JPH07283087A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor

Info

Publication number
JPH07283087A
JPH07283087A JP10069594A JP10069594A JPH07283087A JP H07283087 A JPH07283087 A JP H07283087A JP 10069594 A JP10069594 A JP 10069594A JP 10069594 A JP10069594 A JP 10069594A JP H07283087 A JPH07283087 A JP H07283087A
Authority
JP
Japan
Prior art keywords
solid electrolytic
capacitor element
capacitor
electrolytic capacitor
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10069594A
Other languages
Japanese (ja)
Other versions
JP3253216B2 (en
Inventor
Kazuhiro Higuchi
和浩 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marcon Electronics Co Ltd
Original Assignee
Marcon Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marcon Electronics Co Ltd filed Critical Marcon Electronics Co Ltd
Priority to JP10069594A priority Critical patent/JP3253216B2/en
Publication of JPH07283087A publication Critical patent/JPH07283087A/en
Application granted granted Critical
Publication of JP3253216B2 publication Critical patent/JP3253216B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a solid electrolytic capacitor employing a TCNQ complex having low low variation rate in capacitance as an electrolyte in which the hermetic sealing properties are enhanced. CONSTITUTION:A capacitor element 3 comprising an anode foil, a cathode foil, a spacer paper, and an electrolytic layer principally comprising a complex salt containing TCNQ is set in a metal case 4. The opening of the case 4 is then sealed with polyphenylene sulfide resin 6 or the entire surface of the case 4 is coated with polyphenylene sulfide resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、有機半導体からなる
固体電解コンデンサの封口及び外装構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing and exterior structure for a solid electrolytic capacitor made of an organic semiconductor.

【0002】[0002]

【従来の技術】近年、電子情報機器の高度化に伴い、電
子部品の小形化、高性能化が求められるようになってき
ており、電解コンデンサでも、従来の駆動用電解液を含
浸した電解コンデンサよりも小形化の可能なテトラシア
ノキノジメタン(以下TCNQという)錯体を固体電解
質として用いた固体電解コンデンサが実用化されてい
る。
2. Description of the Related Art In recent years, with the sophistication of electronic information devices, there has been a demand for downsizing and high performance of electronic parts. Even in electrolytic capacitors, conventional electrolytic capacitors impregnated with a driving electrolytic solution have been demanded. A solid electrolytic capacitor using a tetracyanoquinodimethane (hereinafter referred to as TCNQ) complex, which can be miniaturized, as a solid electrolyte has been put into practical use.

【0003】従来、TCNQ錯体を固体電解質として用
いた固体電解コンデンサは、はじめにエッチングにより
粗面化されたアルミニウム、タンタル、ニオブなどの一
対の弁作用金属箔に引出リード線を固着し、マニラ紙な
どのスペーサ紙を介し巻回してコンデンサ素子を形成す
る。次に、アルミニウム等の金属ケースにTCNQ錯体
を入れ加熱して溶融液化させ、この中に前記TCNQ錯
体の融点付近の温度に予備加熱した前記コンデンサ素子
を収容してTCNQ錯体を含浸し、即座に冷却固化した
後、前記金属ケースの開口部をエポキシ樹脂で封止して
エージングを行い、製造過程で発生した誘電体酸化皮膜
損傷を修復して完成品としてなるもので、電解コンデン
サの高性能化の需要に応えた製品である。
Conventionally, in a solid electrolytic capacitor using a TCNQ complex as a solid electrolyte, a lead wire is fixed to a pair of valve action metal foils of aluminum, tantalum, niobium, etc., which are first roughened by etching, and a manila paper, etc. The capacitor element is formed by winding it through the spacer paper. Next, the TCNQ complex is put into a metal case such as aluminum and heated to melt and liquefy, and the capacitor element preheated to a temperature near the melting point of the TCNQ complex is housed therein and impregnated with the TCNQ complex, and immediately. After cooling and solidification, the opening of the metal case is sealed with epoxy resin and aged to repair the damage to the dielectric oxide film that occurred during the manufacturing process, resulting in a finished product. It is a product that meets the demand of.

