JPH07283611A - Dielectric resonator device - Google Patents

Abstract

PURPOSE:To provide the small-sized dielectric resonator device where the production cost is reduced without increasing the number of parts and the characteristic is easily set or adjusted. CONSTITUTION:Plural dielectric resonators R1, R2, and R3 are joined on a substrate 20 and are coupled through auxiliary conductors 22 to 24 consisting of inductance elements or capacitance elements provided on the substrate 20, and a part of auxiliary conductors provided on the substrate 20 is used as a signal input/output conductor for surface mounting to a circuit board or the like. Thus, a shielding metallic case and an attaching bracket are unnecessary, and the dielectric resonator which has a low production cost and is small- sized and has resonators having various numbers of stages is easily produced without requiring a mold only for each of resonators different by the number of stages. Further, resonance frequencies of resonators and degrees of coupling between resonators are set or adjusted independently of one another in this dielectric resonator device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonator device composed of a plurality of dielectric resonators.

[0002]

2. Description of the Related Art Conventionally, one dielectric resonator device has been constructed by combining a plurality of dielectric resonators.
Coupling terminals are inserted into the inner conductor forming holes of multiple dielectric coaxial resonators, and other various conductors are provided on the dielectric substrate to form a coupling capacitance, which is used for coupling with these multiple dielectric coaxial resonators. There is a configuration in which a board is arranged in one metal case, and a coupling terminal inserted into an inner conductor forming hole of each dielectric coaxial resonator is soldered to each conductor of the coupling board. Also, instead of using individual dielectric resonators, multiple inner conductors are provided inside a rectangular parallelepiped dielectric block, and signal input / output conductors are formed on the outer surface together with the outer conductors. There is also a structure in which a dielectric coaxial resonator is formed.

[0003]

The former dielectric resonator device has a drawback in that the number of parts is very large and the size is large as a whole, and the number of assembling steps is large, so that the manufacturing cost is high. The latter dielectric resonator device does not require a metal case for shielding or a mounting bracket for mounting on a circuit board, and surface mounting is easy, but if you want to obtain different numbers of resonators, It was necessary to prepare the mold. Therefore, a large number of molds are required when manufacturing various types of dielectric resonator devices having different characteristics,
There is a problem that the manufacturing cost increases. Moreover, since the distance between resonators is determined by the size and shape of each mold, it is not easy to set the degree of coupling between the resonators, and moreover, it is necessary to set or adjust the degree of coupling between the resonators. The setting or adjustment of the resonance frequency of each resonator is interrelated in its structure, and when one is changed, the other is changed, and it is not easy to set or adjust both independently.

An object of the present invention is to solve such a conventional problem, to reduce the manufacturing cost without increasing the number of parts, to make the dielectric resonator device small in size and easy to set or adjust the characteristics. To provide.

[0005]

A dielectric resonator device according to a first aspect of the present invention is a dielectric resonator device in which a plurality of dielectric resonators are arranged on a substrate, and each dielectric resonator device. Has an inner conductor inside and has a first surface and a second surface facing each other.
An outer conductor on a surface and a side surface extending between the first surface and the second surface, and a coupling conductor forming an electrostatic capacitance with the inner conductor only on one side surface of the outer conductor; The substrate has a plurality of auxiliary conductors that are electrically connected to the coupling conductors of the respective dielectric resonators to couple the dielectric resonators to each other and use a part of the auxiliary conductors as signal input / output conductors to the outside. It is characterized in that the plurality of dielectric resonators are bonded on the substrate in a state where the side surfaces of the body resonator are close to each other.

A dielectric resonator device according to a second aspect of the present invention is the dielectric resonator device according to the first aspect, wherein the substrate is a multilayer wiring substrate, and the auxiliary conductor is provided in an inner layer of the multilayer wiring substrate. To do.

A dielectric resonator device according to a third aspect is the dielectric resonator device according to the first or second aspect, wherein the auxiliary conductor is formed as an inductance element or a capacitance element.

A dielectric resonator device according to a fourth aspect is the dielectric resonator device according to the first, second or third aspect, wherein a plurality of the coupling conductors are provided for each dielectric resonator and the same dielectric resonator is provided. The area of each coupling conductor in is different.

