JPH073493A - High current density tin plating method using circular-arcuately shaped plating cell - Google Patents

High current density tin plating method using circular-arcuately shaped plating cell

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Publication number
JPH073493A
JPH073493A JP15020993A JP15020993A JPH073493A JP H073493 A JPH073493 A JP H073493A JP 15020993 A JP15020993 A JP 15020993A JP 15020993 A JP15020993 A JP 15020993A JP H073493 A JPH073493 A JP H073493A
Authority
JP
Japan
Prior art keywords
plating
tin
current density
aromatic compound
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15020993A
Other languages
Japanese (ja)
Other versions
JP3184005B2 (en
Inventor
Hiromitsu Date
博充 伊達
Chuichi Kato
忠一 加藤
Masato Kageyama
正人 景山
Yasuhiro Akita
靖博 秋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP15020993A priority Critical patent/JP3184005B2/en
Publication of JPH073493A publication Critical patent/JPH073493A/en
Application granted granted Critical
Publication of JP3184005B2 publication Critical patent/JP3184005B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To perform the high current density tin plating at a high speed while controlling the amount of the sludge to be formed by using a circular-arcuately shaped plating cell contg. an electrolyte which has specified respective concn. of sulfuric acid, divalent tin ion and a specific aromatic compound mixture and specifying the plating bath temp. and the current density. CONSTITUTION:At the time of performing the tin plating on a steel strip by using a circular-arcuately shaped plating cell, the concn. in the plating solution of sulfuric acid, divalent tin ion and an aromatic compound mixture are adjusted to 5 to 50g/l, 40 to 100g/l and 0.01 to 2g/l respectively. The above aromatic compound mixture consists of an aromatic compound having at least two hydroxyl groups such as catechol, pyrogallol and another aromatic compound having one hydroxyl group and an electron donative substituent than coordinates through a nitrogen or oxygen coordinating atom such as aminophenol in the ratio of 4:1. The tin plating on a steel strip is performed by electrocrystallizing tin on the steel strip in the above plating solution (electrolyte) at 30 to 70 deg.C bath temp. with a >=50A/dm<2> current density. Thus the high speed tin plating using the sulfuric acid bath which has good environmental properties and can be produced at a low cost is performed without forming the sludge in the bath even at the time of performing the tin plating with a high current density.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ぶりき、薄錫めっき鋼
板等電気錫めっき鋼板の製造に用いる円弧状型めっきセ
ル高電流密度錫めっき方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an arc-shaped plating cell high current density tin plating method used for the production of tin-plated, thin tin-plated steel sheets and other electric tin-plated steel sheets.

【0002】[0002]

【従来の技術】ぶりき、薄錫めっき鋼板等電気錫めっき
鋼板の製造は、通常縦型のめっきセルを用い、めっき浴
にはハロゲン浴、フェロスタン浴、アルカリ浴等を用
い、電流密度20A/dm2程度の比較的低電流密度で
行われる。したがって、生産性の観点では必ずしも満足
できない点があり、高生産性化するために高電流密度化
し、高速でかつ低コストでめっきできる技術の開発が強
く望まれていた。このような高速錫めっき技術を可能に
するには、めっきセルの形状を工夫するいわゆるハード
面での技術と、めっき浴、温度等のめっき条件を工夫す
るいわゆるソフト面での技術との両面での技術が必要と
なる。
2. Description of the Related Art The production of tin electroplated steel sheets such as tinplate and thin tin plated steel sheets is usually carried out using a vertical plating cell, a halogen bath, a ferrostane bath, an alkaline bath, etc., and a current density of 20 A / It is performed at a relatively low current density of about dm 2 . Therefore, there is a point that is not always satisfactory from the viewpoint of productivity, and there has been a strong demand for development of a technique capable of plating at high current density and at high speed and at low cost in order to achieve high productivity. In order to enable such high-speed tin plating technology, both so-called hardware technology that devises the shape of the plating cell and so-called soft technology that devises the plating conditions such as plating bath and temperature. Technology is required.

