly used in an air-conditioned room, but as the size of the computer has been reduced, it has been increasingly used in an air-conditioned room such as an office. In this case, the problem of dirt in the housing of the electronic device due to noise and dust is highlighted.
従来の防塵を考慮した電子機器においては、ファンを筐
体入口側に設け（プシュ形）筐体内の圧力を高めて細か
い塵を侵入してくるのを防いでいる。この種の装置とし
て特開昭60−17938号公報が挙げられる。しかしなが
ら、プシュ形のファン構成では、筐体内の冷却空気の流
れに偏流が生じ、筐体内の半導体部品や電源等をまんべ
んなく冷却するのが困難であり、局所的にヒートスポッ
トが形成される恐れがあった。In a conventional electronic device considering dust prevention, a fan is provided at the entrance side of the housing (push type) to increase the pressure inside the housing to prevent intrusion of fine dust. An apparatus of this type is disclosed in JP-A-60-17938. However, in the push-type fan configuration, a non-uniform flow occurs in the flow of the cooling air in the housing, it is difficult to uniformly cool the semiconductor components, the power supply, etc. in the housing, and there is a possibility that a heat spot is locally formed. there were.
上記従来技術は、入口部にファンを設けたプシュ形のフ
ァン構造で電子機器の筐体系が構成されていたため、筐
体内の各電子部品をまんべんなく冷却できないという問
題があった。The above-mentioned conventional technique has a problem that each electronic component in the housing cannot be evenly cooled because the housing system of the electronic device is configured by the push-type fan structure in which the fan is provided at the inlet portion.
又、ファンが入口に設けられているため、直接外に音が
流れて騒音が高いという問題があった。In addition, since the fan is installed at the entrance, there is a problem that the noise flows directly to the outside and the noise is high.
本発明の目的は、防音性に優れ、かつ筐体内の各電子部
品の冷却が良好な電子装置の冷却構造を提供することに
ある。An object of the present invention is to provide a cooling structure for an electronic device which is excellent in soundproofing and can cool each electronic component in the housing.
上記目的は、電子機器の筐体を２重構造とし、少なくと
も１つの冷却ファンを内側の筐体に対してプル形となる
ようにし、その冷却ファンの空気出口において内側の筐
体からの排気を外側の筐体と内側の筐体との壁間の空気
流路へ導く構造とすることにより達成される。The above object is to make the housing of the electronic device a double structure so that at least one cooling fan has a pull shape with respect to the inner housing, and exhaust air from the inner housing is provided at the air outlet of the cooling fan. This is achieved by adopting a structure that leads to the air flow path between the walls of the outer casing and the inner casing.
電子機器の筐体への塵の侵入を防ぐためには、筐体内の
内圧を外気に比べて高くすれば良い。このためには普
通、第４図に示すようなプシュ形のファン構成がとられ
る。ところが、プシュ形にすると筐体２内の流れ10は偏
流し、冷却空気がほとんど流れない領域が形成されてし
まう。さらに、ファン６は入口の近くに位置するため、
ファン６からの騒音は入口のフィルタ１を通って直接外
に出てくる。また、第５図に示すようにプル形のファン
構成にすると、冷却空気は筐体２内にまんべんなく流れ
るが、プル形では筐体２内の内圧が大気圧に対して負圧
になってしまい筐体のすきまから塵が侵入する。この場
合もファン６は出口部にあり、ファン６からの音は直接
筐体の外に出てしまう。In order to prevent dust from entering the housing of the electronic device, the internal pressure in the housing may be set higher than that in the outside air. For this purpose, a push-type fan arrangement as shown in FIG. 4 is usually used. However, when the push type is used, the flow 10 in the housing 2 is lopsided, and a region where cooling air hardly flows is formed. Furthermore, since the fan 6 is located near the entrance,
The noise from the fan 6 goes out directly through the filter 1 at the inlet. Further, when the pull type fan configuration is used as shown in FIG. 5, the cooling air flows evenly in the housing 2, but in the pull type, the internal pressure in the housing 2 becomes a negative pressure with respect to the atmospheric pressure. Dust enters through the gap in the housing. In this case as well, the fan 6 is at the outlet, and the sound from the fan 6 goes directly outside the housing.
