JPH07245232A - Layered ceramic electronic parts and its production - Google Patents

Abstract

PURPOSE:To obtain a layered ceramic electronic part whose electrode has excellent reliability in electrical connection and in which electrical characteristics such as electrostatic capacitance, etc., can be adjusted without making a buried electronic part element larger in size. CONSTITUTION:A ceramic multi-layered substrate 41 is formed by piling up a sintered body and a ceramic layer and has a plurality of electrodes 2, 3, 12-14, 24, 25, 27 that are formed through a thin-film formation method, and at least one electrodes 13, 14 among them has a thickness different from those of the other electrodes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic electronic component such as a ceramic multi-layer substrate and a monolithic capacitor, and a method for manufacturing the same, and more particularly, a metal film for electrodes formed by a thin film forming method and a ceramic green sheet are integrated. The present invention relates to a monolithic ceramic electronic component obtained through a process of laminating the integrated electrode ceramics integrated sheet and a method for manufacturing the same.

[0002]

2. Description of the Related Art As a multilayer ceramic electronic component, various electronic components such as a multilayer capacitor and a multilayer inductor have been conventionally developed. In recent years, along with the miniaturization of electronic devices, there is a strong demand for miniaturization and improvement in integration density of these electronic components. Therefore, a ceramic multilayer substrate in which a plurality of capacitors, inductors and other electronic component elements and wiring patterns are embedded in one ceramic substrate, or a composite type multilayer ceramic electronic component obtained by compounding a plurality of electronic component elements Is proposed.

The above-mentioned ceramic multilayer substrate and composite type ceramic electronic component are manufactured by a well-known method for manufacturing a laminated ceramic electronic component. That is, a conductive paste for forming internal electrodes is applied on a ceramic green sheet, dried and then laminated to obtain a laminated body. The obtained multilayer body is fired to obtain a sintered body, and external electrodes connected to the internal electrodes are formed on the outer surface of the sintered body, whereby the above-mentioned ceramic multilayer substrate or composite type ceramic electronic component is manufactured. ing.

Further, in a ceramic multi-layer substrate or the like, a through hole is formed in a ceramic green sheet in order to electrically connect a plurality of electronic component elements formed therein, and a conductive paste is injected into the through hole. By doing so, a via hole electrode is formed. This via hole electrode is
The upper and lower electrodes separated by the ceramic layer are electrically connected.

Further, in the conventional method for manufacturing a monolithic ceramic electronic component, the capacitance of the capacitor portion formed inside is mainly designed by adjusting the facing area of the electrodes. That is, the capacitance is adjusted by increasing the facing area of the electrodes when forming a capacitor having a larger capacitance and decreasing the electrode facing area when forming a capacitor having a small capacitance.

[0006]

However, in the conventional method for manufacturing a monolithic ceramic electronic component, since the internal electrodes are formed by using the conductive paste, the conductive paste is baked during firing of the ceramics. Tended to shrink. As a result, the electrical connection between the internal electrodes or between the internal electrode and the via-hole electrode may be impaired. Furthermore, the internal electrodes that should be exposed on the outer surface of the sintered body may not be sufficiently exposed, and the reliability of the electrical connection with the external electrodes may be impaired.

On the other hand, in order to solve the above problems when the internal electrodes are formed of a conductive paste, a multilayer capacitor has been proposed in which the internal electrodes are formed by a thin film forming method such as vapor deposition, plating or sputtering. (Japanese Patent Laid-Open No. 64-42809).

However, in the ceramic multi-layer substrate or the composite type ceramic electronic component, the via hole electrode for electrically connecting the upper and lower internal electrodes is formed, and the via hole electrode is formed on the ceramic green sheet as described above. Only a method of forming a through hole in advance and filling the through hole with a conductive paste is known.

On the other hand, in a monolithic ceramic electronic component having a built-in capacitor, the capacitance of the capacitor is adjusted by the area facing the electrodes as described above. Therefore, when the capacitance is increased, the facing area has to be increased and the area of the capacitor portion tends to be increased. As a result, the dimensions of the monolithic ceramic electronic components are increased,
Alternatively, it may not be possible to obtain a sufficiently large capacitance.

An object of the present invention is to provide a monolithic ceramic electronic component having a structure capable of effectively increasing the electrical component element built-in density and a method of manufacturing the same, which is excellent in the electrical connection of the conductive portion. .

