JPH07246610A - Die for extruding ceramic structure - Google Patents
Die for extruding ceramic structureInfo
- Publication number
- JPH07246610A JPH07246610A JP4247094A JP4247094A JPH07246610A JP H07246610 A JPH07246610 A JP H07246610A JP 4247094 A JP4247094 A JP 4247094A JP 4247094 A JP4247094 A JP 4247094A JP H07246610 A JPH07246610 A JP H07246610A
- Authority
- JP
- Japan
- Prior art keywords
- supply hole
- forming groove
- ratio
- kneaded
- ceramic structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はセラミックス構造体押出
用口金に関し、特に成形溝と坏土供給孔とがそれぞれ又
は一定の割合で連通された構造を有するセラミックス構
造体押出用口金に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic structure extrusion die, and more particularly to a ceramic structure extrusion die having a structure in which a molding groove and a kneaded material supply hole are communicated with each other or at a constant ratio. .
【０００２】[0002]
【従来の技術】従来から、成形溝と坏土供給孔とがそれ
ぞれ連通された構造を有するセラミックス構造体押出用
口金は、種々の構成のものが知られている。図８は従来
のセラミックス構造体押出用口金の一例の構成を示す図
である。図８に示す例において、５１は口金本体、５２
は成形溝、５３は坏土供給孔であり、本例では成形溝５
２と坏土供給孔５３とがそれぞれ連通した例を示してい
る。2. Description of the Related Art Conventionally, various structures of ceramic structure extrusion die having a structure in which a forming groove and a kneaded material supply hole are communicated with each other are known. FIG. 8 is a diagram showing a configuration of an example of a conventional ceramic structure extrusion die. In the example shown in FIG. 8, 51 is a base body, 52
Is a forming groove, and 53 is a kneaded clay supply hole.
2 and the kneaded clay supply hole 53 communicate with each other.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
セラミックス構造体押出用口金は、成形溝や坏土供給孔
等の形状、大きさを変化させると、押出後のセラミック
ス構造体の圧着強度が変化するとともに、押出成形中の
押出圧力の変化、坏土の流動性のばらつきおよび変化
が、セラミックス構造体の押し出される速度に与える影
響が大きくなり、常に一定の状態で押出作業を行えない
場合がある問題があった。However, in the conventional ceramic structure extrusion die, when the shape and size of the forming groove, the kneaded material supply hole and the like are changed, the pressure bonding strength of the ceramic structure after extrusion is changed. In addition, changes in the extrusion pressure during extrusion molding, variations and changes in the fluidity of the kneaded material have a large effect on the extrusion speed of the ceramic structure, and it may not always be possible to perform extrusion work in a constant state. There was a problem.
【０００４】本発明の目的は上述した課題を解決して、
押出後のセラミックス構造体の圧着強度を向上させると
ともに、押出圧力の変化等の種々の要因の影響を少なく
できるセラミックス構造体押出用口金を提供しようとす
るものである。The object of the present invention is to solve the above-mentioned problems,
An object of the present invention is to provide a die for ceramic structure extrusion capable of improving the pressure bonding strength of the ceramic structure after extrusion and reducing the influence of various factors such as changes in extrusion pressure.
【０００５】[0005]
【課題を解決するための手段】本発明のセラミックス構
造体押出用口金は、成形溝とこの成形溝へそれぞれ連通
された複数の坏土供給孔とを有するセラミックス構造体
押出用口金において、(a) 成形溝深さ／成形溝幅の比を
６〜２０の範囲内とし、(b) １個の坏土供給孔断面積／
坏土供給孔ピッチの面積の比を０．１〜０．６の範囲内
とし、(c) 坏土供給孔径／坏土供給孔ピッチの比を０．
４〜０．８の範囲内とし、(d) 成形溝と坏土供給孔との
坏土進行方向の重複部分の長さを０．３〜１．５mmの範
囲内としたことを特徴とするものである。A ceramic structure extruding die according to the present invention is a ceramic structure extruding die having a forming groove and a plurality of kneaded material supply holes respectively communicating with the forming groove. ) Forming groove depth / forming groove width ratio within the range of 6 to 20, (b) cross-sectional area of one kneaded clay supply hole /
The ratio of the area of the kneaded material supply hole pitch is set in the range of 0.1 to 0.6, and (c) the ratio of the kneaded material supply hole diameter / the kneaded material supply hole pitch is set to 0.
