JPH0744352B2 - Manufacturing method of radio wave shield tape - Google Patents
Manufacturing method of radio wave shield tapeInfo
- Publication number
- JPH0744352B2 JPH0744352B2 JP4337791A JP4337791A JPH0744352B2 JP H0744352 B2 JPH0744352 B2 JP H0744352B2 JP 4337791 A JP4337791 A JP 4337791A JP 4337791 A JP4337791 A JP 4337791A JP H0744352 B2 JPH0744352 B2 JP H0744352B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- metal foil
- solder
- reel
- foil tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Building Environments (AREA)
- Physical Vapour Deposition (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電磁波シールド目地接合
用のテープの製造方法に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a tape for joining electromagnetic wave shield joints.
【０００２】[0002]
【従来の技術】図２は本発明者等によって特願平２−３
０４００５号において提案された電磁波シールド製造方
法の概要を示すもので、半田溶融槽ａの溶融半田ｂ内
に、半田付着ローラｃが回転自在に配設され、同ローラ
ｃの前後両側上部に、テープ押付ローラｄ、ｅが昇降自
在に装架され、前記半田溶融槽ａの前端外側、及び後端
外側には夫々テープリールｆ及び巻取リールｇが配設さ
れ、前記テープリールｆに捲装された、ニツケルメツキ
を施した電解鉄箔等より構成され金属箔テープｈが、巻
取リールｇによって巻取られ、半田溶融槽ａの上部を横
断するように構成されている。2. Description of the Related Art FIG.
The outline of the electromagnetic wave shield manufacturing method proposed in No. 04005 is as follows. A solder attaching roller c is rotatably arranged in a molten solder b of a solder melting tank a, and a tape is provided on both upper front and rear sides of the roller c. The pressing rollers d and e are vertically movably mounted, and a tape reel f and a take-up reel g are provided outside the front end and the rear end of the solder melting tank a, respectively, and are wound around the tape reel f. A metal foil tape h made of nickel-plated electrolytic iron foil or the like is wound by a take-up reel g so as to cross the upper portion of the solder melting tank a.
【０００３】更に半田溶融槽ａには自動温度調節器ｉ、
半田溶融槽ａにおける金属箔テープｈの出口側には同テ
ープｈに半田を均一の厚さに付着させる可動ナイフエツ
ジｊ及び半田の酸化を防止するためのフラツクス塗布器
ｋが装架され、更に図示せぬテープ送り出し速度、テー
ブ張力調整装置が設けられている。而して巻取リールｇ
によってテープリールｆに捲装された金属箔テープｈを
巻取り、半田溶融槽ａ内を横断させる過程において、前
記テープ押付ローラｄ、ｅを圧下して金属箔テープｈを
半田付着ローラｃに圧着することによって、同ローラｃ
を介して前記金属箔テープｈの下面に半田メツキを施
し、更に前記金属箔テープｈの下面にはナイフエツジｊ
によって均一な厚さで半田メツキを付着し、不陸のない
平滑な面に仕上げて、表面処理が容易に行なわれるよう
にし、前記金属箔テープｈにフラツクス塗布器ｋを介し
てフラツクスを塗布して半田の酸化を防止したのち、金
属箔テープｈを巻取リールｇに巻取るものである。Further, in the solder melting tank a, an automatic temperature controller i,
On the outlet side of the metal foil tape h in the solder melting tank a, a movable knife edge j for attaching the solder to the tape h with a uniform thickness and a flux applicator k for preventing the oxidation of the solder are mounted. A tape feeding speed and tape tension adjusting device (not shown) are provided. Take-up reel g
In the process of winding up the metal foil tape h wound around the tape reel f by the tape reel f and traversing the inside of the solder melting tank a, the tape pressing rollers d and e are pressed down to press the metal foil tape h onto the solder adhering roller c. The same roller c
Solder plating is applied to the lower surface of the metal foil tape h through the metal foil tape h and the knife edge j
By applying solder plating with a uniform thickness to finish a smooth surface without unevenness so that the surface treatment can be easily performed, the flux is applied to the metal foil tape h through the flux applicator k. After preventing the solder from being oxidized, the metal foil tape h is wound around the winding reel g.
【０００４】[0004]
【発明が解決しようとする課題】前記の方法において
は、金属箔テープの裏面に半田が回り込む惧れがある。
本発明はこのような問題点に鑑みて提案されたもので、
その目的とする処は、金属箔テープの片面にのみ半田メ
ツキが完全に施された電波シールドテープを連続的に製
造しうる方法を提供する点にある。In the above method, there is a fear that the solder may wrap around the back surface of the metal foil tape.