[0011]

DISCLOSURE OF THE INVENTION The present invention provides a laminated ceramic electronic component and a method for producing the same, in which the electrode is formed by a thin film forming method to improve reliability of electrical connection of the electrode. It is characterized by having the following configuration.

That is, according to the first aspect of the present invention, in a multilayer ceramic electronic component having a sintered body in which a plurality of electrodes formed by a thin film forming method are laminated via ceramic layers, among the plurality of electrodes, A multilayer ceramic electronic component, wherein the thickness of at least one electrode is partially or different from that of another electrode.

In the monolithic ceramic electronic component of the present invention, the thickness of at least one electrode is partially or different from that of another electrode. Therefore, it is possible to adjust the electrical characteristics such as capacitance by using the electrodes having different thicknesses. Moreover, since the electrodes are formed by the thin film forming method, the reliability of the electrical connection between the electrodes or between the electrodes and an external electrode formed separately can be improved.

In the ceramic electronic component of the present invention, the thickness of at least one electrode is partially or different from the thickness of the other electrodes as described above, but this different method can be arbitrarily determined according to the purpose. . For example, of the pair of electrodes facing each other with the ceramic layer in between, the thickness of one electrode may be different from the thickness of the other electrode. Alternatively, as described in claim 2, the electrodes may be configured so that the thicknesses thereof are partially different on the same plane, and if the thicknesses of the plurality of electrodes formed on the same plane are different between the electrodes. You may let me.

Furthermore, the electrodes in the present invention are not limited to those that function as electrodes of electronic component elements such as capacitors and inductors, but also include electrodes that form wiring patterns. The electrodes forming this wiring pattern are not limited to those extending on a plane at a predetermined height position in the sintered body, and as described in claim 3, for electrically connecting the upper and lower electrodes to each other. Via hole electrodes are also included. That is, in claim 3, among the electrode portions or electrodes having different thicknesses, the electrode portion or electrode having a relatively large thickness is connected to the upper or lower electrode separated by the ceramic layer. A via hole electrode is formed.

As described above, the electrode in the present invention is
It is a general term for all the conductive parts formed in the sintered body, and not only those formed in the sintered body,
It may be formed on the outer surface of the sintered body.

A fourth aspect of the present invention provides a method for manufacturing a monolithic ceramic electronic component according to the first aspect of the present invention, which comprises at least one electrode for forming an electrode on a support by a thin film forming method. Forming a single metal film, forming a ceramic green sheet on the support to obtain an electrode ceramics integrated sheet supported by the support, and stacking a plurality of electrode ceramics integrated sheets A multilayer ceramic electronic component, comprising: a step of obtaining a laminate and a step of firing the laminate, wherein at least one metal film in the laminate has a thickness partially or different from that of another metal film. It is a manufacturing method.

The method of making the thickness of the electrode-constituting metal film different may be variously changed according to the purpose. For example, prior to obtaining the electrode ceramics integrated sheet, a metal film may be formed on the support by varying the thickness of the metal film formed on the support. Alternatively, when the electrodes have different thicknesses on the same plane, the metal films formed on one support may be formed so as to have different thicknesses. Furthermore, in order to obtain a structure in which a plurality of electrodes have different thicknesses on the same plane, as described in claim 5, in at least one electrode ceramics integrated sheet, a plurality of metal films having different thicknesses are used. Should be configured.

In forming the via-hole electrode, as described in claim 6, among the metal film portions or the metal films having different thicknesses, the thick metal film portion or the metal film penetrates the ceramic green sheet. It may be formed so that When the laminated body is obtained using the electrode-ceramics integrated sheet, the electrode-ceramics integrated sheet supported by a support is transferred by a transfer method and laminated as described in claim 7. It can be done by going. In this case, the support may be peeled off from the electrode ceramics integrated sheet prior to lamination, or may be peeled off after transfer.

The above-mentioned thin film forming method includes a conventionally known thin film forming method such as vapor deposition, plating or sputtering, and unlike the case of the internal electrode formed by using a conductive paste, ceramic firing It has already been completed as a metal film before.

[0021]

According to the first aspect of the invention, since the electrodes are formed by the thin film forming method, it is difficult for the electrodes to shrink when firing the ceramic. Therefore, the reliability of the electrical connection between the electrodes or between the electrodes and the external electrode is enhanced.

In addition, since the thickness of at least one electrode is partially or different from that of the other electrodes, it is possible to adjust the facing distance between the upper and lower electrodes, for example, by using the different thickness. It is possible to adjust electric characteristics such as capacitance.

