JPH07283537A - Manufacture of matrix board - Google Patents

Abstract

PURPOSE:To provide a manufacturing method wherein layer thickness irregularity of ring type contact points formed in intersection holes is small, and an inspection method for easily testing the electric continuity of a pattern, regarding the manufacturing method and the inspection method of a matrix board. CONSTITUTION:Each board resin layer forming a matrix board 10 is a large board resin layer 4 having a peripheral outside region 20 of a frame type outside an intersection hole forming region. Through holes 33A, 33B for plating which are pattern-connected with the respective end portions of an X-direction pattern 1, and through holes 34A, 34B for plating which are connected with the respective end portions of a Y-direction pattern 2 are formed in the peripheral outside region 20. Each of the through holes 33A, 33B, 34A, 34B is used as a cathode, and electroplating is performed. Thereby ring type contact points are formed on the lands of each pattern exposed on the inner peripheral wall of each intersection hole 3, and then the peripheral outside region 20 is cut out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a method for manufacturing a matrix board. In recent years, the intersections where the X-direction pattern and the Y-direction pattern are three-dimensionally intersected by alternately laminating the substrate resin layers having the plurality of X-direction patterns and the substrate resin layers having the plurality of Y-direction patterns. There is used a matrix board in which an intersection hole is drilled and a connecting pin is inserted into the selected intersection hole to connect the X-direction pattern and the Y-direction pattern.

As an example of the matrix board, a matrix board used for a main wiring board of a telephone exchange system is shown in FIG. In the figure, 10 is a substrate resin layer 4 on which a large number of Y-direction patterns 2 are formed, a substrate resin layer 4 on which a large number of X-direction patterns 1 is formed, and a substrate resin on which a large number of Y-direction patterns 2 (shown by dotted lines) are formed. Layer 4 and substrate resin layer 4 on which a large number of X-direction patterns 1 (shown by solid lines) are stacked in this order, and the substrate resin layer 4 on which no pattern is formed is laminated on the uppermost layer to form four inner conductor layers. It is a matrix board consisting of.

An intersection hole 3 is bored at each intersection where the X-direction pattern 1 and the Y-direction pattern 2 intersect three-dimensionally, and lands of the X-direction pattern 1 and the Y-direction pattern 2 are formed on the inner peripheral wall of the intersection hole 3. I'm getting naked.

Each of the X-direction pattern 1 and the Y-direction pattern 2 is formed by etching a copper foil having a foil thickness of about 150 μm, the pattern width is about 1.3 mm, and the inner diameter of the intersection hole 3 is It is about 1.1 mm.

Connector through holes 7 are arranged outside one of the areas where the intersection holes 3 are formed (on the left side in the drawing), and the respective connector through holes 7 and the corresponding X-direction patterns 1 are connected in a pattern. There is.

Further, the through holes 8 for connectors are arranged on the other outside (lower side in the figure) of the area where the intersection holes 3 are formed, and Y corresponding to each of the through holes 8 for connectors is arranged.
The directional pattern 2 is connected by a pattern.

Then, the connector pin 6A of the connector 6-1
To the connector through hole 7
And the X direction pattern 1 are connected, and the connector pin of the connector 6-2 is connected.

Therefore, when the intersection hole 3 is selected and the connection pin 15 is inserted, the land of the X-direction pattern 1 and the land of the Y-direction pattern 2 are connected via the connection pin 15. Therefore, the desired X-direction pattern 1 and the desired Y-direction pattern 2 are freely connected, and a circuit is formed which connects predetermined two locations via the connectors 6-1, 6-2.

In addition, in the peripheral portion of the matrix board 10,
A fixing screw hole (not shown) for attaching the matrix board 10 to the device is provided. Hereinafter, the intersection hole and the connecting pin will be described in detail with reference to FIGS.

A ring-shaped contact 5-1 is provided by plating on the land of the X-direction pattern 1 which is exposed on the inner peripheral wall of the intersection hole 3.
Ring-shaped contacts by plating on the land of Y direction pattern 2
5-2 is provided.

In each of the ring-shaped contacts 5-1, 5-2, a nickel plating layer 5B is provided on the surface of the copper plating layer 5A, and gold plating or the like is further applied on the surface of the nickel plating layer 5B. The connecting pin 15 is made of a metal material with a head, and two upper and lower insulating rings 15K are fitted around the outer periphery of the pin portion. Then, on the outer circumference of the upper insulating ring 15K, a resilient ring-shaped conductor with a slit (for example, copper-based metal plated with gold) 15
Wearing A. A resilient ring-shaped conductor with a slit (for example, copper-based metal plated with gold) 15B is fitted around the lower insulating ring 15K.

The outer diameter dimensions of the ring-shaped conductors 15A and 15B are
Since the inner diameters of the ring-shaped contacts 5-1 and 5-2 are made slightly larger, by pushing the connecting pin 15 into the intersection hole 3, the ring-shaped contacts 5-A and 15B corresponding to the ring-shaped contacts 5- are formed. 1,
Press 5-2.

