JPH07297602A - Dielectric resonant parts and its production - Google Patents

Abstract

PURPOSE:To provide a dielectric resonant parts and its production which can easily change the coupling degree and the coupling relation between both resonators adjacent to each other without changing the external shape and the size of a dielectric block nor deteriorating the Qo. CONSTITUTION:A dielectric block 1 includes three resonator holes 2a, 2b and 2c, and the center hole 2b tilts to both end faces 1a and 1b. Meanwhile other side holes 2a and 2c are set vertical to both faces 1a and 1b respectively. In such a constitution, the inductive coupling is secured between the resonators of one of both resonator holes adjacent to each other with the capacitive coupling secured between the resonators of the other of both reaonator holes respectively. These coupling degrees can be changed by changing the tilting degree of the hole 2b. This tilting hole 2b can be formed by the cutting process of an ultrasonic processing machine.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonance component, and more particularly to a dielectric resonance component in which a plurality of dielectric coaxial resonators are integrally formed in a single dielectric block, and a tilted resonator. The present invention relates to a method for manufacturing a dielectric resonance component having holes.

[0002]

2. Description of the Related Art In a dielectric resonant component in which a plurality of dielectric resonators are coupled to each other, conventionally, in order to obtain capacitive coupling between adjacent resonators, a step is formed in a dielectric block as shown in FIG. In order to form a resonator hole having a portion and to obtain inductive coupling, for example, as shown in FIG. 6, coupling means such as a coupling groove is formed on the outer surface of the dielectric block. In the following figures, the dot-filled portion shows the visible portion (conductor non-forming portion) of the dielectric block.

As shown in FIG. 5, a dielectric resonance component provided with a resonator hole having a step portion penetrates a pair of opposing faces 1a, 1b of a substantially rectangular parallelepiped dielectric block 1 and, for example, Two resonator holes 2a and 2b are formed, and inner conductors 3 and 3 are formed on the inner surfaces of the resonator holes 2a and 2b.
A pair of input / output electrodes 5 and 5 are formed at predetermined locations on the outer surface of the dielectric block 1, and an outer conductor 4 is formed on substantially the entire outer surface except the regions where the input / output electrodes 5 and 5 are formed.

The inner conductors 3 and 3 are provided with a non-formed portion of the inner conductor 3 in the vicinity of one opening surface 1a (hereinafter referred to as an open end surface) of the resonator holes 2a and 2b, and the outer conductor 4 is formed. Is opened (separated), and the other opening surface 1b (hereinafter, referred to as a short-circuit side end surface) is short-circuited (conducted) with the outer conductor 4.

External coupling capacitance is generated between each inner conductor 3 in the resonator holes 2a and 2b and the input / output electrode 5, and external coupling capacitance is obtained by this external coupling capacitance.

Inside each of the resonator holes 2a, 2b, a step portion 21 is provided near the center between the open side end surface 1a and the short circuit side end surface 1b, and the step portion 21 is provided from the open side end surface 1a.
The inner diameters of the resonator holes 2a and 2b up to are larger than the inner diameters of the resonator holes 2a and 2b from the short-circuit side end face 1b to the step portion 21. The resonator holes 2a, 2b are formed such that their central axes are parallel to each other and in a direction perpendicular to both end faces 1a, 1b.

In this structure, the resonator holes 2a and 2b are provided.
The coupling between the two resonators formed for each is capacitive coupling, and an attenuation pole is formed on the low frequency side of the pass band.

Further, as shown in FIG. 6, the dielectric resonance component having the coupling groove formed on the outer surface of the dielectric block has the coupling groove 6,
6 is on both main surfaces of the dielectric block 1 and is a resonator hole 2
It is provided between a and 2b. Each coupling groove 6, 6 is
It extends in parallel with the respective resonator holes 2a, 2b, starts from the open side end face 1a, and stops near the approximate center between the open side end face 1a and the short-circuit side end face 1b. An outer conductor 4 is formed on the surface of each coupling groove 6, 6. Each of the resonator holes 2a and 2b is formed with a constant inner diameter, and the central axes thereof are parallel to each other and perpendicular to both end faces 1a and 1b.

The other structure of this dielectric resonance component is the same as that shown in FIG. 5, and the description thereof is omitted.