The present invention has been proposed in view of such problems,
An object of the object is to provide a method capable of continuously producing a radio wave shield tape in which solder plating is completely applied on only one surface of a metal foil tape.
【０００５】[0005]
【課題を解決するための手段】前記の目的を達成するた
め、本発明に係る電波シールドテープの製造方法によれ
ば金属箔テープに予めニツケルメツキを施したのち、片
面にのみアルミニウムを蒸着し、同金属箔テープを半田
溶融槽内を通過せしめるものである。請求項２の発明は
半田溶融槽を挟んで相対する両側外部に金属箔テープを
送り出しリール及び巻取りリールを配設するとともに、
前記槽内にテープ押付けローラを装架し、予めニツケル
メツキを施し、片面にのみアルミニウムを蒸着してなる
金属箔テープを前記送り出しリールにニツケルメツキ鏡
面が表面に位置するように捲装して、同金属箔テープを
前記巻取りリールによって巻取り、同テープを前記テー
プ押付ローラを経由して半田溶融槽内を通過せしめるも
のである。In order to achieve the above object, according to the method of manufacturing a radio wave shield tape of the present invention, a metal foil tape is preliminarily plated with nickel, and then aluminum is vapor-deposited on only one surface of the metal foil tape. The metal foil tape is passed through the solder melting tank. According to a second aspect of the present invention, the metal foil tape is sent out to both sides of the solder melting tank so as to face each other, and the reel and the winding reel are arranged.
A tape pressing roller is mounted in the tank, and nickel plating is applied in advance, and a metal foil tape formed by vapor-depositing aluminum only on one surface is wound around the delivery reel so that the nickel plating mirror surface is located on the surface, and the same metal is used. The foil tape is taken up by the take-up reel, and the tape is passed through the solder pressing tank via the tape pressing roller.
【０００６】[0006]
【作用】本発明によれば前記したように、予めニツケル
メツキを施したのち片面にのみアルミニウムを蒸着した
金属箔テープを半田溶融槽内を通過せしめることによっ
て、同金属箔テープのニツケルメツキ鏡面にのみ半田メ
ツキが施され、反対側のアルミニウム蒸着面には半田が
回り込まない。According to the present invention, as described above, by passing a metal foil tape, which has been plated with nickel in advance and then aluminum is vapor-deposited on only one side, in the solder melting tank, solder is applied only to the mirror-finished mirror surface of the metal foil tape. Solder does not wrap around on the opposite aluminum vapor-deposited surface.
【０００７】請求項２の発明は半田溶融槽を挟んで配設
された金属箔テープ送り出しリール及び巻取りロール間
に亘って、ニツケルメツキが施され、片面にのみアルミ
ニウムを蒸発した金属箔テープをして半田溶融槽を通過
せしめ、その間に同テープにテープ押付けローラを介し
て半田メツキを施すことによって、テープの片面にのみ
半田メツキが施された電波シールドテープを連続的に製
造するものである。According to the second aspect of the present invention, a nickel foil is applied between the metal foil tape feeding reel and the winding roll which are disposed with the solder melting tank interposed therebetween, and the metal foil tape is formed by evaporating aluminum only on one surface. The tape is passed through a solder melting tank, and solder tape is applied to the tape via a tape pressing roller in the meantime to continuously produce a radio wave shield tape in which solder tape is applied to only one surface of the tape.
【０００８】[0008]
【実施例】以下本発明を図２に示す実施例について説明
すると、１は半田溶融槽で同槽１の上部に、槽内の溶融
半田２に一部浸漬するようにテープ押付ローラ３が装架
されている。更に前記半田溶融槽１を挟んで同槽１の外
側に金属箔テープ送り出しリール４及び巻取りリール５
が配設されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiment shown in FIG. 2. Reference numeral 1 is a solder melting tank, and a tape pressing roller 3 is mounted on the upper portion of the tank 1 so as to be partially immersed in the molten solder 2 in the tank. It is hung. Further, a metal foil tape feed reel 4 and a take-up reel 5 are provided outside the bath 1 with the solder melting bath 1 interposed therebetween.
Is provided.
