JPH07263051A - Connecting structure for printing board - Google Patents

Connecting structure for printing board

Info

Publication number
JPH07263051A
JPH07263051A JP5044694A JP5044694A JPH07263051A JP H07263051 A JPH07263051 A JP H07263051A JP 5044694 A JP5044694 A JP 5044694A JP 5044694 A JP5044694 A JP 5044694A JP H07263051 A JPH07263051 A JP H07263051A
Authority
JP
Japan
Prior art keywords
terminal
printing
pins
board
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5044694A
Other languages
Japanese (ja)
Inventor
Tadayoshi Sato
忠義 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP5044694A priority Critical patent/JPH07263051A/en
Publication of JPH07263051A publication Critical patent/JPH07263051A/en
Pending legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electronic Switches (AREA)
  • Details Of Resistors (AREA)

Abstract

PURPOSE:To increase electric current capacity without increasing the number of external connecting terminals of a printing board by branching off at least one among plural terminal pins of a connecting terminal part to be connected to an external control circuit from a midway part. CONSTITUTION:In a printing board 1 of a thermal head, golden circuit patterns 3 to electrically connect a heating resistor R, connecting terminals 4 and a driving element 7 to drive the resistor R to each other, are formed on a surface of an insulating board 2 such as ceramics. A connector composed of plural terminal pins 6 to be sandwiched by and electrically connected to the terminals 4 and housings 5 to integrally hold the pins 6, is installed. When at least one among the pins 6 is branched off from a midway part, plural wiring cables can be connected to these pins. Thereby, electric current capacity to be supplied to a circuit pattern of the board 1 can be increased without changing a diameter of cables.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ファクシミリ等の印字
装置に使用されるサーマルヘッドやLEDヘッド等の印
字用基板に関し、詳しくは、印字用基板の接続端子部の
接続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing substrate such as a thermal head or an LED head used in a printing device such as a facsimile, and more particularly to a connection structure of a connecting terminal portion of the printing substrate.

【0002】[0002]

【従来の技術】従来の印字用基板、例えばサーマルヘッ
ドの印字用基板の接続構造は、実開平2−95642
号、実開平2−95643号の公報に示されるように、
セラミック基板に設けられた発熱抵抗体の各ドットと、
発熱抵抗体を駆動する駆動素子とを回路パターンで接続
し、また印字用基板が用いられる電子機器の外部制御回
路を接続する複数の接続端子が印字用基板の一側縁端部
に設けられた接続端子部と、駆動素子とを回路パターン
で接続し、該接続端子部に複数のクリップ端子からなる
コネクタを直接半田付け等で接続していた。
2. Description of the Related Art A conventional printing substrate, for example, a connection structure for a printing substrate of a thermal head is disclosed in Japanese Utility Model Publication No. 2-95642.
As disclosed in Japanese Utility Model Publication No. 2-95643,
Each dot of the heating resistor provided on the ceramic substrate,
A plurality of connection terminals for connecting a driving element for driving the heating resistor with a circuit pattern and for connecting an external control circuit of an electronic device in which the printing substrate is used are provided at one side edge portion of the printing substrate. The connection terminal portion and the driving element are connected by a circuit pattern, and a connector including a plurality of clip terminals is directly connected to the connection terminal portion by soldering or the like.

【0003】そして、各クリップ端子に配線ケーブルが
接続され、印字用基板が取り付けられてある電子機器か
ら、電源や印字データなどの信号が供給され使用されて
いた。
Then, a wiring cable is connected to each clip terminal, and a signal such as a power source or print data is supplied from an electronic device to which a printed circuit board is attached for use.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、従来の
印字用基板の接続構造では、印字用基板に形成される接
続端子の各々に接続される端子ピンは1対1で対応して
いたので、印字用基板の大型のものや、高速印字に使用
される場合、印字用基板に要求される電流容量が大きい
と、印字用基板の表面に形成される回路パターンが電流
容量に対応が可能であっても、端子ピンやそれに接続さ
れる電子機器からの配線ケーブルの電流容量をオーバー
してしまい、印字用基板の電流容量は接続端子やそれに
接続される配線ケーブルの電流容量により限定されてい
た。
However, in the conventional connecting structure of the printing substrate, the terminal pins connected to each of the connecting terminals formed on the printing substrate correspond to each other in a one-to-one correspondence. If the printed circuit board has a large current capacity and is used for high-speed printing, the circuit pattern formed on the surface of the printed circuit board can handle the current capacity. However, the current capacity of the terminal pin and the wiring cable from the electronic device connected thereto is exceeded, and the current capacity of the printing substrate is limited by the current capacity of the connection terminal and the wiring cable connected thereto.

【0005】そのために、配線ケーブルの電流容量を増
加させるために、配線ケーブルの一部の線径を他の線よ
り大きくしなければならないという問題点があった。さ
らに、配線ケーブルを変更することなく印字用基板を大
きな電流容量に対応させようとすると、印字用基板に形
成される接続端子の増加が必要となり、印字用基板に形
成される回路パターンの密度が高くなるだけでなく、絶
縁基板の外形寸法が大きくなり、印字用基板の接続性の
低下を招くという問題点があった。
Therefore, in order to increase the current capacity of the wiring cable, there is a problem in that the diameter of a part of the wiring cable must be made larger than that of the other wires. Furthermore, if the printed circuit board is made to cope with a large current capacity without changing the wiring cable, it is necessary to increase the number of connection terminals formed on the printed circuit board, which reduces the density of the circuit pattern formed on the printed circuit board. There is a problem that not only the height becomes higher, but also the outer dimension of the insulating substrate becomes larger, which leads to deterioration of the connectivity of the printing substrate.

【0006】本願発明は、印字用基板の外部接続端子の
数を増加させることなく、印字用基板の電流容量を増大
させることが可能な印字用基板の接続構造を提供するこ
とを目的とする。
An object of the present invention is to provide a connecting structure for a printing substrate which can increase the current capacity of the printing substrate without increasing the number of external connection terminals of the printing substrate.

【0007】[0007]

【課題を解決するための手段】従来の課題を解決するた
めに、本願の請求項1に記載した発明は、印字用基板の
接続構造であって、絶縁基板上に印字媒体と、前記印字
媒体を駆動させる複数の駆動素子と、外部制御回路に接
続される接続端子部とを備え、これらを回路パターンを
介して接続した印字用基板の接続構造において、前記接
続端子部に設けられる複数の端子ピンのうち、少なくと
も1つの端子ピンが途中部から分岐していることを特徴
としている。
In order to solve the conventional problems, the invention described in claim 1 of the present application is a connection structure of a printing substrate, wherein a printing medium on an insulating substrate, and the printing medium. In a connection structure of a printing substrate having a plurality of drive elements for driving a plurality of drive elements and a connection terminal portion connected to an external control circuit and connecting these via a circuit pattern, a plurality of terminals provided in the connection terminal portion At least one terminal pin among the pins is branched from the middle part.

【0008】一方、本願の請求項2に記載した発明は、
前記途中部から分岐している端子ピンが、前記接続端子
部の少なくとも端部にあることを特徴としている。尚、
ここで示す印字媒体とは、発熱のエネルギーにより印字
する抵抗体や、光のエネルギーにより印字する発光素子
等を示している。
On the other hand, the invention described in claim 2 of the present application is
It is characterized in that the terminal pin branched from the intermediate portion is at least at an end portion of the connection terminal portion. still,
The print medium shown here indicates a resistor for printing by heat energy, a light emitting element for printing by light energy, and the like.