[0009]

In the dielectric resonator device according to the first aspect of the present invention, one dielectric resonator device is constituted by disposing a plurality of dielectric resonators on the substrate. An inner conductor is formed inside each dielectric resonator, and an outer conductor is formed on a first surface and a second surface facing each other and on a side surface extending between the first surface and the second surface, and on one side surface thereof. A coupling conductor that forms a capacitance with the inner conductor is formed. A plurality of auxiliary conductors are formed on one of the substrates, and the auxiliary conductors provided on the substrate with the plurality of dielectric resonators bonded to each other with the side surfaces of the adjacent dielectric resonators close to each other. The conductors are electrically connected to the coupling conductors of the respective dielectric resonators to couple the dielectric resonators to each other, and a part of them functions as a signal input / output conductor for the outside. As described above, since each dielectric resonator is individually configured, the resonator frequency of each stage resonator and the coupling degree between the resonators can be set or adjusted individually and independently. Moreover, since the dielectric resonator device itself can be surface-mounted on the mounting substrate as it is, a shielding metal case and a mounting bracket as in the prior art are not necessary.

In the dielectric resonator device according to a second aspect of the present invention, since the auxiliary conductor is provided in the inner layer of the multilayer wiring board, a plurality of dielectric resonators are bonded on the board,
The coupling conductors of each dielectric resonator are connected (coupled) via the inner layer of the multilayer wiring board. Therefore, the coupling conductors of the respective dielectric resonators are connected (coupled) without being affected by other conductors provided on the surface of the substrate where the plurality of dielectric resonators face each other.

In the dielectric resonator device according to the third aspect of the present invention, the auxiliary conductor acts as an inductance element or a capacitance element, and the dielectric resonators are coupled via the inductance element or the capacitance element. Thereby, for example, a polarized band pass filter is constructed.

In the dielectric resonator device according to the fourth aspect, the capacitance between the coupling conductor and the inner conductor is determined according to the area of the coupling conductor in each dielectric resonator. It is possible to set or adjust the coupling capacitance between the dielectric resonator in which the coupling conductor is formed and another dielectric resonator.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the dielectric resonator device of the first embodiment is shown in FIGS.

FIG. 1 is an external perspective view of a dielectric resonator device. In FIG. 1, R1, R2, and R3 are individual dielectric resonators, and 20 is a substrate for joining these dielectric resonators.

FIG. 2 is an external perspective view of one representative dielectric resonator showing the structure of the three dielectric resonators shown in FIG. As described above, each dielectric resonator is formed by forming the inner conductor forming hole 2 in the axial direction inside the prismatic dielectric and forming the outer conductor 6 on the outer surface of the dielectric.

FIG. 3 is a plan view showing the structure of the dielectric resonator shown in FIG. In FIG. 3, (S1), (S6),
(S5) and (S4) are plan views seen from the respective surfaces S1, S6, S5, S4 of the one dielectric resonator shown in FIG. In this way, the outer conductor is formed on the first surface S1 of the dielectric and the second surface S2 facing the first surface S4 and the four side surfaces S3, S4, S5, S6 extending between the first surface S1 and the second surface S2, An inner conductor forming hole 2 having an inner conductor formed on the inner peripheral surface is provided inside the body. Further, on one side surface S5, coupling conductors 7 and 8 are formed in an insulated state from the outer conductor 6.

FIG. 4 is a plan view of the substrate. (A) is a junction surface of the dielectric resonator, (B) is a left side surface of the substrate, (C) is a bottom surface of the substrate, and (D) is a right side surface of the substrate. Are shown respectively. A ground conductor 21 is provided on the upper and lower surfaces of the substrate 20 and almost the entire end surface.
Are formed, and auxiliary conductors 24 and 25 are formed on the upper surface, and auxiliary conductors 22 and 23 are formed in an insulated state from the ground conductor 21 from the upper surface to the lower surface through the end surface.
The four auxiliary conductors 22, 23, 24 and 25 are electrically connected to the coupling conductors of the three dielectric resonators. Of these, the auxiliary conductors 22 and 23 are also used as signal input / output conductors for a circuit board or the like.

