JPH07262893A - Case enclosed type magnetic proximity switch - Google Patents

Abstract

PURPOSE:To provide a magnetic proximity switch capable of binding-soldering lead wires at a certain distance from a glass end, apart from the glass end surface of a reed switch so that head shock is not applied to the glass part of the reed switch, and surely conducting the center positioning of the reed switch after an outer case assembling. CONSTITUTION:A reed switch fixing recess 13 is formed in an inner case 4, a groove 14 is formed in the lengthwise direction at both ends of the reed switch fixing recess 13, a reed switch 1 and a lead wire 2 are fitted to the recess 13 and the groove 14, terminal ends A18, B19 of the lead wire 2 are bound to reeds A16, B17 at both ends of the reed switch 1, then soldering treatment 6 is applied. The inner case 4 in which the lead wire is fixed to the recess 13 and the groove 15 is fixed to an outer case 3 through floating prevention patches 9 and fixing pins 10, then casting resin 5 is poured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic proximity switch.

[0002]

2. Description of the Related Art As shown in FIG. 2, in a conventional magnetic proximity switch, a reed switch 1 is held at a certain distance 7 from both ends of the glass, and the end of a lead wire 2 is entangled with the reed switch 1. The outer part 3
Built in. Then, the casting resin 5 is injected into the recess 20 of the outer case together with the reed switch to complete the magnetic proximity switch.

However, according to the conventional method, when the lead wire 2 is wired in a straight line when the reed switch 4 is installed in the recess 20 of the outer case 3, the lead wire becomes very easy to move. For this purpose, the lead wire 2 is passed through the insertion hole 11 penetrating the recess 20 from the outside of the outer case 3, the lead wire 2 is bent in the recess 20 of the outer case, and the reed switch is held in the recess 20 of the outer case 3. After the lead wire 2 was entangled with the lead of No. 1 and soldering was performed, the reed switch 1 was formed on the holding portion 12. At this time, depending on the state of the soldering process, a certain distance between the both end surfaces of the glass of the reed switch and the entangled position becomes small, the thermal shock of the soldering process is applied, the reed switch becomes defective, and the lead wire 2 is bent. Then, the repulsive force of the lead wire 2 is exerted, and the position of the reed switch is deviated.

[0004]

SUMMARY OF THE INVENTION In order to prevent a thermal shock from being applied to the glass portion of the reed switch, the present invention provides a certain distance from the glass edge, separates it from the glass of the reed switch, entangles the lead wire, and solders it. It is also an object of the present invention to provide a magnetic proximity switch having a structure capable of reliably positioning the reed switch after being assembled in the outer case.

[0005]

DISCLOSURE OF THE INVENTION The present invention relates to a magnetic proximity switch using a reed switch, and a reed switch mounting recess having a groove at both ends for holding a certain distance from both ends of the glass of the reed switch. Use an inner case provided with a lead wire mounting groove in parallel with the longitudinal direction of the recess, and incorporate the lead wire and the reed switch in which the lead wire is twisted into the outer case having means for keeping the inner case stationary. Is a magnetic proximity switch.

[0006]

According to the present invention, an inner case and an outer case are provided, and a reed switch mounting recess and a lead wire mounting groove are provided in the inner case so that the reed switch has a sufficient distance from the glass end face and is separated from the reed switch glass. Since the lead wire is entangled and soldered, thermal shock is not applied to the reed switch, and the reed switch bonded to the reed switch mounting recess has the lead wire bonded to the lead wire mounting portion. Unlike the conventional case, the lead wire does not move inside the inner case. Furthermore, since the inner case is attached to the outer case by the anti-floating potch and the fixing pin, the inner case does not float up and move from the outer case even when the casting resin is injected. The center position of the reed switch housed in is not displaced.

[0007]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an assembling process of the magnetic proximity switch of the present invention.

As shown in FIG. 1A, the inner case 4 is provided with a reed switch mounting recess 13 parallel to the reed switch 1 in the longitudinal direction. After mounting the reed switch 1 in this recess, the reeds of the reed switch 1 have two grooves 14 at both ends of the inner case 4 having a sufficient distance 8.
And is projected to the outside of the inner case 4.

