JPH0745945A - Apparatus and method for soldering - Google Patents

Abstract

PURPOSE:To reduce thermal damage to a component mounted on a board in a soldering operation, to perform a high-quality soldering operation, to make an apparatus compact and to save its space when an integrated circuit such as an HIC or the like is manufactured. CONSTITUTION:A reflow soldering apparatus 2 and a laser soldering apparatus 4 are integrated. A temperature which is supplied by the reflow soldering apparatus 2 is set to a temperature which dose not damage a component soldered on a board, and heat supplied by the laser soldering apparatus 4 is made a temperature at which the component can be soldered in addition to heat supplied by a reflow soldering means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus suitably used for manufacturing integrated circuits such as HIC. Specifically, by combining the reflow soldering means and the laser heating means, the reflow soldering means applies heat to the extent that the components on the board to be assembled are not damaged, and the insufficient heat is locally applied to the laser. The present invention relates to a soldering apparatus that supplies high-quality solder by reducing the damage to the components mounted on a substrate when the solder is supplied by a heating means.

[0002]

2. Description of the Related Art In recent years,
With the progress of high-density surface mounting technology on circuit boards, HICs of integrated circuits are being advanced. At present, soldering of large parts such as a shield case in HIC manufacturing is generally performed by soldering using a dip bath or manual soldering.

However, with the progress of automation of integrated circuit manufacturing and further progress of HIC, it is difficult to obtain high quality HIC by high density mounting by the conventional soldering means. Further, since reflow soldering is a method of uniformly heating the entire substrate to a temperature equal to or higher than the melting point of the solder, it causes deterioration of the characteristics of mounting components having no heat resistance, for example, components having a resin-based body.

For this reason, conventionally, laser soldering in which heating is performed using laser light has been performed as a means for avoiding heating of the entire substrate and heating only necessary portions for soldering. In this method, the soldering portion of the substrate is irradiated with a light beam of laser light to heat the soldering portion to melt the solder. But,
In laser soldering, the amount of heat applied to the soldering portion is insufficient depending on the size of the substrate and components and the materials used, and stable soldering may be difficult.

The present invention has been made in view of the above circumstances, and it is possible to apply a sufficient amount of heat to a soldering portion for stable soldering, and further, to prevent deterioration of the characteristics of a mounting component having no heat resistance. It is an object of the present invention to provide a novel soldering device and a soldering method that do not cause the problem.

[0006]

Means and Actions for Solving the Problems The inventors of the present invention have made earnest studies to achieve the above-mentioned object, and as a result, it is difficult to perform stable soldering only with the current laser heating means due to insufficient heat quantity. However, the laser heating means and the reflow soldering means are combined, and the soldering portion is heated by the laser heating means during the soldering by the reflow soldering means, and the heat by the reflow soldering means and the heat by the laser heating means are added. It was found that by melting the solder with heated heat, highly reliable soldering can be performed efficiently without damaging the mounted components, and the device can be made compact and space saving. The present invention has been completed.

Therefore, the present invention, as the first invention,
There is provided a soldering device comprising: a reflow soldering unit and a laser heating unit that heats a soldering portion while a substrate is soldered by the reflow soldering unit.

Further, the present invention, as a second invention, heats a soldering portion by laser light while the substrate is reflow-soldered, and heats supplied by reflow soldering and heat supplied by laser light. Provided is a soldering method characterized by performing soldering.

Further, the present invention comprises, as a third invention, reflow soldering means and laser heating means for heating a soldering portion while a substrate is soldered by the reflow soldering means, and the reflow soldering means The temperature supplied by the soldering means is a temperature that does not damage the components soldered to the board, and the heat supplied by the laser heating means is in addition to the heat supplied by the reflow soldering means. Provided is a soldering device having a temperature at which soldering is possible.

In the present invention, the purpose of the reflow soldering means is to compensate for insufficient heating by the laser heating means. Further, the purpose of the laser heating means is to locally heat the soldered portion in addition to the heat generated by the reflow soldering means.

In the present invention, the structure of the reflow soldering means is not limited, and hot air type reflow soldering means, infrared heating tunnel furnace type reflow soldering means, reflow soldering means (VPS) utilizing latent heat of organic solvent, etc. Any of can be used. In this case, a belt conveyor type lower heating type reflow soldering means can be particularly preferably used, as shown in Examples described later.
Also, the configuration of the laser heating means is not limited, and any configuration may be used as long as it can locally heat the soldering portion.

