JPH0730023A - Semiconductor element cooling device - Google Patents

Abstract

PURPOSE:To provide a semiconductor cooling device which can be made small in size, and weight can be reduced and heat carrying power can be enhanced. CONSTITUTION:A heat receiving block 3 is attached to one side of an airtight container 1, and heat radiating fins 4 are attached to the other side of the airtight container 1. An inner tube 11 is attached to almost all regions of a heat insulating part 7 and a condensation part 6 inside the airtight container 1 through the intermediary of a retainer 12. An inner tube 11 is formed in such a manner that a proper gap is formed between its outer circumference and the airtight container, and the end part on the side of the heat insulating part 7 is widened in tapered form.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element cooling device used in a power converter or the like.

[0002]

2. Description of the Related Art A semiconductor element used in a power converter or the like requires some cooling means because it generates heat when energized. In recent years, however, a cooling apparatus using a heat pipe cooler has been widely adopted.

FIG. 4 is a cross-sectional view of a heat pipe type cooler, in which 1 is a tubular closed container in which a small amount of refrigerant 2 is sealed, and a semiconductor element (not shown) is provided on one side of this closed container 1. 2) is mounted on the other side of the closed container 1 to which heat is dissipated to the atmosphere. Here, the part of the heat receiving part block 3 forms the evaporation part 5, the part of the radiating fins 4 forms the condensation part 6, and the middle of these forms the heat insulating part 7.

As described above, the heat pipe cooling type cooler is formed by the evaporation section 5, the condensation section 6 and the heat insulation section 7.
It is used as a means for transporting heat from the evaporation section 5 to the condensation section 6. That is, heat transfer is carried out by utilizing the phase change of evaporation / condensation of the refrigerant 2, and the refrigerant 2 becomes a gas inside the closed container 1 due to the pressure difference, and the vapor flow 8 from the evaporation part 5 to the condensation part 6 flows. And a liquid flow 9 that is liquefied and moves from the condensation unit 6 to the evaporation unit 5 by gravity flows in opposition.

[0005]

As described above, since the vapor flow 8 and the liquid flow 9 of the refrigerant 2 flow in the closed container 1 so as to face each other, the vapor flow 8 adversely affects the liquid flow 9, There is a problem such as a dry-out phenomenon in which the refrigerant 2 is not smoothly returned to the evaporation portion 5 and is in a liquid leakage state, which is a factor of the heat transfer capacity limit of the heat pipe cooler. Therefore, it is an object of the present invention to provide a semiconductor element cooling device that enhances the above-mentioned heat transport capacity limit and realizes downsizing and weight reduction of the device.

[0006]

In order to achieve the above object, the invention according to claim 1 is formed by providing a heat receiving portion block to which a semiconductor element is attached to one side of a tubular closed container in which a refrigerant is sealed. Is installed in the portion excluding the evaporation part of the refrigerant, the condensation part of the refrigerant formed by providing the radiation fin on the other side of the closed container, and the evaporation part inside the closed container,
A tubular partitioning body having open ends is provided to partition a vaporized vapor stream of the refrigerant in the evaporation section and a liquefied vapor stream of the vaporizer in the condenser section.

In the invention according to claim 2, the partition body is further provided with a plurality of holes. Further, in the invention according to claim 3, the partition body has an approximately arc-shaped cross-section with its upper side opened.

[0008]

[Operation] The vapor flow of the refrigerant rises inside the tubular partition,
Since the liquid flow of the refrigerant condensed in the condensing part descends through the gap formed between the partition and the closed container, the opposing vapor flow and liquid flow are separated, and the circulation of the refrigerant becomes smooth, increasing the heat transport capacity. Improve the cooling capacity.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the invention according to claim 1,
The figure (a) is a longitudinal sectional view, and the figure (b) is A of the figure (a).
FIG. In FIGS. 1A and 1B, 10 is a heat pipe type cooler, and this heat pipe type cooler 10
Is a closed container 1 in which a small amount of refrigerant 2 is enclosed, a heat receiving block 3 attached to one side of the closed container 1, a radiation fin 4 attached to the other side of the closed container 1, and a closed container 1 In the same manner as the conventional heat pipe type cooler described above, the heat receiving part block 3 part is the evaporating part 5, the radiating fins 4 part is the condensing part 6, and the middle of these parts is The heat insulating parts 7 are formed respectively.

Further, the inner pipe 11 forms an appropriate gap between the outer periphery thereof and the inner periphery of the closed container 1, and the heat insulating portion 7
And the condensing part 6 are housed so as to cover substantially the entire area, and the hermetically sealed container 1 is provided with eight supports 12 arranged at two locations along the longitudinal direction and four locations along the radial direction at one location. It is fixed to the inner wall of the, and the end portion on the heat insulating portion 6 side is expanded in a tapered shape. When fixing the inner pipe 11, the intermediate portion of the closed container 1 is divided in advance, joined to the inner wall of the intermediate portion via the support 12, and then the end portions are provided on both sides of the intermediate portion. Each of them is joined, or one end of the closed container 1 is opened, a brazing material is placed near the support 12, and they are joined by heating in a heating furnace or the like, and the rear end is joined. You may

Next, the operation of the embodiment configured as described above will be described. The heat generated by the semiconductor element (not shown) is
The heat receiving unit block 3 transfers heat to the evaporation unit 5 to evaporate the refrigerant 2 enclosed in the closed container 1. The vapor stream 8 of the refrigerant 2 resulting from this evaporation moves to the condenser section 6 through the inside of the inner tube 11, condenses the inner wall of the closed container 1 into which the heat radiation fins 4 are attached in the condenser section 6, and the liquid stream 9 Then, it returns to the evaporation section 5 along the inner wall. By repeating the above cycle, the phase change of the refrigerant 2 transfers the heat generated by the semiconductor element (not shown) from the evaporation section 5 to the condensation section 6.