【０００９】更に半田溶融槽１には自動温度調節器６、
半田溶融槽１における金属箔テープ７の出口側には同テ
ープ７に半田を均一の厚さに付着させる可動ナイフエツ
ジ８及び半田の酸化を防止するためのフラツクス塗布器
９が設けられ、更に図示せぬテープ送り出し装置及びテ
ープ張力調整装置が設けられている。電解箔等の金属箔
テープ７に予めニケツルメツキを施し、同テープ７の粗
面にアルミニウムを蒸着し、ニツケルメツキ鏡面７ａ側
にフラツクスを塗布し、前記送り出しリール４に前記金
属箔テープ７をニツケルメツキ鏡面７ａ側が表面に、ア
ルミニウム蒸着面７ｂが裏面になるように捲着する。Further, in the solder melting tank 1, an automatic temperature controller 6,
On the outlet side of the metal foil tape 7 in the solder melting tank 1, there are provided a movable knife edge 8 for adhering the solder to the tape 7 with a uniform thickness, and a flux applicator 9 for preventing the oxidation of the solder, which is further shown in the drawing. A tape feeding device and a tape tension adjusting device are provided. A metal foil tape 7 such as an electrolytic foil is preliminarily nicked, aluminum is vapor-deposited on the rough surface of the tape 7, and a flux is applied to the nickle mirror surface 7a side. The side is the front surface and the aluminum vapor deposition surface 7b is the back surface.
【００１０】次いで前記巻取リール５によって前記巻取
リール４から金属箔テープ７を巻取り、同テープ７が半
田溶融槽１内を通過する際、テープ押付けローラ３によ
って金属箔テープ７のニツケルメツキ鏡面７ａ側に半田
メツキが施される。更に金属箔テープ７の半田メツキ付
着面７ｃはナイフエツジ８によって均一な厚さを有する
不陸のない平滑な面に仕上げられ、表面処理が容易に行
なわれるようになる。次いで前記金属箔テープ７の半田
付着面７ｃにフラツクス塗布器９を介してフラツクスを
塗布して半田の酸化を防止したのち、金属箔テープ７を
巻取ロール５に巻取るものである。Then, the metal foil tape 7 is taken up from the take-up reel 4 by the take-up reel 5, and when the tape 7 passes through the inside of the solder melting tank 1, the tape pressing roller 3 makes a mirror surface of the metal foil tape 7 on a mirror surface. Solder plating is applied to the 7a side. Further, the solder plating adhering surface 7c of the metal foil tape 7 is finished by the knife edge 8 into a smooth surface having a uniform thickness and having no unevenness, which facilitates the surface treatment. Next, after the flux is applied to the solder adhering surface 7c of the metal foil tape 7 through the flux applicator 9 to prevent the oxidation of the solder, the metal foil tape 7 is wound on the winding roll 5.
【００１１】[0011]
【発明の効果】本発明によれば前記したように金属箔テ
ープに予めニツケルメツキを施したのち、片面にのみア
ルミニウムを蒸着して、同金属箔テープを半田溶融槽内
を通過せしめることによって、金属箔テープにおける片
面にのみ半田が均一な厚みで付着され、半田溶着の際、
反対側に半田がはみ出して付着する惧れがなく、金属箔
テープの接合面は不陸のない平滑面に仕上げられ、表面
処理が容易なものとなる。According to the present invention, as described above, the metal foil tape is preliminarily plated with nickel, and then aluminum is vapor-deposited on only one side, and the metal foil tape is passed through the solder melting tank to form a metal foil. Solder is applied with a uniform thickness only on one side of the foil tape.
There is no risk of solder sticking out and adhering to the opposite side, and the joining surface of the metal foil tape is finished to be a smooth surface without unevenness, which facilitates surface treatment.
【００１２】本発明の方法によって製造された電波シー
ルドテープは金属接合部の溶接工法に適用され、床、
壁、天井の連続的な施工を可能ならしめ、また接合部を
半田によって溶着することによって、電磁波遮蔽性能が
向上される。請求項２の発明は予めニケツルメツキを施
し、片面にのみアルミニウムを蒸着した金属箔テープ
を、半田溶融槽を挟んで相対する同テープ送り出しリー
ルと巻取リールとの間に亘って、半田溶融槽を通過させ
る過程において、同槽内に配設されたテープ押付けロー
ラを介して前記テープの片面にのみ半田メツキを施すも
のであって、このように請求項２の発明によれば片面に
のみ半田メツキが施された電波シールドテープを連続的
に製造しうるものである。The radio wave shielding tape produced by the method of the present invention is applied to the welding method for metal joints,
Electromagnetic wave shielding performance is improved by enabling continuous construction of walls and ceilings and welding the joints with solder. According to a second aspect of the present invention, a metal foil tape, which has been nicked in advance and has aluminum vapor-deposited on only one surface thereof, is provided between the tape feeding reel and the take-up reel, which face each other with the solder melting tank in between, and the solder melting tank is provided. In the process of passing, the solder plating is applied only to one surface of the tape via the tape pressing roller arranged in the same tank. Thus, according to the invention of claim 2, the solder plating is applied to only one surface. It is possible to continuously manufacture a radio wave shielding tape provided with.
【図１】本発明に係る電波シールドテープの製造方法の
一実施例の実施状況を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing an implementation state of an embodiment of a method of manufacturing a radio wave shield tape according to the present invention.
