JPH0736442Y2 - Cable connection - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a prefabricated cable connecting portion using a mold stress cone.

(Prior Art) Conventionally, a prefabricated termination connection has been widely used as a termination connection for a rubber / plastic cable.

The cable end of this prefabricated cable connection part has a terminal metal member fixed to the exposed cable conductor by stripping one end of the cable, and, as shown in FIG. A semi-conductive tape winding layer 3 made of a semi-conductive polyethylene tape or a semi-conductive polyethylene adhesive tape or the like is provided to cover the cable insulator 2, and the semi-conductive layer 5 is formed on one taper surface of the spindle-shaped insulation reinforcement body 4 from above. A mold stress cone 6 integrally molded with is fitted from the side of the semiconductive layer 5 to electrically connect the semiconductive conductor 1 of the cable and the sleeve portion 7 of the semiconductive layer 5 of the mold stress cone 6. ing.

And this cable end is a mold stress cone 6
Is inserted in the recess 8 of the epoxy sleeve 9 having a conductor fitting matching the terminal fitting of the cable conductor in the center thereof for conductor connection and the front surface of the mold stress cone 6 is made of epoxy. Recess 8 of sleeve 9
Then, the pressing metal fitting 10 is brought into contact with the mold stress cone 6 on the side of the semiconductive layer 5 and is pressed and fixed by the spring 11. In the figure, 12 is a cable shielding layer and 13 is a cable sheath.

(Problems to be solved by the invention) However, in such a conventional cable connecting portion,
Since the tip of the semiconductive tape winding layer 3 is located near the rising portion of the semiconducting layer 5 of the stress cone 6, there is a problem that a weak point is likely to occur in the electric field. Further, since the positional relationship between the position of the tip of the semiconductive tape winding layer 3 and the rising portion of the stress cone cannot be visually checked, there is a problem that the reliability depends on the skill of the operator of the tape winding. .

Further, when the semi-conductive tape winding layer 3 is formed of a semi-conductive polyethylene adhesive tape, there is a problem that the semi-conductive polyethylene adhesive tape is easily displaced when the stress cone is moved during assembly.

Further, it is conceivable to provide a semiconductive tape winding layer from above the sleeve portion 7 of the semiconductive layer 5 of the mold stress cone 6 to above the cable semiconductive layer 1, but the epoxy sleeve 9 is fixed to a porcelain insulator or the like, Mold stress cone 6
Is fixed to the porcelain insulator by the pressing metal fitting 10, so that when the cable expands and contracts due to the heat cycle, the mold stress cone 6 moves in the axial direction, and the wound semiconductive tape is displaced. there were.

The present invention has been made to solve such a problem, the performance is not affected by the quality of the semi-conductive tape winding, the result of the semi-conductive tape winding work can be visually confirmed, and the mold stress cone It is an object of the present invention to provide a cable connecting portion in which a semiconductive tape winding layer does not shift even when a wire moves.

[Structure of the Invention] (Means for Solving the Problem) The cable connecting portion of the present invention is a mold in which a semi-conductive layer is integrally molded on the outer circumference of the insulator of the stripped cable end on one tapered surface of the spindle-shaped insulation reinforcement body. The molded stress cone is fitted from the semiconductive layer side, the cable end is inserted into the cable end receiving hole of the insulating sleeve having the cable end receiving hole, and the mold stress cone is placed on the rear side of the semiconductive layer side. In the cable connecting portion which is pressed and fixed toward the cable end receiving hole side by the pressing means arranged in the above, a cylindrical elastic thin portion extending along the cable insulator is formed on the semiconductive layer base of the stress cone. A semi-conductive tape winding layer is provided so as to extend from the end of the cylindrical thin elastic portion to the semi-conductive layer of the cable.

A known epoxy sleeve can be used as the insulating sleeve.