【0004】TCNQ錯体は、その伝導度が約10S/
cmと、従来の電解コンデンサの電解液(0.01S/
cm)に比べ非常に高く、このTCNQ錯体を固体電解
質として用いることにより、インピーダンスの周波数特
性、漏れ電流特性、温度特性などの諸特性に優れた固体
電解コンデンサを得ることができる。
The TCNQ complex has a conductivity of about 10 S /
cm and the electrolytic solution of a conventional electrolytic capacitor (0.01 S /
cm), and by using this TCNQ complex as a solid electrolyte, it is possible to obtain a solid electrolytic capacitor excellent in various characteristics such as impedance frequency characteristics, leakage current characteristics, and temperature characteristics.

【0005】しかしながら、上記構成による固体電解コ
ンデンサの金属ケース開口部は、エポキシ樹脂等の熱硬
化性で高硬度の樹脂を注入して封止されているため、硬
化時の収縮あるいは加熱時の熱膨張率差などによって大
きな剪断応力が作用する結果、封口樹脂と金属ケースの
間に亀裂が生じ、内部のTCNQ錯体が外気に曝され
て、TCNQ錯体と外気中の酸素や水蒸気が反応し、T
CNQ錯体が劣化して急激な静電容量の減少、tanδ
の増加などの要因となり、時間の経過とともにコンデン
サ機能が低下するといった信頼性に劣る欠点を有してい
た。
However, since the metal case opening of the solid electrolytic capacitor having the above-mentioned structure is sealed by injecting a thermosetting resin having a high hardness such as an epoxy resin, the shrinkage at the time of curing or the heat at the time of heating is cured. As a result of the large shear stress acting due to the difference in expansion coefficient, a crack is generated between the sealing resin and the metal case, the TCNQ complex inside is exposed to the outside air, and the TCNQ complex reacts with oxygen and water vapor in the outside air.
The CNQ complex deteriorates and the capacitance decreases rapidly, tan δ
It has a drawback of poor reliability such that the capacitor function deteriorates with the lapse of time due to the increase of the capacitor.

【0006】そのため、TCNQ錯体を含浸したコンデ
ンサ素子をエポキシ、フェノール等の熱硬化性樹脂でト
ランスファー成形により外装することも考えられるが、
トランスファ成形における樹脂温度及び金型温度は20
0〜300℃に達し、加えてトランスファ成形は成形終
了までの所要時間が長いため、コンデンサ素子は高温中
に長時間とどまることになり、したがってコンデンサ素
子が熱劣化したり、あるいはコンデンサ素子に含浸され
た固体電解質が劣化したりする。すなわち、特にTCN
Q錯体は200〜260℃で溶融し、数十秒で絶縁化し
てしまう場合もあるので、固体電解質としてTCNQ錯
体を主成分として用いた場合、トランスファー成形では
電気的特性に悪影響を及ぼし電解コンデンサとして製品
化することは困難であった。
Therefore, it is conceivable to coat the capacitor element impregnated with the TCNQ complex with a thermosetting resin such as epoxy or phenol by transfer molding.
The resin temperature and mold temperature in transfer molding are 20
0 to 300 ° C is reached, and in addition, since transfer molding takes a long time to complete the molding, the capacitor element stays at a high temperature for a long time. Therefore, the capacitor element is thermally deteriorated or impregnated into the capacitor element. The solid electrolyte deteriorates. That is, especially TCN
The Q complex may be melted at 200 to 260 ° C. and may be insulated in a few tens of seconds. Therefore, when the TCNQ complex is used as the main component as the solid electrolyte, the electrical characteristics are adversely affected in transfer molding and the electrolytic capacitor is used. It was difficult to commercialize.