In this structure, the resonator holes 2a and 2b are provided.
The coupling between the two resonators formed for each is inductive coupling, and an attenuation pole is formed on the high frequency side of the pass band.

In order to obtain inductive coupling, instead of the coupling groove, a dielectric block provided with a step portion, a slit provided, or the like is also used.

In order to obtain attenuation poles on the low band side and high band side of the pass band, three or more resonator holes are formed in the dielectric block to obtain the attenuation poles on the low band side. A resonator hole having a stepped portion is provided, and a coupling groove or the like is provided on the outer surface of the dielectric block in order to obtain a damping pole on the high frequency side to form a dielectric resonance component.

[0013]

However, in each of the above-mentioned conventional dielectric resonant components, there is a stepped portion (stepped surface) on the inside or the outside thereof, so that loss occurs and Qo (no-load Q) decreases. There was a problem.

Further, in a dielectric resonance component having a stepped portion in a resonator hole as shown in FIG. 5, the coupling between both resonators is capacitive coupling, and it is difficult to obtain inductive coupling. In order to change the coupling degree, that is, the characteristics such as the pass band width, it is necessary to make complicated settings such as changing the ratio of the lengths of the large inner diameter portion and the small inner diameter portion of the resonator hole and the ratio of the inner diameters.

Further, in a dielectric resonant component having a coupling groove or the like formed on the outer surface of the dielectric block as shown in FIG. 6, the outer shape of the dielectric block is complicated, and mounting on a substrate causes a problem in mounting. was there. Further, in order to change the degree of coupling, the dimensions, shapes, etc. of the coupling groove, the stepped portion, etc.,
It is necessary to change the outer shape of the dielectric block. That is, when a dielectric resonant component having different characteristics such as pass band width is required, a large number of dielectric blocks having an outer shape corresponding to each characteristic are required, and it is difficult to standardize the dielectric block.

Therefore, an object of the present invention is to solve the above problems of the conventional dielectric resonance component, to reduce the Qo of the resonator without changing the outer shape and size of the dielectric block. To provide a dielectric resonance component and a method for manufacturing the dielectric resonance component, which can easily change the coupling degree and the coupling relation (capacitive coupling or inductive coupling) between adjacent resonators without each other. .

[0017]

In order to achieve the above object, the invention according to claim 1 provides a plurality of resonator holes between a pair of opposed end faces of a dielectric block, In a dielectric resonance component having an inner conductor formed on an inner surface and an outer conductor formed on an outer surface of a dielectric block, at least one resonator hole of the resonator hole is provided with its central axis relative to the pair of end surfaces. It is characterized in that it is formed so as to be inclined.

In the invention according to claim 2, in the invention according to claim 1, the dimension between the resonator holes on the open side end surface side of the adjacent resonator holes is larger than the dimension between the resonator holes on the short circuit side end surface side. It is characterized by being formed.

According to a third aspect of the present invention, in the first aspect of the invention, the dimension between the resonator holes on the open-side end surface side of the adjacent resonator holes is made smaller than the dimension between the resonator holes on the short-circuit side end surface side. It is characterized by what has been done.

According to a fourth aspect of the present invention, at least one resonator hole is provided between a pair of opposing end surfaces of the dielectric block, an inner conductor is formed on the inner surface of the resonator hole, and an outer surface of the dielectric block is formed. In the method of manufacturing a dielectric resonant component, wherein an outer conductor is formed on at least one of the resonator holes, and a central axis of the resonator hole is inclined with respect to the pair of end faces. Some of the resonator holes including the holes or all the resonator holes are formed by using an ultrasonic processing machine.

[0021]

According to the above construction, at least one of the plurality of resonator holes is formed to be inclined, so that the dimension between the inclined resonator hole and the adjacent resonator hole is set to the open side end surface. Side and the short-circuit side end face side can be formed differently, so that the coupling relationship between adjacent resonators (capacitive coupling or inductive coupling) can be changed, and the adjacent resonator holes can be changed. The degree of coupling can be changed by changing the inclination of.

Further, by forming the resonator hole of the dielectric resonance component having such an inclined resonator hole by using the ultrasonic processing machine, the resonator hole having any inclination and shape can be easily formed. can do.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings showing the embodiments thereof. In the figure, the same or corresponding parts and those having the same functions as those in the conventional example are designated by the same reference numerals.