【0009】[0009]

【作用】前記のように印字用基板の接続端子部に取り付
けられる端子ピンのうち、少なくとも1つを途中部から
分岐させたことにより、該端子ピンに複数の配線ケーブ
ルを接続することができ、配線ケーブルの径を変えるこ
となく印字用基板の回路パターンに供給できる電流容量
を増大させることが可能になる。
As described above, by branching at least one of the terminal pins attached to the connection terminal portion of the printing substrate from the middle portion, it is possible to connect a plurality of wiring cables to the terminal pins. It is possible to increase the current capacity that can be supplied to the circuit pattern of the printed board without changing the diameter of the wiring cable.

【0010】さらに、印字用基板側の接続端子の数を増
加させることなく、電流容量を増大させることができ
る。
Further, the current capacity can be increased without increasing the number of connection terminals on the printing substrate side.

【0011】[0011]

【発明の効果】従って、本発明によると、印字用基板の
回路パターンに供給できる電流容量を増大させるため
に、印字基板上に接続端子の数を増加させることがない
ので、印字用基板の外形寸法を変更することがなく、印
字用基板の小型・軽量を図ることができると共に、印字
用基板に用いられる絶縁基板の外形寸法を変更する必要
がなくなり、絶縁基板を統一することができ、価格の低
減を達成することができる効果を有する。
Therefore, according to the present invention, the number of connecting terminals on the printed board is not increased in order to increase the current capacity that can be supplied to the circuit pattern of the printed board. The size and weight of the printing board can be reduced without changing the dimensions, and it is not necessary to change the external dimensions of the insulating board used for the printing board, and the insulating board can be unified. Has the effect that can be achieved.

【0012】また、印字基板上に接続端子の数を増加さ
せることがないので、絶縁基板に回路パターン等を形成
する際に、印刷にて形成するためのマスクを変更する必
要がなくなり、回路パターンの設計が簡略になるという
効果を有する。さらに、絶縁基板にコネクタ等を取り付
けて、印字用基板とした際に、外形寸法が変化すること
なく、電流容量を増加させることが可能となり、印字用
基板の電子機器への接続性が向上するという効果を有す
る。
Further, since the number of connecting terminals is not increased on the printed board, it is not necessary to change the mask for printing when forming a circuit pattern or the like on the insulating substrate, and the circuit pattern is not necessary. This has the effect of simplifying the design. Furthermore, when a connector or the like is attached to the insulating substrate to form a printing substrate, it is possible to increase the current capacity without changing the outer dimensions and improve the connectivity of the printing substrate to electronic devices. Has the effect.

【0013】そのうえ、分岐部を有する端子ピンを絶縁
基板の接続端子のうち、端部の端子に用いた場合、接続
されるピンのピッチを変更することなく、接続可能な端
子数を増加させることが可能になるという効果を有す
る。
Moreover, when the terminal pin having the branch portion is used as the terminal terminal of the connection terminals of the insulating substrate, the number of connectable terminals can be increased without changing the pitch of the connected pins. Has the effect that it becomes possible.

【0014】[0014]

【実施例】以下、本発明の実施例を図面を用いて説明す
る。図1は本発明の一実施例のサーマルヘッドの平面図
を示しており、印字用基板1は、セラミック等の絶縁基
板2の表面に、発熱抵抗体Rと接続端子4と絶縁基板2
の表面に実装された発熱抵抗体Rを駆動させる駆動素子
7とを、電気的に接続する金からなる回路パターン3を
形成してなり、接続端子4に挟持されかつ電気的に接続
される複数の端子ピン6と、端子ピン6を一体に保持し
ているハウジング5からなるコネクタを取り付けてなっ
ている。この実施例では、絶縁基板2の一側縁両端部に
接続端子4からなる接続端子部が形成されたものを示し
たが、印字用基板1が使用される電子機器によって印字
用基板1の回路パターン3は変更されるので、印字用基
板1の大きさや電気特性によっては、絶縁基板2の一側
縁に1ヶ所の接続端子部を設けただけでも良い。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention. A printing substrate 1 includes a heating resistor R, a connection terminal 4, and an insulating substrate 2 on a surface of an insulating substrate 2 made of ceramic or the like.
A plurality of drive patterns that are electrically connected to a driving element 7 that drives the heating resistor R mounted on the surface of the substrate, and that are sandwiched by connection terminals 4 and electrically connected. The connector including the terminal pin 6 and the housing 5 that integrally holds the terminal pin 6 is attached. In this embodiment, the insulating substrate 2 has the connection terminal portions formed of the connection terminals 4 formed at both ends of one side edge, but the circuit of the printing substrate 1 may be changed depending on the electronic device in which the printing substrate 1 is used. Since the pattern 3 is changed, only one connecting terminal portion may be provided on one side edge of the insulating substrate 2 depending on the size and electric characteristics of the printing substrate 1.