【0007】また重要なことは、エポキシ樹脂はTCN
Q錯体と反応することである。したがって、金属ケース
開口部を封止するために充填されたエポキシ樹脂と接触
したTCNQ錯体は反応して溶解し、エポキシ樹脂に溶
け込んでいくため、コンデンサのESR、tanδを劣
化させるという問題点を有しており、エポキシ樹脂は、
TCNQ錯体を使用したコンデンサのケース開口部の充
填樹脂としては適さない樹脂である。
It is also important that the epoxy resin is TCN
To react with the Q complex. Therefore, the TCNQ complex that comes into contact with the epoxy resin filled to seal the opening of the metal case reacts and dissolves and dissolves into the epoxy resin, which causes a problem of degrading the ESR and tan δ of the capacitor. The epoxy resin is
It is a resin that is not suitable as a filling resin for the case opening of a capacitor using a TCNQ complex.

【0008】[0008]

【発明が解決しようとする課題】以上のように、前記従
来技術では封口樹脂と金属ケース間に亀裂が生じてコン
デンサ特性を劣化させ、信頼性に欠ける問題があり、ま
た封口樹脂に熱硬化性樹脂を用いているため、樹脂の硬
化に数時間を要し、各工程間の時間的バランスが崩れや
すく、スムーズな流れを阻害するという問題を有してい
た。
As described above, in the above-mentioned prior art, there is a problem that the cracking occurs between the sealing resin and the metal case to deteriorate the capacitor characteristics and the reliability is poor, and the sealing resin has a thermosetting property. Since the resin is used, it takes several hours to cure the resin, the time balance between the respective steps is easily lost, and there is a problem that a smooth flow is obstructed.

【0009】また、ケース開口部を封口する樹脂として
のエポキシ樹脂は、接触したTCNQ錯体が反応してエ
ポキシ樹脂に溶け込んでコンデンサのESRやtanδ
を劣化させる欠点を有していた。
Further, in the epoxy resin as a resin for sealing the opening of the case, the TCNQ complex in contact reacts with the epoxy resin and melts into the epoxy resin to produce ESR or tanδ of the capacitor.
Had the drawback of deteriorating.

【0010】本発明は、上記の問題点を解決するもので
あり、封口樹脂と封口方法を改良することによって、コ
ンデンサ特性の劣化となる要因を解消し、また工程のス
ムーズな流れを構成し、TCNQ錯体を電解質として用
いた安価で高信頼性の固体電解コンデンサを提供するこ
とを目的とするものである。
The present invention solves the above-mentioned problems, and by improving the sealing resin and the sealing method, the factors that cause deterioration of the capacitor characteristics are eliminated, and a smooth process flow is constituted. An object is to provide an inexpensive and highly reliable solid electrolytic capacitor using a TCNQ complex as an electrolyte.

【0011】[0011]

【課題を解決するための手段】本発明による固体電解コ
ンデンサは、陽極箔、陰極箔及びスペーサ紙からなりT
CNQを含む錯塩を主成分とする電解質層を形成したコ
ンデンサ素子と、該コンデンサ素子を収函した金属ケー
スと、少なくとも該金属ケースの開口部を封口したポリ
フェニレンサルファイド樹脂とを具備した構成からなる
ものである。
A solid electrolytic capacitor according to the present invention comprises an anode foil, a cathode foil and spacer paper.
A structure comprising a capacitor element formed with an electrolyte layer containing a complex salt containing CNQ as a main component, a metal case housing the capacitor element, and a polyphenylene sulfide resin in which at least the opening of the metal case is sealed. Is.

【0012】[0012]

【作用】以上のような構成になる固体電解コンデンサに
よれば、ポリフェニレンサルファイド樹脂による射出成
型により、コンデンサ素子及び少なくともコンデンサ素
子を収函する金属ケースの開口部を外装するため、例え
金属ケースとポリフェニレンサルファイド樹脂が剥離し
てもコンデンサ素子と外気が接する可能性がなくなり、
従って信頼性を飛躍的に高めたコンデンサ素子を得るこ
とができる。
According to the solid electrolytic capacitor having the above-described structure, the capacitor element and at least the opening of the metal case for housing the capacitor element are externally molded by injection molding with polyphenylene sulfide resin. Even if the sulfide resin peels off, there is no possibility that the capacitor element will come into contact with the outside air,
Therefore, it is possible to obtain a capacitor element with dramatically improved reliability.