FIG. 5 shows Y of the dielectric resonator device shown in FIG.
It is a sectional view of a 1-Y1 portion. In this way, the inner conductor forming hole 2 is provided at the center of the dielectric 1, and the inner conductors 3 and 4 separated by the inner conductor non-forming portion 5 are formed on the inner surface thereof, and the stray capacitance is provided between the inner conductors 3 and 4. It forms Cs. In this example, the inner conductor 3 acts as a λ / 4 long resonance conductor having the second surface S2 of the dielectric as a short-circuit surface and the inner conductor non-forming portion 5 as an open end.

FIG. 6 shows Y of the dielectric resonator device shown in FIG.
It is a sectional view of a 2-Y2 portion. In this way, electrostatic capacitance is generated between the vicinity of the open end of the inner conductor 3 of each dielectric resonator and the coupling conductors 7 and 8. The coupling conductors 7 and 8 of the dielectric resonator R1 are electrically connected to the auxiliary conductors 22 and 24 on the substrate side, and the coupling conductors 7 and 8 of the dielectric resonator R2 are electrically connected to the auxiliary conductors 24 and 25 on the substrate side. Then, the coupling conductors 7 and 8 of the dielectric resonator R3 are electrically connected to the auxiliary conductors 25 and 23 on the substrate side. A ceramic substrate, a glass / epoxy substrate, or the like is used as the substrate 20, but when the dielectric resonator is bonded to the ceramic substrate, an inorganic conductive paste may be applied, dried and cured, and then baked. When bonding a dielectric resonator to a glass / epoxy substrate,
The two may be joined together by using a high-temperature solder paste (cream solder) and then heated to perform the solder fusion joining.

FIG. 7 is an equivalent circuit diagram of the dielectric resonator device shown in FIGS. 1 and 6. Here, Cs is a stray capacitance generated between the inner conductors 3-4 of each dielectric resonator. Further, Ce, C12, C21, C23, C32, and Ce are capacitances generated between the inner conductors shown in FIG. 6 and the coupling conductors. In this way, a dielectric resonator device that functions as a three-stage bandpass filter formed by coupling three dielectric resonators is obtained.

Next, the structure of the dielectric resonator device of the second embodiment is shown in FIGS.

FIG. 8 is an external perspective view of the dielectric resonator device. In FIG. 8, R1, R2, and R3 are individual dielectric resonators, and 20 is a substrate for bonding these dielectric resonators.

FIG. 9 is an external perspective view of one representative dielectric resonator showing the structure of the three dielectric resonators shown in FIG. As described above, each dielectric resonator is formed by forming the inner conductor forming hole 2 in the axial direction inside the prismatic dielectric and forming the outer conductor 6 on the outer surface of the dielectric.

FIG. 10 is a plan view showing the structure of the dielectric resonator shown in FIG. In FIG. 10, (S1), (S
6), (S5), and (S4) are plan views seen from respective surfaces S1, S6, S5, and S4 of the one dielectric resonator shown in FIG. In this way, the outer conductor is formed on the first surface S1 of the dielectric and the second surface S2 facing the first surface S4 and the four side surfaces S3, S4, S5, S6 extending between the first surface S1 and the second surface S2, An inner conductor forming hole 2 having an inner conductor formed on the inner peripheral surface is provided inside the body. Further, on one side surface S5, coupling conductors 7 and 8 are formed in an insulated state from the outer conductor 6.
Unlike the example shown in FIG. 3 as the first embodiment, this second embodiment
In this embodiment, the outer conductor is formed so as to surround the coupling conductors 7 and 8 on the side surface S5, and the side surfaces S6 and S4 are formed.
An outer conductor is formed on the entire surface.

FIG. 11 is a plan view of the substrate. (A) is the junction surface of the dielectric resonator, (B) is the left side of the substrate, (C) is the bottom of the substrate, and (D) is the right side of the substrate. Are shown respectively. The ground conductor 2 is provided on almost the entire upper and lower surfaces and the end surface of the substrate 20.
1 is formed on the upper surface of the auxiliary conductors 24, 25, 26,
27, 28 and 29, and auxiliary conductors 22 and 23 are formed in an insulated state from the ground conductor 21 from the end face to the lower face. These six auxiliary conductors 24, 25, 26,
27, 28 and 29 are electrically connected to the respective coupling conductors of the three dielectric resonators. The auxiliary conductors 22 and 23 are used as signal input / output conductors for a circuit board or the like.

