JPH0738312B2 - connector - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a surface mounting technique (S) for mounting a connector, particularly on a printed circuit board.
The present invention relates to a connector for a so-called surface mount type pin grid array (PGA) type LSI package that can be performed by MT).

[0002]

2. Description of the Related Art Conventionally, as a connector, there is a connector for a through-hole type PGA type LSI package. As shown in FIGS. 7 to 9, this connector has an insulator 110 and a plurality of conductive contacts 120 housed in the insulator 110. The contacts 120 are housed in a one-to-one correspondence in each of the housing parts 111 in which a plurality of space parts are formed in the insulator 110. The accommodating portions 111 are arranged in a matrix on the insulator 110. Further, the contact 120 has a fitting portion 121 that fits into a conductive mating contact (not shown) assembled in the LSI package. Further, a holding portion 119 holding the fitting portion 121 is provided on one side of the fitting portion 121, and a terminal portion 122 extending from one side of the holding portion 119 to the side opposite to the fitting portion 121. is doing. The terminal portion 122 projects outward from one surface of the insulator 110.

Further, the terminal portion 122 is the insulator 1
10 is inserted into a through hole of a printed circuit board (not shown) provided so as to face one surface. And the terminal part 1
22 is connected to a conductive pattern forming a circuit of the printed circuit board. Further, the side wall of the insulator 110 opposite to the one surface thereof, that is, the fitting portion 1 of the contact 120.
An insulator 11 is provided on the side wall facing the tip of 21.
An insertion hole 118 is formed so as to penetrate the housing portion 111 from the outside of 0. A mating contact of a PGA type LSI package (not shown) is inserted into the insertion hole 118, and the mating contact fits into the fitting portion 121. As a result, the mating contact is electrically connected to the printed circuit board via the contact 120.

In order to meet the recent demand for high-density mounting of connectors, a connector having a surface mounting structure as shown in FIGS. 10 and 11 is used for high density mounting. 10 and 11, the same parts as those in FIG. 9 are designated by the same reference numerals and the description thereof will be omitted. As shown in FIG. 10, the contact 120 in this connector has a terminal portion 123a formed in an inverted chevron shape. Terminal part 1
23a is fixed to the conductive pad 131 formed on the printed circuit board 130 by solder 132. In addition, as shown in FIG. 11, the terminal portion 123 b formed in an inverted V shape is attached to the conductive pad 131 formed on the printed circuit board 130 by the solder 132.

[0005]

However, in the case where the terminal portions 123a and 123b are mounted on the printed circuit board 130 by the above-mentioned conventional SMT, fixing by soldering work is adopted. For this reason, the soldered portion becomes a shadow of the insulator 110, and it is difficult to confirm whether the soldering is good or bad.

Further, it is difficult to deal with the deformation due to the difference in thermal expansion coefficient between the insulator 110 and the printed circuit board 130, and the soldered portion becomes fatigued, which causes peeling.

Therefore, an object of the present invention is to provide various fixing methods by interposing an FPC board between the contact and the printed circuit board and moving the fixed portion of the contact and the printed circuit board out of the shade of the insulator. It is possible to use.

Another object of the present invention is to provide a connector which absorbs the deformation caused by the difference in thermal expansion coefficient between the insulator and the printed circuit board, reduces the fatigue of the soldered portion, and is less likely to peel off. To provide that.

[0009]

According to the present invention, in a socket connector including a conductive contact and an insulator accommodating the contact, which is mounted on one surface of a printed circuit board, the contact and the printed circuit board are provided. FPC provided with a conductive pattern for connecting to and from each other
The board has a board, and the contact fits into the mating contact, a holding section that extends to one side of the fitting section and holds the insulator in the insulator, and one side of the holding section outside the insulator. The FPC board has a terminal portion extending in a protruding direction from the one surface thereof in the plate thickness direction and protruding to the opposite surface, and a connecting portion connected to the conductive pattern on the opposite surface. A connector characterized by having is obtained.

[0010]

The terminal portion of the contact is inserted into the through hole of the conductive land portion of the FPC board, and the terminal portion is fixed by the crimper. The insulator is press-fitted into the contact mounted on the FPC board to assemble the contact with the insulator, and then the insulator is fixed to the printed circuit board.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the connector of the present invention will be described below with reference to FIGS.