According to the second aspect of the invention, since the thickness of the electrode is partially or different from that of the other electrode on the same plane, the capacitance formed by using the electrode formed by the above-mentioned thin film forming method is used. It is possible to arrange electronic component elements having different electrical characteristics such as.

Further, as described in claim 3, the relatively thick electrode portion or electrode is connected to the electrode arranged above or below the ceramic layer to separate the thick electrode. A via hole electrode can be formed by the portion or the electrode. Since the via hole electrode is also formed by the thin film forming method, the via hole electrode is unlikely to contract during firing. Therefore, the reliability of the electrical connection between the via hole electrode and the internal electrode can be improved.

In the invention according to claim 4, an electrode ceramics integrated sheet is obtained by forming a ceramic green sheet after forming a metal film on the support, and the electrode ceramics integrated sheet is laminated. Then
By firing, the monolithic ceramic electronic component according to the first aspect of the invention is obtained. In this case, the electrode is formed by forming at least one metal film on the support by a thin film forming method, and therefore, unlike the conductive paste, shrinkage is unlikely to occur during the baking performed later.

Further, as in the first aspect of the invention, since at least one metal film is configured so as to have a different thickness partially or from other metal films, the method of varying the thickness is adjusted. By doing so, electrical characteristics such as capacitance can be adjusted.

In the invention described in claim 5, at least 1
3. The multilayer ceramic electronic device according to claim 2, wherein the electrode film integrated with one sheet of the electrode ceramics comprises the metal film portions or the metal films having different thicknesses, and therefore the electrode portions or electrodes having different thicknesses are provided on the same plane. You can get the parts.

In the invention according to claim 6, since the relatively thick metal film portion or the metal film is formed to have a thickness penetrating the ceramic green sheet, the via hole electrode of the invention according to claim 3 is provided. The metal film portion or the metal film having a relatively large thickness can be used.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A monolithic ceramic electronic component according to an embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS.

First, the support 1 shown in FIG. 1 is prepared. The support 1 is provided to support the electrode ceramics integrated sheet described later, and the material forming the support 1 is not particularly limited. However, in order to facilitate transfer when transferring and stacking the electrode ceramics integrated sheets, it is preferable to use a flexible synthetic resin film such as a polyethylene terephthalate film or a polypropylene film. Further, the upper surface of the support 1 may be subjected to a mold release treatment such as a fluorine resin coating or a silicon resin coating, which facilitates the peeling from the support 1 when the electrode ceramics integrated sheet is transferred. It can be carried out.

Next, metal films 2 and 3 for forming internal electrodes are formed on the upper surface of the support 1 by a thin film forming method.
As the thin film forming method, a conventionally known appropriate thin film forming method such as vapor deposition, plating or sputtering can be used. The metal films 2 and 3 have the same thickness, but are configured to have different planar shapes. Since the metal films 2 and 3 are formed by the thin film forming method, they are already completed as metal films in the state shown in FIG. Therefore, shrinkage is unlikely to occur in the firing process described below.

Next, as shown in FIG. 2, a ceramic green sheet 4 is formed on the support 1. The ceramic green sheet 4 is formed by applying a ceramic slurry containing a ceramic powder such as a dielectric ceramic and having the same thickness as the metal films 2 and 3. That is, the thickness of the ceramic green sheet 4 is made substantially equal to that of the metal films 2 and 3 so that the upper surfaces of the metal films 2 and 3 are exposed, whereby the electrode ceramics integrated sheet 5 is configured.

On the other hand, a support film 11 is prepared separately from the electrode ceramics integrated sheet 5 as shown in FIG. The support film 11 is the support film 1 described above.
Is configured similarly to. The metal films 12 to 14 are formed on the support film 11 by a thin film forming method. Metal film 12
~ 14 have different thicknesses as shown. That is, the metal film 14 is thickest, and the metal films 13 and 12 are made thinner in this order.

Like the metal films 2 and 3, the metal films 12 to 14 as described above are formed by a thin film forming method such as vapor deposition, plating or sputtering. The metal films 12 to 14 having different thicknesses can be formed by various methods. For example, when forming a metal film by vapor deposition, plating or sputtering, first, the metal films 12 to 1
A metal film is formed by covering a portion other than the portion where 4 is formed with a mask. When the thickness of the metal film 12 is reached,
The upper surface of the metal film 12 is covered with a mask to further form a metal film. Next, when the thickness of the metal film 13 reaches a predetermined thickness, the upper surface of the metal film 13 is covered with a mask, a metal film is further formed, and when the thickness of the metal film 14 reaches the predetermined thickness, The formation of the film may be completed.