FIG. 12 is a sectional view of the YY portion of the dielectric resonator device shown in FIG. In this way, electrostatic capacitance is generated between the vicinity of the open end of the inner conductor 3 of each dielectric resonator and the coupling conductors 7 and 8. On the other hand, the substrate 20 is a multi-layer wiring substrate, and the auxiliary conductors 24, 25, 26, 27, 2 are formed on the upper layer thereof.
8, 29, etc. are formed, and auxiliary conductors 30, 31, 3 are formed on the inner layer.
2 and 33 are formed, and auxiliary conductors 22 and 23 and a ground conductor 21 are further formed in the lower layer. As shown in the figure, the upper layer auxiliary conductors 24 and 29 are connected to the inner layer auxiliary conductors 30 and 33 through via holes. The upper layer auxiliary conductors 25 and 26 are connected to the middle layer auxiliary conductor 31 via via holes, and similarly, the auxiliary conductors 27 and 28 are connected to the middle layer auxiliary conductor 32 via via holes, respectively. The multilayer wiring board 20 is formed by, for example, printing a conductive paste having a predetermined pattern on a ceramic green sheet, stacking the layers, and baking the layers.

As shown in FIG. 12, by joining three dielectric resonators R1, R2, R3 on the substrate 20, the coupling conductors 7, 8 of the dielectric resonator R1 are the auxiliary conductors 24 on the substrate side. , 25, the coupling conductors 7, 8 of the dielectric resonator R2 are conducted to the substrate side auxiliary conductors 26, 27, and the coupling conductors 7, 8 of the dielectric resonator R3 are substrate side auxiliary conductor 28. , 29. With this configuration, the auxiliary conductor provided in the middle layer of the substrate 20 can be provided even if the outer conductor is present around the coupling conductor on the surface where the coupling conductor of each dielectric resonator is formed. Via, the adjacent dielectric resonators are capacitively coupled. As a result, the dielectric resonator device shown in the equivalent circuit diagram similar to FIG. 7 is obtained.

Next, the construction of the dielectric resonator device of the third embodiment is shown in FIGS.

FIG. 13 shows FIG. 1 shown in the second embodiment.
It is sectional drawing of the dielectric resonator device corresponding to 2. The difference from the dielectric resonator device shown in the second embodiment is that the substrate 2
It has a structure of 0. That is, in this third embodiment, the substrate 20
Auxiliary conductors 31 and 32 are formed on the inner layer of the above, and an auxiliary conductor 34 is formed on the other inner layer at a position facing both auxiliary conductors. With this structure, electrostatic capacitances are formed between the auxiliary conductors 31-34 and 32-34.

FIG. 14 is an equivalent circuit diagram of the dielectric resonator device shown in FIG. In FIG. 14, Cs is the stray capacitance generated at the tip of the inner conductor that acts as the resonance conductor of each dielectric resonator. Also Ce, C12, C21, C2
3, C32, Ce are capacitances generated between the inner conductors and the coupling conductor shown in FIG. 13, and C122 is an auxiliary conductor 31-34.
An electrostatic capacitance generated between the two is C233 is an electrostatic capacitance generated between the auxiliary conductors 32-34. In this way, the three dielectric resonators are sequentially coupled via the capacitance, and
By coupling the first and third stages through the electrostatic capacitances C122 and C233, an attenuation pole is generated on the low frequency side of the pass band.

FIG. 15 shows the characteristic of the frequency-attenuation amount. In this way, a dielectric resonator device that acts as a bandpass filter that sharply attenuates the low-pass side of the passband is obtained.

In the third embodiment, the example in which the auxiliary conductor acting as a capacitance element is provided in the inner layer of the substrate has been shown. However, the auxiliary conductor acting as a capacitance element is provided in the upper layer of the substrate and each dielectric resonance An outer conductor may be formed in the container except for a region facing the auxiliary conductor portion acting as a capacitance element.