【0013】また、熱可塑性樹脂であるポリフェニレン
サルファイド樹脂を用いた射出成型による外装を行うこ
とで、外装に要する時間が素子1個あたり1秒程度に短
縮でき、ラインの合理化とコスト削減を図ることができ
るものである。
Further, by performing the outer packaging by injection molding using a polyphenylene sulfide resin which is a thermoplastic resin, the time required for the outer packaging can be shortened to about 1 second per element, and the rationalization of the line and the cost reduction can be achieved. Is something that can be done.

【0014】[0014]

【実施例】以下、本発明の実施例について説明する。す
なわち図1に示すように、公知の手段により粗面化さ
れ、誘電体酸化皮膜を形成されたアルミニウムからなる
陽極箔と、同様に粗面化された陰極箔に、超音波溶接法
などにより引出しリード線1,2を固着した。この陽極
箔及び陰極箔の間にスペーサ紙を介在させて前記引出し
リード線1,2が同一方向に位置するように巻回しコン
デンサ素子3を形成した。このコンデンサ素子を3%の
アジピン酸アンモニウム水溶液中に浸漬して電圧を印加
して再化成し、巻回過程で生じた誘電体酸化皮膜の損傷
部の補修を行った。次に、TCNQ錯体をアルミニウム
ケース4に入れて約300℃の平面ヒータ上に載せて溶
融液化させ、ここに予め約300℃に予熱した前記コン
デンサ素子3を入れて、このコンデンサ素子3にTCN
Q錯体5を含浸し、即座にコンデンサ素子3をアルミニ
ウムケース4ごと冷却水に入れて冷却しTCNQ錯体5
を固化させた。次いで、このコンデンサ素子3を前記ケ
ース4ごと130℃の金型にセットし、ポリフェニレン
サルファイド樹脂をシリンダ温度290℃で射出して外
装樹脂層6を形成し、しかる後125℃雰囲気中で前記
引出しリード線1,2間に定格電圧を90min印加し
てエージング処理を行い、更に陰極、定格等のマーキン
グを行い完成品とした。
EXAMPLES Examples of the present invention will be described below. That is, as shown in FIG. 1, an anode foil made of aluminum roughened by a known means and having a dielectric oxide film formed thereon and a cathode foil similarly roughened are drawn by ultrasonic welding or the like. The lead wires 1 and 2 were fixed. A capacitor paper was formed by interposing a spacer paper between the anode foil and the cathode foil so that the lead wires 1 and 2 were positioned in the same direction. This capacitor element was immersed in a 3% aqueous solution of ammonium adipate and re-formed by applying a voltage to repair the damaged portion of the dielectric oxide film generated during the winding process. Next, the TCNQ complex is put in an aluminum case 4 and placed on a flat heater of about 300 ° C. to melt and liquefy, and the capacitor element 3 preheated to about 300 ° C. is put therein, and the TCNQ complex is put into the TCNQ complex.
Immerse the Q complex 5 and immediately put the capacitor element 3 together with the aluminum case 4 in cooling water to cool the TCNQ complex 5
Was solidified. Next, the capacitor element 3 together with the case 4 is set in a mold of 130 ° C., a polyphenylene sulfide resin is injected at a cylinder temperature of 290 ° C. to form an exterior resin layer 6, and then the lead-out lead is put in an atmosphere of 125 ° C. A rated voltage was applied between the wires 1 and 2 for 90 min to perform aging treatment, and then the cathode, rating, etc. were marked to complete the product.