The length of the ring-shaped conductors 15A and 15B is larger than the thickness of the substrate resin layer 4. Therefore, the connection pin
When 15 is pushed into the intersection hole 3, the upper X-direction pattern 1 and the upper Y-direction pattern 2 are connected via a ring-shaped contact 5-1, a ring-shaped conductor 15A, and a ring-shaped contact 5-2. X
The directional pattern 1 and the lower Y-direction pattern 2 are connected via a ring-shaped contact 5-1, a ring-shaped conductor 15B, and a ring-shaped contact 5-2.

When the connecting pin 15 is pushed into the selected intersection hole 3 to connect the desired X-direction pattern 1 and the desired Y-direction pattern 2, the reliability of the bonding is determined by the layer thickness of the ring-shaped contact and the ring-shaped contact. It is almost determined by the variation of the inner diameter of.

The matrix board is not limited to the one described above, and without providing the through holes 7 and 8 for the connector,
In some cases, the external connection terminals are directly inserted and used in the intersection holes 3 on the outer row of the X-direction pattern 1 and the intersection holes 3 on the outer column of the Y-direction pattern 2.

Further, the connection pin 15 is not provided with two ring-shaped conductors but is provided with only one ring-shaped conductor, and the upper X-direction pattern 1, the upper Y-direction pattern 2 and the lower X-direction pattern 1 are provided. It is also possible to connect the lower Y-direction pattern 2 through a different intersection hole 3.

[0017]

2. Description of the Related Art A conventional method for forming a ring-shaped conductor is shown in FIG. Conventionally, each substrate resin layer forming the matrix board 10 has a rectangular shape larger than the outer shape of the matrix board 10, and a peripheral outer region 20 is provided outside the matrix board 10.

A pair of plating through holes 25A, 25B are provided at one corner of the outer peripheral region 20 and a pair of plating through holes 26A, 26B are provided at the other corner. Then, the connector through hole 7 in the first row and the plating through hole 25A are connected by a lead-out pattern 21A, and the connector through hole 7 and the plating through hole in the last row are connected.
It is connected to 25B with a drawing pattern 21B.

Further, the lead-out pattern 21 is drawn out from all the other through holes 7 for connectors to the outer peripheral edge area 20, and the lead-out pattern 21 is drawn out to the outer peripheral edge area 20 from the land of the intersection hole 3 at the end of each row. There is.

The ends of the lead-out patterns 21 are connected by short-circuit patterns 23 so that the lands of the X-direction pattern 1 in the same layer of all the intersection holes 3 are connected in series. On the other hand, the through hole 8 for the connector in the first row and the through hole 26A for the plating are connected by the lead-out pattern 22A, and the through hole 8 for the connector and the through hole for the plating in the last row are connected.
It is connected to 26B with a drawing pattern 22B.

Further, the lead-out pattern 22 is drawn out from all the other through holes 8 for connectors to the outer peripheral edge area 20, and the lead-out pattern 22 is drawn out to the outer peripheral edge area 20 from the land of the intersection hole 3 at the end of each row. ing.

The ends of the lead-out patterns 22 are connected by short-circuit patterns 24 so that all the lands in the same layer of the Y-direction pattern 2 of the intersection holes 3 are connected in series. The matrix board 10 with the outer peripheral region 20 having such a configuration is immersed in a plating bath, the plating through hole 25A and the plating through hole 25B serve as a pair of plating electrodes, and the plating through hole 26A and the plating through hole 26A. Through hole 26B for use as another pair of plating electrodes, and the land and Y of the X-direction pattern 1 bare on the inner peripheral wall of the intersection hole 3
Copper is electroplated on the land of the directional pattern 2 to provide a copper plating layer 5A, and then the copper plating layer 5A is transferred to a nickel plating bath to form a nickel plating layer 5B on the surface of the copper plating layer 5A.

Then, the surface of the nickel plating layer 5B is gold-plated, and the ring-shaped contact 5-1 and the Y-direction pattern 2 are formed on the land of the X-direction pattern 1 barely exposed on the inner peripheral wall of the intersection hole 3.
A ring-shaped contact 5-2 is formed on the land.

Needless to say, the outer peripheral region 20 is cut off after plating.

[0025]

By the way, as described above, the plating thickness of the ring-shaped contact provided on the inner peripheral wall of the intersection hole varies widely.

More specifically, since the X-direction pattern and the Y-direction pattern have small cross-sectional areas, they have high electric resistance. Therefore, the current density flowing through the bare land on the inner wall of the intersection hole provided at a location far from the plating through hole (cathode) will be applied to the inner wall of the intersection hole provided at a location near the plating through hole (cathode). It is smaller than the current density flowing through the bare land.

As a result, the plating thickness of the ring-shaped contact in the intersection hole close to the plating through hole becomes thicker than the plating thickness of the ring-shaped contact in the intersection hole far from the plating through hole.