Next, the construction of the dielectric resonator device of the fourth embodiment is shown in FIGS.

FIG. 16 shows FIG. 1 shown in the second embodiment.
It is sectional drawing of the dielectric resonator device corresponding to 2. The difference from the dielectric resonator device shown in the second embodiment is that the substrate 2
It has a structure of 0. That is, in the fourth embodiment, the substrate 20
Auxiliary conductors 31 and 32 are formed on the inner layer of, and an auxiliary conductor 35 acting as an inductance element is formed between both auxiliary conductors.

FIG. 17 is a plan view showing the shape of the auxiliary conductor in the inner layer of the substrate 20. In this way, the auxiliary conductor 31-
Auxiliary conductor 35 acting as an inductance element between 32
To form.

FIG. 18 is an equivalent circuit diagram of the dielectric resonator device according to the fourth embodiment. In FIG. 18, L is an inductance element formed by the auxiliary conductor 35. Other configurations are the same as those shown in FIG. In this way, the three dielectric resonators are sequentially coupled via the electrostatic capacitance and the first and third stages are coupled via the inductance element L, so that the high frequency side of the pass band is obtained. A damping pole is created.

FIG. 19 shows the characteristic of the frequency versus the amount of attenuation. In this way, a dielectric resonator device that acts as a bandpass filter that sharply attenuates the high band side of the passband is obtained.

In the fourth embodiment, the example in which the auxiliary conductor acting as an inductance element is provided in the inner layer of the substrate is shown. However, the auxiliary conductor acting as an inductance element is provided in the upper layer of the substrate, and each dielectric resonance An outer conductor may be formed in the container except for a region facing the auxiliary conductor portion acting as an inductance element.

The structure of the dielectric resonator device of the fifth embodiment is shown in FIGS.

FIG. 20 shows the second embodiment shown in FIG.
3 is a plan view of each surface of a dielectric resonator corresponding to FIG. Figure 10
The difference from the example shown in FIG. 3 is that the auxiliary conductors 7 and 8 are arranged not in the arrangement direction of the dielectric resonator but in the axial direction of the inner conductor.

FIG. 21 is a plan view of each surface of the substrate corresponding to the drawing shown in FIG. 11 as the second embodiment. In this way, the positions of the auxiliary conductors 24, 25, 26, 27, 28, 29 on the substrate side are respectively determined according to the positions of the coupling conductors on the dielectric resonator side, and the auxiliary conductors 30,
31, 32, and 33 are provided, the auxiliary conductor 30 connects between the auxiliary conductors 25-22, and the auxiliary conductor 31 connects the auxiliary conductor 2
4-27 are connected, and the auxiliary conductor 26 is connected by the auxiliary conductor 32.
-29 is connected, and auxiliary conductor 33 further connects auxiliary conductors 28-23. With this configuration, the adjacent dielectric resonators are capacitively coupled, and the dielectric resonator device shown in the equivalent circuit diagram similar to FIG. 7 is obtained.

Next, FIG. 22 shows the structure of the dielectric resonator device of the sixth embodiment. FIG. 22 is a plan view of each surface of the dielectric resonator corresponding to FIG. 3 shown as the first embodiment. In this way, by presetting the areas of the auxiliary conductors 7 and 8 to be different, or by adjusting the areas of the auxiliary conductors 7 and 8 to be different by cutting,
The value of the capacitance between each auxiliary conductor 7, 8 and the inner conductor can be set and adjusted. Next, FIGS. 23 to 25 show the structure of the dielectric resonator device according to the seventh embodiment. FIG. 23 is a plan view of the entire dielectric resonator device, and this dielectric resonator device is used as an antenna duplexer. R1, R2 in the figure
R3 and R4 are individual dielectric resonators, and 20 is a substrate for joining these dielectric resonators. In the dielectric resonators R1 and R2, an inner conductor forming hole is provided in the axial direction inside a prismatic dielectric body, and a terminal T that conducts to the inner conductor is formed in the inner conductor forming hole.
Have been inserted. The dielectric resonators R3 and R4 have the same structure as that shown in FIGS. 43,44,4
Reference numerals 5, 46, and 47 are auxiliary conductors provided on the upper surface of the substrate 20 in the figure, and capacitors C1 and C2 as individual components are bonded onto the auxiliary electrodes 43 and 44, respectively.
An inductor L2 as an individual component is joined between 3 and 44, and an inductor L1 as an individual component is joined between the auxiliary electrodes 44 and 45. In addition, the dielectric resonators R1 and R2
Is connected to the ground conductor 21 on the upper surface of the substrate 20, and
The terminal T is connected to the capacitors C1 and C2, respectively. The dielectric resonators R3 and R4 are joined to the ground conductor 21 on the upper surface of the substrate 20 and the coupling conductors 7 and 8 are connected to the auxiliary conductors 45, 46 and 47, respectively.