【0015】次に、このようにして得た本発明になる固
体電解コンデンサと従来技術によって得られた固体電解
コンデンサの特性について調査した結果を述べる。すな
わち、以下に示す実施例と従来例の静電容量、tan
δ、漏れ電流、100kHzにおけるESRの初期値を
表1に、また、それぞれを105℃雰囲気中で定格電圧
を印加して寿命試験したときのそれぞれの経過時間に対
する静電容量変化率を表2に示す。
Next, the results of an investigation of the characteristics of the solid electrolytic capacitor according to the present invention thus obtained and the solid electrolytic capacitor obtained by the prior art will be described. That is, the capacitance and tan of the following examples and conventional examples
Table 1 shows the initial values of δ, leakage current, and ESR at 100 kHz, and Table 2 shows the rate of change in capacitance with respect to each elapsed time when each of them was subjected to a life test by applying a rated voltage in an atmosphere of 105 ° C. Show.

【0016】なお試料の定格は20V−3.3μF、個
数はそれぞれ100個で、数値は平均値である。
The samples are rated at 20 V-3.3 μF, the number of each is 100, and the numerical values are average values.

【0017】なお、従来例は、実施例と同様な手段でコ
ンデンサ素子を構成し、TCNQ錯体を含浸した後、ア
ルミニウムケースの開口部にエポキシ樹脂を充填し、5
0℃で2時間予備硬化させた後、105℃で2時間硬化
させ、自然冷却させたものである。その後のエージング
処理は実施例と同様にして行いコンデンサとしたもので
ある。
In the conventional example, a capacitor element was constructed by the same means as in the example, impregnated with the TCNQ complex, and then the opening of the aluminum case was filled with epoxy resin.
It was pre-cured at 0 ° C. for 2 hours, then at 105 ° C. for 2 hours, and naturally cooled. Subsequent aging treatment was performed in the same manner as in the example to obtain a capacitor.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】上記表1から明らかなように、初期特性で
は実施例と従来例に差は見られないが、表2に示した静
電容量変化率を見ると、従来例の静電容量変化率が実施
例に比べて格段に大きな値を示している。これはアルミ
ケースとエポキシ樹脂との密着不完全が原因であり、試
験後の素子を観察した結果、アルミケースとエポキシ樹
脂が剥離して亀裂が生じているのが見られた。これに対
して実施例は、表2から明らかなように静電容量変化率
が小さく、密閉性が大幅に改善されていることを示して
いる。
As is clear from Table 1 above, there is no difference in the initial characteristics between the embodiment and the conventional example, but looking at the capacitance change rate shown in Table 2, the capacitance change rate of the conventional example is shown. Shows a much larger value than in the examples. This is due to incomplete adhesion between the aluminum case and the epoxy resin. As a result of observing the element after the test, it was found that the aluminum case and the epoxy resin were peeled off and cracked. On the other hand, the example shows that the rate of change in capacitance is small and the hermeticity is significantly improved, as is clear from Table 2.

【0021】本発明は、外装樹脂(封口も含み)として
ポリフェニレンサルファイド樹脂に限定したものである
が、これに代えて射出成形が可能で、耐熱温度が高く、
TCNQ錯体との反応がない樹脂として芳香族ポリエチ
レン等も存在するが、芳香族ポリエチレンは耐湿性が劣
るため、静電容量変化率が大きくなるという結果を得て
いる。
The present invention is limited to the polyphenylene sulfide resin as the exterior resin (including the sealing), but instead of this, injection molding is possible and the heat resistant temperature is high,
Aromatic polyethylene and the like exist as a resin that does not react with the TCNQ complex, but aromatic polyethylene has poor moisture resistance, and thus the rate of change in capacitance is large.