Next, as shown in FIG.
A ceramic green sheet 15 is formed on top. The thickness of the ceramic green sheet 15 is made substantially equal to the thickness of the metal film 14. Therefore, in the obtained electrode-ceramics integrated sheet 16, the metal film 14 penetrates vertically and the upper surface 14a of the metal film 14 is exposed. On the other hand, the upper surfaces of the metal films 13 and 12 are embedded in the ceramic green sheet 15.

The electrode ceramics integrated sheets 5 and 16 prepared as described above are laminated together with other electrode ceramics integrated sheets to obtain a laminate 21 shown in FIG. In the laminated body 21, the electrode ceramics integrated sheet 5 described above is laminated on the lowermost layer, and the electrode ceramics integrated sheet 22, the electrode ceramics integrated sheet 16 and the electrode ceramics integrated sheet 23 are laminated in this order. ing. The steps of preparing the electrode-ceramics integrated sheets 22 and 23 are the same as those of the electrode-ceramics integrated sheets 5 and 16 described above, although a detailed description thereof is omitted. However,
The electrode ceramics integrated sheet 22 has the same thickness as the electrode ceramics integrated sheet 16. Further, the metal films 24 and 25 are formed so as to penetrate the electrode ceramics integrated sheet 22. In addition,
Reference numeral 26 indicates a ceramic green sheet.

On the other hand, the electrode ceramics integrated sheet 23
Has a structure in which the metal film 27 and the ceramic green sheet 28 are integrated, and is obtained by forming the ceramic green sheet 28 on the support and then forming the metal film 27 on the upper surface by a thin film forming method. ing. That is, when the electrode-ceramic integrated sheet 23 is obtained, the metal film 27 is formed on the support after first forming the ceramic green sheet 28, not the metal film.

In the production of the electrode ceramics integrated sheet prepared in the present invention, such as the electrode ceramics integrated sheet 23, all the electrode ceramics integrated sheets are formed into a ceramic green film after forming a metal film on the support. It need not consist of what is obtained by molding the sheet.

Next, the step of stacking the electrode ceramics integrated sheets 5, 16, 22, and 23 will be described. First, on the stacking stage, the electrode ceramics integrated sheet 5 is reversed to the direction shown in FIG.
The support 3 is placed so that the lower surface is on the 3 side, and the support 1 is peeled off after pressure-bonding on the stacking stage. Next, the electrode-ceramics integrated sheet 22 is laminated on the electrode-ceramics integrated sheet 5 together with the support in the same manner as described above and pressure-bonded, and then the support (not shown) is removed. In this way, the electrode-ceramics integrated sheets 22, 16, which are supported by the support, are stacked upside down in order and peeled off the support.
23 can be sequentially laminated on the electrode ceramics integrated sheet 5.

However, in obtaining the laminate 21, the electrode ceramics integrated sheet may be peeled from the support in advance, and the peeled electrode ceramics integrated sheets may be laminated in order. However, if the above-mentioned transfer method is used, the laminated body 21 can be reliably and highly accurately obtained even when the thickness of the electrode ceramics integrated sheet is thin, and thus the transfer method is preferable.

By firing the laminate 21 obtained as described above, the ceramic multilayer substrate 41 shown in FIG. 6 can be obtained. In the ceramic multilayer substrate 41, the ceramic green sheets 4, 15, 26, 28 of the electrode ceramics integrated sheets 5, 16, 22, 23 are fired to form a ceramic sintered body 42. The electrodes 2, 3, 12, 13, 14, 24, 25, 27 made of the above-described metal film are formed in the ceramic sintered body 42 (for ease of explanation, reference numerals of the electrodes are used). The reference numbers of the metal films mentioned above will be used as they are.).

In the ceramic multi-layer substrate 41, the electrodes 14 and 25 constitute via-hole electrodes which electrically connect the electrodes 3 and 27, which are vertically separated by the ceramic layer 42a, as shown in the figure. There is.