For this reason, the connecting pin is not pushed into the intersection hole near the plating through hole, and there is a risk that the connecting pin may bend and break. Further, when the connecting pin is inserted into the intersection hole far from the through hole for plating, there is a problem that the connection becomes defective.

The present invention has been made in view of the above points, and has a small variation in the layer thickness of the ring-shaped contact formed in the intersection hole, and has a high reliability of connection with the connecting pin. It is intended to provide a way.

Another object of the present invention is to provide a test method for a matrix board which can easily carry out a continuity test of X / Y direction patterns.

[0031]

In order to achieve the above object, the present invention provides a substrate resin layer having a plurality of X-direction patterns 1 and a plurality of Y-direction patterns 2 as illustrated in FIG. A predetermined number of the formed substrate resin layers are alternately laminated, and X
In a method of manufacturing a matrix board 10 in which intersection holes 3 are punched at points where a directional pattern 1 and a Y-direction pattern 2 intersect three-dimensionally, each substrate resin layer that constitutes the matrix board 10 is provided with an intersection hole formation region. A large-sized substrate resin layer 4 having a frame-shaped outer peripheral region 20 on the outer side of.

The through holes 33A and 33B for plating, which are pattern-connected to the respective ends of the X-direction pattern 1, are
The board resin layer 4 provided in the outer peripheral area 20 and the through hole 34A, 34B for plating which is pattern-connected to each end of the Y-direction pattern 2 are provided in the other outer resin area 4 of the peripheral board 20. And are alternately stacked.

Next, the intersection hole 3 is drilled. Then, electroplating is performed by using the through holes 33A, 33B, 34A, 34B for plating as cathodes, and ring-shaped contacts are formed on the lands of the X-direction pattern 1 bare on the inner peripheral wall of each intersection hole 3.
5-1 to the land of Y direction pattern 2 and other ring-shaped contact
5-2 are provided respectively.

Next, the outer peripheral region 20 is cut off to form a matrix board having a predetermined outer shape. As illustrated in FIG. 2, one end of the X-direction pattern 1 extends and a connector through hole 7 is formed at the end of the extending portion, and one end of the Y-direction pattern 2 extends and the connector is formed at the end of the extending portion. In the manufacturing method of the matrix board 10 in which the through holes 8 are formed,
Each board resin layer that constitutes 10 is placed outside the area where the intersection hole and the through hole for the connector are formed, and the outer peripheral area of the frame shape.
A large-sized substrate resin layer 4 having 20.

A plating through-hole 33A pattern-connected to each connector through-hole 7 and a plating through-hole 33B pattern-connected to the other end of each X-direction pattern 1 are provided in the outer peripheral region.
20. The board resin layer 4 provided on the substrate 20, the through holes 34A for plating which are pattern-connected to the through holes 8 for connectors, and the through holes for plating which are pattern-connected to the other end of each Y-direction pattern 2. Hall 34B
Are alternately laminated with the other substrate resin layers 4 provided in the outer peripheral region 20.

Next, the intersection hole 3 and the through hole lower hole for the connector are drilled, respectively. After that, electroplating is performed by using the plating through holes 33A, 33B, 34A, 34B as cathodes, and the land of the bare pattern is formed on the inner peripheral wall of each intersection hole 3 and the inner peripheral wall of the through hole lower hole for a connector. Each has a ring-shaped contact.

Then, the outer peripheral region 20 is cut off to form a matrix board having a predetermined outer shape. Figure 3
As illustrated in FIG. 2, a plurality of Xs arranged on the substrate resin layer 4 are arranged.
The directional pattern 1 is divided into at least two groups, and the plurality of Y-direction patterns 2 arranged on the other substrate resin layer 4 are divided into at least two groups, and each group is divided by a short circuit pattern 43A provided in the outer peripheral region 20. Each of the X-direction patterns 1 is connected in series, and each Y-direction pattern 2 in each group is connected in series via the short-circuit pattern 44A provided in the outer peripheral region 20. The other substrate resin layers 4 are alternately laminated.

Next, the intersection hole 3 and the through hole lower hole for the connector are formed. The plating through holes 33A, 33B, 34A, 34B provided in the outer peripheral region 20 are used as cathodes for electroplating, and the pattern is left bare on the inner peripheral wall of each intersection hole 3 and the inner peripheral wall of the through hole lower hole for a connector. A ring-shaped contact is provided on each land.

After that, the outer peripheral region 20 is cut off to form a matrix board having a predetermined outer shape. Alternatively, each substrate resin layer that constitutes the matrix board 10,
A large-sized substrate resin layer 4 having a frame-shaped outer peripheral region 20 outside the formation region of the intersection hole and the through hole for connector.
The outer peripheral region 20 is divided into an outer peripheral region 20A and an outer peripheral region 20B.