It is characterized in that it is in the range of 4 to 0.8, and (d) the length of the overlapping portion of the forming groove and the kneaded material supply hole in the direction of kneaded clay is in the range of 0.3 to 1.5 mm. It is a thing.
【０００６】[0006]
【作用】上述した構成において、(a) 成形溝深さ／成形
溝幅の比を６〜２０の範囲内とし、(b) １個の坏土供給
孔断面積／１個の坏土供給孔ピッチの面積の比を０．１
〜０．６の範囲内とし、(c) 坏土供給孔径／坏土供給孔
ピッチの比を０．４〜０．８の範囲内とし、(d) 成形溝
と坏土供給孔との坏土進行方向の重複部分の長さを０．
３〜１．５ｍｍの範囲内としているため押出後のセラミ
ックス構造体の圧着強度を向上させることと、押出圧力
の変化等の種々の要因のセラミックス構造体の押し出さ
れる速度に与える影響を少なくすることという相反する
特性を両者とも良好な範囲に保つことができる。In the above-mentioned structure, (a) forming groove depth / forming groove width ratio is within the range of 6 to 20, and (b) one kneaded clay supply hole cross-sectional area / one kneaded clay supply hole. The pitch area ratio is 0.1
Within a range of up to 0.6, (c) the ratio of the diameter of the kneaded clay supply hole / the pitch of the kneaded clay supply hole within the range of 0.4 to 0.8, and (d) the kneading between the forming groove and the kneaded clay supply hole. Set the length of the overlapping part in the soil advancing direction to 0.
Since the pressure is within the range of 3 to 1.5 mm, the pressure bonding strength of the ceramic structure after extrusion is improved, and the influence of various factors such as changes in extrusion pressure on the extrusion speed of the ceramic structure is reduced. Both of these contradictory characteristics can be maintained in a favorable range.
【０００７】[0007]
【実施例】図１〜図３はそれぞれ本発明の一例としてセ
ラミックス構造体押出用口金を示す図であり、図１は口
金の成形溝側の平面を、図２は口金の坏土供給孔側の平
面を、図３は図１におけるＸ−Ｘ線に沿った断面をそれ
ぞれ示している。図１〜図３に示した例において、１は
口金本体、２は成形溝、３は坏土供給孔、４は口金凸
部、５はコア部を示している。また、本例では、たとえ
ば成形溝のピッチを一辺１．３５ｍｍの正方形とし、成
形溝２の幅を０．１０８ｍｍとするとともに、坏土供給
孔３は成形溝２の交点１カ所おきに配置している。1 to 3 are views showing a die for extruding a ceramic structure as an example of the present invention, FIG. 1 is a plane of a die forming groove side, and FIG. 2 is a kneaded material supply hole side of the die. 3 and FIG. 3 shows a cross section taken along line XX in FIG. In the examples shown in FIGS. 1 to 3, 1 is a die body, 2 is a forming groove, 3 is a kneaded material supply hole, 4 is a die convex portion, and 5 is a core portion. In this example, for example, the pitch of the forming groove is a square having a side length of 1.35 mm, the width of the forming groove 2 is 0.108 mm, and the kneaded material supply holes 3 are arranged at every other intersection of the forming groove 2. ing.
【０００８】なお、上述したセラミックス構造体押出用
口金の成形溝および坏土供給孔の加工方法は、放電加工
（カーボン型・銅型・ワイヤー・パイプ等々）、エッチ
ング加工、電解加工、放電加工のいずれかの加工方法を
利用することができる。また、口金の表面に無電解メッ
キ又はＣＶＤ処理による耐摩耗性被膜が付与されていて
もよい。さらに、成形溝２と坏土供給孔３の全てがそれ
ぞれ連通していてもよく、また成形溝２と坏土供給孔３
との重複部が坏土留め構造となっていてもよい。さらに
また、坏土供給孔３が複数のドリル径を用いて加工され
たような多段構造でもよいとともに、成形溝２がテーパ
又は逆テーパ形状でもよい。また、口金が複数枚の部材
を張り合わせた構造でもよいとともに、セル構造は３
角、４角、６角等形状はどのような形状であってもよ
い。The above-mentioned forming groove of the ceramic structure extrusion die and the kneaded material supply hole are processed by electrical discharge machining (carbon type, copper type, wire, pipe, etc.), etching, electrolytic machining, and electric discharge machining. Either processing method can be used. Further, a wear resistant coating may be provided on the surface of the die by electroless plating or CVD treatment. Further, all of the forming groove 2 and the kneaded material supply hole 3 may communicate with each other, and the forming groove 2 and the kneaded material supply hole 3 may be connected.
The overlapping portion with and may have a puddle retaining structure. Furthermore, the kneaded material supply hole 3 may have a multi-step structure such that it is processed by using a plurality of drill diameters, and the forming groove 2 may have a taper or an inverse taper shape. Further, the base may have a structure in which a plurality of members are bonded together, and the cell structure is 3
The shape such as the corner, the corner, the hexagon, etc. may be any shape.
【０００９】上述したセラミックス構造体用口金の構造
は従来のセラミックス構造体押出用口金とほぼ同様であ
り、本発明で重要なのは、上述したセラミックス構造体
用口金において、成形溝２の深さ／成形溝２の幅の比を
６〜２０の範囲内とし、１個の坏土供給孔３の断面積／
坏土供給孔３のピッチの面積の比を０．１〜０．６の範
囲内とし、坏土供給孔径／坏土供給孔ピッチの比を０．
４〜０．８の範囲内とし、成形溝２と坏土供給孔３との
坏土進行方向の重複部分の長さを０．３〜１．５ｍｍの
範囲内としている点である。The structure of the above-mentioned ceramic structure die is almost the same as that of the conventional ceramic structure extrusion die. What is important in the present invention is the depth of the forming groove 2 / forming in the above-mentioned ceramic structure die. The width ratio of the groove 2 is set within the range of 6 to 20, and the cross-sectional area of one kneaded clay supply hole 3 /
The ratio of the area of the pitch of the kneaded material supply holes 3 is within the range of 0.1 to 0.6, and the ratio of the diameter of the kneaded material supply hole / the pitch of the kneaded material supply hole is 0.
It is within the range of 4 to 0.8, and the length of the overlapping portion of the forming groove 2 and the kneaded clay supply hole 3 in the direction of the kneaded clay is within the range of 0.3 to 1.5 mm.
【００１０】すなわち、図４に成形溝２と坏土供給孔３
を模式的に示すように、まず成形溝２の深さｄと成形溝
２の幅ｗとの比：ｄ／ｗが６〜２０となるようにする。
また、図４において、坏土供給孔３の径Ｄ／坏土供給孔
ピッチの比を０．４〜０．８とし、成形溝２と坏土供給
孔３との重複長さＬを０．３〜１．５ｍｍとしている。
同時に、図５に示すように１個の坏土供給孔３が受け持
つ坏土供給孔ピッチの断面積を、図５(a) に示すように
坏土供給孔３が成形溝２の交点１個おきに配されている
場合は斜線を施したａ部の面積を、図５(b) に示すよう
に坏土供給孔３が成形溝２の各交点に配されている場合
は斜線を施したｂ部の面積で表すものとし、さらに坏土
供給孔３の断面積と坏土供給孔３のピッチの面積の比が
０．１〜０．６となるようにしている。That is, FIG. 4 shows the forming groove 2 and the kneaded material supply hole 3
First, the ratio of the depth d of the forming groove 2 to the width w of the forming groove 2: d / w is set to 6 to 20.
Further, in FIG. 4, the ratio of the diameter D of the kneaded clay supply holes 3 / the pitch of the kneaded clay supply holes is 0.4 to 0.8, and the overlapping length L of the forming groove 2 and the kneaded clay supply holes 3 is 0. It is set to 3 to 1.5 mm.
At the same time, as shown in FIG. 5, the cross-sectional area of the kneaded clay supply hole pitch, which is handled by one kneaded clay supply hole 3, is shown in FIG. The area of the shaded a part is shaded when arranged alternately, and the shaded area is shaded when the kneaded material supply holes 3 are arranged at each intersection of the forming grooves 2 as shown in FIG. 5 (b). The area of the portion b is represented, and the ratio of the cross-sectional area of the kneaded clay supply holes 3 to the area of the pitch of the kneaded clay supply holes 3 is 0.1 to 0.6.
【００１１】以下、実際の例について説明する。実施例１ まず、コージェライト原料１００重量部に対し、バイン
ダー４重量部、界面活性剤１重量部、水３５重量部を加
え、土練機を用いて混練して押し出すべき坏土を調製し
た。調製した坏土のレオロジー特性は、クリープ試験に
おいて、η0 ＝１．３×１０8 Ｐａｓ、η1 ＝１．３×
１０7 Ｐａｓ、Ｇ0 ＝５．４×１０6 Ｐａ，Ｇ1 ＝１．
６×１０6 Ｐａであった。なお、使用する坏土のレオロ
ジー特性は、クリープ試験において、η0 ／Ｇ0 ≦１０
５(sec) 、η1 ／Ｇ1 ≦７０(sec) のものを使用すると
好ましい。An actual example will be described below. Example 1 First, to 100 parts by weight of a cordierite raw material, 4 parts by weight of a binder, 1 part by weight of a surfactant and 35 parts by weight of water were added and kneaded using a kneader to prepare a kneaded material to be extruded. The rheological properties of the prepared kneaded clay were η 0 = 1.3 × 10 8 Pas and η 1 = 1.3 × in the creep test.
10 7 Pas, G 0 = 5.4 × 10 6 Pa, G 1 = 1.
It was 6 × 10 6 Pa. The rheological properties of the kneaded clay used were η 0 / G 0 ≦ 10 in the creep test.
It is preferable to use one having 5 (sec) and η 1 / G 1 ≦ 70 (sec).
【００１２】同時に、上述した図１〜図３に示す形状
で、コア部は成形溝ピッチ１．５４ｍｍ（成形溝幅３０
０μｍ）、１．３５ｍｍ（成形溝幅１０８μｍ）の正方
形で、成形溝幅は３００μm と１０８μm 、坏土供給孔
と成形溝とは成形溝の交点１カ所おきの所で連結したセ
ラミックス構造体押出用口金のそれぞれにおいて、成形
溝の深さを変えて成形溝深さ／成形溝幅の比を種々変化
させるとともに坏土供給孔面積／坏土供給孔ピッチの面
積比を０．５としたＡ系統の口金と、坏土供給孔の直径
を変えて供給孔／成形溝の面積比を種々変化させるとと
もに成形溝深さ／成形溝幅の比を１０としたＢ系統の口
金を準備した。そして、準備したセラミックス構造体押
出用口金を使用して、調製した坏土を押し出して、長さ
１００ｍｍの図６に示すような壁６と空間７とから構成
されるセラミックス構造体を製造した。なお、Ａ系統、
Ｂ系統とも成形溝と供給孔の重複長さは共に１．１ｍｍ
であった。At the same time, in the shape shown in FIGS. 1 to 3 described above, the core portion has a molding groove pitch of 1.54 mm (forming groove width 30
0 μm), 1.35 mm (forming groove width 108 μm) square, forming groove width 300 μm and 108 μm, for extrusion of ceramic structure where kneaded material supply holes and forming grooves are connected at every other intersection of forming grooves In each of the mouthpieces, the depth of the forming groove is changed to variously change the forming groove depth / forming groove width ratio, and the area ratio of the kneaded material supply hole area / the kneaded material supply hole pitch is set to 0.5. And the diameter of the kneaded material supply hole was changed to variously change the area ratio of the supply hole / forming groove, and a B-system mouthpiece having a forming groove depth / forming groove width ratio of 10 was prepared. Then, the prepared kneaded clay was extruded using the prepared ceramic structure extrusion die to manufacture a ceramic structure having a wall 6 and a space 7 having a length of 100 mm as shown in FIG. In addition, system A,
In both system B, the overlapping length of the forming groove and the supply hole is 1.1 mm.
