JPH0741991U - Connecting terminal - Google Patents

Connecting terminal

Info

Publication number
JPH0741991U
JPH0741991U JP7417693U JP7417693U JPH0741991U JP H0741991 U JPH0741991 U JP H0741991U JP 7417693 U JP7417693 U JP 7417693U JP 7417693 U JP7417693 U JP 7417693U JP H0741991 U JPH0741991 U JP H0741991U
Authority
JP
Japan
Prior art keywords
terminal
connection
transistor
power transistor
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7417693U
Other languages
Japanese (ja)
Inventor
池 英 司 菊
Original Assignee
株式会社ジャルコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャルコ filed Critical 株式会社ジャルコ
Priority to JP7417693U priority Critical patent/JPH0741991U/en
Publication of JPH0741991U publication Critical patent/JPH0741991U/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

(57)【要約】 【目的】 トランジスタソケットのような電気的特性,
機械的特性についての問題が生じることがなく、しか
も、従来の直付けの半田付けのような作業性の問題もな
いパワ−トランジスタと回路基板との接続用端子を提供
すること。 【構成】 合成樹脂等の不導体で形成した短かい棒状を
なすボデ−本体と、該ボデ−本体に下端側を貫通させて
立設した少なくとも3本の導電体による接触子本体であ
って、上端をパワ−トランジスタの端子の半田付け接続
部に形成すると共に前記ボデ−本体から突出した下端側
を基板の回路パタ−ンへの接続脚部に形成した接触子と
から成り、前記接触子の接続脚部を回路パタ−ンに接続
してボデ−本体を回路基板上に止め、前記半田付け接続
部にトランジスタの端子を半田付け接続するようにし
た。
(57) [Abstract] [Purpose] Electrical characteristics such as transistor socket,
(EN) Provided is a terminal for connecting a power transistor and a circuit board, which does not cause a problem in mechanical characteristics and has no workability problem such as the conventional direct soldering. A short rod-shaped body body made of a non-conductor such as synthetic resin, and a contact body made of at least three electric conductors erected upright at the lower end side of the body body. A contactor having an upper end formed in a soldered connection portion of a terminal of a power transistor and a lower end side protruding from the body of the body formed in a connection leg portion for connecting to a circuit pattern of a substrate. The connecting legs were connected to the circuit pattern, the body of the body was stopped on the circuit board, and the terminals of the transistor were soldered to the soldering connection portion.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、例えばオ−ディオアンプのパワ−トランジスタの端子を回路基板に 形成された回路パタ−ンに接続する際などに使用して有用な接続端子に関するも のである。 The present invention relates to a connection terminal which is useful when, for example, the terminal of a power transistor of an audio amplifier is connected to a circuit pattern formed on a circuit board.

【0002】[0002]

【従来の技術】[Prior art]

従来から、パワ−トランジスタTは、図4,図5に例示するように、ヒ−トシ ンクHにビスb等により止め、該トランジスタTの端子t1〜t3は回路基板Pの回 路パタ−ンCpに半田付けZによりいわゆる直付けする構造が採用されている。Conventionally, the power transistor T is fixed to the heat sink H by a screw b or the like as illustrated in FIGS. 4 and 5, and the terminals t 1 to t 3 of the transistor T are connected to the circuit pattern of the circuit board P. The so-called direct mounting structure is adopted by soldering Z to the solder Cp.

【0003】 しかし、図4に例示したものでは、回路基板Pの回路パタ−ンCpが当該基板P の裏面に位置しているため、回路基板Pやシャ−シ等を含んだセット全体を裏返 しにして半田付けZを行わなければならず、作業に手間がかかるという難点があ った。However, in the example illustrated in FIG. 4, since the circuit pattern Cp of the circuit board P is located on the back surface of the board P, the entire set including the circuit board P and the chassis is turned over. However, the soldering Z had to be carried out, and the work was troublesome.

【0004】 また、上記図4に例示したもののように、セット裏面に半田付けZの部分があ る場合、将来のメンテナンス等のために本体(図示せず、シャ−シ裏面やアンプ ケ−シングの底)に大きな穴とこの穴を塞ぐためのカバ−が不可欠となって、セ ット全体のコストの面からも有利とはいえない。Further, as shown in FIG. 4 above, when there is a soldering Z portion on the rear surface of the set, a main body (not shown, the rear surface of the chassis or the amplifier casing) is provided for future maintenance or the like. A large hole in the bottom) and a cover for closing this hole are indispensable, and it cannot be said to be advantageous in terms of the cost of the entire set.