【図２】従来の電波シールドテープの製造方法の実施状
況を示す縦断面図である。FIG. 2 is a vertical cross-sectional view showing an implementation state of a conventional method for manufacturing a radio wave shield tape.
１ 半田溶融槽 ２ 溶融半田 ３ テープ押付ローラ ４ 金属箔テープ送り出しリール ５ 巻取リール ７ 金属箔リール ７ａ ニツケルメツキ鏡面 ７ｂ アルミニウム蒸着面 ７ｃ 半田付着面 1 Solder Melting Tank 2 Melting Solder 3 Tape Pressing Roller 4 Metal Foil Tape Feeding Reel 5 Winding Reel 7 Metal Foil Reel 7a Nickel Mirror Surface 7b Aluminum Evaporation Surface 7c Solder Adhesion Surface
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｅ０４Ｂ 1/684 Ｂ２３Ｋ 101:16 (72)発明者 土田 恭義 東京都渋谷区千駄ヶ谷四丁目６番15号 株 式会社フジタ内 (72)発明者 大西 一昌 東京都千代田区永田町２−12−14 株式会 社 エービーシー商会内 (72)発明者 伊藤 桂 東京都千代田区永田町２−12−14 株式会 社 エービーシー商会内 (72)発明者 松井 輝夫 神奈川県横浜市神奈川区富家町１ 東海金 属株式会社内 (72)発明者 上野 博生 神奈川県横浜市神奈川区富家町１ 東海金 属株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location // E04B 1/684 B23K 101: 16 (72) Inventor Kyoyoshi Tsuchida 4-chome Sendagaya, Shibuya-ku, Tokyo No. 6-15 Fujita Co., Ltd. (72) Inventor Kazumasa Onishi 2-12-14 Nagata-cho, Chiyoda-ku, Tokyo Incorporated company, ABC Shokai (72) Inventor Katsura Ito 2-12-14 Nagata-cho, Chiyoda-ku, Tokyo Stock company ABC Trading Company (72) Inventor Teruo Matsui 1 Tomi-cho, Kanagawa-ku, Yokohama, Kanagawa Tokai Kinzoku Co., Ltd. (72) Inventor Hiroo Ueno 1 Tomi-Ken, Kanagawa-ku, Yokohama, Tokai Kinzoku Co., Ltd. Within
Claims (2)
したのち、片面にのみアルミニウムを蒸着し、同金属箔
テープを半田溶融槽内を通過せしめることを特徴とする
電波シールドテープの製造方法。1. A method of manufacturing a radio wave shield tape, comprising: applying a metal plating to a metal foil tape in advance; then, vapor-depositing aluminum on only one surface of the metal foil tape and allowing the metal foil tape to pass through a solder melting tank.
金属箔テープを送り出しリール及び巻取りリールを配設
するとともに、前記槽内にテープ押付けローラを装架
し、予めニツケルメツキを施し、片面にのみアルミニウ
ムを蒸着してなる金属箔テープを前記送り出しリールに
ニツケルメツキ鏡面が表面に位置するように捲装して、
同金属箔テープを前記巻取りリールによって巻取り、同
テープを前記テープ押付ローラを経由して半田溶融槽内
を通過せしめる請求項１記載の電波シールドテープの製
造方法。2. A metal foil tape is sent to the outside on both sides of the solder melting bath to face each other, a reel and a take-up reel are arranged, a tape pressing roller is mounted in the bath, and nickel plating is applied in advance to form one side. A metal foil tape formed by vapor-depositing aluminum only is wound around the delivery reel so that the nickel mirror surface is located on the surface,
2. The method of manufacturing a radio wave shield tape according to claim 1, wherein the metal foil tape is wound by the take-up reel, and the tape is passed through the solder pressing tank via the tape pressing roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4337791A JPH0744352B2 (en) | 1991-03-08 | 1991-03-08 | Manufacturing method of radio wave shield tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4337791A JPH0744352B2 (en) | 1991-03-08 | 1991-03-08 | Manufacturing method of radio wave shield tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04297098A JPH04297098A (en) | 1992-10-21 |
| JPH0744352B2 true JPH0744352B2 (en) | 1995-05-15 |
Family
ID=12662136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4337791A Expired - Fee Related JPH0744352B2 (en) | 1991-03-08 | 1991-03-08 | Manufacturing method of radio wave shield tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744352B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09316643A (en) * | 1996-02-15 | 1997-12-09 | Mitsubishi Materials Corp | Sticking preventing parts for physical vapor deposition system |
-
1991
- 1991-03-08 JP JP4337791A patent/JPH0744352B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04297098A (en) | 1992-10-21 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |