JPH0725121B2 - Tube for conveying circuit parts, manufacturing apparatus and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an annular tubular member, a manufacturing apparatus and a manufacturing method thereof, and more particularly, a circuit component carrying tube suitable for carrying a chip-shaped circuit component, a manufacturing apparatus and a manufacturing method thereof. Regarding

[0002]

2. Description of the Related Art Conventionally, in order to automatically mount a chip-shaped electronic circuit component on a circuit board, for example, Japanese Patent Laid-Open No. 2-34449.
It is known that a mounter is used to move and mount on a circuit board as shown in Japanese Patent Laid-Open No. In this mounter device, the chip-shaped electronic circuit parts are sequentially sent out from the container accommodating the chip-shaped electronic parts through the guide means, and the chip-shaped electronic circuit parts are supplied to the accommodating recesses formed at the respective predetermined positions of the template. After that, the chip-shaped electronic circuit components arranged on this template are moved and mounted on the circuit board in the arrangement state as received. Then, conventionally, a tube formed by molding a resin into a tube has been used as a guide means for carrying the chip-shaped electronic component from the storage container to the template.

[0003]

However, when the chip-shaped electronic component is conveyed by the conventional resin tube guiding means, static electricity is generated by friction between the electronic component and the inner surface of the resin tube, and the static electricity is generated. Be charged to. The electrification of such chip-shaped electronic components prevents the electronic components that must be distributed and arranged at predetermined positions of the template through the guide tube from being placed in the correct positions. That is, due to the electrostatic charge of the chip-shaped electronic component, this electronic component is not accommodated in the predetermined concave portion of the template but is adsorbed to another position, and then on the circuit board of the electronic circuit component in the mounter. Installation will be hindered.

In order to solve such a problem, it has been proposed to apply a conductive coating to the surface of the guide tube, for example. However, the chip-shaped electronic components that move in the tube cut the surface and peel it off, which cannot withstand long-term use. It has also been proposed to fill the resin material forming the guide tube with a conductive filler. However, it is difficult to secure sufficient conductivity on the surface of the tube, and thus it is difficult to remove sufficient static electricity from the chip-shaped electronic component.

Therefore, in view of the above-mentioned problems in the prior art, the present invention has a sufficient inner peripheral surface when used as a resin-made tube filled with a conductive filler, particularly as a guide tube for chip-shaped electronic parts. It is an object of the present invention to provide a tube for transporting a circuit component, a device for producing the same, and a method for producing the same, in which sufficient conductivity is ensured and the conductivity is not easily lost by the movement of the chip-shaped electronic component.

[0006]

In order to solve the above-mentioned problems, a tube for carrying circuit parts proposed by the present invention is a tube for carrying circuit parts, wherein a conductive filler is distributed inside the tube. The characteristic filler is characterized by being distributed at a higher density on the inner peripheral surface side of the tubular cross section.

Further, in the present invention, as a device for manufacturing the above-mentioned circuit component carrying tube, a cylindrical cylinder, a mandrel arranged in the central axis direction of the cylinder, and a space between the mandrel and the cylinder are filled. For conveying circuit parts having means for pressurizing resin, a die provided at the end of the cylinder and having an orifice inner surface whose inner surface is narrowed in a tapered shape at the tip, and a core pin provided at the end of the mandrel In the tube manufacturing apparatus, there is further provided means near the core pin or the die orifice, for forming a magnetic field between the outer peripheral surface of the core pin and the inner peripheral surface of the die orifice surrounding the core pin. An apparatus is provided.

Further, in the present invention, as a method for manufacturing the above-mentioned circuit component carrying tube, a resin material in which a conductive filler is mixed between a cylindrical cylinder and a mandrel arranged in the central axis direction of the cylinder. And extrude it toward the die orifice side of the tip side of the cylinder whose inner surface is tapered, and pass it between the die orifice and the core pin provided at the tip of the mandrel to form a tube shape. A method of manufacturing a circuit component carrying tube, characterized in that the tube is formed while forming a magnetic field between the outer peripheral surface of the core pin and the inner peripheral surface of the die orifice surrounding the core pin. suggest.

[0009]

In the tube for conveying circuit parts according to the present invention, the conductive filler mixed in the resin material is distributed at a higher density on the inner peripheral surface side of the tubular cross section, so that the inner peripheral surface of the tube is It is possible to sufficiently secure the conductivity. Further, according to the manufacturing apparatus and the manufacturing method of the circuit component transport tube of the present invention, by utilizing the magnetism of the conductive filler mixed in the resin material molded into a tube, the outer peripheral surface of the core pin, The filler is sucked toward the inner peripheral side by forming a tube while forming a magnetic field with the inner peripheral surface of the die orifice surrounding the core pin. As a result, the conductive filler mixed in the resin material is distributed at a higher density on the inner peripheral surface side of the tubular cross section.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 2 shows a manufacturing apparatus for manufacturing the circuit component carrying tube according to the present invention. As shown in the figure, this manufacturing apparatus includes a cylinder 11 having an external cylindrical shape filled with a resin material containing a conductive filler, and a mandrel 12 extending in the central axis direction of the cylinder 11. have. Between the cylinder 11 and the mandrel 12, a so-called ram 13, which has an external cylindrical shape, is provided slidably in the vertical direction, and a ram head 14 is attached to the lower end of the ram 13. Reference numeral 15 in this figure is a seal ring provided between the cylinder 11 and the mandrel 12.

Further, a die 16 having a so-called funnel-shaped gradient is attached to the inner surface of the lower end of the cylinder 11, and a die orifice 17 is attached to the tip of the funnel-shaped portion of the die 16. There is.
The opening angle of this funnel-shaped part is indicated by θ,
This angle θ is preferably about 30 ° to 60 °. Reference numeral 18 in the drawing denotes a seal ring provided between the cylinder 11 and the die 16, and reference numeral 19 denotes a seal ring provided between the die 16 and the die orifice 17.