【0003】ハード面の技術としてのめっきセル形状
は、通常錫めっきに使用されているのは浸漬縦型セルで
あるが、この場合には高電流密度化に必要な液の高流速
化が困難であり、特公昭58−32239、61−21
319号公報に示されているめっきセルでは、めっき液
の高流速化は可能であるが、電極とストリップとの間の
めっき液量で静圧差を生じて、ストリップの位置、形状
を矯正する必要があるため、所定のめっき液量が必要で
あり、鋼ストリップの位置、形状を保ちながら10mm
以下の電極−鋼ストリップ距離の実現には困難性があ
る。これに対し、本発明者らは、先に鋼ストリップの中
央ずれや形状不良をほぼ完全に矯正し、電極−鋼ストリ
ップ距離を小さくできる円弧状めっきセルを提案した
(特願平5−042674号)。
Regarding the plating cell shape as a technique for the hard surface, the immersion vertical cell is usually used for tin plating, but in this case, it is difficult to increase the flow velocity of the liquid required for high current density. And Japanese Patent Publications 58-32239, 61-21
In the plating cell disclosed in Japanese Patent No. 319, it is possible to increase the flow rate of the plating solution, but it is necessary to correct the position and shape of the strip by causing a static pressure difference in the amount of the plating solution between the electrode and the strip. Therefore, a certain amount of plating solution is required, and 10 mm while maintaining the position and shape of the steel strip.
There are difficulties in achieving the following electrode-steel strip distances. On the other hand, the present inventors have previously proposed an arc-shaped plating cell capable of almost completely correcting the center displacement and defective shape of the steel strip, and reducing the electrode-steel strip distance (Japanese Patent Application No. 5-042674). ).

【0004】一方、ソフト技術としてのめっき浴は、上
述のめっき浴中で最も広く使用されているのはフェロス
タン浴であるが、この浴を用いても50A/dm2以上
になると激しいめっき焼けが生じてしまい、高電流密度
化は困難である。これに対しては、特開平4−2285
95号公報に開示されているようなアルキルスルホン酸
を酸成分とするめっき浴がある。しかしながら、めっき
浴のもう一つの具備すべき条件として、COD値に代表
されるような廃液における環境問題のないことが極めて
重要な要件であるが、前述のフェロスタン浴はもとよ
り、アルキルスルホン酸浴においても、この環境性に問
題がある。以上述べてきたように、高速化が可能な高電
流密度でめっきができ、かつ良環境性で、低コストな技
術は、従来技術では困難であるといえる。
On the other hand, the plating bath as a soft technique is the ferrostane bath which is most widely used among the above-mentioned plating baths. However, even if this bath is used, it will cause severe plating burn at 50 A / dm 2 or more. Therefore, it is difficult to increase the current density. For this, Japanese Patent Laid-Open No. 4-2285
There is a plating bath containing an alkyl sulfonic acid as an acid component as disclosed in Japanese Patent Laid-Open No. 95. However, as another condition of the plating bath, it is a very important requirement that there is no environmental problem in the waste liquid represented by the COD value. However, there is a problem with this environment. As described above, it can be said that the conventional technique is difficult to perform plating at a high current density capable of speeding up, good environmental friendliness, and low cost.

【0005】[0005]

【発明が解決しようとする課題】本発明者らは、上述の
高速錫めっき化のソフト技術となるめっき浴として低コ
スト、良環境性の観点から、硫酸浴に着目した。しか
し、硫酸浴は特に高電流密度領域ではスラッジの発生が
極めて多いのが最大の弱点であった。このスラッジが多
量に発生すると、効果な錫イオンを無駄にして製造コス
トを高くするばかりでなく、めっき中にめっき皮膜に付
着しめっき品質を損ねるという問題がある。したがっ
て、硫酸浴を用いて高電流密度の錫めっきを行う場合に
は、ソフト技術面ではスラッジの発生を抑制するととも
に、流れ易くするためにその形状を小さくするめっき浴
と、ハード技術面ではスラッジを流し去ることが可能で
高流速が可能なめっきセルが必要である。そこで、本発
明は、スラッジ発生が少なくかつ形状が小さいめっき浴
と高流速が可能なめっきセルとを組み合わせた円弧状型
めっきセル高電流密度錫めっき方法の提供を目的とす
る。
The present inventors have paid attention to a sulfuric acid bath as a plating bath which is a soft technique for high-speed tin plating, from the viewpoint of low cost and good environment. However, the most weak point of the sulfuric acid bath is that sludge is extremely generated especially in the high current density region. If a large amount of this sludge is generated, there is a problem that not only the effective tin ions are wasted but the manufacturing cost is raised, but also the plating quality adheres to the plating film during plating and the plating quality is impaired. Therefore, when performing tin plating with a high current density using a sulfuric acid bath, in terms of soft technology, the generation of sludge is suppressed, and in order to facilitate flow, a plating bath that reduces its shape and sludge from a hard technology side are used. There is a need for a plating cell capable of flushing away and capable of high flow rates. Therefore, an object of the present invention is to provide an arc-shaped plating cell high current density tin plating method in which a plating bath with less sludge generation and a smaller shape and a plating cell capable of high flow rate are combined.