Met.
【００１３】セラミックス構造体の押出特性を評価する
ため、まず押出圧依存性として、各口金使用時の坏土押
出圧力を８０〜１６０ｋｇ／ｃｍ2 に変化させたときの
押出速度を求め、両者の対数値によりグラフを描いて直
線回帰を行い傾きを求め、この傾きを押出圧力（又は流
動抵抗）に対する押出速度の依存性とした。そして、こ
の傾きが小さい方が、押出成形中の押出圧力の変化、坏
土の流動性のばらつきおよび変化、およびこれらの組み
合わせの影響が小さいため、最も小さい場合を◎、小さ
い場合を○、中程度である場合を△、高い場合を×とし
て表記した。In order to evaluate the extrusion characteristics of the ceramic structure, first, as the extrusion pressure dependence, the extrusion rate when the extrusion pressure of the kneaded clay when each die was used was changed to 80 to 160 kg / cm 2 was obtained, and A graph was drawn using logarithmic values and linear regression was performed to determine the slope, and this slope was taken as the dependence of the extrusion speed on the extrusion pressure (or flow resistance). And, the smaller this inclination is, the smaller the influence of the change of extrusion pressure during extrusion molding, the variation and change of the fluidity of the kneaded clay, and the combination thereof, so the smallest case is ◎, the smallest case is ○, and the medium. When the degree is high, it is shown as Δ, and when it is high, it is shown as x.
【００１４】また、圧着強度としては図７(a) 、(b) に
示すように、焼成後のセラミックス構造体の流路に垂直
な方向および流路方向の３点曲げ強度を求め、この値が
最も高いものを◎、高いものを○、中程度のものを△、
低い場合を×として表記した。以下、Ａ系統の口金を使
用して成形溝深さ／成形溝幅を変えた場合の結果を表１
に、Ｂ系統の口金を使用して坏土供給孔面積／坏土供給
孔ピッチ面積比を変えた場合の結果を表２にそれぞれ示
す。As the pressure-bonding strength, as shown in FIGS. 7 (a) and 7 (b), the three-point bending strength in the direction perpendicular to the flow path of the ceramic structure after firing and in the flow path direction was obtained, and this value was obtained. The highest is ◎, the highest is ○, the medium is △,
When it was low, it was expressed as x. Below, Table 1 shows the results when the forming groove depth / forming groove width was changed using the A-system die.
Table 2 shows the results when the ratio of the kneaded material supply hole area / the kneaded material supply hole pitch area was changed using the B-system spinneret.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【表２】 [Table 2]
【００１７】以上の結果から、成形溝深さ／成形溝幅比
が大きいほど押出圧依存性も圧着強度も大きくなること
がわかる。一方、坏土供給孔面積／坏土供給孔ピッチ面
積の比が大きいほど押出圧依存性が小さく、圧着強度は
大きくなることがわかる。よって、これらの相反する関
係より最適な成形溝深さ／成形溝幅の比および坏土供給
孔面積／坏土供給孔ピッチ面積の比を求めると、成形溝
深さ／成形溝幅の比が６〜２０で、坏土供給孔面積／坏
土供給孔ピッチ面積の比が０．１〜０．６であることが
わかる。From the above results, it can be seen that the larger the forming groove depth / forming groove width ratio, the greater the extrusion pressure dependency and the pressure bonding strength. On the other hand, it is understood that the larger the ratio of the kneaded material supply hole area / the kneaded material supply hole pitch area, the smaller the extrusion pressure dependency and the higher the pressure bonding strength. Therefore, when the optimum ratio of the forming groove depth / forming groove width and the ratio of the kneaded material supply hole area / the kneaded material supply hole pitch area are obtained from these contradictory relationships, the forming groove depth / forming groove width ratio is It can be seen that the ratio of the kneaded material supply hole area / the kneaded material supply hole pitch area is 6 to 20 and is 0.1 to 0.6.