FIG. 24 is a plan view of each surface of the substrate 20,
(A) is a junction surface of a dielectric resonator, (B) is a front surface, (C)
Shows a left side surface, (D) shows a bottom surface, and (E) shows a right side surface. In this way, the auxiliary conductors 43, 45, 47 are connected to the signal input / output conductors 41, 40, from the end face of the substrate to the bottom face.
42 are pulled out respectively.

FIG. 25 is an equivalent circuit diagram of the dielectric resonator device shown in FIG. Here, C1 and C2 are capacitors C1 and C2 in FIG. 23, but C3, C4 and C5 are static electricity generated between the auxiliary conductors 45, 44 and 43 shown in FIG. 23 and the ground conductor 21 on the bottom surface side of the substrate. It is the electric capacity. Also, C
6, C7, C8 and C9 are capacitances generated between the coupling conductors 7 and 8 of the dielectric resonators R3 and R4 and their inner conductors.
Thus, the two-stage resonator using the dielectric resonators R1 and R2 acts as a band stop filter, and the two-stage resonator using the dielectric resonators R3 and R4 acts as a band pass filter. , The entire device includes signal input / output conductors 41, 4
2 and 40 function as an antenna duplexer having a TX terminal, an RX terminal, and an ANT terminal, respectively.

In the seventh embodiment shown in FIGS. 23 to 25, two dielectric resonators R are used as a band pass filter on the receiving side.
Although 3 and R4 are used, this portion may be used as a one-stage band pass filter by using one dielectric resonator.

In each of the above-described embodiments, an example in which a λ / 4-length resonator having the second surface S2 of the dielectric resonator block as the short-circuit surface is used as each dielectric resonator is shown. A resonator having a λ / 2 length having open ends on both the first surface and the second surface of the body, or a λ / 2 length having both the first surface and the second surface of the dielectric as a short-circuit surface. You may use what comprised the resonator. Further, in each of the above-described embodiments, the example in which the outer conductor is formed on both the first surface and the second surface of the dielectric has been shown.
It is also possible to use a dielectric resonator in which one or both of the first surface and the second surface of the dielectric body is an open surface on which the outer conductor is not formed. Further, in each embodiment, the first surface and the second surface of the dielectric are
Although the through hole extending between the surfaces is defined as the inner conductor forming hole, the inner conductor forming hole does not necessarily have to penetrate, and the inner conductor may be provided in the void provided in the dielectric body.

[0047]

According to the present invention, there is no need for a conventional shielding metal case or a mounting bracket, the manufacturing cost is low, the dielectric resonator device is small in size, and has various stages of resonators. Dielectric resonance that can be easily manufactured without requiring a dedicated die for the number of resonators, and that the resonance frequency of each resonator and the degree of coupling between the resonators can be set or adjusted independently of each other. Equipment is obtained.

Particularly, in the dielectric resonator device according to the second aspect, since the plurality of dielectric resonators are not affected by the other conductors provided on the opposing substrate surfaces, the conductor pattern is formed on the substrate. The degree of freedom increases. Further, since the outer conductor can be formed on the entire other side surface adjacent to the side surface forming the coupling conductor, the outer conductor pattern of the dielectric resonator can be easily formed.

Further, in the dielectric resonator device according to the third aspect of the present invention, the dielectric resonator functioning as a bandpass filter having an attenuation pole in the low band or high band of the pass band without adding a separate individual component. The device is easy to obtain.