Referring to FIGS. 1 and 3, the connector includes a box-shaped insulator 11, a plurality of conductive contacts 20 accommodated in the insulator 11, and an FPC board 30 for fixing the contacts 20. Have

At the lower portion of the insulator 11, there are provided locking projections 16 formed at the four corners of the side wall, and board fixing projections 17 formed so as to project downward at the lower end portions. The locking projection 16 and the board fixing projection 17 can be integrally formed when the insulator 11 is formed.
Further, in the insulator 11, a plurality of accommodating portions 12 for accommodating and mounting the contacts 20 are sequentially arranged in the matrix direction. Then, the accommodation portion 12 is formed in a square hole shape. An insertion hole 14 that communicates with a closed entry 13 that guides the insertion of a mating contact (not shown) of the LSI package is formed in the upper portion of the housing portion 12.

The contact 20 includes a fitting portion 21 that fits into a mating contact of an LSI package (not shown), a holding portion 23 that extends to one side of the fitting portion 21 and holds the insulator 10 and a holding portion 23. 23, and a terminal portion 24 protruding from one side of the insulator 11 to the outside of the insulator 11. The contact 20 is a socket contact, which is made by punching a thin conductive plate and then bending it. The terminal portion 24 penetrates the FPC board 30 from one surface thereof in the plate thickness direction and projects to the opposite surface.
The terminal portion 24 has a connection portion 24a. Connection part 2
4a is bifurcated from its tip toward the holding portion 23. Further, in the contact 20, the holding portion 2
A press-fitting portion 25 for press-fitting and mounting the contact 20 in the insulator 11 is formed in the connector 3. Press fitting part 2
The reference numeral 5 projects slightly outward from both sides of the holding portion 23 and is press-fitted into the lateral wall of the housing portion 12 in FIG.

As shown in FIGS. 3 and 4, the FPC board 30 has notches 36 that allow the locking projections 16 at the four corners A and lands 3 that correspond to the contacts 20 in a one-to-one correspondence.
1 and a circuit pattern 32 electrically connected to the land 31
And are formed. Here, the land 31 and the circuit pattern 32 are combined to form a conductive pattern.

The FPC board 30 is formed with a plurality of through holes 33 for penetrating the terminal portion 24. The through holes 33 are tilted by about 45 degrees with respect to the row of rows in order to effectively use the space allowed for the contacts 20. Therefore, the contact 20 is arranged at the same angle as the angle of the through hole 33. A land 31 is provided on the FPC board 30 so as to face one surface and the other surface thereof. The land 31 facing the through hole 3
3 connected to each other. The land 31 provided on the opposite surface of the FPC board 30 is connected to the circuit pattern 32.

Next, the assembling of this connector will be shown with reference to FIGS. As shown in FIGS. 5 and 6, the terminal portion 24 of the contact 20 is connected to the through hole 3 of the FPC board 30.
Insert in 3. In this state, the terminal portion 24 and the FPC
The substrate 30 is a lower crimper 40 and an upper anvil 4
The contact 20 is attached to the FPC board 30 by crimping and fixing the contact 20 to the FPC board 1. The anvil 41 is formed in a tubular shape, and the crimper 40 has two reverse-arch-shaped receiving grooves 43 formed symmetrically on the upper surface thereof. Here, the tip end of the connection portion 24a contacts the anvil 41. When the crimper 40 is further pushed down toward the anvil 41, the crimper 40 is expanded outward along the receiving groove 43 and bent to the land 31. Finally, the connection portion 24a is the land 3 on the opposite surface of the FPC board 30.
Touch 1. At this time, the tip end surface of the crimper 40 pushes down the shoulder portion of the press-fitting portion 25, and the connection portion 24 a is bent by the curved surface of the receiving groove 43. At this point, the contact 20 and the land 31 formed on the FPC board 30 are electrically connected. At this time, cutouts 3 are formed on the four sides of the FPC board 30.
The remaining peripheral portion 37 due to the formation of 6 is arranged so as to project outside the four side walls of the insulator 11.