Therefore, the vapor stream and the liquid stream of the refrigerant are separated from each other, whereby the vapor stream does not adversely affect the liquid stream, the limit of the heat transport capacity is increased, and the heat pipe cooler excellent in the heat transport capacity is provided. Can be provided.

Next, FIGS. 2A and 2B show an embodiment of the invention described in claim 2, wherein FIG. 2A is a vertical sectional view and FIG. 2B is a perspective view showing a main part. In the figure (a), 15 is a heat pipe type cooler, and this heat pipe type cooler 15 is an inner pipe.
Except for 16, the configuration is similar to that of the heat pipe cooler 10 described above.

That is, the inner pipe 16 has a structure in which one end (the heat insulating portion side) is tapered in the same manner as the inner pipe 11 described above, and a large number of holes 16a are provided in the pipe wall, and the heat treatment described above is performed. It is fixed to the inner wall of the closed container 1 via a support (not shown) similar to the pipe cooler 10.

In the embodiment configured as described above,
The vapor stream 8 moves to the outside through the holes 16a of the inner pipe 16 and condenses into the liquid stream 9 even while returning to the condensing section. Therefore, the refrigerant 2 can be quickly returned to the evaporation section.

3A and 3B show an embodiment of the invention described in claim 3, wherein FIG. 3A is a vertical sectional view and FIG. 3B is a sectional view taken along line BB in FIG. In FIG. 1A, 20 is a heat pipe type cooler, which is used by inclining it to an angle close to horizontal, and the heat pipe type cooler 10 other than the inner pipe 21 is used. It has the same configuration as.

That is, the inner tube 21 is inclined and the closed container 1
It has a circular arc shape with its upper side opened when it is attached to the inner wall of the hermetically sealed container 1 through a support (not shown) similar to the heat pipe cooler 10 described above. However, since the upper side is open, no support is provided on this side.

In the embodiment configured as described above,
The vapor flow 8 and the liquid flow 9 are separated from each other as in the above-described embodiments, but the refrigerant condensed on the inner wall of the closed container 1 is
Along the inner wall of the closed container 1, it falls in the circumferential direction, and the steam flow 8
The liquid flow 9 is returned to the evaporation section without being affected by. Therefore, the flow passage area of the steam flow 8 is increased, the movement of the vapor is accelerated, and the refrigerant 2 can be quickly moved to the condenser.

[0019]

As described above, according to the first to third aspects of the present invention, the heat receiving portion block to which the semiconductor element is attached is provided on one side of the airtight container having a tubular shape in which the refrigerant is sealed. In the semiconductor element cooling device configured to form a vaporization section of the semiconductor element and to form a condenser section of the refrigerant by providing a radiation fin on the other side and transport heat by the phase change of the refrigerant, the evaporation section inside the hermetic container is Since the tubular partition that separates the refrigerant vapor and liquid streams is provided in the removed portion, the refrigerant vapor stream and liquid stream are partitioned to improve the heat transport capacity and simplify the heat transport mode. In addition, it is possible to use up to the theoretical heat transport capacity limit, reduce the number of units used, limit design at the design stage, etc., and provide a semiconductor element cooling device that realizes downsizing and weight reduction of the device. You can

[Brief description of drawings]

1 shows an embodiment of the invention according to claim 1, (a)
Is a vertical cross-sectional view, and (b) is a cross-sectional view taken along line AA of (a).

2A and 2B show an embodiment of the invention described in claim 2, wherein FIG. 2A is a longitudinal sectional view and FIG.

3A and 3B show an embodiment of the invention described in claim 3, wherein FIG. 3A is a vertical sectional view, and FIG. 3B is a sectional view taken along line BB of FIG.

FIG. 4 is a vertical sectional view of a conventional heat pipe cooler.

[Explanation of symbols]

1 ... Airtight container, 2 ... Refrigerant, 3 ... Heat receiving part block, 4 ... Radiating fin, 5 ... Evaporating part, 6 ... Condensing part, 7 ... Heat insulating part, 8 ...
Steam flow, 9 ... Liquid flow, 10, 15, 20 ... Heat pipe type cooler, 11, 16, 21 ... Inner tube, 12 ... Support, 16a ... Hole.

Claims (3)

[Claims] 1. An evaporating portion of the refrigerant, which is formed by providing a heat receiving portion block to which a semiconductor element is attached, on one side of a tubular closed container in which a refrigerant is sealed, and a heat radiation fin on the other side of the closed container. And a condensing portion of the refrigerant formed and formed,
It is installed in a portion other than the evaporation section inside the closed container, and is a tubular shape with both ends open to partition the vapor stream in which the refrigerant is vaporized in the evaporation section and the liquid stream in which the vapor stream is liquefied in the condenser section. Device for cooling a semiconductor element having a partition body. 2. The semiconductor element cooling device according to claim 1, wherein the partition body is provided with a plurality of holes. 3. An evaporating part of the refrigerant formed by inclining a hermetically sealed container in which a refrigerant is enclosed and providing a heat receiving block to which a semiconductor element is mounted on one side, and a heat radiating fin on the other side of the hermetically sealed container. Condensed portion of the refrigerant formed by providing, is installed in a portion excluding the evaporation portion inside the closed container, the vapor flow of the refrigerant vaporized in the evaporation portion and the vapor flow in the condensation portion. A semiconductor element cooling device having a partition body for partitioning a liquefied liquid flow and having a substantially arc-shaped cross section with an open upper side.