【0006】[0006]

【課題を解決するための手段】従来から知られているよ
うに、錫めっき液中の錫イオンはSn2+として存在する
が、液中の酸素によって酸化して、次式(1)に従って
錫酸化物になってしまう。この錫酸化物がスラッジであ
る。 Sn2++O2→SnO2 (1) 本発明者らは、上述の課題に対し、Sn2+イオンと有機
化合物との関わり合いを酸化防止および生成するスラッ
ジの小形状化について詳細に検討し、併せて高流速化が
可能なめっきセルとの組み合わせを種々検討した結果、
本発明に至ったものである。
As conventionally known, tin ions in a tin plating solution exist as Sn 2+ , but they are oxidized by oxygen in the solution and tin is converted according to the following formula (1). It becomes an oxide. This tin oxide is sludge. Sn 2+ + O 2 → SnO 2 (1) With respect to the above-mentioned problems, the present inventors have studied in detail the oxidation of the relationship between Sn 2+ ions and an organic compound and the miniaturization of sludge generated. In addition, as a result of various studies on various combinations with plating cells capable of high flow rate,
The present invention has been achieved.

【0007】すなわち、本発明は、電解めっき位置にて
鋼ストリップ走行ラインを円弧状に曲げ、この円弧状部
の内側および外側に沿って電極を配置し、該電極と鋼ス
トリップとの間に電解液を入れる円弧状型めっきセルを
用い、硫酸5〜50g/l、二価錫イオン40〜100
g/lおよび二つ以上のヒドロキシ基を有する芳香族化
合物と、一つのヒドロキシ基と窒素あるいは酸素で配位
した電子供与性置換基とを有する芳香族化合物とを、4
対1の割合で混合した芳香族化合物0.01〜2g/l
を主成分とする電解液を用い、浴温30〜70℃、電流
密度50A/dm2以上で鋼ストリップ上に錫を電析さ
せる円弧状型めっきセル高電流密度錫めっき方法であ
る。なお、本発明で表す円弧状とは、円、楕円の他に、
屈曲点がなく、滑らかに一方向に沿って曲げられた状態
を意味するものである。
That is, according to the present invention, the steel strip running line is bent into an arc shape at the electrolytic plating position, the electrodes are arranged along the inside and outside of the arc-shaped portion, and the electrolysis is performed between the electrode and the steel strip. Using an arc-shaped plating cell in which the solution is placed, sulfuric acid 5 to 50 g / l, divalent tin ion 40 to 100
An aromatic compound having g / l and two or more hydroxy groups, and an aromatic compound having one hydroxy group and an electron-donating substituent coordinated with nitrogen or oxygen are used.
Aromatic compound mixed in a ratio of 1 to 0.01 to 2 g / l
Is an arc-shaped plating cell high current density tin plating method in which tin is electrodeposited on a steel strip at a bath temperature of 30 to 70 ° C. and a current density of 50 A / dm 2 or more using an electrolytic solution containing as a main component. Incidentally, the arc shape represented in the present invention, in addition to a circle and an ellipse,
It means a state where there is no bending point and it is smoothly bent along one direction.

【0008】[0008]

【作用】以下、本発明について詳細に説明する。第一
に、ソフト技術としてのめっき浴に関して述べる。ま
ず、めっき液の硫酸濃度は5〜50g/lとする。これ
は、5g/lで電解液のpHは約1.2で二価錫イオン
は安定であるが、これより低い濃度では、電解時に陰極
近傍でpHが高くなるため、二価錫イオンが不安定とな
って沈澱が生じ易く、電析した錫の光沢が優れない。一
方、50g/lより濃いと、鋼ストリップの溶解による
浴中の鉄濃度の上昇による浴の劣化促進、装置の腐食促
進等、様々な弊害が生じる。
The present invention will be described in detail below. First, the plating bath as a soft technique will be described. First, the sulfuric acid concentration of the plating solution is set to 5 to 50 g / l. At 5 g / l, the pH of the electrolytic solution is about 1.2, and the divalent tin ion is stable. However, at a concentration lower than this, the pH becomes high in the vicinity of the cathode during electrolysis, so the divalent tin ion is not stable. It becomes stable and easily precipitates, and the gloss of electrodeposited tin is not excellent. On the other hand, if the concentration is higher than 50 g / l, various problems such as accelerated deterioration of the bath due to an increase in iron concentration in the bath due to dissolution of the steel strip and accelerated corrosion of the apparatus will occur.