[0012]

EXAMPLES Next, the present invention will be illustrated concretely by examples, but the present invention is not limited to the following examples. Embodiment FIG. 1 is a schematic perspective view showing a soldering device according to an embodiment of the present invention. The soldering apparatus according to the present embodiment is a lower heating type reflow soldering apparatus (reflow soldering means) 2
And a laser soldering device (laser heating means) 4 are integrated. The purpose of using the lower heating type reflow soldering device 2 is to compensate for insufficient heating of the laser soldering device 4 and to perform soldering by using the movement and speed control of the belt conveyor. Further, the purpose of using the laser soldering device 4 is to locally heat the soldered portion.

The reflow soldering apparatus 2 is of a lower heating type having a lower heating source and a dip tank 6 and a belt conveyor 8, and is a large-sized soldering component 10 such as a shield case placed on the belt conveyor 8. Is moved in the direction of the arrow in the figure. This reflow soldering device 2
In advance, the speed and heating temperature profile of the belt conveyor 8 are set according to the size of the soldering component 10.

In the laser soldering apparatus 4, 12 is a stand, 14 is an arm, 16 is a laser oscillator, and 18
Is a light guide made of glass fiber, 20 is a laser condenser lens attached to the arm 14, and the laser light 22 is emitted from the laser condenser lens 20 to the soldering portion of the soldering component 10. There is.
The laser soldering device 4 has a mechanism capable of variously changing the irradiation of the laser beam 22 to the soldering portion depending on the shape, size, etc. of the soldering component 10. Therefore, the laser condensing lens 20 can be replaced, added, changed in position, and the laser oscillator 16 can be replaced.

Further, the reflow soldering device 2 is provided with a sensor switch 24 at a position corresponding to the installation position of the laser soldering device 4, and the sensor switch 24 detects the soldering component 10. ing. The sensor switch 24 is used to turn on / off the laser oscillator 16. Since this sensor switch 24 needs to be turned on / off in accordance with the size of the soldering component 10, etc.,
The mechanism is movable left and right.

When soldering the soldering component 10 using the soldering apparatus of this embodiment, laser soldering is performed at the point B where the solder is melted in the reflow soldering profile in the reflow soldering apparatus 2 shown in FIG. A fixing temperature of laser light is applied to the soldering portion by the attaching device 4. That is, the soldering component 10 is conveyed by the belt conveyor 8 and the laser oscillator 16 is turned on by the sensor switch 24 (or a control circuit synchronized with the reflow temperature may be provided) when the peak temperature of the reflow is reached. Then, the soldering part is irradiated with laser light. As a result, the total amount of heat supplied per unit time is increased even at the same temperature, and more reliable soldering can be obtained regardless of the size of the board and components.

Generally, reflow soldering is carried out with a certain profile (temperature rise curve), but as described above, depending on the size of the substrate and parts and the material used, the current reflow soldering apparatus is used. In some cases, sufficient soldering cannot be obtained. On the other hand, in the present embodiment, a more reliable soldering is obtained by applying the spot type fixing temperature with the laser soldering device 4, and the soldering iron is small and does not fit. It has the advantage that it can be soldered in place. Furthermore, in the present embodiment, by integrating different types of soldering devices, which conventionally had to be prepared separately, it is possible to make the device compact and save space.

[0018]

As described above, according to the present invention, by combining the reflow soldering means and the laser heating means, a sufficient amount of heat is applied to the soldering portion, and highly reliable soldering is performed efficiently. You can do well,
It does not cause deterioration of the characteristics of mounted parts that do not have heat resistance. Therefore, the present invention can be particularly effectively used for automatic soldering of a board on which a component that is damaged by heating, such as a component having a resin-based body, is mounted. Further, the present invention has the advantages that the device can be made compact and space saving can be achieved, and that it is possible to perform soldering in a narrow space where a soldering iron does not enter and to solder a narrow pitch component. Have.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a soldering device according to an embodiment of the present invention.

FIG. 2 is a graph showing a profile of reflow soldering in the same device.

[Explanation of symbols]

 2 Reflow soldering device 4 Laser soldering device 6 Lower heating source and dip tank 8 Belt conveyor 10 Soldering parts 16 Laser oscillator 18 Light guide 20 Laser condenser lens 22 Laser light 24 Sensor switch

Claims (3)

[Claims] 1. A soldering apparatus comprising reflow soldering means and laser heating means for heating a soldering portion while a substrate is soldered by the reflow soldering means. 2. A soldering part is heated by laser light while the substrate is reflow-soldered, and soldering is performed by heat supplied in reflow soldering and heat supplied by laser light. Soldering method. 3. Reflow soldering means and laser heating means for heating a soldering portion while a substrate is being soldered by the reflow soldering means, wherein the temperature supplied by the reflow soldering means is The temperature should not damage the components to be soldered to the board, and the heat supplied by the laser heating means should be a temperature at which components can be soldered in addition to the heat supplied by the reflow soldering means. A soldering device characterized by.