FIG. 1 shows the structure of the dielectric resonant component according to the first embodiment of the present invention. FIG. 1A is an external perspective view of the dielectric resonance component, and FIG. 1B is a sectional view taken along line XX of FIG.

The dielectric resonant component of this embodiment is shown in FIG.
As shown in (a) and (b), the pair of opposed faces 1a, 1b of the substantially rectangular parallelepiped dielectric block 1 are penetrated,
Two resonator holes 2a and 2b are formed, and the resonator holes 2a and
Inner conductors 3 are formed on the inner surface of 2b. A pair of input / output electrodes 5 and 5 are provided at predetermined locations on the outer surface of the dielectric block 1.
The outer conductor 4 is formed on substantially the entire outer surface except the regions where the input / output electrodes 5 and 5 are formed.

The inner conductors 3 and 3 are opened (separated) from the outer conductor 4 by providing an inner conductor non-formation portion in the vicinity of the open end face 1a which is one of the opening faces of the resonator holes 2a and 2b. ,
The short-circuit side end surface 1b, which is the other opening surface, is short-circuited (conducted) with the outer conductor 4.

External coupling capacitances are generated between the inner conductors 3 and 3 and the input / output electrodes 5 and 5 in the resonator holes 2a and 2b, and the external coupling capacitance is used to obtain external coupling.

As shown in FIG. 1 (b), the resonator holes 2a, 2b are formed such that their central axes are inclined with respect to both end faces 1a, 1b, and are closer to each other on the open side end face 1a side. As such, the short-side end face 1b is formed so as to be farther away. That is, the dimension d1 between the centers of the openings of the resonator holes 2a and 2b on the open side end face 1a (hereinafter, referred to as the dimension between the open side resonator holes) is the dimension d2 between the centers on the short side end face 1b ( (Hereinafter, it is referred to as the dimension between the resonator holes on the short-circuit side.)
Configured to be larger than.

In this structure, the ratio of the electric field energy related to the coupling between the two resonators formed in each of the resonator holes 2a and 2b tends to decrease on the side of the open end face 1a, but on the side of the short end face 1b. Then, the ratio of the magnetic field energy related to the coupling increases, and the coupling between the two resonators becomes coupling due to the magnetic field energy, that is, inductive coupling. The degree of coupling can be easily set and adjusted by changing the inclination of the resonator holes 2a and 2b, that is, the dimensions d1 and d2 between the resonator holes.

Next, FIG. 2 shows the structure of the dielectric resonant component according to the second embodiment of the present invention. FIG. 2 is a sectional view of the dielectric resonance component.

In the dielectric resonant component of this embodiment, as shown in FIG. 2, the resonator holes 2a and 2b are formed so that their central axes are inclined with respect to the both end surfaces 1a and 1b, and the open end surface is formed. It is formed so as to be further away from the side 1a and closer to the short-circuit side end face 1b. That is, the dimension d1 between the open side resonator holes is configured to be smaller than the dimension d2 between the short side resonator holes. For other configurations, see FIG.
The configuration is the same as that of the first embodiment shown in FIG.

In this structure, the ratio of the electric field energy related to the coupling between the resonators formed in each of the resonator holes 2a and 2b increases on the open side end surface 1a side, and the short-circuit side end surface 1a.
On the b side, the ratio of magnetic field energy related to coupling decreases,
The coupling between the two resonators is coupling by electric field energy, that is, capacitive coupling. Further, the degree of coupling can be changed by changing the inclination of the resonator holes 2a and 2b as in the first embodiment.
It can be easily set and adjusted.

As described above, in the first and second embodiments, the resonator holes are formed such that their central axes are inclined with respect to the open end surface and the short-circuit end surface, so that the space between adjacent resonators is increased. The coupling can be either capacitive coupling or inductive coupling, and the degree of coupling can be easily set and adjusted, so that the desired characteristics can be easily obtained.

Further, since there is no stepped portion (stepped surface) inside or outside the dielectric resonance component, it is possible to improve characteristics such as insertion loss without lowering Qo, and standardize the outer shape and dimensions. You can

In each of the above embodiments, the adjacent resonator holes are inclined to obtain a higher degree of coupling. However, the present invention is not limited to this, and one resonator hole is formed on the end face. It may be formed in the vertical direction and only the other resonator hole may be inclined.