【0022】なお、上記実施例では巻回形のコンデンサ
素子について述べたが、陽極箔と陰極箔とをスペーサを
介して積層した積層形の場合でも同様の効果を得ること
ができる。また、実施例ではケースの全面をポリフェニ
レンサルファイド樹脂で被覆し外装した場合について述
べたが、少なくともケース開口部又は開口部近傍をポリ
フェニレンサルファイド樹脂で封口し、密閉性を高めた
構成も本特許の範囲に含まれる。
Although the spiral type capacitor element has been described in the above embodiment, the same effect can be obtained in the case of the laminated type in which the anode foil and the cathode foil are laminated via the spacer. Further, in the examples, the case where the entire surface of the case is covered with the polyphenylene sulfide resin and is described as the outer case is described, but at least the case opening or the vicinity of the opening is sealed with the polyphenylene sulfide resin, and the configuration in which the hermeticity is improved is also within the scope of the present patent include.

【0023】そして、外部への引出リード線を同一方向
から導出したものを例示して説明したが、これに限定さ
れることなく外部への引出リード線をそれぞれ反対方向
から導出するようにしてもよいことは勿論である。
Although the lead wires to the outside are drawn out from the same direction by way of example, the present invention is not limited to this, and the lead wires to the outside may be drawn from opposite directions. Of course good things.

【0024】[0024]

【発明の効果】以上述べたように本発明によれば、密閉
性に優れ、静電容量変化率が小さく信頼性に富み実用的
価値の高い固体電解コンデンサを提供することができ
る。
As described above, according to the present invention, it is possible to provide a solid electrolytic capacitor which is excellent in hermeticity, has a small capacitance change rate, is highly reliable, and has a high practical value.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明になる固体電解コンデンサの実施例を示
す正断面図。
FIG. 1 is a front sectional view showing an embodiment of a solid electrolytic capacitor according to the present invention.

【符号の説明】[Explanation of symbols]

1 引出しリード線 2 引出しリード線 3 コンデンサ素子 4 アルミニウムケース 5 TCNQ錯体 6 ポリフェニレンサルファイド樹脂 1 Lead Out Lead Wire 2 Lead Out Lead Wire 3 Capacitor Element 4 Aluminum Case 5 TCNQ Complex 6 Polyphenylene Sulfide Resin

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01G 9/08 C ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01G 9/08 C

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 陽極箔、陰極箔及びスペーサ紙からなり
テトラシアノキノジメタンを含む錯塩を主成分とする電
解質層を形成したコンデンサ素子と、該コンデンサ素子
を収函した金属ケースと、少なくとも該金属ケースの開
口部を封口したポリフェニレンサルファイド樹脂とを具
備した固体電解コンデンサ。
1. A capacitor element formed of an anode foil, a cathode foil and a spacer paper, on which an electrolyte layer containing a complex salt containing tetracyanoquinodimethane as a main component is formed, a metal case containing the capacitor element, and at least the capacitor element. A solid electrolytic capacitor comprising a polyphenylene sulfide resin in which an opening of a metal case is sealed.
【請求項2】 ポリフェニレンサルファイド樹脂が金属
ケースの全面を外装したことを特徴とする請求項1に記
載の固体電解コンデンサ。
2. The solid electrolytic capacitor according to claim 1, wherein the polyphenylene sulfide resin covers the entire surface of the metal case.
【請求項3】 コンデンサ素子が巻回形又は積層形であ
ることを特徴とする請求項1又は請求項2に記載の固体
電解コンデンサ。
3. The solid electrolytic capacitor according to claim 1 or 2, wherein the capacitor element is a wound type or a laminated type.
JP10069594A 1994-04-13 1994-04-13 Solid electrolytic capacitors Expired - Fee Related JP3253216B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10069594A JP3253216B2 (en) 1994-04-13 1994-04-13 Solid electrolytic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10069594A JP3253216B2 (en) 1994-04-13 1994-04-13 Solid electrolytic capacitors

Publications (2)

Publication Number Publication Date
JPH07283087A true JPH07283087A (en) 1995-10-27
JP3253216B2 JP3253216B2 (en) 2002-02-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3253216B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4391984B2 (en) 2005-12-19 2009-12-24 富士通株式会社 Cable transport mechanism and library device

Also Published As

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