On the other hand, the mandrel 12 is gradually reduced in outer diameter at a portion corresponding to the funnel-shaped portion of the die 16, and is made thin at a portion corresponding to the die orifice 17. The core pin 20 is formed. The resin material in the cylinder 11 is gradually compressed into a tube shape between the funnel-shaped inner surface of the die 16 and the mandrel 12 as the ram 13 and the ram head 14 descend, and the die orifice 17 and the core pin 2 are then compressed.
It is formed into a tubular shape through a tubular space formed between 0 and 0. Incidentally, reference numerals 21, 2 in this figure
Reference numerals 2 and 23 denote band heaters provided around the outer circumferences of the die 16 and the die orifice 17 in order to keep the die 16 and the die orifice 17 at a predetermined temperature. , For example 50
It is maintained at about 60 ° C to 60 ° C.

The conductive filler mixed in the resin material is a magnetic filler, and a powdered filler such as Fe, Ni or Co is mixed in the resin material. According to the present invention, means for forming a magnetic field is provided between the outer peripheral surface of the core pin 20 and the inner peripheral surface of the die orifice 17. In the embodiment of the present invention, examples of such magnetic field forming means include an electromagnet 50 as shown in FIG. 2 and a permanent magnet 51, 52 as shown in FIG. 3 or 4. That is, in the case of the electromagnet 50 of FIG. 2, the magnetic force generated by the electromagnet 50 forms a magnetic field in the narrow space at the tip of the mandrel 12 and the core pin 20 which are usually made of a magnetic material of iron-based metal. Also, FIG.
Alternatively, when the permanent magnets 51 and 52 shown in FIG. 4 are used, the magnetic field is formed by the tubular permanent magnets 51 and 52 attached to the tip of the core pin 20.

Next, the operation of the manufacturing apparatus for the circuit component carrying tube according to the present invention will be described. First, FIG.
In, the cylinder 11 is filled with a resin material, and the resin material is extruded by sliding the ram 13 and the ram head 14 attached to the lower end thereof downward. As a result, the resin material is transferred to the cylinder 11
It passes between a die 16 at the lower end of the mandrel 12, a die orifice 17 provided continuously to the die 16 and a core pin 20 provided at the tip of the mandrel 12, and is formed into an annular tube shape. At the same time, the magnetic material filler of the conductive material mixed in the resin formed by passing through the electromagnet 50
It is attracted to the surface side of the core pin 20 by the magnetic field formed by. Therefore, the magnetic filler is distributed at a high density on the inner peripheral side of the tube molded by this. This point is the same in the embodiments shown in FIGS. 3 and 4 described above.

FIG. 1 shows a cross section of a circuit component carrying tube molded by the above manufacturing method. As is clear from the figure, in the molded tube 100, the conductive material fillers 102, 1 mixed in the resin material 101 are used.
02 ... are distributed at a high density on the inner peripheral side. This allows
It is possible to obtain a circuit component transport tube that has sufficient conductivity as a circuit component transport tube and is also excellent in strength.

[0016]

As is apparent from the above description, according to the present invention, a resin-made tube in which a conductive filler is distributed at a high density on the inner peripheral surface side of the tube, particularly a chip-shaped electronic component It is possible to obtain a tube for carrying circuit parts, which has conductivity and sufficient strength suitable for being used as a guide tube for the above. Further, in the manufacturing apparatus and the manufacturing method thereof, it is possible to manufacture the above-described circuit component carrying tube of the present invention with a relatively simple structure by utilizing the magnetic field.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a circuit component carrying tube according to the present invention.

FIG. 2 is a cross-sectional view of an apparatus for manufacturing a circuit component carrying tube according to the present invention.

FIG. 3 is a partially enlarged cross-sectional view showing a modified example of the manufacturing apparatus of the circuit component carrying tube shown in FIG.

4 is a partially enlarged cross-sectional view showing a modified example of the manufacturing apparatus of the circuit component carrying tube shown in FIG.

[Explanation of symbols]

 11 Cylinder 12 Mandrel 13 Ram 14 Ram Head 15, 18, 19 Seal Ring 16 Die 17 Die Orifice 20 Core Pin 21, 22, 23 Band Heater 50 Electromagnet 51, 52 Permanent Magnet 100 Tube 101 Resin Material 102 Filler

Claims (3)

[Claims] 1. A circuit component carrying tube having a conductive filler distributed therein, wherein the conductive filler is distributed at a higher density on the inner peripheral surface side of the tubular cross section. Tube for transporting circuit parts. 2. A cylindrical cylinder, a mandrel arranged in the direction of the central axis of the cylinder, a means for pressurizing a resin filled between the mandrel and the cylinder, and an end portion of the cylinder. And a die having an orifice inner surface whose inner surface is tapered in a tapered shape, and a core pin provided at an end of the mandrel. And a means for forming a magnetic field between the outer peripheral surface of the core pin and the inner peripheral surface of the die orifice surrounding the core pin. 3. A resin material mixed with a conductive filler is filled between a cylindrical cylinder and a mandrel arranged in the central axis direction of the cylinder, and the inner surface of the resin material is squeezed into a tapered shape. In the method of manufacturing a circuit component carrying tube, which is extruded to the die orifice side of the tip side of the cylinder and passed between the die orifice and the core pin provided at the tip of the mandrel to form a tube, A method of manufacturing a circuit component carrying tube, characterized in that a tube is formed while a magnetic field is formed between the surface and an inner peripheral surface of the die orifice surrounding the core pin.