第２図に示すように、筐体を２重にしファン６を筐体内
部に設ける構成をとるとこの困難を回避できる。プル形
であるため、内側筐体３内の流れ10は、まんべんなく流
れる。ファン６からの音は直接出てくることなく途中の
経路中で減衰する。内側筐体３内の内圧は大気圧に対し
て負圧になるが、ファン６より下流側の内側筐体３内と
外側筐体２で囲まれた区間の圧力は正圧になるため、大
気中の塵がすきまを通って筐体内に侵入することはな
い。As shown in FIG. 2, this difficulty can be avoided if the housing is doubled and the fan 6 is provided inside the housing. Because of the pull shape, the flow 10 in the inner housing 3 flows evenly. The sound from the fan 6 does not come out directly but is attenuated in the path along the way. Although the internal pressure in the inner casing 3 becomes a negative pressure with respect to the atmospheric pressure, the pressure in the section enclosed by the inner casing 3 on the downstream side of the fan 6 and the outer casing 2 becomes a positive pressure. The dust inside will not penetrate into the housing through the gap.
以下、本発明の一実施例を第１図により説明する。電子
機器の筐体は外側筐体２および内側筐体３により構成さ
れる。筐体内には電子部品4,5や半導体８を載せた基板
９が配置されている。ファン６は２重筐体内の冷却空気
の出口側にあり、冷却空気入口部にはフィルタ１が設け
てある。An embodiment of the present invention will be described below with reference to FIG. The housing of the electronic device includes an outer housing 2 and an inner housing 3. A substrate 9 on which electronic components 4, 5 and a semiconductor 8 are mounted is arranged in the housing. The fan 6 is located on the cooling air outlet side in the double housing, and the filter 1 is provided at the cooling air inlet portion.
本発明においては、ファンがプル形構成で内側筐体の下
部にあるため、冷却空気が筐体内をまんべんなく流れ
る。ファン６からの音は出入口から直接出てくることは
なく、また、外側筐体２および内側筐体３で囲まれる空
間の圧力が大気圧に対して正圧になるために、大気中の
塵が筐体のすきまを通って侵入することはない。In the present invention, since the fan has a pull-shaped structure and is located in the lower portion of the inner housing, cooling air flows evenly in the housing. The sound from the fan 6 does not come out directly from the inlet / outlet, and since the pressure in the space surrounded by the outer housing 2 and the inner housing 3 becomes a positive pressure with respect to the atmospheric pressure, dust in the atmosphere is discharged. Does not enter through the gap in the housing.
以上、本実施例においては、騒音源であるファン６やそ
の他の部品が２重の筐体により囲まれており、かつ出入
口から遠い所に配置されているため、ファンおよび流体
騒音を大幅に低減できる効果がある。As described above, in the present embodiment, the fan 6 which is a noise source and other parts are surrounded by the double housing and arranged at a place far from the entrance and exit, so that the fan and fluid noise are significantly reduced. There is an effect that can be done.
本発明の他の実施例を第３図により説明する。本実施例
においては、大形のファン６が出口側に設置されてお
り、小形のファン11が入口側に設置されている。このよ
うなプシュ・プル形のファン構成は筐体内の圧損が大き
な際に有効である。ファン６の動力はファン11のものよ
りも大きいため、流れはプル形のものになる。騒音上も
音が最も大きなファン６は、２重筐体内部にあるため、
主たる騒音源の音を大幅に低減させることができる。Another embodiment of the present invention will be described with reference to FIG. In this embodiment, a large fan 6 is installed on the outlet side, and a small fan 11 is installed on the inlet side. Such a push-pull type fan configuration is effective when the pressure loss in the housing is large. The power of fan 6 is greater than that of fan 11, so the flow is pull-shaped. Since the fan 6 that produces the loudest noise is inside the double housing,
The sound of the main noise source can be significantly reduced.