Next, the structure of the dielectric resonant component according to the third embodiment of the present invention is shown in FIG. FIG. 3 is an external perspective view of a dielectric resonance component including a three-stage resonator showing an example of an application example of the above embodiment.

The dielectric resonant component according to this embodiment is shown in FIG.
As shown in FIG. 3, three resonator holes 2 are provided in the dielectric block 1.
a, 2b, and 2c are provided. The resonator hole 2b located in the center is formed so as to be inclined with respect to the open-side end faces 1a and 1b, and the resonator holes 2a and 2c on both sides have both end faces 1a and 1b.
It is formed in a direction perpendicular to a and 1b. That is,
The resonator hole 2b is formed so as to be inclined so as to approach the resonator hole 2c on the open side end surface 1a side and to approach the resonator hole 2a on the short-circuit side end surface 1b.

In this structure, the resonator holes 2a and 2b are provided.
The coupling between the two resonators formed in 1 is inductive coupling, and the coupling between both resonators formed in the resonator holes 2b and 2c is capacitive coupling. Therefore, the frequency attenuation characteristic of this dielectric resonant component is 1 on the high frequency side and 1 on the low frequency side of the pass band.
Two attenuation poles are formed.

The resonator holes 2a and 2c do not necessarily have to be perpendicular to the end faces 1a and 1b, and may be formed to have a different inclination from that of the resonator hole 2b. May be formed in a direction perpendicular to both end surfaces 1a and 1b, and the resonator holes 2a and 2c on both sides may be formed to be inclined with respect to both end surfaces 1a and 1b.

As described above, in the dielectric resonance component having three or more stages of resonators, by forming resonator holes having different inclinations, a plurality of capacitive couplings and inductive couplings can be obtained. Further, the coupling degree between the adjacent resonators can be easily set and adjusted by changing the inclination degree of the adjacent resonator holes.

In short, according to the present invention, in a dielectric resonance component in which a plurality of dielectric coaxial resonators are integrally formed in a single dielectric block, at least one resonator hole is formed to be inclined. Thus, the degree of coupling and the coupling relationship between adjacent resonators can be easily changed without providing coupling means such as a stepped portion inside or outside the dielectric resonant component.

In addition to the structure of each of the above-described embodiments, another coupling means such as a coupling groove may be used in combination to change the coupling degree to a greater extent.

Further, in the above embodiment, the dielectric resonant component in which a pair of input / output electrodes are formed at predetermined locations on the outer surface of the dielectric block has been described, but the present invention is not limited to this.
Instead of the input / output electrodes, a resin pin or the like may be used to connect to the external circuit. Further, the inner conductor and the outer conductor may be separated on the open side end face side by separating the inner conductor and the outer conductor on the open side end face.

Next, an example of a method of manufacturing the inclined resonator hole in each of the above embodiments will be described. FIG. 4 is a partially enlarged external view showing a state in which a resonator hole is formed using an ultrasonic processing machine. As shown in FIG. 4, the resonator hole forming method of this embodiment is performed by placing the dielectric block 1 to be cut on the holding jig 12 mounted on the processing table 11 of the ultrasonic processing machine, The cutting tool 14 attached to the amplification horn 13 of the sonic processing machine is brought into contact with the resonator hole forming portion of the dielectric block 1, and the cutting tool 14 vibrates to supply cutting water together with cutting water from the nozzle 15 of the compression pump. The resonator holes 2 are formed by vibrating the abrasive grains and sequentially cutting the resonator hole forming portion. The dielectric block 1 is installed on the holding jig 12 with an inclination with respect to the cutting tool 14, and thus the resonator hole is formed with an inclination with respect to the opening surface of the resonator hole of the dielectric block 1.

In this resonator hole forming method, the inclination angle of the resonator hole can be set arbitrarily by changing the installation angle of the dielectric block 1, that is, the shape of the installation portion of the holding jig 12 on which the dielectric block 1 is installed. Further, by changing the shape and size of the cutting tool 14, the cross-sectional shape and size of the resonator hole can be easily changed.

