JPH07290396A - Board drilling method and board drilling machine - Google Patents

Abstract

PURPOSE:To surely recognize the position of the mark on a board. CONSTITUTION:The illumination light H2 from a light source 3 transmits a milky translucent plate 33, and the illuminance distribution is smoothed. The smoothed illumination light H3 is reflected on a half-mirror 21, and it is radiated to a printed board K as the illumination light H3 coaxial with the optical axis L of a CCD camera 1. The regulated light H4 from the printed board K transmits the half-mirror 21 and is received by an image pickup camera 1. The position of a mark M is recognized by the image of the printed board K, and drilling is applied at the center of gravity position of the mark M. The contrast between the portion of the mark M and the other portion is made clear, and drilling can be correctly made.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate hole punching method and a substrate hole punching machine, and more particularly to a substrate hole punching method and a substrate hole punching method in which a board illumination system is improved so that a mark at a hole punching position can be surely recognized. Substrate drilling machine.

[0002]

2. Description of the Related Art FIG. 3 is an explanatory block diagram showing an example of a conventional substrate punching machine. This board puncher 200 is a printed board K having a mark M (for example, copper foil) formed on its surface.
A processing table 5 on which (for example, a glass epoxy substrate) is placed,
CC that captures the optical image of the printed circuit board K as an image
A D camera 1, a ring-shaped light source 203 (for example, a ring-shaped high-frequency fluorescent lamp) installed around the CCD camera 1 to illuminate the printed circuit board K, and a side opposite to the CCD camera 1 with respect to the processing table 5. Installed spindle 6
A drill 7 attached to the spindle 6, an image processing section 4 for processing an image captured by the CCD camera 1, and the spindle 6 is controlled based on the processing result of the image processing section 4 to control the mark M. And a control device 8 for making a hole at the position of the center of gravity. In addition, H5
Is irradiation light, H6 is specular reflection light, and HC is diffuse reflection light. The mark M has a diameter of 4 mm and a thickness of about 500 nm, for example.

[0003]

In the conventional board punching machine 200 described above, the CCD camera 1 is provided with the printed board K.
Is obtained by the diffused reflection light HC. However, in the optical image due to the diffusely reflected light HC, the contrast between the mark M portion and the other portion of the printed circuit board K becomes unclear, and the position of the mark M can be surely recognized for all kinds of printed circuit boards. There is a problem that a printed circuit board of a type that cannot be accurately drilled will appear.
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate punching method and a substrate punching machine in which the illumination system of the substrate is improved so that the mark at the punching position can be surely recognized.

[0004]

According to a first aspect of the present invention, an optical image of a substrate (K) having a mark (M) formed on its surface is captured as an image by an image pickup camera (1) and based on the image. In a method of drilling a substrate by drilling to a predetermined drilling position, illumination light (H3) having a smoothed illuminance distribution is irradiated coaxially with the optical axis (L) of the image pickup camera (1) to obtain a substrate (K). There is provided a method for drilling a substrate, which comprises illuminating a substrate.

According to a second aspect of the present invention, in the present invention, an optical image of a substrate (K) having a mark (M) formed on its surface is captured as an image by an image pickup camera (1), and a predetermined punching position is obtained based on the image. In the substrate boring machine for boring a hole, the illumination light (H3) is coaxial with the optical axis (L) of the imaging camera (1).
Irradiation means (21, 31) for irradiating the substrate (K) with
And a smoothing means (32) for smoothing the illuminance distribution of the illumination light (H3). In the board punching machine having the above structure, the coaxial irradiation means has an inclination of 45 ° with respect to the optical axis (L) of the imaging camera (1) and is interposed between the imaging camera (1) and the board (K). A half mirror (21) provided and a light source (3) for making illumination light incident on the half mirror (21) from a direction of 90 ° with respect to the optical axis (L) of the image pickup camera (1). It is preferable that Further, in the substrate punching machine having the above structure, the smoothing means (33)
Is preferably a milky white translucent plate, frosted glass or opal glass provided in the optical path of the illumination light.

[0006]

In the substrate boring method and the board boring machine (100) of the present invention, the illumination light (H3) having a smoothed illuminance distribution.
Is irradiated coaxially with the optical axis (L) of the imaging camera (1) to illuminate the substrate (K). As described above, since the illumination light (H3) whose illuminance distribution is smoothed is used, there is no erroneous recognition due to uneven illuminance distribution. Further, since the illumination light (H3) is irradiated coaxially with the optical axis (L) of the imaging camera (1), the optical image of the substrate (K) can be obtained by the regular reflection light (H4), and the substrate (K). The contrast between the mark (M) part and the other part becomes clear. Therefore, the position of the mark (M) can be surely recognized on various types of printed circuit boards, and the board can be accurately drilled.