【0009】二価錫イオン濃度は、40〜100g/l
とする。40g/l未満では高電流密度でめっきを行う
といわゆるめっき焼けを生じ、高品質のぶりきが得難
い。100g/lを超えると、鋼ストリップの持ち出す
二価錫イオンが多くなることに加え、スラッジが多量に
生成するようになり、経済的に不利である。
The divalent tin ion concentration is 40 to 100 g / l.
And If it is less than 40 g / l, so-called plating burn occurs when plating is performed at a high current density, and it is difficult to obtain high-quality tinplate. When it exceeds 100 g / l, in addition to the large amount of divalent tin ions carried out by the steel strip, a large amount of sludge is generated, which is economically disadvantageous.

【0010】めっき液にはさらに酸化を抑制する効果を
有する芳香族化合物を添加する。酸化を抑制する化合物
としては、二価の錫イオンと錯体を形成して酸化しにく
くする効果と、酸化して四価の錫イオンとなったものを
再度還元して二価に戻してしまう効果を共有することが
望ましい。このような2つの効果を有するのが、二つ以
上のヒドロキシ基を有する芳香族化合物である。すなわ
ち、ヒドロキシ基を有することで還元性を持ち、二つ以
上あることでその電子供与性のために、ベンゼン環の電
子密度が高くなり、二価の錫イオンと錯体を形成し易く
なる。
An aromatic compound having an effect of suppressing oxidation is further added to the plating solution. As a compound that suppresses oxidation, the effect of forming a complex with a divalent tin ion to make it difficult to oxidize, and the effect of reducing the oxidized tetravalent tin ion back to divalent It is desirable to share. An aromatic compound having two or more hydroxy groups has two such effects. That is, by having a hydroxy group, it has a reducing property, and when it has two or more, it has an electron donating property, so that the electron density of the benzene ring becomes high, and it becomes easy to form a complex with a divalent tin ion.

【0011】ヒドロキシ基以外の置換基は、ヒドロキシ
基、アミノ基、メトキシ基等でよいので、具体例として
の化合物は、ジヒドロキシフェニル化合物(カテコー
ル、ヒドロキノン、2,3−ジヒドロキシ安息香酸、
3,4−ジヒドロキシベンズアルデヒド、3,5−ジヒ
ドロキシトルエン等)、トリヒドロキシフェニル化合物
(ピロガロール、フロログルシン、没食子酸、没食子酸
n−プロピル、3,4,5−トリヒドロキシ安息香酸
等)である。
Since the substituents other than the hydroxy group may be a hydroxy group, an amino group, a methoxy group, etc., specific examples of the compound include dihydroxyphenyl compounds (catechol, hydroquinone, 2,3-dihydroxybenzoic acid,
3,4-dihydroxybenzaldehyde, 3,5-dihydroxytoluene, etc.) and trihydroxyphenyl compounds (pyrogallol, phloroglucin, gallic acid, n-propyl gallate, 3,4,5-trihydroxybenzoic acid, etc.).

【0012】さらに、形成するスラッジの形状を小さく
するためには、この二つ以上のヒドロキシ基を有する芳
香族化合物と、一つのヒドロキシ基と窒素あるいは酸素
で配位した電子供与性置換基とを有する芳香族化合物と
を、4対1の割合で混合した芳香族化合物が極めて大き
な効果を有することが判った。後者の具体例としては、
アミノフェノール、ヒドロキシアニソールがある。
Further, in order to reduce the shape of the sludge formed, the aromatic compound having two or more hydroxy groups and one hydroxy group and an electron donating substituent coordinated with nitrogen or oxygen are used. It has been found that an aromatic compound obtained by mixing the aromatic compound with the aromatic compound in a ratio of 4: 1 has an extremely large effect. As a concrete example of the latter,
There are aminophenol and hydroxyanisole.