【0005】 一方、図5に例示したもののように、ヒ−トシンクHのトランジスタTの取付 面と回路基板Pとが平行な向きで臨接している場合には、半田付けZの作業自体 を行い難いという問題がある。On the other hand, as shown in FIG. 5, when the mounting surface of the transistor T of the heat sink H and the circuit board P are in contact with each other in a parallel direction, the work of soldering Z itself is performed. There is a problem of difficulty.

【0006】 上記のような点に鑑み、ヒ−トシンクHに取付けられたパワ−トランジスタT の端子t1〜t3と回路基板Pの回路パタ−ンCpを接続するための専用部品として、 図6に示すようなトランジスタソケットTsと称される部品が開発され使用された が、種々の問題点が指摘され、現在では殆んど使用されていない。In view of the above points, as a dedicated component for connecting the terminals t 1 to t 3 of the power transistor T mounted on the heat sink H and the circuit pattern Cp of the circuit board P, Although a component called a transistor socket Ts as shown in 6 has been developed and used, various problems have been pointed out and it is hardly used at present.

【0007】 即ち、上記トランジスタソケットTsは、薄い箱状をなす合成樹脂等の電気不導 体で形成した本体Shに、パワ−トランジスタTの各端子t1〜t3を挿込み接続する バネ接触タイプの3つの接触子C1,C2,C3を設けると共に、各接触子C1〜C3と一 体形成された回路接続用の端子r1〜r3を設けたもので、図7に例示するような態 様で使用するものであったので、半田付けの問題は解消できたが、次のような新 たな問題点が指摘されたのである。That is, the transistor socket Ts is a spring contact for inserting and connecting the respective terminals t 1 to t 3 of the power transistor T into the main body Sh formed of an electrically non-conductive material such as a thin box-shaped synthetic resin. In addition to providing three types of contacts C 1 , C 2 , C 3 and terminals r 1 to r 3 for circuit connection, which are integrally formed with each of the contacts C 1 to C 3 , FIG. Since it was used in the manner as illustrated in Example 1, the problem of soldering could be solved, but the following new problems were pointed out.

【0008】 而して、図6,図7に示したトランジスタソケットTsは、パワ−トランジスタ Tの端子t1〜t3と接続される接触子C1〜C3がバネ接触タイプであるため、前記ト ランジスタTの発熱に加え、大電流が流れることによってこの接触部に熱が発生 し、これらの熱がソケットTsの電気的,機械的性能に支障を来すおそれが高い。Therefore, in the transistor socket Ts shown in FIGS. 6 and 7, since the contacts C 1 to C 3 connected to the terminals t 1 to t 3 of the power transistor T are spring contact type, In addition to the heat generation of the transistor T, a large current flows, so that heat is generated at this contact portion, and there is a high possibility that the heat will hinder the electrical and mechanical performance of the socket Ts.

【0009】 また、パワ−トランジスタTの各端子t1〜t3のピッチ精度が粗いため、このソ ケットの各接触子C1〜C3との接触抵抗を安定に保持することが困難な場合が多く 、前記端子t1〜t3によって接触子C1〜C3側のバネのへたりを招来する問題がある 。Further, when the pitch accuracy of each terminal t 1 to t 3 of the power transistor T is rough, it is difficult to stably maintain the contact resistance with each contactor C 1 to C 3 of this socket. However, there is a problem in that the terminals t 1 to t 3 cause the spring of the springs on the side of the contacts C 1 to C 3 to settle.

【0010】 これに関し、各端子t1〜t3と各接触子C1〜C3との接触抵抗を安定にするため、 接触子C1〜C3のバネ圧を高めると、各端子t1〜t3の挿入がしづらくなり、作業中 、端子t1〜t3の曲がりを招来し、かえって作業に手間取ることがある。In this regard, in order to stabilize the contact resistance between each of the terminals t 1 to t 3 and each of the contacts C 1 to C 3 , if the spring pressure of the contacts C 1 to C 3 is increased, each terminal t 1 insertion of ~t 3 is difficult to, in the work, and lead to a bending of the terminal t 1 ~t 3, rather it may take time to work.

【0011】[0011]

【考案が解決しようとする課題】[Problems to be solved by the device]

本考案は上記のような従来技術に鑑み、トランジスタソケットのような電気的 特性,機械的特性についての問題が生じることがなく、しかも、従来の直付けの 半田付けのような作業性の問題もないパワ−トランジスタと回路基板との接続用 端子を提供することを課題とするものである。 In view of the above-mentioned conventional techniques, the present invention does not have the problems of electrical characteristics and mechanical characteristics of a transistor socket, and has the workability problem of the conventional direct soldering. It is an object of the present invention to provide a terminal for connecting a power transistor that does not exist to a circuit board.