Plating through-holes 33A and 33B are provided in the outer peripheral edge outer area 20B, and a pair of test through-holes 41A and 41B are provided in the inner peripheral outer edge area 20A. Short circuit pattern 43 formed on 20A
For plating on the board resin layer 4 in which the starting end of the X-direction pattern 1 is pattern-connected to the test through hole 41A and the end is pattern-connected to the other test through hole 41B, and the outer peripheral edge outer region 20B. Through holes 34A and 34B are provided, and a pair of test through holes are provided in the inner peripheral edge outer area 20A.
42A and 42B are provided, and each Y-direction pattern 2 is connected in series via a short-circuit pattern 44 formed in the inner peripheral edge outer region 20A, and the starting end of the Y-direction pattern 2 is connected to the test through hole 42A and the other end is connected to the other end. Test through hole 42
Another board resin layer 4 which is pattern-connected to B respectively,
Stack alternately.

Next, the intersection hole 3 and the through-hole lower hole for the connector are drilled, respectively. After the ring-shaped contacts are electroplated on the lands of the exposed pattern on the inner peripheral wall of each intersection hole 3 and the inner peripheral wall of the through hole for a connector, the outer peripheral edge outer region 20B is cut off.

Then, the test through holes 41A, 41B, 42
Insert the pins connected to the test equipment into A and 42B,
A continuity test is performed on the X-direction pattern 1 arranged on the same substrate resin layer 4 and the Y-direction pattern 2 arranged on the same substrate resin layer 4.

Thereafter, the inner peripheral edge outer area 20A is cut off to form a matrix board having a predetermined outer shape.

[0044]

According to the present invention, both ends of each X-direction pattern and Y-direction pattern, or a small number of X-direction patterns are used.
A through hole for plating, that is, a cathode is provided at each end of the directional pattern and a small number of Y-direction patterns connected in series to perform electroplating.

As a result, the difference in the current densities flowing through the bare lands on the inner peripheral wall of each intersection hole is small.
Therefore, the variation in the layer thickness of the ring-shaped contact formed in the intersection hole is reduced, and the reliability of the connection with the connection pin is improved.

According to the second aspect of the present invention, the ring-shaped contact can be provided on the inner peripheral wall of the connector through hole at the same time when the ring-shaped contact is provided on the inner peripheral wall of the intersection hole.

According to the invention of claim 4, all the X-direction patterns arranged on the same substrate resin layer are connected in series, and all the Y-direction patterns arranged on the same substrate resin layer are also connected in series. Has been done.

Therefore, the time required for the continuity test of the X-direction pattern and the Y-direction pattern is shortened.

[0049]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a view showing the principle of the manufacturing method of the present invention. (A) is a plan view, (B) is a cross-sectional view of the two-dot chain line AA shown in (A), and FIG. 2 is the present invention. FIG. 3 is a diagram showing an embodiment of the manufacturing method of FIG. 3, FIG. 3 is a diagram showing another embodiment of the manufacturing method of the present invention, and FIG. 4 is a diagram showing still another embodiment of the manufacturing method of the present invention.

In FIG. 1, reference numeral 10 denotes a substrate resin layer on which a large number of Y-direction patterns 2 are formed, a substrate resin layer on which a large number of X-direction patterns 1 is formed, and a large number of Y-direction patterns 2 (shown by dotted lines in a plan view). And the substrate resin layer on which a large number of X-direction patterns 1 (indicated by a solid line in the plan view) are formed in this order, and a substrate resin layer on which no pattern is formed is laminated on the uppermost layer. It is a matrix board composed of four inner conductor layers.

Then, the respective X-direction patterns 1 and Y
An intersection hole 3 is drilled at each intersection where the direction pattern 2 intersects three-dimensionally, and the X-direction pattern 1 is formed on the inner peripheral wall of the intersection hole 3.
And the land of the pattern 2 in the Y direction is exposed.

Each of the X-direction pattern 1 and the Y-direction pattern 2 is formed by etching a copper foil having a foil thickness of about 150 μm, and the pattern width is about 1.3 mm. The board resin layer has a thickness of about 1 mm.

In manufacturing such a matrix board 10, each of the substrate resin layers is a large substrate resin layer 4 having a frame-shaped outer peripheral region 20 outside the region where the intersection holes 3 are arranged. .

The substrate resin layer 4 on which the X-direction pattern 1 is formed is formed by extending both ends of the X-direction pattern 1 to the outer peripheral region 20 and forming a plating through hole 33A at one end of each X-direction pattern 1. The lands and the lands of the through holes 33B for plating are provided at the other ends, respectively.

Further, the substrate resin layer 4 on which the Y-direction pattern 2 is formed has the both end portions of the Y-direction pattern 2 at the outer peripheral region.
The lands of the plating through holes 34A are provided at one end of each Y-direction pattern 2 and the lands of the plating through holes 34B are provided at the other end of each Y-direction pattern 2.