【0013】スラッジの生成は、液中で錫酸化物となっ
た時点で、溶解度が小さいために晶出し、ある程度の大
きさになった場合に沈澱するものであるが、一般によく
知られているように、生成サイトが多いほど晶出時の形
状は小さくなる。これら2種の芳香族化合物を添加する
と、詳細な機構は不明であるが、最初から錯体を形成し
ないで直接酸化するもの、一つのヒドロキシ基を有する
芳香族化合物と一度錯体を形成し、その後何らかの理由
で離れた時点で酸化するもの、あるいは二つのヒドロキ
シ基を有する芳香族化合物と一度錯体を形成し、その後
何らかの理由で離れた時点で酸化するものというよう
に、一律の条件で酸化しなくなるため、小さな形状にな
るものと考えられる。これらの化合物の添加濃度は0.
01〜2g/lが最適である。これは0.01g/l未
満ではその効果がなく、2g/l超では効果はあるもの
の、飽和してしまうので経済的ではなく、良環境性を保
つのにもマイナス面があるためである。
The formation of sludge is such that when it becomes tin oxide in the liquid, it crystallizes due to its low solubility and precipitates when it reaches a certain size, but it is generally well known. As described above, the more production sites, the smaller the shape during crystallization. When these two kinds of aromatic compounds are added, the detailed mechanism is unknown, but those that directly oxidize without forming a complex from the beginning, once form a complex with an aromatic compound having one hydroxy group, and then It does not oxidize under uniform conditions, such as those that oxidize at a distance for some reason, or that once complex with an aromatic compound having two hydroxy groups and then oxidize at a distance for some reason, do not oxidize under uniform conditions. It is thought that it will be a small shape. The addition concentration of these compounds was 0.
The optimum value is 01 to 2 g / l. This is because if it is less than 0.01 g / l, there is no effect, and if it exceeds 2 g / l, there is an effect, but it is saturated, so it is not economical and there is a downside to maintaining good environment.

【0014】さらに、上述の化合物の中でも詳細に検討
すると、置換基の配位箇所によってその効果が変わり、
特にオルト位(o−)とパラ位(p−)にある時に効果
が最大になるので、好ましくは、オルト位(o−)とパ
ラ位(p−)に配位している芳香族化合物がよい。即
ち、フロログルシンよりピロガロールの方が、m−アミ
ノフェノールよりo−,p−アミノフェノールの方が効
果が大きい。これは、詳細は不明であるもののその分子
構造上ベンゼン環に電子が集まり易く錯体形成の容易に
なることに関係したものであると考えられ、添加量もこ
れらオルト位、パラ位のものは0.01〜0.1g/l
と少量で効果を発揮する。
Furthermore, when the above compounds are examined in detail, the effect changes depending on the coordination site of the substituent,
In particular, since the effect is maximized at the ortho position (o-) and the para position (p-), it is preferable that the aromatic compound coordinated to the ortho position (o-) and the para position (p-) is used. Good. That is, pyrogallol is more effective than phloroglucin, and o- and p-aminophenol is more effective than m-aminophenol. It is considered that this is related to the fact that electrons are easily collected in the benzene ring due to its molecular structure and the complex formation is facilitated, though the details are unknown, and the addition amount of these ortho-positions and para-positions is 0. 0.01-0.1 g / l
And a small amount is effective.

【0015】また、めっき条件のうち、浴温は30〜7
0℃とする。電解や攪拌等による発熱のため、30℃未
満の浴温を得るには冷却のためのコストがかかり、経済
的でないばかりでなく、外観、耐食性の優れためっきが
得られない。70℃を超える浴温での操業は、装置類の
腐食や鋼板の鉄溶出促進による浴の劣化が促進されるこ
と、および蒸気の発生が多くなり、作業環境が悪くなる
ことから避けるべきである。
Among the plating conditions, the bath temperature is 30 to 7
Set to 0 ° C. Due to heat generation due to electrolysis, stirring, etc., it takes a cost for cooling to obtain a bath temperature of less than 30 ° C., which is not economical and plating excellent in appearance and corrosion resistance cannot be obtained. Operation at a bath temperature of over 70 ° C should be avoided because the corrosion of the equipment and the deterioration of the bath due to the accelerated elution of iron from the steel sheet are accelerated, and the generation of steam increases and the working environment deteriorates. .

