JPH0744445Y2 - Polishing waste liquid treatment device - Google Patents

Polishing waste liquid treatment device

Info

Publication number
JPH0744445Y2
JPH0744445Y2 JP1991106691U JP10669191U JPH0744445Y2 JP H0744445 Y2 JPH0744445 Y2 JP H0744445Y2 JP 1991106691 U JP1991106691 U JP 1991106691U JP 10669191 U JP10669191 U JP 10669191U JP H0744445 Y2 JPH0744445 Y2 JP H0744445Y2
Authority
JP
Japan
Prior art keywords
liquid
coolant
storage tank
ceramic filter
polishing waste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991106691U
Other languages
Japanese (ja)
Other versions
JPH0549257U (en
Inventor
壽治 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP1991106691U priority Critical patent/JPH0744445Y2/en
Publication of JPH0549257U publication Critical patent/JPH0549257U/en
Application granted granted Critical
Publication of JPH0744445Y2 publication Critical patent/JPH0744445Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Auxiliary Devices For Machine Tools (AREA)

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】本考案は、研磨廃液処理装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing waste liquid treatment device.

【0002】[0002]

【従来の技術】従来、研磨廃液の再生利用は広く実施さ
れており、例えば、特公昭58−30112号公報等に
おいて開示されているように、一般に、研磨廃液を固液
分離処理した後、その処理液に必要量のクーラントを補
給して再生している。
2. Description of the Related Art Conventionally, the recycling of polishing waste liquid has been widely practiced. For example, as disclosed in Japanese Examined Patent Publication No. 58-30112, the polishing waste liquid is generally subjected to solid-liquid separation treatment and then The process liquid is regenerated by supplying the required amount of coolant.

【0003】[0003]

【考案が解決しようとする課題】しかし、従来の再生処
理は、スクリーンや遠心分離機等により固液分離してい
る関係上、金属微粒子の分離が十分でなかったり、ある
いは固液分離した処理液にクーラントを補給混合しなが
ら、その混合液のPHを測定してクーラントの補給量を
所定に制御している関係上、迅速な調整が困難であると
いった諸々の欠点を有していた。
However, in the conventional regeneration treatment, since the solid-liquid separation is carried out by a screen, a centrifuge or the like, the fine metal particles are not sufficiently separated, or the treatment liquid obtained by the solid-liquid separation is used. In addition, while the coolant is replenished and mixed, the pH of the mixed solution is measured to control the replenishment amount of the coolant to a predetermined level, which causes various drawbacks such that quick adjustment is difficult.

【0004】本考案は、このようなことに着目し、これ
を解決すべく各方面から鋭意検討の結果、研磨廃液を荷
電処理装置で凝集処理した後、セラミックフイルタで処
理した濾過液の流量及び濃度に基いてクーラントの補給
量を制御するようにすれば、上述した欠点を一挙に解消
し得ることを見出したのである。
The present invention pays attention to such a situation, and as a result of earnest studies from various directions to solve this, as a result, after the polishing waste liquid is agglomerated by a charge treatment device, the flow rate of the filtrate treated by a ceramic filter and It has been found that if the coolant replenishment amount is controlled based on the concentration, the above-mentioned drawbacks can be solved at once.

【0005】[0005]

【課題を解決するための手段】すなわち、本考案に係る
研磨廃液処理装置は、研磨廃液に通電して凝集処理する
荷電処理装置と、前記荷電処理装置から直接若しくは中
間貯留タンクを経て供給される荷電処理液を濾過するセ
ラミックフイルタと、前記セラミックフイルタから供給
される濾過液とクーラント補給装置から供給されるクー
ラントとを混合した再生液を貯留する再生液貯留タンク
と、前記濾過液の流量及び濃度に基いて前記クーラント
の補給量を制御するクーラント補給量制御装置とを備え
ていることを特徴とするものである。
That is, a polishing waste liquid treatment apparatus according to the present invention is supplied from a charging treatment apparatus which energizes a polishing waste fluid to perform a coagulation treatment, and the charging treatment apparatus directly or through an intermediate storage tank. A ceramic filter for filtering the charge treatment liquid, a regenerant storage tank for storing a regenerant liquid obtained by mixing a filtrate supplied from the ceramic filter and a coolant supplied from a coolant replenishing device, and a flow rate and concentration of the filtrate. And a coolant replenishment amount control device for controlling the replenishment amount of the coolant based on the above.