【００１８】実施例２ まず、坏土供給孔径／坏土供給孔ピッチの影響を調べる
ため、以下の表３に示したように坏土供給孔径／坏土供
給孔ピッチを変化させた、成形溝幅３００μｍと１０８
μｍの口金を準備し、口金加工の精度を求めるととも
に、実施例１と同様に坏土を押し出して、得られたセラ
ミックス構造体の圧着強度も求めた。なお、上記以外の
口金の構造は、成形溝深さ／成形溝幅の比を１０、成形
溝と供給孔の重複長さを１．１ｍｍとした。結果を表３
に示す。なお、口金加工強度の○は、精度良く加工でき
たことを示す。表３の結果から、坏土供給孔径／坏土供
給孔ピッチの比は０．４〜０．８の範囲であることがわ
かる。 Example 2 First, in order to investigate the effect of the kneaded material supply hole diameter / kneaded material supply hole pitch, as shown in Table 3 below, the forming groove in which the kneaded material supply hole diameter / kneaded material supply hole pitch was changed. Width 300 μm and 108
A μm die was prepared, the accuracy of die processing was determined, and the kneaded material was extruded in the same manner as in Example 1 to determine the pressure bonding strength of the obtained ceramic structure. In the structure of the die other than the above, the ratio of the molding groove depth / the molding groove width was 10, and the overlapping length of the molding groove and the supply hole was 1.1 mm. The results are shown in Table 3.
Shown in. In addition, the ◯ of the die processing strength indicates that the processing was performed with high accuracy. From the results in Table 3, it is understood that the ratio of the diameter of the kneaded clay supply holes / the pitch of the kneaded clay supply holes is in the range of 0.4 to 0.8.
【００１９】[0019]
【表３】 [Table 3]
【００２０】実施例３ 成形溝と坏土供給孔との坏土進行方向の重複部分の長さ
の影響を調べるため、以下の表４に示したように重複部
分の長さを変化させた、成形溝幅３００μｍと１０８μ
ｍの口金を準備した。そして、得られた口金のセルブロ
ックの強度を求めた。なお、上記以外の口金の構造は、
成形溝深さ／成形溝幅の比を、成形溝幅が３００μｍの
もので１３、１０８μｍのもので１０とし、坏土供給孔
面積／坏土供給孔ピッチ面積比を、成形溝幅３００μｍ
のもので０．４、１０８μｍのもので０．６とし、以下
成形溝幅に応じて、坏土供給孔径／坏土供給孔ピッチは
成形溝幅３００μｍで０．８、１０８μｍで０．８とし
た。結果を表４に示す。セルブロックの強度および圧着
強度は、高いものを○、中程度のものを△、低いものを
×として示した。表４の結果から、重複部分の長さは
０．３〜１．５ｍｍの範囲であることがわかる。 Example 3 In order to investigate the effect of the length of the overlapping portion of the forming groove and the kneading material supply hole in the kneaded clay advancing direction, the length of the overlapping portion was changed as shown in Table 4 below. Molding groove width 300μm and 108μ
Prepared the m base. Then, the strength of the cell block of the obtained die was determined. In addition, the structure of the base other than the above,
The forming groove depth / forming groove width ratio was set to 13 when the forming groove width was 300 μm and was set to 10 when the forming groove width was 108 μm, and the kneaded clay supply hole area / kneaded material supply hole pitch area ratio was set to 300 μm.
