JPH07294782A - Receptacle structure - Google Patents

Abstract

PURPOSE:To efficiently heat a receptacle holding an optical connector by high- frequency inductive heating regardless of materials of constituting parts by forming this receptacle of plastic and subjecting the surface of the receptacle to a plating treatment including conductor layers. CONSTITUTION:The receptacle 8 holding the optical connector of an electro-optic conversion module for optically coupling an optical semiconductor element and an optical fiber is formed of a nonconductive plastic and its surface is composed of the Ni plating layer and the Sn plating layer thereon. The receptacle 8 has a sleeve 10 for precision positioning of a ferrule part. The relative positions of a light emitting element 7 and the receptacle 8 are precisely adjusted in such a manner that the light is most efficiently coupled to the optical fiber in the optical connector inserted into the sleeve 10. Solder 11 is placed between this light emitting element 7 and the receptacle 8 and is subjected to high-frequency inductive heating by energizing a coil 6 from a high-frequency power source 9. At this time, a high-frequency current is mainly passed in the plating layers by a skin effect, by which the solder 11 is rapidly melted with the low current.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a receptacle structure capable of high frequency induction heating in a short time with a low current.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 5 and 6, a cylindrical mechanical component 2 and a rod-shaped mechanical component 3 which are conductors are relatively positioned at the center of a coil 1 and these mechanical components 2, Placing brazing material 4 between 3 and high frequency power supply 5
High-frequency current is passed to perform high-frequency induction heating.

The high frequency induction heating changes the magnetic field generated in the coil 1 by the high frequency current to excite eddy currents in the mechanical parts 2 and 3 to generate Joule heat. Due to the heat generated by this, the brazing material 4 is melted and the mechanical parts 2 and 3 are brazed to each other.

[0004]

Since the high frequency induction heating utilizes Joule heat, the object is limited to the conductor and cannot be applied to materials other than metal. Further, since aluminum, brass, etc., which are easily priced for parts, have low electric resistance, they have a problem that the brazing material does not melt due to poor heating property, or that a large current and a long time are required for melting the brazing material.

On the other hand, metals such as Ni, Cr, and Fe, which have high electric resistance, have the disadvantages of poor workability, high cost of parts, and poor environmental resistance. The present invention was made by paying attention to the phenomenon that the eddy current excited by the high frequency induction heating is a high frequency current and flows near the surface of the component due to the skin effect. That is, an object of the present invention is to provide a receptacle structure capable of efficiently heating by high frequency induction heating regardless of the internal material of the mechanical component.

[0006]

The structure of the present invention which achieves such an object is, in an electro-optical conversion module for optically coupling an optical semiconductor element and an optical fiber, a receptacle for holding an optical connector formed of plastic. And a plating treatment including at least one conductor layer is performed on the surface thereof. The conductor layer is N
It is characterized by having an i plating layer and an Sn plating layer.

[0007]

The induced high frequency current flows near the surface of the mechanical component due to the skin effect. Therefore, if the surface of the mechanical component is plated with a material having high electric resistance, induction heating can be efficiently performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. An embodiment of the present invention is shown in FIGS.
Shown in the figure. The present embodiment is an example applied to an optical communication component (electric-optical conversion module for optically coupling an optical semiconductor element and an optical fiber).

That is, as shown in FIGS. 2 and 3, the light emitting element 7 and the receptacle 8 are arranged in the center of the coil 6, and the coil 6 is connected to a high frequency power source 9. The receptacle 8 holds an optical connector (not shown), and has a sleeve 10 for precisely positioning a ferrule part (not shown). Light emitting element 7 and receptacle 8
The relative position of is precisely adjusted to couple the light most efficiently into the optical fiber in the optical connector that is inserted into the sleeve 10. Then, the solder 11 is placed between the positioned light emitting element 7 and the receptacle 8 and the coil 6 is energized by the high frequency power source 9 to perform high frequency induction heating.

Here, the inside of the receptacle 8 is made of brass, and the surface thereof is a Ni plating layer 12 as shown in FIG.
And an Sn plating layer 13 thereon. Although the light emitting element 7 is not directly heated by high frequency, it is desirable to apply Au plating or Ni plating to improve solder wettability. Since Ni and Sn have higher electric resistance than brass, the induced high frequency current is due to the skin effect.
Since it mainly flows through the Ni plating layer 12 and the Sn plating layer 13 on the surface, compared with the case where the Ni plating layer 12 and the Sn plating layer 13 are not present, the current is efficiently generated with a low current and in a short time, and the solder 11 is heated in a short time. To melt.

Further, Sn applied on the Ni plating layer 12
The plating layer shows good solder leakage and is firmly fixed. As described above, in this embodiment, the two plated layers 12 and 13 are formed on the surface of the receptacle 8 for each function. Therefore, the coil current can be lowered, which means that the influence on an article sensitive to current such as an optical semiconductor is reduced, which is very useful.

Further, since the heating time can be shortened, the change in relative position due to thermal expansion can be made small, which is extremely effective for parts that require ultra-precision alignment such as parts for optical communication. Is. Furthermore, two-layer plating layer 1
In the upper layer of 2 and 13, it is possible to select a material that improves the leakage property with the brazing material.

Since the internal material of the member does not affect the heating characteristics, it can be selected independently of the plating material. For example, the internal material of the receptacle 8 may be made of non-conductive plastic, and one or two or more conductor layers may be plated on the surface of the plastic to significantly reduce the unit price of parts.

[Test Example] FIG. 4 shows a test example of heating time. The object is a solid brass part in the figure, b in the figure
Is a component having a Ni plating layer with a thickness of 20 μm on the surface. In the test, the value of the current passed through the coil to bring the surface temperature of the component to 183 ° C. was measured with respect to the time until then. As is clear from the results shown in FIG.
It can be seen that the high frequency heating characteristics of the component having the plated layer are improved, and heating can be performed with a low current for a short time.

[0015]

As described above in detail with reference to the embodiments, since the receptacle structure of the present invention can be induction-heated at a low current and in a short time by utilizing the skin effect,
It is suitable for joining with parts that are sensitive to large currents using brazing material, and is effective for parts that require precise alignment.

[Brief description of drawings]

FIG. 1 is a perspective view showing a partially broken internal structure according to an embodiment of the present invention.

FIG. 2 is a perspective view of a high frequency induction heating device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a high frequency induction heating device according to an embodiment of the present invention.

FIG. 4 is a graph showing a relationship between current and time for heating characteristics according to an example of the present invention.

FIG. 5 is a perspective view of a conventional high frequency induction heating device.

FIG. 6 is a cross-sectional view of a conventional high frequency induction heating device.

[Explanation of symbols]

 6 coil 7 light emitting element 8 receptacle 10 sleeve 11 solder 12 Ni plating layer 13 Sn plating layer

Claims (3)

[Claims] 1. An electro-optical conversion module for optically coupling an optical semiconductor element and an optical fiber, wherein a receptacle for holding an optical connector is formed of plastic, and a plating treatment including at least one conductor layer on a surface thereof is performed. Receptacle structure characterized by being applied. 2. The receptacle structure according to claim 1, wherein the conductor layer has a Ni plating layer. 3. The receptacle structure according to claim 1, wherein the conductor layer has a Sn plating layer.