【0015】図2(A)、図2(B)はそれぞれ、図1
の実施例でコネクタに使用される端子ピン6a、6bを
示す図面で、セラミック基板2を挟持するための挟持部
Bと、外部の接続端子と接続される接続部A1と分岐部
A2からなっている。この実施例では接続部A1と分岐
部A2の2つに分岐されているが、印字用基板に要求さ
れる電流容量と接続端子との関係で、分岐させる数は特
に2に限定されるものではない。
2 (A) and 2 (B) are respectively shown in FIG.
In the drawings showing the terminal pins 6a and 6b used for the connector in the above embodiment, a holding portion B for holding the ceramic substrate 2, a connecting portion A1 connected to an external connecting terminal, and a branch portion A2. There is. In this embodiment, the connection part A1 and the branch part A2 are branched into two, but the number of branches is not particularly limited to two because of the relationship between the current capacity required for the printing substrate and the connection terminal. Absent.

【0016】又、接続部A1から分岐部A2を分岐させ
る位置は、挟持部B近傍でも、接続部A1端部近傍でも
良く、コネクタにハウジング5を用いる場合と、そうで
ない場合とに合わせて分岐させれば良い。さらに、挟持
部Bは本実施例のように、絶縁基板に接続された後、挟
持部Bの弾性力だけで保持すると、印字用基板の製造プ
ロセスにおいて、絶縁基板に端子ピンの接続が簡略化さ
れるという効果があるが、端子ピンの接続強度をより高
めるために、挟持部Bで挟持した後半田接続してもよ
く、さらに、半田のみで接続しても良い。
The branching portion A2 may be branched from the connecting portion A1 near the sandwiching portion B or near the end portion of the connecting portion A1. The branching may be made depending on whether the housing 5 is used for the connector or not. You can do it. Further, when the holding portion B is connected to the insulating substrate as in this embodiment and then held by only the elastic force of the holding portion B, connection of the terminal pins to the insulating substrate is simplified in the manufacturing process of the printing substrate. However, in order to enhance the connection strength of the terminal pins, soldering may be performed after the terminals are clamped by the clamping section B, or only soldering may be performed.

【0017】その上接続後、接続部分に樹脂等を塗布し
て絶縁の為の保護層を形成しても良い。図3は他の実施
例のコネクタを示す平面図で、端子ピン6を一体に保持
しているハウジング5からなり、この実施例に示すコネ
クタには、図2(A)に示した端子ピン6aを右端に用
いたものであるが、このコネクタにおいて、接続部が分
岐した端子ピン6が使用される場所は、特に右端に限定
されるものではなく、印字用基板の接続端子の配置に合
わせてコネクタの左端に、図2(B)に示した端子ピン
6bを用いたものや、図1のサーマルヘッドのように、
コネクタの左右両端に端子ピン6a、6bを用いたもの
でも良い。
After the connection, a resin or the like may be applied to the connecting portion to form a protective layer for insulation. FIG. 3 is a plan view showing a connector of another embodiment, which comprises a housing 5 holding terminal pins 6 integrally, and the connector shown in this embodiment has the terminal pins 6a shown in FIG. Is used at the right end, but in this connector, the location where the terminal pin 6 having the branched connection is used is not particularly limited to the right end, and may be set according to the arrangement of the connection terminals of the printing substrate. Like the one using the terminal pin 6b shown in FIG. 2B at the left end of the connector or the thermal head shown in FIG.
It is also possible to use the terminal pins 6a and 6b on both the left and right ends of the connector.