Then, on the substrate resin layer 4 having the Y-direction pattern 2 formed thereon, the substrate resin layer 4 having the X-direction pattern 1 formed thereon, and the substrate resin layer 4 having the Y-direction pattern 2 formed thereon, The substrate resin layer 4 having the X-direction pattern 1 formed thereon is stacked, and the substrate resin layer 4 having no pattern formed thereon is laminated on the uppermost layer.

Then, strip-shaped plating electrodes 35A for connecting the plating through-holes 33A and strip-shaped plating electrodes 35B for connecting the plating through-holes 33B are formed on both front and back surfaces of the laminated substrate resin layers. , Plating through holes
The strip-shaped plating electrode 36A connecting the 34A and the strip-shaped plating electrode 36B connecting the plating through-hole 34B.
Is provided by etching a copper foil attached to the entire surface of the substrate resin layer 4.

Then, after forming through-hole pilot holes penetrating the lands of the respective plating through-holes,
A conductive layer is formed on the inner peripheral wall of the through hole pilot hole by a known general method to finish the plating through hole.

After that, each X-direction pattern 1 and Y
Intersection holes 3 are drilled in such a manner that the directional patterns 2 intersect three-dimensionally, and lands of the X-direction pattern 1 and the Y-direction pattern 2 are exposed on the inner peripheral wall of each intersection hole 3. B is alternately laminated with the respective resin layers 4 of the substrate, which have the through holes 34A and 34B for plating provided at the respective ends of the pattern 2 in the Y direction.

Intersection holes (inner diameter is about 1.1 m) at the points where the X-direction pattern 1 and the Y-direction pattern 2 intersect three-dimensionally.
m) Drill 3 After that, it is dipped in a copper plating bath, electroplated with copper using the through holes 33A, 33B, 34A, 34B for plating as cathodes, and the land of the X-direction pattern 1 exposed on the inner peripheral wall of each intersection hole 3 is exposed. The ring-shaped contact 5-1 of the copper layer and the ring-shaped contact 5-2 of the other copper layer are provided on the land of the pattern 2 in the Y direction.

Next, it is dipped in a nickel plating bath, and nickel is electroplated by using each of the through holes 33A, 33B, 34A, 34B for plating as a cathode, and a ring-shaped contact 5 of a copper layer is formed.
A nickel layer is provided on each surface of 1,5-2.

Further, gold plating is performed to complete ring-shaped contacts 5-1 and 5-2 in which the surfaces of the nickel layers are gold-plated. Then, the outer peripheral region 20 is separated to form the matrix board 10 having a predetermined outer shape.

In the electroplating according to the conventional method, the layer thickness of the ring-shaped contact has a large variation of 0.1 mm to 0.19 mm, but according to the method of the present invention, the layer thickness of the ring-shaped contact is 0.14 mm.
It was reduced to a variation of ~ 0.16mm.

The matrix board 10 shown in FIG. 2 has a substrate resin layer on which a large number of Y-direction patterns 2 are formed, a substrate resin layer on which a large number of X-direction patterns 1 are formed, and a large number of Y-direction patterns 2 (indicated by dotted lines in the figure). ), A substrate resin layer on which a large number of X-direction patterns 1 (indicated by solid lines in the drawing) are formed in this order, and a substrate resin layer on which no pattern is formed is laminated on the uppermost layer, It is composed of four inner conductor layers, and one end of each X-direction pattern 1 extends and a connector through hole 7 is formed at the end of the extending portion, and one end of each Y-direction pattern 2 extends and the extending portion. Through holes 8 for connectors are respectively formed at the ends of the.

The matrix board 10 shown in FIG.
Since it consists of two conductor layers, the through hole 7 for the connector connected to the X direction pattern 1 in the upper layer and the other through hole for the connector connected to the X direction pattern 1 in the lower layer at one end (left side in the figure) of each row. 7 and 2 are provided side by side. In addition, a connector through hole 8 connected to the upper Y-direction pattern 2 and another connector through hole 8 connected to the lower Y-direction pattern 2 are provided at one end (lower side in the drawing) of each row. They are arranged side by side.

In manufacturing such a matrix board 10, each of the substrate resin layers forming the matrix board 10 has a frame-shaped outer peripheral area 20 outside the area where the intersection hole and the through hole for the connector are formed. The substrate resin layer 4 has a shape. The outer peripheral edge area 20 is divided into an outer peripheral edge area 20A and an outer peripheral edge area 20B.

In the board resin layer 4 on which the X-direction pattern 1 is formed, the lead-out pattern 31 is led out from each connector through hole 7, and the plating through hole 33A is provided in the outer peripheral edge outer region 20B. Direction pattern 1
The lead-out pattern 31 is led out from the other end of the above, and the through hole 33B for plating is provided in the outer peripheral edge outer region 20B.

Further, in the substrate resin layer 4 on which the X-direction pattern 1 is formed, the test through holes 41A (the through holes connected to the X-direction pattern of the upper layer and the X-layer of the lower layer) are provided at the selected corners of the inner peripheral edge outer region 20A. Two test through holes (a through hole connected to the direction pattern) are provided, and another test through hole 41B (a through hole connected to the upper X direction pattern and a through connected to the lower X direction pattern) is provided at another corner. Two test through holes) are provided.