In the ceramic multilayer substrate 41 of this embodiment,
As described above, the electrodes 12, 13, 27 formed inside are
Not only the electrodes 2 and 3 formed on the outer surface, but also the via-hole electrodes are made of a metal film formed by a thin film forming method. Therefore, during firing for obtaining the ceramic sintered body 42, the above-mentioned electrodes are unlikely to contract. Therefore, the reliability of the electrical connection between the internal electrodes, the electrical connection between the via hole electrode and the internal electrode, and the electrical connection between the electrode located on the outer surface such as the external electrode and the internal internal electrode or the via hole electrode can be improved.

Further, the electrodes 3 and 13 form a capacitor. In this case, the electrodes 3 and 13 have different thicknesses as illustrated. Therefore, since the facing distance between the electrodes 3 and 13 can be adjusted by adjusting the thickness of the electrode 13, the capacitance can be adjusted accordingly. That is, by increasing the thickness of the electrode 13, it is possible to configure a capacitor portion having a larger capacitance without increasing the area of the capacitor constituent portion. Therefore, the ceramic multilayer substrate 41
It is possible to reduce the area of the capacitor constituent part in the above, and it is possible to miniaturize the ceramic multilayer substrate 41 and improve the integration density of electronic component elements in the ceramic multilayer substrate 41.

The ceramic multilayer substrate 41 of this embodiment is also used.
Then, like the electrodes 12, 13 and 14, a plurality of electrodes located on the same plane have different thicknesses. In the conventional method of forming a plurality of electrodes by screen-printing a conductive paste on a ceramic green sheet, it was very difficult to make the thicknesses of the plurality of electrodes located on the same plane largely different from each other. On the other hand, in this embodiment, the electrodes 12 to 1 are formed by the thin film forming method as described above.
4 is formed, it is possible to accurately form the electrodes 12 to 14 having various thicknesses as illustrated.

FIG. 7 is a schematic perspective view showing the main part of the second embodiment of the present invention, and is a perspective view schematically showing only the capacitor portion built in the ceramic multilayer substrate.

The capacitor portion 61 built in this ceramic multilayer substrate has a rectangular shape along the outline indicated by reference numeral 62. Here, the electrodes 63 and 64 each having a rectangular planar shape are opposed to each other to form the first capacitor section 65, and the electrodes 66 and 6 are laterally separated by a predetermined distance.
7 are opposed to each other to form a second capacitor section 68. The areas of the electrodes 66 and 67 are the same as those of the electrodes 63 and 64. However, the facing distance between the electrodes 66 and 67 is ½ of the distance between the electrodes 63 and 64. That is, the facing distance between the electrodes 66 and 67 is
The electrode 67 is arranged so that it is half the facing distance between the electrodes 3 and 64.
Is thicker as shown.

Therefore, although the first capacitor section 65 and the second capacitor section 68 have the same area and thickness of the constituent parts, the capacitance of the second capacitor section 68 is
It is twice as large as the first capacitor section 65. That is, the second capacitor having twice the capacity of the first capacitor unit 65
It can be seen that the capacitor section 68 of No. 1 is downsized to the same size as the first capacitor section 65.

In this way, by making the thickness of the metal film formed by the thin film forming method different so as to make the electrode thickness different, it is possible to construct a capacitor having the same size and a larger electrostatic capacitance. Further, it is possible to configure the capacitor parts of various capacities while keeping the size of the capacitor part constant, and therefore, the size of the capacitor part in the ceramic multilayer substrate can be standardized regardless of the capacity, This facilitates the design of the electrical connection structure in the ceramic multilayer substrate.

Incidentally, FIG. 7 is a diagram schematically showing only the portions where the first and second capacitor portions 65 and 68 are formed in the ceramic multilayer substrate, and the respective electrodes 63, 64 and 66. It should be pointed out that a ceramic layer and other electronic component elements are formed in series on the upper surface or the lower surface of the electrodes 67 and 67.

Further, in the above-mentioned first and second embodiments,
Although the electrostatic capacity is adjusted by changing the thickness of the electrodes, it is possible to adjust other electric characteristics other than the electrostatic capacity by changing the thickness of the electrodes.

Although the first and second embodiments are used for the ceramic multilayer substrate, the present invention incorporates a plurality of electronic component elements such as a multilayer capacitor having a plurality of capacitors incorporated therein, an inductor and a capacitor. It can also be applied to a composite type multilayer ceramic electronic component formed by the above.