【0018】端子ピン6の絶縁基板側の寸法Xは従来の
印字用基板と変更することなく、印字用基板に供給でき
る電流容量は増加しており、それにともなってコネクタ
は、外部制御回路と接続される側の寸法Yが従来より1
ピン分増加しただけであり、特に、端子ピン6aを右端
に用いたコネクタと、端子ピン6bを左端に用いたコネ
クタを印字用基板に用いた場合、コネクタの外部制御回
路との接続側のピン数が増加することで、コネクタの外
形寸法も端子ピン6a、6bを用いた側に増大するが、
印字用基板の両端からコネクタがはみ出すことがなく、
印字用基板は従来のものと外形寸法が変化することがな
いので、印字用基板が用いられる電子機器の外形寸法を
変更することなく搭載することが可能となる。
The size X of the terminal pin 6 on the side of the insulating substrate is the same as that of the conventional printing substrate, and the current capacity that can be supplied to the printing substrate is increasing. Accordingly, the connector is connected to the external control circuit. Dimension Y on the side to be closed is 1
In particular, when the connector using the terminal pin 6a at the right end and the connector using the terminal pin 6b at the left end are used for the printed board, the pins on the side of connection with the external control circuit of the connector are increased. As the number increases, the external dimensions of the connector also increase to the side where the terminal pins 6a and 6b are used.
The connector does not stick out from both ends of the printing board,
Since the external dimensions of the printing substrate do not change from those of the conventional one, it is possible to mount the electronic device in which the printing substrate is used without changing the external dimensions.

【0019】また殊に、印字用基板の回路パターンのう
ち、一般に高電流容量の必要なグランド端子またはコモ
ン端子に分岐部を有する端子ピンを用いた場合、印字用
基板の外形寸法を変更することなく、供給可能な電流容
量が増加し、高速度、高品質印字に対応可能な印字用基
板を電子機器に搭載することが可能となる。図4は図3
のコネクタを矢印Cの方向から、つまり、絶縁基板に挿
入される側からみた図面で、端子ピン6のうち、右端に
図2(A)に示した端子ピン6aを用いている。
Further, in particular, in the case where a terminal pin having a branch portion is used as a ground terminal or a common terminal which generally requires a high current capacity in the circuit pattern of the printing board, the outer dimensions of the printing board should be changed. Therefore, the current capacity that can be supplied is increased, and it becomes possible to mount a printing substrate that can handle high-speed, high-quality printing in electronic devices. FIG. 4 is FIG.
2A, the terminal pin 6a shown in FIG. 2A is used at the right end of the terminal pin 6 in the drawing seen from the direction of the arrow C, that is, from the side inserted into the insulating substrate.

【0020】図5はサーマルヘッドの片側の接続端子と
外部制御回路との接続を示す一実施例の斜視図で、印字
用基板1の絶縁基板2に、端子ピン6を一体に保持した
ハウジング5を取り付け、電子機器(図示せず)の外部
制御回路からの複数の配線ケーブル9を一体に保持した
外部接続端子8を、コネクタに挿入して接続される。こ
の実施例では、コネクタにはハウジング5があるものを
用いたが、印字用基板と電子機器の外部制御回路との接
続は、ハウジング5なしで端子ピン6に直接挿入するよ
うな接続構造を採ってもよく、また、ハウジング5なし
の端子ピン6と配線ケーブル9とを直接半田等で接続す
る構造を採っても良い。
FIG. 5 is a perspective view of an embodiment showing the connection between the connection terminal on one side of the thermal head and the external control circuit. The housing 5 in which the terminal pins 6 are integrally held on the insulating substrate 2 of the printing substrate 1 is shown. , And external connection terminals 8 integrally holding a plurality of wiring cables 9 from an external control circuit of an electronic device (not shown) are inserted into the connector for connection. In this embodiment, the connector having the housing 5 is used, but the connection between the printing substrate and the external control circuit of the electronic device is such that the connector is directly inserted into the terminal pin 6 without the housing 5. Alternatively, the terminal pin 6 without the housing 5 and the wiring cable 9 may be directly connected by soldering or the like.