本実施例においては、ファンの数を増やしたために、フ
ァン１個当りのファン動力を低減でき、かつ冷却空気の
流量を増やせる利点がある。In this embodiment, since the number of fans is increased, the fan power per fan can be reduced, and the flow rate of cooling air can be increased.
本発明によれば、筐体内の流れをよどみなくすることが
でき、かつ外側筐体の内部の圧力を大気圧よりも高くす
ることができるので、防塵性に優れかつ筐体内の各電子
部品の冷却が良好になる効果がある。又、ファンが２重
筐体内にあるため、防音性に優れる効果がある。According to the present invention, the flow in the housing can be prevented from stagnation, and the pressure inside the outer housing can be made higher than the atmospheric pressure. It has the effect of improving cooling. Further, since the fan is inside the double housing, there is an effect of excellent soundproofing.
第１図は本発明の一実施例を示し、第２図は本発明の原
理図、第３図は本発明の他の実施例、第４図はプシュ形
のファン構成の説明図、第５図はプル形のファン構成の
説明図である。 １……フィルタ、２……外側筐体、３……内側筐体、4,
5……電子部品、６……ファン、７……足、８……半導
体、９……基板、10……流れ、11……ファン、12……吸
音材。FIG. 1 shows an embodiment of the present invention, FIG. 2 is a principle diagram of the present invention, FIG. 3 is another embodiment of the present invention, and FIG. 4 is an explanatory view of a push-type fan structure, and FIG. The figure is an illustration of a pull-type fan configuration. 1 ... Filter, 2 ... Outer housing, 3 ... Inner housing, 4,
5 ... electronic parts, 6 ... fan, 7 ... foot, 8 ... semiconductor, 9 ... substrate, 10 ... flow, 11 ... fan, 12 ... sound absorbing material.
Claims (1)
却ファンより成る電子機器において、前記筐体を２重構
造とし、少なくとも１つの前記冷却ファンを内側の筐体
に対してプル形となるようにし、該冷却ファンの空気出
口において内側の筐体からの排気を外側の筐体と内側の
筐体との壁間の空気通路へ導く構造とすることを特徴と
する電子機器の冷却構造。1. An electronic device comprising a housing, an electronic component inside the housing, and a cooling fan, wherein the housing has a double structure, and at least one cooling fan is a pull type with respect to an inner housing. And a structure for guiding the exhaust air from the inner casing to the air passage between the walls of the outer casing and the inner casing at the air outlet of the cooling fan. Construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253806A JPH0752795B2 (en) | 1986-10-27 | 1986-10-27 | Electronic device cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253806A JPH0752795B2 (en) | 1986-10-27 | 1986-10-27 | Electronic device cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108800A JPS63108800A (en) | 1988-05-13 |
| JPH0752795B2 true JPH0752795B2 (en) | 1995-06-05 |
Family
ID=17256406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61253806A Expired - Lifetime JPH0752795B2 (en) | 1986-10-27 | 1986-10-27 | Electronic device cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0752795B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3366244B2 (en) | 1998-02-04 | 2003-01-14 | 富士通株式会社 | Electronics |
| JP5503191B2 (en) * | 2009-05-29 | 2014-05-28 | オルガノ株式会社 | Outside air purification device |
| JP6155710B2 (en) * | 2013-03-11 | 2017-07-05 | 株式会社豊田自動織機 | Preventing dust from entering the engine from the fuel injector connection in the engine head cover |
-
1986
- 1986-10-27 JP JP61253806A patent/JPH0752795B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63108800A (en) | 1988-05-13 |
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