(Operation) In the cable connecting portion of the present invention, the elastic semi-conductive layer of the stress cone is formed with an expandable and contractible cylindrical thin-walled portion following the tapered surface, and the cable semi-conductive layer is formed on the end of the cylindrical elastic thin-walled portion. Since the semi-conductive tape winding layer is provided over the upper side, even if the mold stress cone and the cable insulator move relative to each other, the semi-conductive tape winding layer is not displaced. Also, since the semi-conductive tape winding layer does not come near the rising part of the semi-conductive layer of the mold stress cone, the performance does not depend on the quality of the tape winding, and the finished result can be visually checked. .

(Embodiment) Next, an embodiment of the present invention will be described with reference to FIG. In the description of FIG. 1, parts common to those of FIG. 2 are designated by the same reference numerals, and redundant description will be omitted.

In the connection part of this embodiment, one end of a cable to be connected is stepped off to fix the terminal metal fitting to the exposed cable conductor, and as shown in FIG. 1, from the cable semiconductive layer 1 to the cable insulator 2. The structure is the same as the conventional cable connecting portion in that the mold stress cone 6 integrally molded with the semiconductive layer 5 is fitted from the semiconductive layer 5 side.

And in the connection part of the present invention, the mold stress cone 6
In place of the sleeve 7, the semiconductive layer 5 is provided with an expandable and contractible cylindrical elastic thin portion 14 so that the exposed portion A is formed on the tapered surface side. A semi-conductive tape winding layer 15 is formed on the layer 1.

In the cable connecting portion configured as described above, it is not necessary to move the mold stress cone 6 at the time of assembly, and even when the cable is thermally expanded and contracted, the cylindrical elastic thin wall portion 14 of the semiconductive layer 5 of the mold stress cone 6 does not move. Since it expands and contracts and absorbs accordingly, the semiconductive tape winding layer 15 is not displaced.

Further, since the semi-conductive tape winding layer 15 is formed on the cylindrical thin elastic portion 14, it is possible to visually check the finished state, and the semi-conductive tape winding layer 15 is formed on the inner surface side near the rising portion of the taper surface of the mold stress cone. Since the edge of the conductive tape does not come, the performance does not depend on whether the tape is wound or not. Therefore, it is possible to form a cable connection portion having good characteristics and high reliability.

[Effects of the Invention] As described above, according to the cable connecting portion of the present invention,
A cylindrical elastic thin portion extending along the cable insulator is formed at the base of the semi-conductive layer of the mold stress cone, and the semi-conductive layer extends from the end of the cylindrical elastic thin portion to the cable semi-conductive layer. Since the tape winding layer is provided, it is possible to prevent the semi-conductive tape winding layer from being displaced, and it is possible to perform a visual check, so that it is possible to form a highly reliable cable connection portion with good characteristics.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing a cable connecting portion of an embodiment of the present invention, and FIG. 2 is a vertical sectional view showing a conventional cable connecting portion. 1 ... Cable semi-conductive layer 2 ... Cable insulator 3 ... Semi-conductive tape winding layer 4 ... Insulation reinforcement 5 ... Semi-conductive layer 6 ... Mold stress cone 7 ... Sleeve part 8 ... Recessed portion 9 …… Epoxy sleeve 10 …… Pressing fitting 11 …… Spring 12 …… Cable shield layer 13 …… Cable sheath 14 …… Elastic thin part 15 …… Semiconductive tape winding layer

Claims (1)

[Scope of utility model registration request] 1. A mold stress cone, in which a semiconductive layer is integrally molded on one tapered surface of a spindle-shaped insulation reinforcement, is fitted from the semiconductive layer side to the outer periphery of the insulation of the stripped cable end, and the cable terminal is formed. Is inserted into the cable end receiving hole of the insulating sleeve having the cable end receiving hole, and the mold stress cone is pressed and fixed toward the cable end receiving hole side by the pressing means arranged rearward of the semiconductive layer side. In the cable connection part consisting of, in addition to forming a cylindrical elastic thin portion extending along the cable insulator on the semiconductive layer base of the stress cone,
A cable connecting portion, wherein a semiconductive tape winding layer is provided so as to extend from the end of the cylindrical elastic thin portion to the cable semiconductive layer.