【0006】[0006]

【実施例】以下、本考案に係る一実施例について図面に
基いて述べると、図1において、この処理装置は、荷電
処理装置1と、セラミックフイルタ2と、クーラント補
給装置3と、クーラント補給量制御装置4と、原液貯留
タンク5と、中間貯留タンク6と、再生液貯留タンク7
等を備えている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to the drawings. In FIG. 1, this processing device includes a charging processing device 1, a ceramic filter 2, a coolant replenishing device 3 and a coolant replenishing amount. Control device 4, stock solution storage tank 5, intermediate storage tank 6, reclaimed liquid storage tank 7
And so on.

【0007】なお、荷電処理装置1は槽8内に電極(図
示されていない)を装着しており、原液貯留タンク5か
ら管路9を経て槽8内に供給される研磨廃液に通電(例
えば50ボルト以下、5アンペア以下に通電)して凝集
処理する。これにより、電極上に懸濁物を析出させずに
懸濁物の電荷を中和することができ、従って、懸濁物の
凝集によりその粒径を大きくすることができる。
The charging apparatus 1 is equipped with electrodes (not shown) in the tank 8 to energize the polishing waste liquid supplied from the stock solution storage tank 5 into the tank 8 through the conduit 9 (for example, Aggregation is carried out by applying 50 V or less and 5 amps or less). This makes it possible to neutralize the charge of the suspension without depositing the suspension on the electrode, and thus to increase the particle size of the suspension by agglomeration.

【0008】続いて、この荷電処理液が管路10を経て
中間貯留タンク6に送られ、更に、ここから管路11を
経てセラミックフイルタ2に供給されて濾過される。こ
の濾過に際し、荷電処理液の懸濁物が凝集して粒径が大
きくなっているので、多孔性のセラミックフイルタ2の
致命的な目詰り(逆洗により性能回復が困難なような目
詰り)が発生し難く、従って、必要に応じて行う逆洗に
より、セラミックフイルタ2の外表面に積層された凝集
粒子層を容易に剥離することができる。
Subsequently, the charge treatment liquid is sent to the intermediate storage tank 6 via the pipe line 10, and further supplied from this to the ceramic filter 2 via the pipe line 11 to be filtered. At the time of this filtration, since the suspension of the charge treatment liquid is agglomerated and the particle size becomes large, fatal clogging of the porous ceramic filter 2 (clogging that performance recovery is difficult due to backwashing) Therefore, the agglomerated particle layer laminated on the outer surface of the ceramic filter 2 can be easily peeled off by backwashing if necessary.

【0009】以下、セラミックフイルタ2から排出され
る濾過液は、管路12を経て再生液貯留タンク7に送ら
れると共にこれと並行してクーラント補給装置3により
クーラントが再生液貯留タンク7に補給される。この補
給装置3は、弁13を閉じ、かつ弁14を開いた状態
で、タンク15に貯留されているクーラントをポンプ1
6で循環、すなわち、クーラントが管路17,18を経
て循環される。また、弁13,14を所定に開き、タン
ク15から抜き出したクーラントの一部を循環させると
共に残部を管路19を経て再生液貯留タンク7に補給す
ることができる。
Hereinafter, the filtrate discharged from the ceramic filter 2 is sent to the regenerant storage tank 7 through the pipe 12, and at the same time, the coolant is replenished to the regenerant storage tank 7 by the coolant replenishing device 3. It This replenishing device 3 pumps the coolant stored in the tank 15 with the valve 13 closed and the valve 14 opened.
At 6, the coolant is circulated via lines 17 and 18. Further, the valves 13 and 14 can be opened in a predetermined manner, a part of the coolant extracted from the tank 15 can be circulated, and the remaining part can be replenished to the regenerant storage tank 7 through the pipe line 19.

【0010】係るクーラントの補給において、クーラン
ト補給量制御装置4でその補給量が所定に制御される。
この補給量制御装置4は、管路12を経て再生液貯留タ
ンク7に供給される濾過液の流量を、この管路12に装
着されている流量計20で測定すると共にその濃度を紫
外線吸光度計21で測定し、これらの測定信号に基いて
管路19に装着されている流量計22及び弁23を所定
に制御してクーラントの補給量を制御する。その際、弁
23は、再生液貯留タンク7において、使用に適した一
定組成の研磨液に調整することができるように、濾過液
の流量及び濃度に応じてクーラント補給量の増減制御を
行い、かつ流量計22は、所定流量に制御するように補
正信号を弁23に送り、係る制御を濾過液の供給中行
う。
In the coolant replenishment, the coolant replenishment amount control device 4 controls the replenishment amount to a predetermined value.
The replenishment amount control device 4 measures the flow rate of the filtrate supplied to the regenerant storage tank 7 through the conduit 12 with a flow meter 20 attached to the conduit 12 and measures the concentration thereof with an ultraviolet absorptiometer. The flow rate meter 22 and the valve 23 mounted on the conduit 19 are controlled in a predetermined manner based on these measurement signals to control the replenishment amount of the coolant. At that time, the valve 23 controls the increase / decrease of the coolant replenishment amount in accordance with the flow rate and concentration of the filtrate so that the polishing liquid of a constant composition suitable for use can be adjusted in the regenerant storage tank 7. Moreover, the flow meter 22 sends a correction signal to the valve 23 so as to control the flow rate to a predetermined value, and performs such control during the supply of the filtrate.