【0012】[0012]

【課題を解決するための手段】[Means for Solving the Problems]

上記課題を解決することを目的としてなされた本考案接続端子の構成は、合成 樹脂等の不導体で形成した短かい棒状をなすボデ−本体と、該ボデ−本体に下端 側を貫通させて立設した少なくとも3本の導電体による接触子本体であって、上 端をパワ−トランジスタの端子の半田付け接続部に形成すると共に前記ボデ−本 体から突出した下端側を基板の回路パタ−ンへの接続脚部に形成した接触子とか ら成り、前記接触子の接続脚部を回路パタ−ンに接続してボデ−本体を回路基板 上に止め、前記半田付け接続部にトランジスタの端子を半田付け接続するように したことを特徴とするものである。 The structure of the connection terminal of the present invention made for the purpose of solving the above-mentioned problems is a short rod-shaped body body formed of a non-conductor such as synthetic resin, and a standing body with the lower end side penetrating the body body. A contactor body formed of at least three conductors, the upper end of which is formed in a soldering connection portion of a terminal of a power transistor, and the lower end side of which is projected from the body is a circuit pattern of a board. The contact leg of the contact is connected to the circuit pattern, the body of the body is fixed on the circuit board, and the transistor terminal is connected to the soldering connection. It is characterized by being connected by soldering.

【0013】[0013]

【作用】[Action]

本考案接続端子によって、基板の回路パタ−ン上のパワ−トランジスタの端子 を接続すべき部分を、ヒ−トシンクに固定されたパワ−トランジスタの端子が接 続し易い形態、つまり半田付け作業を行い易い場所,向きに変えたと同じように 形成できるので、半田付け作業が楽になる。また、この接続端子とトランジスタ の端子は半田付けによる接続であるから、この接続の機械的特性,電気的特性は 、ソケットによる接続のような問題はない。 With the connection terminal of the present invention, it is easy to connect the power transistor terminal fixed to the heat sink to the part where the power transistor terminal on the circuit pattern of the board should be connected, that is, soldering work. Since it can be formed in the same place where it is easy to carry out, and it can be formed in the same way as the orientation, soldering work becomes easier. Also, since the connection terminal and the transistor terminal are connected by soldering, the mechanical and electrical characteristics of this connection do not have the problems of a socket connection.

【0014】[0014]

【実施例】【Example】

次に、本考案の実施例を図1〜図3により説明する。図1は本考案端子の一例 の斜視図、図2は図1の接続端子の使用例の斜視図、図3は本考案端子の別例の 斜視図である。 Next, an embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view of an example of the terminal of the present invention, FIG. 2 is a perspective view of an example of using the connection terminal of FIG. 1, and FIG. 3 is a perspective view of another example of the terminal of the present invention.

【0015】 図1において、1は短かい断面角柱状をなすように合成樹脂等の不導体により 形成した本考案端子のボデ−本体、2,3,4は前記ボデ−本体1の上面1a側に 、下端側を当該本体1から貫通して下面1b側に露出させた態様で立設した黄銅等 の導体により板状に形成した接触子本体で、通常、前記ボデ−本体1の成形時に それと一体に成形される。In FIG. 1, reference numeral 1 is a body of a terminal of the present invention formed of a non-conductor such as synthetic resin so as to have a short cross-section prismatic shape, and 2, 3 and 4 are the upper surface 1a side of the body 1 The contact body is a plate-like body made of a conductor such as brass that is erected in such a manner that its lower end penetrates the main body 1 and is exposed to the lower surface 1b side. It is molded integrally.

【0016】 各接触子本体2〜4は、夫々電気的に独立しており、各接触子本体2〜4の上 端には、ここでは、パワトランジスタTの各端子t1〜t3を挿入してそれらを下か ら支えるための切欠2a,3a,4aと、当該切欠2a〜4aを形成するための切込みを折 曲げて形成した水平向きの舌片21a,31a,41aが形成されてトランジスタの端子 の半田付け接続部に形成されている。The contact bodies 2 to 4 are electrically independent of each other, and here, the terminals t 1 to t 3 of the power transistor T are inserted at the upper ends of the contact bodies 2 to 4, respectively. Then, the notches 2a, 3a, 4a for supporting them from below and the horizontally oriented tongues 21a, 31a, 41a formed by bending the notches for forming the notches 2a-4a are formed. It is formed on the soldered connection part of the terminal.