0.4 to 108 μm and 0.6 to 108 μm, and depending on the forming groove width, the kneaded clay supply hole diameter / kneaded material supply hole pitch is 0.8 when the forming groove width is 300 μm and 0.8 when 108 μm. did. The results are shown in Table 4. Regarding the strength and pressure bonding strength of the cell block, the high one is indicated by ◯, the middle one is indicated by Δ, and the low one is indicated by x. From the results in Table 4, it can be seen that the length of the overlapping portion is in the range of 0.3 to 1.5 mm.
【００２１】[0021]
【表４】 [Table 4]
【００２２】[0022]
【発明の効果】以上の説明から明らかなように、本発明
によれば、(a) 成形溝深さ／成形溝幅の比を６〜２０の
範囲内とし、(b) １個の坏土供給孔断面積／坏土供給孔
ピッチの面積の比を０．１〜０．６の範囲内とし、(c)
坏土供給孔径／坏土供給孔ピッチの比を０．４〜０．８
の範囲内とし、(d) 成形溝と坏土供給孔との坏土進行方
向の重複部分の長さを０．３〜１．５ｍｍの範囲内とし
ているため、押出後のセラミックス構造体の圧着強度を
向上させることと、押出圧力の変化と口金の機械的強度
等の種々の要因のセラミックス構造体の押し出される速
度に与える影響を少なくすることという相反する特性を
両者とも良好な範囲に保つことができる。As is apparent from the above description, according to the present invention, (a) forming groove depth / forming groove width ratio is within the range of 6 to 20, and (b) one kneaded clay. The ratio of supply hole cross-sectional area / kneaded material supply hole pitch area is within the range of 0.1 to 0.6, and (c)
The ratio of kneaded clay supply hole diameter / kneaded clay supply hole pitch is 0.4 to 0.8
(D) Since the length of the overlapping part of the forming groove and the kneaded clay supply hole in the kneaded clay advancing direction is within the range of 0.3 to 1.5 mm, pressure bonding of the ceramic structure after extrusion is performed. Keeping the contradictory characteristics of improving strength and reducing the influence of various factors such as change in extrusion pressure and mechanical strength of the die on the extrusion speed of the ceramic structure within a good range. You can
【図１】本発明の一例としてセラミックス構造体押出用
口金の成形溝側の平面を示す図である。FIG. 1 is a view showing a plane on a molding groove side of a die for extrusion of a ceramic structure as an example of the present invention.
【図２】本発明の一例としてセラミックス構造体押出用
口金の坏土供給孔側の平面を示す図である。FIG. 2 is a view showing a plane of a die for ceramic structure extrusion on the side of a kneaded material supply hole as an example of the present invention.
【図３】図１に示す例におけるＸ−Ｘ線に沿った断面を
示す図である。FIG. 3 is a diagram showing a cross section taken along line XX in the example shown in FIG.
【図４】本発明における成形溝と坏土供給孔とを模式的
に示す断面図である。FIG. 4 is a cross-sectional view schematically showing a forming groove and a kneaded clay supply hole in the present invention.
【図５】本発明における成形溝と坏土供給孔とを模式的
に示す平面図である。FIG. 5 is a plan view schematically showing a forming groove and a kneaded clay supply hole in the present invention.
【図６】押し出されたセラミックス構造体の一例を示す
図である。FIG. 6 is a diagram showing an example of an extruded ceramic structure.
【図７】本発明におけるセラミックス構造体に対する３
点曲げ試験の状態を示す図である。FIG. 7 is a diagram for a ceramic structure according to the present invention.
It is a figure which shows the state of a point bending test.
【図８】従来のセラミックス構造体押出用口金の一例を
示す図である。FIG. 8 is a view showing an example of a conventional ceramic structure extrusion die.