Then, each X-direction pattern 1 is
Connected in series via the short-circuit pattern 43 (short-circuit pattern connecting the lead-out patterns 31) formed in the outer region 20A on the inner peripheral edge, and the starting end of the X-direction pattern 1 was used as a test through hole.
The end is connected to 41A and to the other test through hole 41B.

On the other hand, in the board resin layer 4 on which the Y-direction pattern 2 is formed, the lead-out pattern 32 is led out from each connector through hole 8, and the plating through hole 34A is provided in the outer peripheral edge outer region 20B. From the other end of the Y direction pattern 2 of the drawing pattern 32 is derived,
A plating through hole 34B is provided in the outer peripheral edge outer region 20B.

Further, in the substrate resin layer 4 on which the Y-direction pattern 2 is formed, test through holes 42A (a through hole connected to the upper Y-direction pattern and a lower Y layer) are formed at selected corners of the inner peripheral edge outer region 20A. Two test through holes (a through hole connected to the direction pattern) are provided, and another test through hole 42B (a through hole connected to the upper Y direction pattern and a through connected to the lower Y direction pattern) are provided at other corners. Two test through holes) are provided.

Then, each Y-direction pattern 2 is
Connected in series via the short-circuit pattern 44 (short-circuit pattern connecting the lead-out patterns 32) formed in the outer region 20A on the inner peripheral edge, and the starting end of the Y-direction pattern 2 was used as a test through hole.
At 42A, the end is connected to the other test through hole 42B.

Then, the substrate resin layer 4 having the X-direction pattern 1 formed on the substrate resin layer 4 having the Y-direction pattern 2 formed thereon, and the substrate resin layer 4 having the Y-direction pattern 2 formed thereon, The substrate resin layer 4 having the X-direction pattern 1 formed thereon is stacked, and the substrate resin layer 4 having no pattern formed thereon is laminated on the uppermost layer.

Then, strip-shaped plating electrodes 35A connected to the plating through-holes 33A and strip-shaped plating electrodes connected to the other plating through-holes 33B are formed on both front and back surfaces of the laminated substrate resin layers. Copper strips 35A are attached to the entire surface of the substrate resin layer 4 with strip-shaped plating electrodes 36A connecting the plating through-holes 34A and strip strip-shaped plating electrodes 36B connecting the other plating through-holes 34B. The foil is provided by etching or the like.

After the through hole pilot holes penetrating the lands of the respective plating through holes and the test through hole pilot holes penetrating the lands of the test through holes 41A, 41B, 42A, 42B are drilled, The conductor layer is formed on the inner peripheral wall of the through hole pilot hole to finish the plating through hole, and the conductor layer is formed on the inner peripheral wall of the test through hole pilot hole to finish the test through hole by the general method ing.

Next, the intersection holes 3 are drilled at the points where the X-direction pattern 1 and the Y-direction pattern 2 intersect three-dimensionally, and the pilot holes penetrating the connector through-hole lands are drilled.

Each through hole for plating
33A, 33B, 34A, and 34B are used as cathodes, electroplated, and exposed to the inner peripheral wall of each intersection hole 3 and through hole for connector. The pattern land consists of copper layer, nickel layer, and gold layer, respectively. Provide a ring-shaped contact.

Thereafter, as shown in FIG. 4, the outer peripheral edge outer region 20B is cut off. And a test through hole
41A, 41B, 42A, 42B are inserted into the pins connected to the tester, respectively, and the continuity test of X-direction pattern 1 arranged on the same substrate resin layer 4 and Y-direction pattern 2 arranged on the same substrate resin layer 4 is conducted. Carry out.

After the continuity test, the inner peripheral edge outer area 20A is cut off to form a matrix board having a predetermined outer shape. The manufacturing method shown in FIG. 3 is applied to the matrix board 10 having a small number of intersection holes.

The matrix board 10 is formed by alternately laminating four substrate resin layers having a plurality of Y-direction patterns 2 and a plurality of substrate resin layers having a plurality of X-direction patterns 1 formed thereon. The connector through hole 7 is provided at one end of the Y direction pattern 2, and the connector through hole 8 is provided at one end of each Y-direction pattern 2.

The plural X-direction patterns 1 arranged on the substrate resin layer 4 are divided into two groups, and the plural Y-direction patterns 2 arranged on the other substrate resin layer 4 are divided into two groups. And
The X-direction patterns 1 in each group are connected in series to the substrate resin layer 4 in which the X-direction patterns 1 are arranged via the short-circuit patterns 43A provided in the inner peripheral edge outer region 20A.

Further, a lead-out pattern is derived from the connector through hole 7 at the beginning of the group connected in series, the plating through hole 33A is provided in the outer peripheral edge outer region 20B, and the end of the group connected in series in the X direction. A lead-out pattern is led out from the other end of the pattern 1, and a plating through hole 33B is provided in the outer peripheral edge outer region 20B.