Next, the insulator 10 is put on the contact 20 erected on the FPC board 30. That is,
The insulator 11 is covered so that the fitting part and the holding part of the contact 20 are housed in the housing part. As a result, the press-fitting portion 25 of the contact 20 is press-fitted into the side wall of the housing portion 12, and the contact 20 is assembled and fixed to the insulator 11.
At this time, the peripheral portion 37 of the FPC board 30 is pulled out from the insulator 11 while being locked by the locking projection 16 as shown in FIG.

Further, in order to mount the insulator 11 on the printed circuit board, the mounting projection 17 is inserted into a mounting hole (not shown) previously formed in the printed circuit board, and the tip of the mounting projection 17 is heated. The circuit terminal portion 45 of the peripheral portion 37 of the FPC board 30 is melted.
Solder (see FIG. 4) to the printed circuit board. That is, the remaining peripheral portion 37 is exposed to the outside of the position behind the lower surface of the insulator 10. By soldering the exposed circuit terminal portion 45 of the peripheral portion 37 to the circuit pattern of the printed circuit board, the contact 20 and the printed circuit board can be electrically connected.

In the description of the embodiment, the connection example of the FPC board 30 and the contact 20 electrically connected by crimping is described as the connection of the contact 20 and the FPC board 30 and the contact 2.
0 and the insulator 11 are press-fitted in this order. However, when soldering or using a low-resistivity conductive adhesive, the contact 20 and the insulator 11 are press-fitted together as much as possible, and then the contact 20 and FP
It can be said that the workability is better when the electrical connection with the C substrate 30 is made.

Further, the connection portion 24a of the contact 20 and the land 31 can be electrically connected by soldering or adhesion by a conductive adhesive, in addition to pressure bonding.

[0022]

As described above with reference to the embodiments, according to the connector of the present invention, the FPC board is interposed between the contact and the printed circuit board, and the mounting and fixing portion of the contact and the printed circuit board is insulated. It is possible to use various fixing methods by moving it from the shade to the outside.

Further, the deformation caused by the difference in thermal expansion coefficient between the insulator and the board can be absorbed by the FPC board, the fatigue of the soldered portion can be reduced, and a connector with less peeling can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of one core portion of a connector of the present invention.

FIG. 2 is a perspective view showing the entire connector of FIG.

3 is a perspective view showing the entire FPC board of FIG. 1. FIG.
It is sectional drawing which showed the 1 core part of the state before the assembly of the connector of FIG.

FIG. 4 is a cross-sectional view showing a state where contacts are assembled to the FPC board of FIG.

5 is a cross-sectional view showing a step of assembling a contact with the FPC board of FIG.

FIG. 6 is a perspective view showing a process of assembling a contact with the FPC board shown in FIG. 5;

FIG. 7 is a plan view showing a first conventional example of a conventional connector.

FIG. 8 is a side view of the connector of FIG.

9 is a cross-sectional view of a main part of the connector of FIG.

FIG. 10 is a sectional view showing a second conventional example of a conventional connector.

FIG. 11 is a sectional view showing a third conventional example of a conventional connector.

[Explanation of symbols]

 11 Insulator 12 Storage Part 16 Locking Protrusion 17 Mounting Protrusion 20 Contact 21 Fitting Part 24 Terminal Part 24a Connection Part 30 FPC Board 31 Land

Claims (1)

[Claims] 1. A connector including a conductive contact and an insulator accommodating the contact, the connector being mounted on one surface of a printed circuit board, comprising a conductive pattern for connecting the contact and the printed circuit board to each other. An FPC board is provided, and the contact has a fitting portion that fits into a mating contact, a holding portion that extends to one side of the fitting portion and is held by the insulator, and an outside of the insulator from one side of the holding portion. The FPC board has a terminal portion projecting from the surface of the FPC board.
Through hole for penetrating the terminal portion, and the printed circuit board
Insulator to connect to the circuit pattern of
Has a circuit terminal portion in the peripheral portion that is drawn outward than
The connector is characterized in that the terminal portion penetrates the through hole and projects to the opposite surface of the FPC board, and has a connecting portion connected to the conductive pattern on the opposite surface. .