Therefore, according to this resonator hole forming method, even in the case of a dielectric resonant component having resonator holes having different inclinations, which is difficult to mold by the conventional mold molding, the mold for molding the dielectric block is formed. It is possible to easily form resonator holes with any inclination and shape in the dielectric block after molding or firing without changing the above, etc., and aim to standardize and standardize the dielectric block and molding die. Therefore, the degree of freedom in setting and adjusting the characteristics such as the coupling degree and the coupling relationship can be increased in the designing and manufacturing stages.

It should be noted that the resonator hole perpendicular to the opening surface of the resonator hole may be formed at the time of molding the dielectric block, and only the inclined resonator hole may be formed by this ultrasonic processing machine. All the resonator holes that form the component may be formed by this ultrasonic processing machine.

Further, the formation of the resonator holes by the ultrasonic processing machine may be carried out at any stage after the molding of the dielectric block, after calcination of this molding, or after firing.

The method of forming a resonator hole by using this ultrasonic processing machine can also be applied to a dielectric resonance component having one resonator hole formed in a dielectric block.

[0050]

As described above, according to the dielectric resonance component of the present invention, the resonator holes are formed so as to be inclined with respect to the end faces, that is, both end face sides of adjacent resonator holes are formed. By forming the resonator holes with different dimensions, the adjacent resonators can be coupled either capacitively or inductively, and the degree of coupling can also be changed by changing the degree of inclination. Can be changed. Therefore, since the step portion (step surface) is not formed inside or outside the dielectric resonance component, Qo does not decrease, and characteristics such as insertion loss can be improved. In addition, the desired characteristics can be easily obtained without changing the outer shape and dimensions of the dielectric block, and the outer shape and dimensions of the dielectric resonance component can be standardized, so mounting on a substrate is easy. You can

Further, according to the method of manufacturing a dielectric resonance component of the present invention, even in the case of a dielectric resonance component having resonator holes with different inclinations, the dielectric block can be molded without changing the molding die or the like. Or in the dielectric block after firing,
Resonator holes of any inclination and shape can be easily formed, the dielectric block and the molding die can be shared and standardized, and the characteristics such as coupling degree and coupling relationship can be achieved at the design and manufacturing stage. The degree of freedom in setting and adjusting is increased, and mold cost, molding cost, and material management cost can be reduced.

[Brief description of drawings]

1A is an external perspective view of a dielectric resonant component according to a first embodiment of the present invention, and FIG. 1B is a sectional view taken along line XX of FIG.

FIG. 2 is a sectional view of a dielectric resonance component according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a dielectric resonant component according to a third embodiment of the present invention.

FIG. 4 is a partial external view showing a method of forming a resonator hole in a dielectric resonant component having an inclined resonator hole according to an embodiment of the present invention.

FIG. 5 is an external perspective view of a conventional dielectric resonance component provided with a resonator hole having a step portion.

FIG. 6 is an external perspective view of a conventional dielectric resonance component provided with a coupling groove.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric block 2, 2a, 2b, 2c Resonator hole 3 Inner conductor 4 Outer conductor 5 Input / output electrode 11 Processing table 12 Holding jig 13 Amplification horn 14 Cutting tool 15 Nozzle

Claims (4)

[Claims] 1. A plurality of resonator holes are provided between a pair of opposing end faces of a dielectric block, an inner conductor is formed on an inner surface of the resonator hole, and an outer conductor is formed on an outer surface of the dielectric block. In the dielectric resonance component, the at least one resonator hole of the resonator holes is formed so that its central axis is inclined with respect to the pair of end faces. 2. The dimension between the resonator holes on the open-side end surface side of the adjacent resonator holes is made larger than the dimension between the resonator holes on the short-circuit side end surface side. Dielectric resonance component. 3. The dielectric according to claim 1, wherein the dimension between the resonator holes on the open-side end surface side of the adjacent resonator holes is smaller than the dimension between the resonator holes on the short-circuit side end surface side. Body resonance parts. 4. A dielectric block is provided with at least one resonator hole between a pair of opposing end faces, an inner conductor is formed on an inner surface of the resonator hole, and an outer conductor is formed on an outer surface of the dielectric block. A method of manufacturing a dielectric resonance component, wherein at least one of the resonator holes is formed so that a central axis thereof is inclined with respect to the pair of end faces. A method of manufacturing a dielectric resonance component, characterized in that the resonator holes or all the resonator holes are formed by using an ultrasonic processing machine.