【0016】電流密度は、フェロスタン浴では困難であ
った50A/dm2以上の高電流密度でめっきを行う。
これは、50A/dm2未満では本発明の目的とする高
速化が不可能であるためである。その他のめっき条件、
すなわちめっき液へ添加する光沢剤、鋼ストリップの前
処理、電極種類、めっき後のリフロー処理等は、全て通
常フェロスタン浴を用いて行っている方法を用いれば良
い。
The current density is 50 A / dm 2 or more, which is difficult in the ferrostan bath, and plating is performed at a high current density.
This is because if it is less than 50 A / dm 2 , it is impossible to achieve the high speed as the object of the present invention. Other plating conditions,
That is, for the brightener added to the plating solution, the pretreatment of the steel strip, the electrode type, the reflow treatment after plating, and the like, the method usually performed using a ferrostane bath may be used.

【0017】第二に、ハード技術となるめっきセルであ
るが、本発明では電解めっき位置にて鋼ストリップ走行
ラインを円弧状に曲げ、この円弧状部の内側および外側
に沿って電極を配置し、該電極と鋼ストリップとの間に
電解液を入れる円弧状型めっきセルを用いる。図1にそ
の代表的な形状を示す。このように、第1電極パッドを
ベントフロータータイプとしているので、ストリップと
パッドとの間に静圧が生じてストリップを所用のライン
に沿って保持することができ、しかもストリップの走行
ラインをその走行ラインに曲げて円弧部を形成させてい
るので、ストリップ幅方向に剛性が増し、形状不良が矯
正される。そのため、高電流密度化と、液の10m/s
以上の高流速化が可能である。スラッジの小形状化に
は、液の攪拌も効果が大きいので、前述のめっき浴と円
弧状型めっきセルとの組み合わせによれば、スラッジの
より一層の小形状化、無害化が可能である。
Secondly, regarding the plating cell which is a hard technique, in the present invention, the steel strip running line is bent in an arc shape at the electrolytic plating position, and the electrodes are arranged along the inside and outside of this arc-shaped portion. , An arc-shaped plating cell in which an electrolytic solution is inserted between the electrode and the steel strip. FIG. 1 shows its typical shape. As described above, since the first electrode pad is of the vent floater type, static pressure is generated between the strip and the pad, and the strip can be held along the required line. Since the arc portion is formed by bending the line, the rigidity is increased in the strip width direction and the defective shape is corrected. Therefore, high current density and 10m / s of liquid
The above high flow rate is possible. Since the stirring of the liquid is also very effective in reducing the size of the sludge, it is possible to further reduce the size of the sludge and render it harmless by combining the above-mentioned plating bath and the arc-shaped plating cell.

【0018】[0018]

【実施例】以下本発明を実施例に基づいて具体的に説明
する。まず最初に、スラッジの生成量と形状についての
実施例を示し、次にめっき製造の実施例を示す。 (1)スラッジの生成量と形状試験 下記に示す組成のめっき液に、表1に示す芳香族化合物
を添加して、酸素酸化させた。 めっき液:硫酸錫(II) 108.6g/l(錫として
60g/l) 硫酸 16.7g/l ENSA 4.0g/l
EXAMPLES The present invention will be specifically described below based on examples. First, examples of the amount and shape of sludge produced will be shown, and then examples of plating production will be shown. (1) Sludge Generation Amount and Shape Test The aromatic compounds shown in Table 1 were added to a plating solution having the composition shown below and oxygen-oxidized. Plating solution: tin sulfate (II) 108.6 g / l (60 g / l as tin) sulfuric acid 16.7 g / l ENSA 4.0 g / l