【0021】本願発明の接続構造は、実施例に記載のサ
ーマルヘッドに特に限定されるものではなく、LEDヘ
ッド等の他の印字用基板に採用しても、同様の作用効果
が得られる。
The connection structure of the present invention is not particularly limited to the thermal head described in the embodiment, and the same operational effect can be obtained even if it is adopted in another printing substrate such as an LED head.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の印字用基板を示す平面図FIG. 1 is a plan view showing a printing substrate according to an embodiment of the present invention.

【図2】(A)本発明の印字用基板に使用される端子ピ
ンを示す斜視図 (B)本発明の印字用基板に使用される端子ピンを示す
斜視図
FIG. 2A is a perspective view showing terminal pins used in the printing substrate of the present invention. FIG. 2B is a perspective view showing terminal pins used in the printing substrate of the present invention.

【図3】印字用基板に使用される他の実施例のコネクタ
を示す平面図
FIG. 3 is a plan view showing a connector of another embodiment used for a printed board.

【図4】図3の他の実施例のコネクタを矢印Cからみた
正面図
FIG. 4 is a front view of the connector of another embodiment of FIG. 3 as seen from an arrow C.

【図5】本発明の一実施例の印字用基板と外部接続端子
の接続を説明する斜視図
FIG. 5 is a perspective view illustrating the connection between the printing substrate and the external connection terminal according to the embodiment of the invention.

【符号の説明】[Explanation of symbols]

1・・・・印字用基板 2・・・・絶縁基板 3・・・・回路パターン 4・・・・接続端子 5・・・・ハウジング 6・・・・端子ピン 7・・・・駆動素子 8・・・・外部接続端子 9・・・・配線ケーブル 1 ...- Printing substrate 2 ... Insulating substrate 3 ... Circuit pattern 4 ... Connection terminal 5 ... Housing 6 ... Terminal pin 7 ... Driving element 8 .... External connection terminals 9 ...- Wiring cables

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板上に印字媒体と、前記印字媒体
を駆動させる複数の駆動素子と、外部制御回路に接続さ
れる接続端子部とを備え、これらを回路パターンを介し
て接続した印字用基板の接続構造において、 前記接続端子部に設けられる複数の端子ピンのうち、少
なくとも1つの端子ピンが途中部から分岐していること
を特徴とする印字用基板の接続構造。
1. A printing medium comprising a print medium on an insulating substrate, a plurality of drive elements for driving the print medium, and a connection terminal portion connected to an external control circuit, which are connected through a circuit pattern. In the board connection structure, at least one terminal pin of the plurality of terminal pins provided in the connection terminal portion is branched from an intermediate part, and the connection structure of the printing board.
【請求項2】 前記途中部から分岐している端子ピン
が、前記接続端子部の少なくとも端部にあることを特徴
とする、請求項1に記載の印字用基板の接続構造。
2. The connection structure for a printing substrate according to claim 1, wherein the terminal pin branched from the middle portion is at least at an end portion of the connection terminal portion.
JP5044694A 1994-03-22 1994-03-22 Connecting structure for printing board Pending JPH07263051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044694A JPH07263051A (en) 1994-03-22 1994-03-22 Connecting structure for printing board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044694A JPH07263051A (en) 1994-03-22 1994-03-22 Connecting structure for printing board

Publications (1)

Publication Number Publication Date
JPH07263051A true JPH07263051A (en) 1995-10-13

Family

ID=12859094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044694A Pending JPH07263051A (en) 1994-03-22 1994-03-22 Connecting structure for printing board

Country Status (1)

Country Link
JP (1) JPH07263051A (en)

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