Further, the inner case 4 has a lead wire mounting groove 15 for mounting a lead wire in parallel with the reed switch mounting recess 13 for fixing the reed switch 1. One of the two lead wires is bonded to the lead wire mounting groove 15 with an adhesive. One lead A16 of the reed switch 1 is exposed to the outside of the inner case 4 in the left direction, and the terminal A18 of the lead wire is entangled in the lead for soldering 6. At this time, a sufficient distance 8 is provided from the glass end face so that thermal shock is not applied to the glass portion of the reed switch.

Similarly, the other terminal B of the lead wire 2 is
19 is bent by the lead B17 of the reed switch protruding to the outside of the inner case and subjected to the soldering process 6.

As described above, the reed switch mounting recess 1
3 and the inner case 4 provided with the lead wire mounting groove 15, the reed switch 1 is bonded with an adhesive, and similarly, the lead wire 2 is soldered to the leads at both ends of the reed switch, so that the reed switch is There is no displacement, and the lead wires are separated from the glass of the reed switch and the lead wires are entangled and soldered. Therefore, thermal shock is not applied to the glass of the reed switch.

The outer case 3 is, as shown in FIG.
The recess 20 inside the box has a floating prevention potch 9. The floating prevention potch 9 presses the upper corner portion of the side surface of the inner case 4 to prevent the inner case 4 from floating due to resin injection.

The outer case 3 has a box-shaped inner recess 20.
The reed switch 1 has a fixing pin 10 on its inner side to press the side surface in the longitudinal direction of the reed switch 1 against the inner case. Further, the lead wire groove 21 of the outer case for guiding the lead wire into the recess 20 inside the box is formed.

The inner case 4 accommodating the reed switch in which the lead wire is fixed to the lead is fixed to the fixing pin 10.
It is fixed to the outer case 3 through the floating prevention potch 9.

At this time, the inner case 4 has a floating prevention potch 9
After confirming that the casting resin 5 is contained in the mold, as shown in FIG. 1C, the casting resin 5 is injected into the recess 20 of the outer case.

[0017]

As described above, according to the present invention, the reed switch is fixed to the holding component made of the same material as the outer case,
After the barge soldering process, by incorporating the holding component into the outer case, the lead wire barge soldering process can be performed at a certain distance from the glass end face so that thermal shock is not applied to the glass part of the reed switch. Since the positioning of the reed switch is reliable and the position shift of the reed switch is small, it is possible to easily design the magnetic circuit and to provide an inexpensive magnetic proximity switch.

[Brief description of drawings]

FIG. 1 is a perspective view showing an assembling process of a case-enclosed magnetic proximity switch according to the present invention. FIG. 1A is a perspective view showing a process of assembling the inner case. FIG. 1B is a perspective view showing a process of assembling the inner case and the outer case. Figure 1 (c)
FIG. 6 is a perspective view showing a step of injecting a casting resin into the outer case.

FIG. 2 is a perspective view showing an assembling process of a conventional magnetic proximity switch. FIG. 2A is a front view showing a process in which the lead wire is entangled with the lead of the reed switch. Figure 2
FIG. 6B is a perspective view showing a process of assembling the reed switch and the lead wire to the outer case. FIG. 2C is a perspective view showing a step of injecting the casting resin into the outer case.

[Explanation of symbols]

 1 Reed switch 2 Lead wire 3 Outer case 4 Inner case 5 Casting resin 6 Solder treatment 7,8 Distance 9 Lift prevention potch 10 Fixing pin 11 Insertion hole 12 Retaining part 13 Reed switch mounting recess 14 Groove 15 Lead wire mounting groove 16 Lead A 17 Lead B 18 Terminal A 19 Terminal B 20 Recess 21 Groove for lead wire of outer case

Claims (1)

[Claims] 1. In a magnetic proximity switch using a reed switch, a reed switch mounting recess having a predetermined distance from both ends of the glass of the reed switch and grooves provided at both ends, and a lead parallel to the longitudinal direction of the recess. A magnetic proximity switch characterized by using an inner case having a wire mounting groove, and incorporating the lead wire and a reed switch in which the lead wire is twisted into an outer case having means for keeping the inner case stationary .