Further, on the other substrate resin layer 4 in which the Y-direction patterns 2 are arranged, each Y-direction pattern 2 in each group is connected via the short-circuit pattern 44A provided in the inner peripheral edge outer region 20A.
Are connected in series.

Further, the drawing pattern is derived from the connector through hole 8 at the beginning of the group connected in series, the plating through hole 34A is provided in the outer peripheral edge outer region 20B, and the Y direction at the end of the group connected in series is set. A lead-out pattern is led out from the other end of the pattern 2, and a plating through hole 34B is provided in the outer peripheral edge outer region 20B.

A predetermined number of such substrate resin layers 4 are alternately laminated, and intersection holes 3 are formed at the points where the X-direction pattern 1 and the Y-direction pattern 2 intersect three-dimensionally, and at the same time, for through holes for connectors. Drill a pilot hole through the land.

Electroplating was performed using the respective through holes 33A, 33B, 34A, 34B for plating as cathodes, and the pattern lands were left bare on the inner peripheral wall of each intersection hole 3 and the through hole for connector. Copper layers,
A ring-shaped contact made of a nickel layer and a gold layer is provided, and then the outer peripheral edge outer region 20B and the outer peripheral outer edge region 20B are cut off.

In each of the embodiments, the matrix board composed of four inner conductor layers has been described. However, the present invention is not limited to four inner conductor layers, and for example, 2 inner conductor layers and 6 inner conductor layers can be used. Of course, it is applied to a matrix board having a plurality of inner conductor layers such as layers.

[0089]

Since the manufacturing method of the present invention has the above-mentioned structure, it has the following effects. A plating through hole, that is, a cathode is provided at each end of each X-direction pattern and each Y-direction pattern, or at each end where a small number of X-direction patterns and a small number of Y-direction patterns are connected in series. By reducing the difference in current density flowing through the land exposed on the inner wall of the intersection hole during plating, the layer thickness variation of the ring contact formed in the intersection hole of the matrix board is reduced and the ring contact is reduced. The reliability of the connection with the connection pin is high.

Further, the connecting pin inserted into the intersection hole is not broken. When applied to a matrix board equipped with a connector, the ring-shaped contact can be provided on the inner peripheral wall of the through hole for the connector at the same time when the ring-shaped contact is provided on the inner peripheral wall of the intersection hole. is there.

On the other hand, by providing the test through holes in the outer region of the inner peripheral edge, the time required for the continuity test of the X-direction pattern and the Y-direction pattern can be shortened.

[Brief description of drawings]

1A and 1B are diagrams showing the principle of the manufacturing method of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the double-dot chain line AA shown in FIG.

FIG. 2 is a diagram showing an embodiment of the manufacturing method of the present invention.

FIG. 3 is a diagram showing another embodiment of the manufacturing method of the present invention.

FIG. 4 is a diagram showing still another manufacturing method of the present invention.

FIG. 5 is a diagram of a matrix board, (A) is a plan view,
(B) is a sectional view of a two-dot chain line AA section shown in (A).

FIG. 6 is a sectional view showing a main part of a matrix board.

FIG. 7 is a detailed view of an intersection hole.

FIG. 8 is a diagram showing a conventional method.

[Explanation of symbols]

1 X-direction pattern 2 Y-direction pattern 3 Intersection hole 4 Substrate resin layer 5-1,5-2 Ring-shaped contact 5A Copper plating layer 5B Nickel plating layer 6-1,6-2
Connector 7,8 Connector through hole 10 Matrix board 15 Connection pin 20 Edge outer area 20A Inner edge outer area 20B Outer edge outer area 31,32 Drawing pattern 33A, 33B, 34A, 34B Plating through hole 35A, 35B, 36A, 36B Electrode for plating 41A, 41B, 42A, 42B Test through hole 43, 44 Short circuit pattern

Claims (4)