[0007]

The present invention will be described in more detail with reference to the embodiments shown in the drawings. The present invention is not limited to this. FIG. 1 is a block diagram showing a substrate punching machine according to an embodiment of the present invention. This board drilling machine 100
Is a processing table 5 on which a printed circuit board K (for example, a glass epoxy substrate) having a mark M (for example, copper foil or stainless steel foil) formed thereon is placed, and a CCD camera 1 for capturing an optical image of the printed circuit board K as an image. , The CCD camera 1 having an inclination of 45 ° with respect to the optical axis L of the CCD camera 1
Half mirror 21 provided between the printed circuit board and the printed circuit board K
A light source 3 for making illumination light incident on the half mirror 21 from a direction of 90 ° with respect to the optical axis L of the CCD camera 1, and a smoothing provided between the light source 3 and the half mirror 21. The conversion plate 33 and the processing table 5 to the C
The spindle 6 installed on the side opposite to the CD camera 1, the drill 7 attached to the spindle 6, and the CC
Image processing unit 4 for processing the image captured by the D camera 1
And a control device 8 for controlling the spindle 6 based on the processing result of the image processing unit 4 and making a hole in the position of the center of gravity of the mark M.

The light source 3 is composed of, for example, a halogen lamp 31 of about 20 W and a reflector 32. In addition,
Instead of the halogen lamp 31, a vacuum bulb, a gas filled bulb, a low pressure sodium lamp, a high pressure mercury lamp, a metal high-ride lamp, a high pressure sodium lamp, a xenon lamp or the like may be used. The smoothing plate 33 is composed of, for example, a milky white translucent acrylic plate, a frosted glass plate or an opal glass plate.

As shown in FIG. 2, the illumination light H from the light source 3
1 is diffused by the smoothing plate 33, and its illuminance distribution is smoothed. By this smoothing, it is possible to prevent erroneous recognition of the mark M due to the unevenness of the illuminance distribution of the illumination light H1. The smoothed illumination light H2 enters the half mirror 21 and is reflected toward the printed circuit board K. The reflected illumination light H3 is
It becomes coaxial with the optical axis L of the CCD camera 1, and the printed circuit board K
Is irradiated. On the printed circuit board K, specular reflection light H4 and irregular reflection light HC are generated. The regular reflection light H4 is coaxial with the optical axis L of the CCD camera 1, passes through the half mirror 21, and reaches the CCD camera 1. That is, the CCD camera 1 obtains the optical image of the printed board K by the regular reflection light H4. On the other hand, the diffused reflection light HC does not reach the CCD camera 1.

The image processing section 4 processes the image captured by the CCD camera 1. Then, the control device 8
Based on the processing result of the image processing unit 4, the spindle 6
Is controlled to make a hole in the center of gravity of the mark M.

In the above substrate punching machine 100, the illumination light H
The illuminance distribution of No. 3 is smoothed, and there is no misrecognition of the mark M due to uneven illuminance. Further, since the optical image of the printed circuit board K is obtained by the regular reflection light H4, the contrast between the portion of the mark M of the printed circuit board K and the portion other than that becomes clear, and the position of the mark M can be set in various types of printed circuit boards. Be sure to recognize it. As a result, drilling can be accurately performed on various types of printed circuit boards.

[0012]

According to the substrate punching method and the substrate punching machine of the present invention, the contrast between the mark portion and the other portion of the substrate becomes clear, and the position of the mark can be surely recognized. As a result, it becomes possible to accurately drill the substrate.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a substrate punching machine according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing an optical path in the substrate punching machine of FIG.

FIG. 3 is an explanatory configuration diagram showing an example of a conventional substrate punching machine.

[Explanation of symbols]

 100 substrate drilling machine 1 CCD camera 3 light source 4 image processing unit 5 processing table 6 spindle 7 drill 8 control device 21 half mirror 31 halogen lamp 32 reflector 33 milky white translucent plate K printed board M mark

Claims (4)

[Claims] 1. A substrate boring method in which an optical image of a substrate having a mark formed on a surface thereof is captured as an image by an imaging camera, and a hole is drilled at a predetermined boring position based on the image. A method of boring a substrate, characterized in that the substrate is illuminated by irradiating light coaxially with the optical axis of the imaging camera. 2. A substrate punching machine that captures an optical image of a substrate having a mark formed on its surface as an image with an image pickup camera, and punches it at a predetermined punching position based on the image, wherein the optical axis of the image pickup camera is A substrate punching machine comprising: coaxial irradiation means for coaxially irradiating a substrate with illumination light; and smoothing means for smoothing an illuminance distribution of the illumination light. 3. The substrate punching machine according to claim 2, wherein the coaxial irradiating means is 4 with respect to the optical axis of the imaging camera.
A half mirror having an inclination of 5 ° and provided between the image pickup camera and the substrate, and a light source for making illumination light incident on the half mirror from a direction of 90 ° with respect to the optical axis of the image pickup camera. A board hole punching machine characterized by 4. The substrate punching machine according to claim 2 or 3, wherein the smoothing means is a milky white translucent plate, frosted glass or opal glass provided in an optical path of illumination light. Characteristic board drilling machine.