【0017】 一方、上記各接触子本体2〜4の下端側は、ここではボデ−本体1の下面から ほぼ垂直に延設された形態のいわゆるバ−チカルタイプの接続脚部2b,3b,4bに 形成されている。上記脚部2b,3b,4bの下端側は前後に比較的浅い角度で略くの 字状に折返され、基板側の備入孔(図示せず)に保持するためのいわゆるキンク 21b,31b,41bに形成されており、上記1〜41fによって本考案接続端子Aを形成 する。なお、上記脚部2b〜4bの長さ、及び、キンク21b〜41bの構造は図示の例に 限られず、他の任意の長さ,公知の任意の構造であれば足りる。On the other hand, the lower ends of the contactor bodies 2 to 4 are so-called vertical type connecting leg portions 2b, 3b, 4b which are extended substantially vertically from the lower surface of the body 1 here. Is formed in The lower ends of the legs 2b, 3b, 4b are folded back and forth in a substantially dogleg shape at a relatively shallow angle, so-called kinks 21b, 31b for holding in a charging hole (not shown) on the board side. 41b, and the connection terminal A of the present invention is formed by the above 1 to 41f. The lengths of the leg portions 2b to 4b and the structures of the kinks 21b to 41b are not limited to the examples shown in the figures, and any other length and any known structure will suffice.

【0018】 上記のように形成される本考案接続端子の一例は、図2に示すような態様で使 用様される。即ち、図2に於て、回路パタ−ンCpが裏面に形成された回路基板P に、本考案接続端子Aを、その接続脚部2b,3b,4bを所定の挿込穴に挿入して取 付け、各接触子本体2〜4における各半田付け接続部の切欠21a〜41aにヒ−トシ ンクHにビスbにより固着されたパワ−トランジスタTの各端子t1〜t3を入れて 、この部分を半田付けするのである。An example of the connection terminal of the present invention formed as described above is used in a mode as shown in FIG. That is, in FIG. 2, the connection terminal A of the present invention is inserted into the predetermined insertion holes of the connection terminals A of the present invention on the circuit board P having the circuit pattern Cp formed on the back surface. Attach the terminals t 1 to t 3 of the power transistor T fixed to the heat sink H by the screw b to the notches 21a to 41a of the soldered connection portions of the contact bodies 2 to 4, respectively. This part is soldered.

【0019】 このようにすると、回路パタ−ンCpがパワ−トランジスタTの端子t1〜t3から みれば基板Pの裏面にあっても、図4に示した従来構造のように、裏面での半田 付け作業がなくなるので、作業性が良いのみならず、セット本体の裏面(底)に メンテナンス等用の大きな穴と、この穴を塞ぐカバ−とが不要になるので、この 面でも合理的になる。With this configuration, even if the circuit pattern Cp is on the back surface of the substrate P when viewed from the terminals t 1 to t 3 of the power transistor T, the back surface is formed on the back surface as in the conventional structure shown in FIG. This eliminates the need for soldering work, and not only does it have good workability, but it also eliminates the need for a large hole on the back (bottom) of the set body for maintenance, etc., and a cover for closing this hole. become.

【0020】 図3は、ヒ−トシンクHのパワ−トランジスタTの取付面と回路基板Pが平行 な向きになった図5に例示した従来例の構造に本考案の別例の接続端子を使用し た例を示すものである。FIG. 3 shows the structure of the conventional example shown in FIG. 5 in which the mounting surface of the power transistor T of the heat sink H and the circuit board P are parallel to each other, and the connection terminal of another example of the present invention is used. It shows an example.

【0021】 図3に示すようなパワ−トランジスタTの端子t1〜t3と、回路基板Pの配置態 様であると、図1に示した本考案接続端子の接続脚部2b,3b,4bの向きでは対応 できない。この場合は、接続脚部2b〜4bがボデ−本体1の下面1bに対し平行な向 きに曲げられたいわゆるアングルタイプの本考案接続端子を使用することとなる 。When the terminals t 1 to t 3 of the power transistor T and the circuit board P are arranged as shown in FIG. 3, the connection legs 2b, 3b of the connection terminal of the present invention shown in FIG. 4b orientation is not applicable. In this case, the so-called angle type connection terminal of the present invention in which the connection legs 2b to 4b are bent in a direction parallel to the lower surface 1b of the body 1 is used.