１ 口金本体，２ 成形溝，３ 坏土供給孔，４ 口金
凸部，５コア部1 mouthpiece main body, 2 forming groove, 3 kneaded clay supply hole, 4 mouthpiece convex portion, 5 core portion
Claims (1)
た複数の坏土供給孔とを有するセラミックス構造体押出
用口金において、 (a) 成形溝深さ／成形溝幅の比を６〜２０の範囲内と
し、 (b) １個の坏土供給孔断面積／坏土供給孔ピッチの面積
の比を０．１〜０．６の範囲内とし、 (c) 坏土供給孔径／坏土供給孔ピッチの比を０．４〜
０．８の範囲内とし、 (d) 成形溝と坏土供給孔との坏土進行方向の重複部分の
長さを０．３〜１．５mmの範囲内としたことを特徴とす
るセラミックス構造体押出用口金。1. A ceramic structure extruding die having a forming groove and a plurality of kneaded material supply holes respectively communicating with the forming groove, wherein (a) forming groove depth / forming groove width ratio is 6 to 20. (B) The ratio of the cross-sectional area of one kneaded clay supply hole / the area of the kneaded clay supply hole pitch is within the range of 0.1 to 0.6, and (c) the kneaded clay supply hole diameter / kneaded clay. Supply hole pitch ratio 0.4 ~
Within the range of 0.8, (d) the length of the overlapping portion between the forming groove and the kneaded material supply hole in the direction of kneaded clay is within the range of 0.3 to 1.5 mm. Body extrusion die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4247094A JP2925921B2 (en) | 1994-03-14 | 1994-03-14 | Ceramic structure extrusion die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4247094A JP2925921B2 (en) | 1994-03-14 | 1994-03-14 | Ceramic structure extrusion die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07246610A true JPH07246610A (en) | 1995-09-26 |
| JP2925921B2 JP2925921B2 (en) | 1999-07-28 |
Family
ID=12636960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4247094A Expired - Lifetime JP2925921B2 (en) | 1994-03-14 | 1994-03-14 | Ceramic structure extrusion die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2925921B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003082538A1 (en) * | 2002-03-28 | 2003-10-09 | Ngk Insulators,Ltd. | Honeycomb forming ferrule and jig for honeycomb forming ferrule using the ferrule |
| JP2006088556A (en) * | 2004-09-24 | 2006-04-06 | Hitachi Metals Ltd | Mold for molding ceramic honeycomb structure |
| JP2009196251A (en) * | 2008-02-22 | 2009-09-03 | Denso Corp | Method for regenerating mold for molding honeycomb structure |
| EP2105272A3 (en) * | 2008-03-17 | 2012-03-07 | NGK Insulators, Ltd. | Honeycomb structure-forming die and method for manufacturing the same |
| WO2020236474A1 (en) * | 2019-05-17 | 2020-11-26 | Corning Incorporated | Honeycomb extrusion dies and forming methods |
-
1994
- 1994-03-14 JP JP4247094A patent/JP2925921B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003082538A1 (en) * | 2002-03-28 | 2003-10-09 | Ngk Insulators,Ltd. | Honeycomb forming ferrule and jig for honeycomb forming ferrule using the ferrule |
| US7858007B2 (en) | 2002-03-28 | 2010-12-28 | Ngk Insulators, Ltd. | Honeycomb forming die and jig for honeycomb forming die using the same |
| JP2006088556A (en) * | 2004-09-24 | 2006-04-06 | Hitachi Metals Ltd | Mold for molding ceramic honeycomb structure |
| JP2009196251A (en) * | 2008-02-22 | 2009-09-03 | Denso Corp | Method for regenerating mold for molding honeycomb structure |
| EP2105272A3 (en) * | 2008-03-17 | 2012-03-07 | NGK Insulators, Ltd. | Honeycomb structure-forming die and method for manufacturing the same |
| US8235699B2 (en) | 2008-03-17 | 2012-08-07 | Ngk Insulators, Ltd. | Honeycomb structure-forming die and method for manufacturing the same |
| WO2020236474A1 (en) * | 2019-05-17 | 2020-11-26 | Corning Incorporated | Honeycomb extrusion dies and forming methods |
| US20220314489A1 (en) * | 2019-05-17 | 2022-10-06 | Corning Incorporated | Honeycomb extrusion dies and forming methods |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2925921B2 (en) | 1999-07-28 |
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