【0011】このように、濃度測定手段として紫外線吸
光度計21を用いているので、濾過液の供給中であって
も迅速に測定することができ、従って、弁23を高精度
に制御することができて、常に一定組成の研磨液を調整
することができる。なお、図示されていないが、再生液
貯留タンク7には、供給される濾過液とクーラントとを
循環させて混合する循環管路が装着され、また、所定に
調整された再生液(研磨液)はポンプ送りにより研磨箇
所へ供給される。
As described above, since the ultraviolet absorptiometer 21 is used as the concentration measuring means, the concentration can be measured quickly even while the filtrate is being supplied, and therefore the valve 23 can be controlled with high accuracy. It is possible to always prepare a polishing liquid having a constant composition. Although not shown in the figure, the regenerant storage tank 7 is equipped with a circulation line for circulating and mixing the supplied filtrate and the coolant, and the regenerant (polishing liquid) is adjusted in a predetermined manner. Are supplied to the polishing location by pumping.

【0012】図中、24は各管路に装着されているポン
プを示し、槽8から抜き出される汚泥は、管路25を経
てタンク41に送られる。また、処理中、中間貯留タン
ク6若しくは補助中間貯留タンク26から抜き出される
荷電処理液(濃縮液)は、管路27及び紫外線殺菌装置
28が装着されている管路29を経て中間貯留タンク6
に循環される。その際、高度に濃縮された余剰の荷電処
理液は、タンク30に送られる。
In the figure, reference numeral 24 denotes a pump attached to each pipeline, and the sludge extracted from the tank 8 is sent to the tank 41 via the pipeline 25. Further, during the processing, the charged processing liquid (concentrated liquid) extracted from the intermediate storage tank 6 or the auxiliary intermediate storage tank 26 passes through the pipeline 27 and the pipeline 29 to which the ultraviolet sterilizer 28 is attached, and the intermediate storage tank 6
Is circulated to. At that time, the surplus highly-charged treatment liquid is sent to the tank 30.

【0013】なお、セラミックフイルタ2の逆洗は、コ
ンプレッサー等を備えた装置31より加圧エアを供給し
たり、あるいは管路32,11を経て洗浄水若しくは薬
液をセラミックフイルタ2に供給して行うことができ
る。係る薬液は、硝酸や苛性ソーダ等を用いることがで
きるが、これらの夫々を薬液タンク33,34に貯留す
ると共に洗浄水をタンク35に貯留している。逆洗に際
して発生する排水は、管路36,37を経て後処理工程
に送られる。なお、管路36に熱交換器38が装着さ
れ、かつ管路39は、薬液若しくは洗浄水を回収し得る
ように装着されている。40は流量計である。
The backwashing of the ceramic filter 2 is carried out by supplying pressurized air from a device 31 equipped with a compressor or the like, or by supplying cleaning water or a chemical solution to the ceramic filter 2 via the conduits 32 and 11. be able to. Nitric acid, caustic soda, or the like can be used as the chemical liquid, but each of them is stored in the chemical liquid tanks 33 and 34 and the cleaning water is stored in the tank 35. The wastewater generated during the backwash is sent to the post-treatment process via the pipelines 36 and 37. A heat exchanger 38 is attached to the pipe 36, and a pipe 39 is attached so that the chemical liquid or the cleaning water can be collected. 40 is a flow meter.

【0014】以上、本考案に係る一実施例について述べ
たが、本考案においては、中間貯留タンク6を設置しな
いで、荷電処理装置1から荷電処理液を直接、セラミッ
クフイルタ2に供給してもよい。また、クーラントは、
界面活性剤等の研磨粉分散剤や凝集防止剤あるいは防錆
剤、その他の研磨液用液体添加剤等が含有されたものな
ど、いかなる組成のものであってもよい。
Although one embodiment according to the present invention has been described above, in the present invention, the charge processing liquid is directly supplied from the charge processing device 1 to the ceramic filter 2 without installing the intermediate storage tank 6. Good. Also, the coolant is
It may be of any composition, such as one containing a polishing powder dispersant such as a surfactant, an agglomeration inhibitor or a rust preventive agent, and other liquid additive for polishing liquid.