【0022】[0022]

【考案の効果】[Effect of device]

本考案は以上の通りであって、これまでパワ−トランジスタの端子と、これら を接続すべき回路基板の回路パタ−ンの向き,位置関係が、半田付けし難い向き や位置であった場合、作業性が悪く、また、セットの組立ても煩雑という問題点 があったものを、本考案接続端子を使用することにより、前記問題点を全面的に 解消することができる。また、パワ−トランジスタの端子を半田付けにより接続 するので、トランジスタソケットを使用した場合にあった問題も生じないという 効果が得られる。 The present invention is as described above, and when the direction and the positional relationship between the terminals of the power transistor and the circuit pattern of the circuit board to which they are connected have been such that it is difficult to solder, By using the connection terminal of the present invention, it is possible to completely eliminate the above-mentioned problems, which had problems of poor workability and complicated assembly of the set. Moreover, since the terminals of the power transistor are connected by soldering, the problem that occurs when a transistor socket is used does not occur.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案端子の一例の斜視図。FIG. 1 is a perspective view of an example of a terminal of the present invention.

【図2】図1の接続端子の使用例の斜視図。FIG. 2 is a perspective view of a usage example of the connection terminal of FIG.

【図3】本考案端子の別例の斜視図。FIG. 3 is a perspective view of another example of the present invention terminal.

【図4】パワ−トランジスタの端子と回路パタ−ンの従
来の接続態様の一例を示す斜視図。
FIG. 4 is a perspective view showing an example of a conventional connection mode between a terminal of a power transistor and a circuit pattern.

【図5】パワ−トランジスタの端子と回路パタ−ンの従
来の接続態様の他の例を示す斜視図。
FIG. 5 is a perspective view showing another example of the conventional connection mode between the terminals of the power transistor and the circuit pattern.

【図6】トランジスタソケットの一例の斜視図。FIG. 6 is a perspective view of an example of a transistor socket.

【図7】図6のソケットを使用した接続例の斜視図。7 is a perspective view of a connection example using the socket of FIG.

【符号の説明】[Explanation of symbols]

1 ボデ−本体 2〜4 接触子本体 H ヒ−トシンク T パワ−トランジスタ t1〜t3 トランジスタの端子 P 回路基板1 Body 2 to 4 Contact body H Heat sink T Power transistor t 1 to t 3 Transistor terminal P Circuit board

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 合成樹脂等の不導体で形成した短かい棒
状をなすボデ−本体と、該ボデ−本体に下端側を貫通さ
せて立設した少なくとも3本の導電体による接触子本体
であって、上端をパワ−トランジスタの端子の半田付け
接続部に形成すると共に前記ボデ−本体から突出した下
端側を基板の回路パタ−ンへの接続脚部に形成した接触
子とから成り、前記接触子の接続脚部を回路パタ−ンに
接続してボデ−本体を回路基板上に止め、前記半田付け
接続部にトランジスタの端子を半田付け接続するように
したことを特徴とする接続端子。
1. A body of a short rod-shaped body made of a non-conductor such as synthetic resin, and a body of a contactor made up of at least three conductors erected from the body so that its lower end side penetrates. And the upper end of the contact is formed at the soldering connection part of the terminal of the power transistor and the lower end protruding from the body of the body is formed at the connection leg part of the board to the circuit pattern. A connection terminal characterized in that a connection leg portion of a child is connected to a circuit pattern, a body of the body is stopped on a circuit board, and a terminal of a transistor is soldered to the soldered connection portion.
【請求項2】 接続脚部は、ボデ−本体の下面から垂下
しているか、又は、適宜方向に曲げられた請求項1の接
続端子。
2. The connection terminal according to claim 1, wherein the connection leg portion hangs from the lower surface of the body or is bent in an appropriate direction.
JP7417693U 1993-12-27 1993-12-27 Connecting terminal Pending JPH0741991U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7417693U JPH0741991U (en) 1993-12-27 1993-12-27 Connecting terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7417693U JPH0741991U (en) 1993-12-27 1993-12-27 Connecting terminal

Publications (1)

Publication Number Publication Date
JPH0741991U true JPH0741991U (en) 1995-07-21

Family

ID=13539599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7417693U Pending JPH0741991U (en) 1993-12-27 1993-12-27 Connecting terminal

Country Status (1)

Country Link
JP (1) JPH0741991U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012169645A1 (en) * 2011-06-10 2015-02-23 三洋電機株式会社 ELECTROLYTIC CAPACITOR ELECTRICAL CHARACTERISTIC JIG FOR MEASURING ELECTRIC CAPACITOR, MEASURING DEVICE PROVIDED WITH THE JIG, AND ELECTROLYTIC CAPACITOR MEASURING METHOD

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012169645A1 (en) * 2011-06-10 2015-02-23 三洋電機株式会社 ELECTROLYTIC CAPACITOR ELECTRICAL CHARACTERISTIC JIG FOR MEASURING ELECTRIC CAPACITOR, MEASURING DEVICE PROVIDED WITH THE JIG, AND ELECTROLYTIC CAPACITOR MEASURING METHOD

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