Further, in the dielectric resonator device according to the fourth aspect, the coupling capacitance between the dielectric resonator in which the coupling conductor is formed and another dielectric resonator is set or adjusted depending on the area of the coupling conductor. And a dielectric resonator device having desired characteristics can be easily obtained.

[Brief description of drawings]

FIG. 1 is an external perspective view of a dielectric resonator device according to a first embodiment.

FIG. 2 is an external perspective view of one dielectric resonator forming a part of the dielectric resonator device shown in FIG.

FIG. 3 is a plan view of each surface of the dielectric resonator shown in FIG.

FIG. 4 is a plan view of each surface of a substrate forming a part of the dielectric resonator device shown in FIG.

5 is a cross-sectional view of a Y1-Y1 portion in FIG.

6 is a cross-sectional view of a Y2-Y2 portion in FIG.

FIG. 7 is an equivalent circuit diagram of the dielectric resonator device according to the first embodiment.

FIG. 8 is an external perspective view of a dielectric resonator device according to a second embodiment.

9 is an external perspective view of one dielectric resonator forming a part of the dielectric resonator device shown in FIG. 8. FIG.

FIG. 10 is a plan view of each surface of the dielectric resonator shown in FIG.

FIG. 11 is a plan view of each surface of a substrate forming a part of the dielectric resonator device shown in FIG.

FIG. 12 is a cross-sectional view taken along the line YY in FIG.

FIG. 13 is a sectional view of a dielectric resonator device according to a third embodiment.

FIG. 14 is an equivalent circuit diagram of a dielectric resonator device according to a third embodiment.

FIG. 15 is a characteristic diagram of a dielectric resonator device according to a third embodiment.

FIG. 16 is a sectional view of a dielectric resonator device according to a fourth embodiment.

FIG. 17 is a plan view showing the shape of an auxiliary conductor in the inner layer of the substrate of the dielectric resonator device according to the fourth example.

FIG. 18 is an equivalent circuit diagram of a dielectric resonator device according to a fourth embodiment.

FIG. 19 is a characteristic diagram of the dielectric resonator device according to the fourth example.

FIG. 20 is a plan view of each surface of a dielectric resonator in a dielectric resonator device according to a fifth example.

FIG. 21 is a plan view of each surface of the substrate of the dielectric resonator device according to the fifth example.

FIG. 22 is a plan view of each surface of one dielectric resonator that constitutes a part of the dielectric resonator device according to the sixth embodiment.

FIG. 23 is a plan view of a dielectric resonator device according to a seventh embodiment.

FIG. 24 is a plan view of each surface of the substrate of the dielectric resonator device according to the seventh example.

FIG. 25 is an equivalent circuit diagram of a dielectric resonator device according to a seventh embodiment.

[Explanation of symbols]

 R1, R2, R3-dielectric resonator 1-dielectric 2-inner conductor forming hole 3,4-inner conductor 5-inner conductor non-forming part 6-outer conductor 7,8-coupling conductor 20-substrate 21-ground Conductors 22 to 35-auxiliary conductors 22 and 23- (signal input / output conductors)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01P 7/04

Claims (4)

[Claims] 1. A dielectric resonator device in which a plurality of dielectric resonators are arranged on a substrate, wherein each dielectric resonator has an inner conductor inside, and a first surface and a second surface facing each other. An outer conductor on the surface and a side surface extending between the first surface and the second surface, and a coupling conductor forming a capacitance between the inner conductor and the outer conductor only on one side surface thereof, The substrate has a plurality of auxiliary conductors that are electrically connected to the coupling conductors of the respective dielectric resonators to couple the dielectric resonators and use some of them as signal input / output conductors to the outside. A dielectric resonator device characterized in that a plurality of these dielectric resonators are bonded onto the substrate in a state where side surfaces of the body resonators are close to each other. 2. The dielectric resonator device according to claim 1, wherein the substrate is a multilayer wiring substrate, and the auxiliary conductor is provided in an inner layer of the multilayer wiring substrate. 3. The dielectric resonator device according to claim 1, wherein the auxiliary conductor is formed as an inductance element or a capacitance element. 4. The plurality of coupling conductors are provided for each dielectric resonator, and the area of each coupling conductor in the same dielectric resonator is different. 3. The dielectric resonator device according to item 3.