【0015】[0015]

【考案の効果】上述したように、本考案によると、セラ
ミックフイルタを用いているので、精密濾過することが
できると共に係る濾過の前段で荷電処理しているので、
セラミックフイルタの致命的な目詰りを防止することが
できて、必要に応じて行う逆洗を一段と容易化すること
ができる。
As described above, according to the present invention, since the ceramic filter is used, it is possible to perform microfiltration, and at the same time, it is charged before the filtration.
The fatal clogging of the ceramic filter can be prevented, and the backwashing performed as necessary can be further facilitated.

【0016】また、クーラント補給量制御装置を装着し
ているので、濾過液の流量及び濃度に対応した所定量の
クーラントを高精度に補給し得て再使用に好適な再生液
(研磨液)を迅速に調整することができる。
Further, since the coolant replenishment amount control device is mounted, a replenishing liquid (polishing liquid) suitable for reuse can be replenished with a predetermined amount of coolant corresponding to the flow rate and concentration of the filtered liquid with high precision. Can be adjusted quickly.

【図面の簡単な説明】[Brief description of drawings]

【図1】研磨廃液処理装置のフローシート図である。FIG. 1 is a flow sheet diagram of a polishing waste liquid processing apparatus.

【符号の説明】 1 荷電処理装置 2 セラミックフイルタ 3 クーラント補給装置 4 クーラント補給量制御装置 5 原液貯留タンク 6 中間貯留タンク 7 再生液貯留タンク 20 流量計 21 紫外線吸光度計 22 流量計 23 弁[Explanation of reference symbols] 1 charge processing device 2 ceramic filter 3 coolant replenishing device 4 coolant replenishment amount control device 5 stock solution storage tank 6 intermediate storage tank 7 reclaimed liquid storage tank 20 flow meter 21 ultraviolet light absorber 22 flow meter 23 valve

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 研磨廃液に通電して凝集処理する荷電処
理装置と、前記荷電処理装置から直接若しくは中間貯留
タンクを経て供給される荷電処理液を濾過するセラミッ
クフイルタと、前記セラミックフイルタから供給される
濾過液とクーラント補給装置から供給されるクーラント
とを混合した再生液を貯留する再生液貯留タンクと、前
記濾過液の流量及び濃度に基いて前記クーラントの補給
量を制御するクーラント補給量制御装置とを備えている
ことを特徴とする研磨廃液処理装置。
1. A charging processing device for energizing a polishing waste liquid to perform coagulation processing, a ceramic filter for filtering a charging processing liquid supplied directly from the charging processing device or through an intermediate storage tank, and a ceramic filter. Replenishing liquid storage tank for storing a regenerating liquid obtained by mixing a filtered liquid and a coolant supplied from a coolant replenishing device, and a coolant replenishing amount control device for controlling the replenishing amount of the coolant based on the flow rate and concentration of the filtered liquid. And a polishing waste liquid treatment device.
JP1991106691U 1991-11-29 1991-11-29 Polishing waste liquid treatment device Expired - Lifetime JPH0744445Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991106691U JPH0744445Y2 (en) 1991-11-29 1991-11-29 Polishing waste liquid treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991106691U JPH0744445Y2 (en) 1991-11-29 1991-11-29 Polishing waste liquid treatment device

Publications (2)

Publication Number Publication Date
JPH0549257U JPH0549257U (en) 1993-06-29
JPH0744445Y2 true JPH0744445Y2 (en) 1995-10-11

Family

ID=14440068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991106691U Expired - Lifetime JPH0744445Y2 (en) 1991-11-29 1991-11-29 Polishing waste liquid treatment device

Country Status (1)

Country Link
JP (1) JPH0744445Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306011B1 (en) * 1998-05-11 2001-10-23 Dynetics Corporation System for controlling the size and surface geometry of an orifice

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770454U (en) * 1980-10-13 1982-04-28
JPS5830112A (en) * 1981-08-18 1983-02-22 Toshiba Corp Tank for oil-filld electric apparatus
GB2177625A (en) * 1985-06-17 1987-01-28 Noboru Inoue Fluid filtering apparatus
JPS6352928A (en) * 1986-08-20 1988-03-07 Toshiba Ceramics Co Ltd Electro-discharge processing device

Also Published As

Publication number Publication date
JPH0549257U (en) 1993-06-29

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