[0053]

According to the first aspect of the invention, since the electrodes are formed by the thin film forming method, it is difficult for the electrodes to shrink when firing the ceramics. Therefore, the reliability of the electrical connection between the plurality of electrodes is improved.

Since the thickness of at least one of the plurality of electrodes is partially or different from that of the other electrodes, the distance between the counter electrodes can be controlled by adjusting the difference. It is possible to adjust the electric characteristics such as the capacitance. In particular, when configuring a capacitor part, the capacitance can be adjusted by controlling the way in which the electrodes have different thicknesses, and by increasing the thickness of at least one electrode It is possible to realize a large capacitance by reducing the distance. Therefore, it is possible to configure a capacitor section having a large electrostatic capacity without increasing the size of the capacitor section, so that the density of built-in capacitors can be increased.

According to the second aspect of the present invention, since electrodes having a thickness partially or different from those of the other electrodes are formed on the same plane, the electric characteristics such as capacitance on the same plane can be improved. Different electronic component element parts can be configured.

According to the third aspect of the present invention, the thick electrode portion or electrode is electrically connected to the upper or lower electrode arranged with the ceramic layer in between to form the via hole electrode. Therefore, the reliability of the electrical connection of the via-hole electrode can be improved as compared with the via-hole electrode formed using the conventional conductive paste.

According to the inventions of claims 4 to 6, there is provided a monolithic ceramic electronic component having excellent reliability of connection of the conductive parts of the inventions of claims 1 to 3 and having a high density of embedded electronic component elements. be able to.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which electrodes are formed on a support prepared in an example.

FIG. 2 is a cross-sectional view for explaining an electrode ceramics integrated sheet obtained by forming a ceramic green sheet on the support shown in FIG.

FIG. 3 is a cross-sectional view showing a state in which electrodes are formed on a support prepared in an example.

4 is a cross-sectional view for explaining an electrode ceramics integrated sheet obtained by forming a ceramic green sheet on the support shown in FIG.

FIG. 5 is a cross-sectional view showing a laminated body prepared in an example.

FIG. 6 is a cross-sectional view for explaining a ceramic multilayer substrate obtained in an example.

FIG. 7 is a schematic perspective view showing a portion of a ceramic multilayer substrate according to a second embodiment in which a capacitor portion is formed.

[Explanation of symbols]

 1, 11 ... Supports 2-4, 12-14 ... Metal film (electrode) 24, 25, 27 ... Metal film (electrode) 22, 23 ... Electrode ceramics integrated sheet 26, 28 ... Ceramic green sheet 21 ... Laminated body 41 ... Ceramic multilayer substrate 42 ... Sintered body 65 ... First capacitor part 68 ... Second capacitor part 63, 64, 66, 67 ... Electrode

Claims (7)

[Claims] 1. A monolithic ceramic electronic component having a sintered body in which a plurality of electrodes formed by a thin film forming method are laminated via ceramic layers, wherein at least one of the plurality of electrodes has a partial thickness. Or a thickness of another electrode, a laminated ceramic electronic component. 2. It has at least one electrode formed on a plane at the same height position, and the thickness of the at least one electrode is partially or differently made different from other electrodes located on the same plane. The multilayer ceramic electronic component according to claim 1. 3. The via hole is configured such that, of the electrodes having different thicknesses, an electrode portion or electrode having a relatively large thickness is connected to an upper electrode or a lower electrode separated by a ceramic layer. The multilayer ceramic electronic component according to claim 1, wherein an electrode is formed. 4. A step of forming at least one metal film for forming an electrode on a support by a thin film forming method, and forming a ceramic green sheet on the support,
A step of obtaining an electrode ceramics integrated sheet supported by a support, a step of obtaining a laminated body by laminating a plurality of the electrode ceramics integrated sheets, and a step of firing the laminated body, A method of manufacturing a multilayer ceramic electronic component, wherein the thickness of at least one metal film is partially or different from the thickness of another metal film. 5. The method for manufacturing a laminated ceramic electronic component according to claim 4, wherein the at least one electrode ceramics integrated sheet has metal film portions or metal films having different thicknesses. 6. The metal film portion or the metal film having a relatively large thickness among the metal film portions or the metal films having different thicknesses is formed so as to penetrate the ceramic green sheet. A method for manufacturing the multilayer ceramic electronic component described. 7. The laminated ceramic electronic component according to claim 4, wherein the step of laminating the electrode ceramics integrated sheet is carried out by transferring the electrode ceramics integrated sheet supported on a support. Production method.