【0019】試験は、内径105mm、高さ800mm
の錫溶解槽に粒径2.8mm錫粒を5kg充填し、80
リットルのめっき液を60リットル/分で循環させ、
1.5リットル/分の酸素を吹き込んだ。溶解槽内圧力
は2kgf/cm2とした。酸素吹き込み2時間後にめ
っき液2リットルを濾過し、スラッジの重量を測定し
た。スラッジの形状は、定量評価が困難なので、酸化中
を目視観察して大小を判断した。試験結果は、表1に示
すように、芳香族化合物の添加でスラッジ生成は大幅に
抑制され、さらに2種の芳香族化合物を混合添加するこ
とにより形状も小さくなった。
The test is an inner diameter of 105 mm and a height of 800 mm.
The tin dissolving tank of 5 is filled with 5 kg of tin particles of 2.8 mm in diameter,
Circulating liter of plating solution at 60 liters / minute,
Bubbling oxygen at 1.5 liter / min. The pressure in the dissolution tank was 2 kgf / cm 2 . Two hours after the oxygen was blown, 2 liters of the plating solution was filtered, and the weight of the sludge was measured. Since it is difficult to quantitatively evaluate the shape of sludge, the size of sludge was judged by visual observation during oxidation. As shown in Table 1, the test results show that the sludge formation was significantly suppressed by the addition of the aromatic compound, and the shape was reduced by the addition of the two kinds of aromatic compounds in mixture.

【0020】[0020]

【表1】 [Table 1]

【0021】(2)めっき試験 図1に示す円弧状めっきセル(主仕様は下記)を用い、
下記のめっき条件でめっきを行った。 セル主仕様 電極パッド径:R=500mm 第1及び第2電極パッド間隔:H=20mm スリットノズル間隔:t=5mm パッド幅:W=1200mm パッド円弧部角度:180度 電極材質:Ti母材にPtめっき
(2) Plating test Using the arc-shaped plating cell shown in FIG. 1 (main specifications are as follows),
The plating was performed under the following plating conditions. Cell main specifications Electrode pad diameter: R = 500 mm First and second electrode pad spacing: H = 20 mm Slit nozzle spacing: t = 5 mm Pad width: W = 1200 mm Pad arc angle: 180 degrees Electrode material: Pt on Ti base material Plating

【0022】めっき条件 めっき浴−1 硫酸錫(II) 108.6 g/l (錫として60 g/l) 硫 酸 16.7 g/l ENSA 4.0 g/l ピロガロール 0.08 g/l o−アミノフェノール 0.02 g/l めっき浴−2 硫酸錫(II) 108.6 g/l (錫として60 g/l) 硫 酸 16.7 g/l ENSA 4.0 g/l ピロガロール 0.12 g/l p−ヒドロキシアニソール 0.03 g/l 浴 温 45℃ 電流密度 150A/dm2 目付け量 2g/m2 Plating conditions Plating bath-1 Tin (II) sulfate 108.6 g / l (60 g / l as tin) Sulfuric acid 16.7 g / l ENSA 4.0 g / l Pyrogallol 0.08 g / l o-Aminophenol 0.02 g / l Plating bath-2 Tin (II) sulfate 108.6 g / l (60 g / l as tin) Sulfuric acid 16.7 g / l ENSA 4.0 g / l Pyrogallol 0 .12 g / l p-hydroxyanisole 0.03 g / l bath temperature 45 ° C. current density 150 A / dm 2 basis weight 2 g / m 2

【0023】 操業条件 通板速度 400〜1,0
00mpm 鋼ストリップ寸法 幅1,000×厚さ0.2mm 張力 1 kgf/mm2 めっき液のノズル流速 ul-3m/s, u2-1m/s, u3-2m/s めっき−1およびめっき−2いずれの場合も、めっき操
作上の問題はなく、得られた錫めっき鋼板のめっき光沢
(JIS Z 8741の方法で測定)、耐食性(AT
C試験)共に良好であった。しかも、スラッジ発生も少
なかった。
Operating conditions: strip running speed 400 to 1,0
00 mpm Steel strip dimensions Width 1,000 x thickness 0.2 mm Tension 1 kgf / mm 2 Nozzle flow velocity of plating solution ul-3m / s, u2-1m / s, u3-2m / s Plating-1 and Plating-2 In the case of, there is no problem in the plating operation, and the obtained tin-plated steel sheet has a plating gloss (measured by the method of JIS Z 8741) and a corrosion resistance (AT
C test) was good. Moreover, sludge generation was small.

【0024】[0024]

【発明の効果】以上の実施例から明らかなように、本発
明によれば、高電流密度での錫めっきにおいても低コス
ト、良環境性の硫酸浴でスラッジの生成量を抑えてめっ
きが高速でできるので、ぶりき等の製造において、品質
面、コスト面、環境面での工業的価値が極めて大きい。
As is apparent from the above embodiments, according to the present invention, even in tin plating with high current density, the cost is low, and the amount of sludge generated is suppressed in a sulfuric acid bath of good environment to achieve high-speed plating. Therefore, the industrial value in terms of quality, cost and environment in manufacturing tinplate and the like is extremely large.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係わるめっきセルの構造例を示す断面
図。
FIG. 1 is a sectional view showing a structural example of a plating cell according to the present invention.