[Claims] 1. A substrate resin layer having a plurality of X-direction patterns (1) and a substrate resin layer having a plurality of Y-direction patterns (2) are alternately laminated in a predetermined number to form the X-direction pattern (1). )
The matrix board (1) formed by forming the intersection holes (3) at the points where the and the Y-direction pattern (2) intersect three-dimensionally.
In the manufacturing method of (0), each substrate resin layer constituting the matrix board (10) is
Outside the intersection hole forming area, a frame-shaped outer peripheral area (20)
A large-sized substrate resin layer (4) having plating through holes (33A, 33B) pattern-connected to respective ends of the X-direction pattern (1) in the outer peripheral region (20). Another substrate resin layer (4) provided and plating through holes (34A, 34B) pattern-connected to the respective ends of the Y-direction pattern (2) are provided in the outer peripheral region 20. The substrate resin layers (4) are alternately laminated, then the intersection holes (3) are punched, and the through holes (33A, 33B, 34A, 34B) for plating are respectively formed.
As the cathode and electroplating, and each of the intersection holes
The ring-shaped contact (5-1) is placed on the land of the X-direction pattern (1) exposed on the inner peripheral wall of (3), and another ring-shaped contact (5-2) is placed on the land of the Y-direction pattern (2). Is provided, and then the outer peripheral region (20) is cut off to obtain a matrix board having a predetermined outer shape, which is a method for manufacturing a matrix board. 2. One end of the X-direction pattern (1) extends, and a through hole (7) for a connector is provided at the end of the extension, and
In the method for producing a matrix board (10), wherein one end of the directional pattern (2) is extended and connector through holes (8) are formed at the ends of the extended portion, the matrix board (10) is formed. Each substrate resin layer that comprises
A large-sized substrate resin layer (4) having a frame-shaped outer peripheral area (20) outside the area where the intersection hole and the through hole for the connector are formed, and a pattern is formed on each through hole (7) for the connector. A plating through hole (33A) connected thereto and a plating through hole (33B) pattern-connected to the other end of each of the X-direction patterns (1) are provided in the outer peripheral region (20). The board resin layer (4) provided, the plating through holes (34A) pattern-connected to the respective through holes (8) for the connector, and the other end of the respective Y direction patterns (2) The plating through-holes (34B) formed by pattern connection with the other substrate resin layers (4) provided in the outer peripheral region (20) are alternately laminated, and then the intersection holes (3 ) And a through-hole pilot hole for the connector, respectively, and then Les through-hole for the plating of (33A, 33B, 3
4A, 34B) as a cathode and electroplating, and each ring-shaped contact is provided on the inner land of the intersection hole (3) and the land of the bare pattern on the inner wall of the through hole lower hole for the connector, Thereafter, the outer peripheral region (20) is cut off to obtain a matrix board having a predetermined outer shape, which is a method for manufacturing a matrix board. 3. A plurality of X-direction patterns (1) arranged on a substrate resin layer (4) are divided into at least two groups, and a plurality of Y-direction patterns arranged on another substrate resin layer (4).
(2) is divided into at least two groups, and each of the X-direction patterns (1) in each group is connected in series via a short-circuit pattern (43A) provided in the outer peripheral region (20). The substrate resin layer in which the resin layer (4) and the Y-direction patterns (2) in each group are connected in series via the short-circuit pattern (44A) provided in the outer peripheral region (20). The plating according to claim 1 or 2, wherein (4) and (4) are alternately laminated, and then the intersection hole (3) and the through hole pilot hole for a connector are respectively formed and provided in the outer peripheral region (20). Electroplating with the through holes (33A, 33B, 34A, 34B) for cathode as the cathode, and to the land of the bare pattern on the inner wall of each of the intersection hole (3) and the inner wall of the through hole pilot hole for the connector. , Each of which is provided with a ring-shaped contact, and then the outer peripheral region (20) is separated to form a matrix board having a predetermined outer shape. A method for manufacturing a matrix board, comprising: 4. A frame-shaped outer peripheral area (20) is provided outside the area where the intersection hole and the through hole for the connector are formed, with each board resin layer constituting the matrix board (10) according to claim 1 or 2. A large-sized substrate resin layer (4) having the outer peripheral edge region (20) and the outer peripheral edge region (20A) and the outer peripheral edge region (2).
0B) and the plating through holes (33A, 33B) according to claim 1 or 2 are arranged in the outer peripheral edge outer area (20B), and the inner peripheral outer area
Provide a pair of test through holes (41A, 41B) in (20A),
Each of the X-direction patterns (1) is connected to the inner peripheral edge outer region (2
0A) is connected in series through the short-circuit pattern (43) formed, and the start end of the X-direction pattern (1) is the test through hole (41A) and the end is the other test through hole (41B).
The plating resin through-holes (34A, 34B) according to claim 1 or 2 are disposed in the substrate resin layer (4) respectively pattern-connected to the outer peripheral edge outer region (20B), and the inner peripheral outer region is formed.
A pair of test through holes (42A, 42B) are provided in (20A), and the respective Y-direction patterns (2) are connected in series via a short circuit pattern (44) formed in the inner peripheral edge outer region (20A). The other resin layer of the substrate in which the start end of the Y-direction pattern (2) is connected to the test through hole (42A) and the end end is connected to the other test through hole (42B).
(4) are alternately laminated, and then the intersection hole (3) and the through hole pilot hole for the connector are punched, and the inner peripheral wall of each intersection hole (3) and the through hole pilot hole for the connector are After each ring-shaped contact was electroplated on the land of the pattern exposed on the inner peripheral wall, the outer peripheral edge outer region (20B) was cut off, and then the test through hole (41A, 41B, 42A, 42B). ) In the X direction pattern (1) arranged on the same substrate resin layer (4) and the Y direction pattern (2) arranged on the same substrate resin layer (4). ) Is conducted, and then the inner peripheral edge outer region (20A) is cut off to obtain a matrix board having a predetermined outer shape.