【符号の説明】[Explanation of symbols]

1 第1電極パッド 2 第2電極パッド 3 金属ストリップ 4 第1電極パッドの噴射ノズル 5 第2電極パッドの噴射ノズル 6 コンダクターロール 7 めっき液タンク 8 めっき液排出孔 9 液切りロール u1 ノズル1流速 u2 ノズル2流速 u3 ノズル3流速 t スリットノズル間隔 H 第1及び第2電極パッド間隔 R パッド径 1 1st electrode pad 2 2nd electrode pad 3 Metal strip 4 Jet nozzle of 1st electrode pad 5 Jet nozzle of 2nd electrode pad 6 Conductor roll 7 Plating solution tank 8 Plating solution discharge hole 9 Liquid cutting roll u1 Nozzle 1 Flow rate u2 Nozzle 2 flow rate u3 Nozzle 3 flow rate t Slit nozzle spacing H First and second electrode pad spacing R Pad diameter

───────────────────────────────────────────────────── フロントページの続き (72)発明者 秋田 靖博 千葉県富津市新富20−1 新日本製鐵株式 会社技術開発本部内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhiro Akita 20-1 Shintomi, Futtsu City, Chiba Shin Nippon Steel Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 電解めっき位置にて鋼ストリップ走行ラ
インを円弧状に曲げ、この円弧状部の内側および外側に
沿って電極を配置し、該電極と鋼ストリップとの間に電
解液を入れる円弧状型めっきセルを用い、硫酸5〜50
g/l、二価錫イオン40〜100g/lおよび二つ以
上のヒドロキシ基を有する芳香族化合物と、一つのヒド
ロキシ基と窒素あるいは酸素で配位した電子供与性置換
基とを有する芳香族化合物とを、4対1の割合で混合し
た芳香族化合物0.01〜2g/lを主成分とする電解
液を用い、浴温30〜70℃、電流密度50A/dm2
以上で鋼ストリップ上に錫を電析させる円弧状型めっき
セル高電流密度錫めっき方法。
1. A circle in which a steel strip running line is bent into an arc at an electrolytic plating position, electrodes are arranged along the inside and outside of the arc, and an electrolytic solution is placed between the electrode and the steel strip. Using an arc-shaped plating cell, sulfuric acid 5-50
g / l, divalent tin ion 40 to 100 g / l and an aromatic compound having two or more hydroxy groups, and an aromatic compound having one hydroxy group and an electron-donating substituent coordinated with nitrogen or oxygen. And an electrolytic solution containing 0.01 to 2 g / l of an aromatic compound as a main component, which are mixed at a ratio of 4 to 1, using a bath temperature of 30 to 70 ° C. and a current density of 50 A / dm 2.
The arc-shaped plating cell high current density tin plating method of depositing tin on a steel strip as described above.
JP15020993A 1993-06-22 1993-06-22 Arc type plating cell High current density tin plating method Expired - Fee Related JP3184005B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15020993A JP3184005B2 (en) 1993-06-22 1993-06-22 Arc type plating cell High current density tin plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15020993A JP3184005B2 (en) 1993-06-22 1993-06-22 Arc type plating cell High current density tin plating method

Publications (2)

Publication Number Publication Date
JPH073493A true JPH073493A (en) 1995-01-06
JP3184005B2 JP3184005B2 (en) 2001-07-09

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ID=15491921

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Application Number Title Priority Date Filing Date
JP15020993A Expired - Fee Related JP3184005B2 (en) 1993-06-22 1993-06-22 Arc type plating cell High current density tin plating method

Country Status (1)

Country Link
JP (1) JP3184005B2 (en)

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Publication number Priority date Publication date Assignee Title
JP2022168731A (en) * 2021-04-26 2022-11-08 Jfeスチール株式会社 Manufacturing method of hot-dop galvanized metal plate and manufacturing facility of hot-dip galvanized metal plate

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Publication number Priority date Publication date Assignee Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022168731A (en) * 2021-04-26 2022-11-08 Jfeスチール株式会社 Manufacturing method of hot-dop galvanized metal plate and manufacturing facility of hot-dip galvanized metal plate

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